PCN15880- Burn-In Site Expansion to TTTJ S9S08AW16A/AW60 ...

PCN15880- Burn-In Site Expansion to TTTJS9S08AW16A/AW60/DZ60/DZ128/QD4

Product Page

Number

S9S08AW16A (0M62J/1M62J) 1

S9S08AW60 (5M75B/7M75B) 18

S9S08DZ60_AUTO (1M74K/2M74K) 35

TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective

owners. © Freescale Semiconductor, Inc. 2006.

S9S08DZ128_AUTO (2M78G) 52

S9S08QD4_AUTO (1M15D/2M15D) 69

Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the

Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service

names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are

the property of their respective owners. © Freescale Semiconductor, Inc. 2006.

TM

24/09/13, Mu Kuan

KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion0M62J/1M62J - 9S08AW16A Correlation

0. Introduction – Reason for Burn-In Expansion

� Logistical Expansion



2

1. Objective and Considerations

1.1 Objective

� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site

for 0M62J/1M62J. Complete list of affected parts is outlined in PCN15880.

� This report details the correlation result of below FSL part# to demonstrate that

KES-China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.

� No impact of customer deliveries

� Completed on Sep/20/2013

1.2 Considerations



3

� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and

verified by dual site correlation analysis.

� Identical Burn-In board design used in both sites

� Burn-In drivers are the same in both sites.

Correlation Results (CHD - TJN)2. Burn In Qualification Results

2.1 Introduction:

This report details the burn-in correlation plan and result of S9S08AW16A QFN48 & LQFP44 with correlation vehicle, so that the TrioTech-

Tianjin(TTTJ) site can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site

and then processed in TTTJ, with the ambient burn-in temperature at 125°C.

S9S08AW16A ( LPN:AC16_Auto)

Mask set: 0M62J/1M62J

Production Line: G9FZAW6A / G9ZZAW6A

Package code: 8256/6152

• TTTJ

Hardware:

Burn-in System : IBE

Burn-in Pattern Generator : Flash Memory

Burn-in Driver : CC3



Slide 4


Burn-in Program Software: : MBI

Environment Plan : 125C

Burn-in Program(s) : AC16_QFP44

AC16_QFN48

• KESC

Hardware:






Burn-in Program(s) : AC16_QFP44

AC16_QFN48

Conclusion: Same hardware and software environment were used in both TTTJ and KESC


• Correlation Lot Information:

BI Site Wafer Lot # Final Test Lot # Device Part ID Package Mask/Rev Qty.

TTTJ T1TH532031 YZMEA1GK5P02 S9S08AW16AE0MLDR LQFP44 0M62J 500

TTTJ T1TH532071 YZMEA1GK5Q02 S9S08AW16AE0MLDR LQFP44 0M62J 500

TTTJ T1TH529141 YZMEA1GM8Q02 S9S08AW16AE0MLDR LQFP44 0M62J 500

TTTJ T1TH385111 YZMEA1B64P02 S9S08AW16AE0VLD QFN48 0M62J 500

TTTJ T1TH385091 YZMEA1B9J302 S9S08AW16AE0VLD QFN48 0M62J 500

TTTJ T1TH384751 YZMEA1BKZN02 S9S08AW16AE0VLD QFN48 0M62J 500

KESC T1TH532031 YZMEA1GK5P01 S9S08AW16AE0MLDR LQFP44 0M62J 500

KESC T1TH532071 YZMEA1GK5Q01 S9S08AW16AE0MLDR LQFP44 0M62J 500

KESC T1TH529141 YZMEA1GM8Q01 S9S08AW16AE0MLDR LQFP44 0M62J 500

KESC T1TH385111 YZMEA1B64P01 S9S08AW16AE0VLD QFN48 0M62J 500



Slide 5

KESC T1TH385111 YZMEA1B64P01 S9S08AW16AE0VLD QFN48 0M62J 500

KESC T1TH385091 YZMEA1B9J301 S9S08AW16AE0VLD QFN48 0M62J 500

KESC T1TH384751 YZMEA1BKZN01 S9S08AW16AE0VLD QFN48 0M62J 500

2.2 Engineering Qualification Plan

2.2.1 Requirements:

The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a

specification exists for this transfer/change, then the specification overrides these requirements.

2. Burn In Qualification Results

NameDetail Description

Req’d per

Correlation

Plan,

(Y / N?)

Acceptance Criteria Comment

Pattern Verify

Goal: Correlate and verify correct functionality of burn-in

patterns, cycling, etc

Lot quantity: 1

Units per lot: 5

Temperature: 25C, or as possible

BI Duration: N/A

Y

Correct pattern written

to array or other

product module(s)

This capability may be dependent upon

type of product.



