PZT MEMS Based Energy Harvesting for Miniaturized...

Copyright © 2015 Silex Microsystems. All rights reserved. 1 Copyright © 2015 Silex Microsystems. All rights reserved.

PZT MEMS Based Energy Harvesting for Miniaturized Smart Systems

Magnus Rimskog,

Thorbjörn Ebefors, Samira Nik

Approved for Distribution

Copyright © 2015 Silex Microsystems. All rights reserved. 2

Outline

• Silex, a Brief Overview

• New Material (PZT Focus);

Introduction to PZT

Vibration energy harvesting with PZT

Material Optimization

Material Integration and Manufacturability

• Introducing piezo-MEMS:

Drive for miniaturization

Energy harvesting demo applications

Collaborating in EU, forming consortiums

The smart-MEMPHIS example

• Summary and Conclusion

• Acknowledgement


Silex Microsystems Overview

• A Premier, Global MEMS Foundry Services Company

― Founded in 2000, headquartered near Stockholm, Sweden

― ‘Pure play’ (no own products)

• An Innovation Leader

― Leveraging proprietary TSV-related technologies to push the boundaries of 3D substrate processing and product integration

• A Dedicated and Reliable Manufacturing Partner

― 2,200 m2 of state-of-the-art, separate 6” and 8” wafer fabs

― Volume production oriented

― ISO 9001:2008 certified

Silex Provides

• Processing services including MEMS, CMOS post processing, WLP, Interposers,…..

• Comprehensive Process libraries and 3D ‘building blocks’

• A well proven New Product Introduction (NPI) process

• State of the Art MEMS fab facilities

• A highly experienced team of engineers

• Experience with regards to high volume production in CE market


IoT as a driver: a trillion sensors need power

The IoT powering problem

Even 90% of the IoT opportunities will not realise if you need to change batteries

• Miniaturization and low cost fabrication is needed

• Energy harvesting applications in building, industry,

transport, automotive, others [Yolé, below]

• Piezoelectric vibration energy harvesting:

7-14 B$ addressable market in 2018

[TSenors sumit Munich 2014]

The waves of MEMS


Power-MEMS / Energy Harvesters: A Solution to the IoT Battery Problem

Source: Tsensor Summit

MicroGen presentation, Munich, 2014

IoT problem: Battery life !

Overall IoT & pEH market sizes


PZT (Lead Zirconate Titanate) – What is it?

A ceramic material with compelling properties:

• Piezoelectric: – Mechanically stressed => Develops voltage

– Voltage applied => Physically changes shape

• Dielectric – Large dielectric constant

• Pyroelectric: – Temperature change => Develops voltage

• Ferroelectric: – Spontaneous electric polarization

Possible MEMS applications:

• Actuators; Mirrors, Print-heads, pMUT

• Sensors; inertial, IR, pMUT

• Integrated Passive Devices (IPD)

• Power MEMS; Energy harvesters


TE - 200 nm Au

BE- Ti TiO2 Pt

SiO2

Si

PZT

Sil-Cap® Hermetically Capped Piezo-MEMS PZT harvesting structures for vibrational pEH

smart-MEMPHIS Objectives: • Use State of the Art MEMS with Silex SmartBlock® WL bonding processes combined

with integrated TSVs

• Multi-axis (3DOF) mechanical Silicon resonator vibration structure with low

resonance frequency (< 100 Hz)

• Integrated piezo material (PZT based) with optimal FOM for energy harvesting

• Low temperature vacuum hermitic bonding (using getter for high vacuum/high Q)

• Mechanical force feedback for active frequency tuning

• Achieves smallest footprint and highest MEMS quality and reliability

PZT

Bottom Electrode (Pt)

Si / SiO2

Piezo MEMS

The Vision of the smart-MEMPHIS project a European Energy Harvest and storage consortium

Addressing the increasing demand for low-cost, energy

efficient autonomous systems

Miniaturized autonomous energy supply system utilising piezo-MEMS based harvesting

of vibrational energy.

DEMO1 Leadless pacemaker: from costly, burdensome

surgery to cost-effective and minimally invasive operations.

DEMO2 wider applicability: Wireless sensor network for

structure health monitoring e.g. in aeroplane wings

8

From traditional to leadless, implant-and-forget pacemaker

©From Sorin Group, reproduced with permission

Application development: LivaNova (Sorin Group)

9

Wireless sensor network (WSN) for structural health monitoring (SHM)

Application development: Vermon

10

11

The value chain for the end user applications Partner Organisation role

Silex Microsystems AB Coordinator and MEMS

harvester processing

Acreo Swedish ICT AB MEMS harvester design and

characterization

aixACCT Systems GmbH Harvester characterisation

Chalmers Tekniska Högskola

Supercapacitor development

Linköpings universitet ASIC design

Fraunhofer IZM Panel level packaging

Vermon SA Structure health monitoring

demonstrator

Sorin CRM SAS Pacemaker demonstrator

Spinverse Oy Day-to-day management,

communication, dissemination

• The Consortium covers the whole value

chain exept for the party buying and

installing the system.