6

BI Duration: N/A

Type of units: good

Site: TTTJ

Equipment

Release

Goal: Calibration and verification of entire system

according to site standard equipment release procedure

(May include performing voltage calibration on all drivers

including debug station, meet GR&R requirements, etc.)

Lot quantity / Units per lot: 0

Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TTTJ

YApproval by

manufacturing CAB.


Burn-in Board

Voltages

Goal: Verify that the parts on the burn-in board are

receiving the correct voltage

Lot quantity: 1

Units per lot: Empty and Full Board

Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y

Voltage within range of

target to be agreed by

PE/TE and R&QA.

Measure at front & back of empty and full

burn-in board.

Package Case

Temperature

Goal: Compare temperature at surface of mold compound

or on-chip temperature monitor

Lot quantity: 1

Units per lot: Full Board

Temperature: BI Ta

BI Duration: N/A

Type of units: good

Y

Less than 15%

variation or to be

agreed by PE/TE and

R&QA.

Thermocouples on five units with full burn-

in board running stress pattern. For high

power devices, also verify with single part

on nearly-empty board to ensure no

overheating.



Slide 7

Type of units: good

Site: TTTJ and KESC

overheating.

Ambient

Temperature (Ta)

Goal: Compare temperature of air inside chamber

Lot quantity: 1


Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TTTJ and KESC

Y

Less than 10%

variation or to be

agreed by PE/TE and

R&QA.

One thermocouple. Can be performed

along with Package Case Temperature.


Burn-in Board

Current

Goal: Compare burn-in board current

Lot quantity: 1

Units per lot: Full board

Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y

Less than 15% variation

or to be agreed by PE/TE

and R&QA.

Best measured on individual devices. Or

measure entire full board current minus

empty board current divided by # of devices

on full board.

Three Lot Burn-in

Check

Goal: Verify that burn-in system does not cause abnormal non-

burn-in failures

Lot quantity: 3

Units per lot: 500

Temperature: BI Ta

BI Duration: Typical BI Duration

Type of units: good

Site: TTTJ

Y

Address manufactur-

ability / over-stress

issues.

Run through standard test flow.

Burn-in Yield

Goal: Verify that burn-in system does not cause unusually low

yield

Lot quantity: 1

Units per lot: 500Optional

Post BI yield within PDA

limit or agreed up by May set a target here based on typical yields.



Slide 8

Burn-in YieldUnits per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ and KESC

Optional limit or agreed up by

PE/TE and R&QA.

May set a target here based on typical yields.

Visual

Inspection

Goal: Check for visual mechanicalLot quantity: 1

Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC

Y

Less than 2%

variation or agreed

upon by PE/TE and

R&QA.

Use the same units from Burn-in

Yield check in BI correlation.

Solderability

Test

Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ

YAs per

12MRM27364A


2.3 Correlation/Qualification Results:

2.3.1Pattern Verify:

Table 1 summarizes the pattern comparison results.

Table 1.

LQFP 44: Burn-in Board

Unit # Maskset BI Program BI Pattern Description KESC TTTJ

Unit 1 0M62J AC16_QFP44 Bin2 Check Pass Pass





QFN 48: Burn-in Board


Unit 1 0M62J AC16_QFN48 Bin2 Check Pass Pass





Slide 9




Conclusion: pattern verify pass.

2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220001)

2.3.3 Burn-in Board Voltage Measurements:

Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.

Table 2. Burn-in Board Voltage Measurements at 125C

1) LQFP44

BIB Condition Driver Location Target

(V) KESC

(V) Delta from

Target (mV)

TTTJ(V) Delta from

Target (mV) Empty VDUT1 5.75 5.75 0 5.75 0

VDUT3 5.75 5.75 0 5.74 10

Full VDUT1 5.75 5.74 10 5.75 0

VDUT3 5.75 5.74 10 5.75 0



10

2) QFN48


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V)

Delta from

Target (mV)

Empty VDUT1 5.75 5.74 10 5.75 0

VDUT3 5.75 5.75 0 5.74 10

Full VDUT1 5.75 5.74 10 5.75 0

VDUT3 5.75 5.74 10 5.74 10

Conclusion: Passed requirement.


2.4 Package Case Temperature:

Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of

the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were

located in all four corner sockets and one socket at the center of the burn-in board (see Figure 1). The thermocouples were

epoxied to the top of the device.

Figure 1. Location of Thermocouples

51

3 Feedthrough



Slide 11

4 2

Feedthrough

Connector

(Driver-side)


Table 3. Case Temperatures

1) LQFP44

Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta

1 Upper Left Corner 125.00 125.10 0.08% 2 Lower Left Corner 125.20 125.10 0.08% 3 Center of BIB 125.10 125.00 0.08% 4 Lower Right Corner 125.00 125.00 0.00% 5 Upper Right Corner 125.20 125.20 0.00%

2) QFN48




Slide 12




2.5 Ambient Temperature:

Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.

Table 4. Chamber Air Temperature

Thermocouple Location KESC (C) TTTJ (C) % Delta

Open Area in Chamber 125.10 125.00 0.08%


2.6 Burn-in Board Current:

Table5 shows the current reading on a full burn-in board running various patterns at BI Ta(125C).

Table 5. Burn-in Board Current

BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta

AC16_QFP44 AC16_QFP44 Full 0.6 0.6 0

AC16_QFN48 AC16_QFN48 Full 0.6 0.6 0



Slide 13

AC16_QFN48 AC16_QFN48 Full 0.6 0.6 0



2.7 3-Lot Burn-in Check:

Table 6 shows the result of the burn-in check.

Table 6. 3-Lot Burn-in Check

Lot Package Burn-

in Site

Lot Size Burn-in

Result

YZMEA1GK5P02 10x10 LQFP44 TTJ 500 Pass

YZMEA1GK5Q02 10x10 LQFP44 TTJ 500 Pass

YZMEA1GM8Q02 10x10 LQFP44 TTJ 500 Pass

YZMEA1B64P02 7x7 QFN48 TTJ 500 Pass

YZMEA1B9J302 7x7 QFN48 TTJ 500 Pass

YZMEA1BKZN02 7x7 QFN48 TTJ 500 Pass




Slide 14


2.8 Burn-in Yield:

Table 7 shows the result of the post burn-in yield.

Table 7. Burn-in Yield

Lot Package Burn-in Site Burn-in

Yield

YZMEA1GK5P02 10x10 LQFP44 TTTJ Pass

YZMEA1GK5Q02 10x10 LQFP44 TTTJ Pass

YZMEA1GM8Q02 10x10 LQFP44 TTTJ Pass

YZMEA1B64P02 7x7 QFN48 TTTJ Pass

YZMEA1B9J302 7x7 QFN48 TTTJ Pass

YZMEA1BKZN02 7x7 QFN48 TTTJ Pass

YZMEA1GK5P01 10x10 LQFP44 KESC Pass

YZMEA1GK5Q01 10x10 LQFP44 KESC Pass

YZMEA1GM8Q01 10x10 LQFP44 KESC Pass

YZMEA1B64P01 7x7 QFN48 KESC Pass



Slide 15

YZMEA1B64P01 7x7 QFN48 KESC Pass

YZMEA1B9J301 7x7 QFN48 KESC Pass

YZMEA1BKZN01 7x7 QFN48 KESC Pass

Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement.

2.9 Visual inspection

Table 8 shows the result of the visual inspection post burn-in.

Table 8.Visual Inspection

BI Site Final Test Lot # Package Inspection Qty Visual Yield

TTTJ YZMEA1GK5P02 10x10 LQFP44 500 Pass

TTTJ YZMEA1B64P02 7x7 QFN48 500 Pass

KESC YZMEA1GK5P01 10x10 LQFP44 500 Pass

KESC YZMEA1B64P01 7x7 QFN48 500 Pass

Conclusion: All correlation lots VM yield variation less than criteria, passed requirement.


2.10 Solderability Test Table 11 shoes the result of solderability test post burn-in. Note: Test were done using 20 sample parts per package type

Table 11.Solderability Test

BI Site Final Test Lot # Package Test Qty Result

TTTJ YZMEA1GK5P02 10x10 LQFP44 20 Passed

TTTJ YZMEA1B64P02 7x7 QFN48 20 Passed

LQFP sample photos QFN sample photos



Slide 16

Conclusion: All result showed passed

3. Conclusion and Recommendation

3.1 Conclusion

� Based on this report, 0M62J/1M62J passed all correlation requirements without any issues.

� TTTJ is capable to implement burn-in for S9S08AW16A QFN48 & LQFP44 package

3.2 Recommendation

� Burn-In for 0M62J/1M62J, QFN48 & LQFP44(6152/8256) can be released in TTTJ Burn-In.



17






TM

24/09/13, Zhang Tao

KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion5M75B/7M75B- S9S08AW60 Correlation





19


1.1 Objective


for 5M75B/7M75B. Complete list of affected parts is outlined in PCN15880.