• Selected final end users are engaged in

the EEAB.

The Vision of the smart-MEMPHIS project

12

Addressing the increasing demand for

low-cost, energy efficient autonomous

systems

Miniaturized autonomous energy

supply system

utilising piezo-MEMS based harvesting of vibrational energy.

DEMO1 Leadless pacemaker:

from costly, burdensome surgery to cost-effective and minimally invasive

operations.

DEMO2 wider applicability:

Wireless sensor network for structure health monitoring e.g.

in aeroplane wings

• PZT, 3D integration Piezo MEMS design &

manufacturing

• Ultra low power ASICs and controls ASIC and controls

• Carbon-based supercapacitors Energy storage

• Fan-out panel level packaging Packaging and integration

Leadless pacemaker

Wireless sensor

network

Scope and mission

13

• PZT, 3D integration Piezo MEMS design and

manufacturing

• Ultra low power ASICs and controls

ASIC and controls

• Carbon-based supercapacitors

Energy storage

• Fan-out panel level packaging

Packaging and integration

Leadless pacemaker

Wireless sensor

network for

structural health

monitoring

The components and related challenges

Energy harvesting from vibrations • Low frequency (<100Hz) • Small movements • Requirement of small size

Packaging • Size and reliability:

all components within few cm3

Energy storage • Rechargeability, energy density • The maturity of supercapacitor

ASICs • Low energy

consumption • Small size

14

The approach

PZT based piezo electric harvester element • Silex’s new sol-gel PZT

process. • 3D MEMS vacuum

packaging with TSVs.

Flat panel packaging • Either 2D or 3D

approach

Supercapacitor based energy storage • Improved performance by

functionalisation of the electrode materials

Tailored ASICs • High efficiency • Very low static energy

consumption

15

Piezo harvesters d31 operation mode: vibration-based harvester

Proof mass

PZT <100> Electrodes

Si

Vib

ration

• PZT properties & area • High stress regions • Electrical load (𝑅𝑙𝑜𝑎𝑑) • Resonance frequency 𝑓0 • Parasitic capacitance 𝐶𝑏𝑒𝑎𝑚

Simulations by Acreo

Silex PZT Processing – N Series Sol-Gel Deposition: Spin coating, pyrolysis, crystallisation

Piezo material testing by AixACCT

16

New energy storage materials for supercapacitors

Material requirements for electrodes:

Porosity, surface area, mechanical stability, electrical conductivity, electrochemical stability

Electrode materials development by Chalmers

17

Electrochemical analysis

Capacitance studies by 3 electrode system

Working

electrode

Electrol

yte

Electrochemical behaviour by symmetrical 2-electrode system

Electrode materials testing by Chalmers

18

Energy consumption bottlenecks

● Communication unit (RF standard, protocols)

● Memory unit (low-voltage RAM)

● Controller unit (like yesterday ...)

● Sensor interfaces (ADCs and drivers)

● Power management unit (efficiency)

19

The ASICs – focus in low static power consumption The energy consumption bottlenecs

● Communication unit (RF standard, protocols)

● Memory unit (low-voltage RAM)

● Sensor interfaces (ADCs and drivers)

● Power management unit (efficiency)

● Controller unit

ASICs development by Linköpings universitet 20

The packaging options

21

Single package stacking Stacking of panels System in Package

Higher flexibility Higher integration Highest integration

Modularity, adaptable to different form factors (skyscraper/bungalow)

Small system outline, largest component defines package outline

Smallest outline

Package sizes adapted to different component sizes

Key challenge: yield loss, low modularity

low modularity, heterogeneous package

ASIC

Harvester

energy storage

SMD

ASIC

Harvester

energy storage

SMD

Harvester

ASIC

energy storage

SMD

ASIC

Harvester

energy storageSMD

Packaging by Fraunhofer IZM

The impact of the project

22

Secured and reinforced European leadership in the microsystem sector

• $823 million market for piezo harvesters by 2023

Increased integration and new functionalities at micro- and nanoscale

• >26% cheaper packaging, >10x smaller harvester area, 8x smaller pacemaker volume

Increased autonomy and cognitive functions in SHM networks

• SHM network size up to 1000 individual sensor nodes

Addressing societal challenges in health • From burdensome surgery to minimal invasion,

4X cheaper overall costs of leadless pacemakers

Increased business opportunities, knowledge and competence development


Acknowledgements

• Thanks to all the engineers and operators at Silex’ fabs with a

special thanks to co-authors Thorbjörn Ebefors and Samira Nik.

• Part of the work has been performed within the smart-

MEMPHIS projects. This project has received funding from the European Union’s Horizon 2020 research and innovation

programme under grant agreement No. 644378.

• Thanks also to all our partners in the various collaborative groups participating in this work.


Contact Information

Magnus Rimskog

Sales Director Silex Microsystems United States

[email protected]

Cell: +1-781-690-1955

www.smart-memphis.eu

mailto:[email protected]

http://www.smart-memphis.eu/



Copyright © 2015 Silex Microsystems. All rights reserved.

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