1.2 Considerations



20






2.1 Introduction:

This report details the burn-in correlation plan and result of S9S08AW60 QFN48 & QFP44 with correlation vehicle, so that the TrioTech-Tianjin(TTTJ) site

can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site and then processed in

TTTJ, with the ambient burn-in temperature at 125°C.

S9S08AW60

Mask set: 5M75B/7M75B

Production Line: G9FA8AW6/ G9ZA8AW6


• TTTJ

Hardware:







Slide 21



Burn-in Program(s) : AW_44LQFP

AW_48QFN

• KESC

Hardware:






Burn-in Program(s) : AW_44LQFP

AW_48QFN

• Conclusion: Same hardware and software environment were used in both TTTJ and KESC




TTTJ T1TH147121 YZMEA15X2Q03 S9S08AW16E5MFGE LQFP44 5M75B 500

TTTJ T1TH527221 YZMEA1G9RM02 S9S08AW16E5MFGE LQFP44 5M75B 500

TTTJ T1TH533921 YZMEA1GEJQ02 S9S08AW16E5MFGE LQFP44 5M75B 500

TTTJ T1TH409111 YZMEA1BPDK02 S9S08AW32E5CFDE QFN48 5M75B 500

TTTJ T1TH390731 YZMEA1B0PW02 S9S08AW32E5CFDE QFN48 5M75B 500

TTTJ T1TH429561 YZMEA1D1MU02 S9S08AW32E5CFDE QFN48 5M75B 500

KESC T1TH147121 YZMEA15X2Q00 S9S08AW16E5MFGE LQFP44 5M75B 500

KESC T1TH527221 YZMEA1G9RM01 S9S08AW16E5MFGE LQFP44 5M75B 500

KESC T1TH533921 YZMEA1GEJQ01 S9S08AW16E5MFGE LQFP44 5M75B 500

KESC T1TH409111 YZMEA1BPDK01 S9S08AW32E5CFDE QFN48 5M75B 500

KESC T1TH390731 YZMEA1B0PW01 S9S08AW32E5CFDE QFN48 5M75B 500

KESC T1TH429561 YZMEA1D1MU01 S9S08AW32E5CFDE QFN48 5M75B 500



Slide 22


2.2.1 Requirements:





Req’d per

Correlation

Plan,

(Y / N?)


Pattern Verify



Lot quantity: 1

Units per lot: 5


BI Duration: N/A

Y


to array or other

product module(s)


type of product.



23

BI Duration: N/A

Type of units: good

Site: TTTJ

Equipment

Release






Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TTTJ

YApproval by

manufacturing CAB.


Burn-in Board

Voltages



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



PE/TE and R&QA.


burn-in board.

Package Case

Temperature



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Y

Less than 15%

variation or to be

agreed by PE/TE and

R&QA.





overheating.



Slide 24

Type of units: good

Site: TTTJ and KESC

overheating.

Ambient

Temperature (Ta)


Lot quantity: 1


Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TTTJ and KESC

Y

Less than 10%

variation or to be

agreed by PE/TE and

R&QA.




Burn-in Board

Current


Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



and R&QA.




on full board.

Three Lot Burn-in

Check


burn-in failures

Lot quantity: 3

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ

Y

Address manufactur-


issues.


Burn-in Yield


yield

Lot quantity: 1






Slide 25


Temperature: BI Ta


Type of units: good

Site: TTTJ and KESC


PE/TE and R&QA.


Visual

Inspection



Y

Less than 2%

variation or agreed

upon by PE/TE and

R&QA.



Solderability

Test


YAs per

12MRM27364A



2.3.1 Pattern Verify:


Table 1

LQFP 44: Burn-in Board


Unit 1 5M75B AW_44LQFP Bin2 Check Pass Pass





QFN 48: Burn-in Board


Unit 1 5M75B AW_48QFN Bin2 Check Pass Pass



Slide 26












1) LQFP44


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V)

Delta from

Target (mV)

Empty VDUT1 6.00 5.97 30 5.99 10

VDUT3 6.00 5.96 40 5.98 20

Full VDUT1 6.00 5.99 10 6.00 0

VDUT3 6.00 5.98 20 5.98 20



27

2) QFN48


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V)

Delta from

Target (mV)

Empty VDUT1 6.00 5.98 20 5.99 10

VDUT3 6.00 5.99 10 5.98 20

Full VDUT1 6.00 5.97 30 6.00 0

VDUT3 6.00 5.98 20 5.98 20









51

3 Feedthrough



Slide 28

4 2

Feedthrough

Connector

(Driver-side)



1) LQFP44


1 Upper Left Corner 127.10 127.10 0.00%

2 Lower Left Corner 127.80 127.00 0.60%

3 Center of BIB 127.90 127.10 0.60%

4 Lower Right Corner 127.10 126.90 0.20%

5 Upper Right Corner 127.50 127.30 0.20%

2) QFN48



Slide 29




3 Center of BIB 127.40 126.90 0.39%












Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.





Slide 30

AW_44LQFP AW_44LQFP Full 1.41 1.40 0.7% AW_48QFN AW_48QFN Full 1.40 1.38 1.4%






Lot Package Burn-

in Site

Lot Size Burn-in

Result

YZMEA15X2Q03 10x10 LQFP44 TTTJ 500 Pass

YZMEA1G9RM02 10x10 LQFP44 TTTJ 500 Pass

YZMEA1GEJQ02 10x10 LQFP44 TTTJ 500 Pass

YZMEA1BPDK02 7x7 QFN48 TTTJ 500 Pass

YZMEA1B0PW02 7x7 QFN48 TTTJ 500 Pass

YZMEA1D1MU02 7x7 QFN48 TTTJ 500 Pass




Slide 31


Correlation Results (CHD - TJN)2. Burn In Qualification Results 2.8 Burn-in Yield:




YZMEA15X2Q03 10x10 LQFP44 TTTJ Pass

YZMEA1G9RM02 10x10 LQFP44 TTTJ Pass

YZMEA1GEJQ02 10x10 LQFP44 TTTJ Pass

YZMEA1BPDK02 7x7 QFN48 TTTJ Pass

YZMEA1B0PW02 7x7 QFN48 TTTJ Pass

YZMEA1D1MU02 7x7 QFN48 TTTJ Pass

YZMEA15X2Q00 10x10 LQFP44 KESC Pass

YZMEA1G9RM01 10x10 LQFP44 KESC Pass

YZMEA1GEJQ01 10x10 LQFP44 KESC Pass

YZMEA1BPDK01 7x7 QFN48 KESC Pass

7x7 QFN48 KESC Pass



Slide 32

YZMEA1B0PW01 7x7 QFN48 KESC Pass

YZMEA1D1MU01 7x7 QFN48 KESC Pass






TTTJ YZMEA15X2Q03 10x10 LQFP44 500 Pass

TTTJ YZMEA1BPDK02 7x7 QFN48 500 Pass

KESC YZMEA15X2Q00 10x10 LQFP44 500 Pass

KESC YZMEA1BPDK01 7x7 QFN48 500 Pass



2.10 Solderability Test

Refer to 9S08AW16A data. (Page 15)




Slide 33


3.1 Conclusion

� Based on this report, 5M75B/7M75B passed all correlation requirements without any

issues.

� TTTJ is capable to implement burn-in for S9S08AW60 QFN48 & LQFP44 package

3.2 Recommendation

� Burn-In for 5M75B/7M75B, QFN48 & LQFP44(6152/8256) can be released in TTTJ.



34

� Burn-In for 5M75B/7M75B, QFN48 & LQFP44(6152/8256) can be released in TTTJ.






TM

24/09/13, Chen Li

KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion1M74K/2M74K- S9S08DZ60 Correlation





36


1.1 Objective


for 1M74K/2M74K. Complete list of affected parts is outlined in PCN15880.





1.2 Considerations



37


verified by dual sites correlation analysis.




2.1 Introduction:

This report details the burn-in correlation plan and result of S9S08DZ60 LQFP64, LQFP48 and LQFP32 with correlation vehicle, so that the TrioTech-


and then processed in TTTJ, with the ambient burn-in temperature at 125C.

S9S08DZ60

Mask set: 1M74K/2M74K

Production Line: G9FZDZ6A / G9FZDZ6B/ G9FZDZ6C

Package code: 6300/6089/8426

• TTTJ

Hardware:








Slide 38


Burn-in Program(s) : DZ60E_32LD

DZ60_48LD

DZ60_64LD

• KESC

Hardware:






Burn-in Program(s) : DZ60E_32LD

DZ60_48LD

DZ60_64LD





TTTJ T1DE314191 YZMEA1EXME01 S9S08DZ60F1MLC LQFP32 1M74K 500

TTTJ T1DE306681 YZMEA1GA6402 S9S08DZ60F1MLC LQFP32 1M74K 500

TTTJ T1DE324821 YZMEA1GGBM02 S9S08DZ60F1MLC LQFP32 1M74K 500

TTTJ T1DE294601 YZMEA1EB7901 S9S08DZ60F1MLF LQFP48 1M74K 500

TTTJ T1DE292371 YZMEA1EB7B01 S9S08DZ60F1MLF LQFP48 1M74K 500

TTTJ T1DE306711 YZMEA1ENNA01 S9S08DZ60F1MLF LQFP48 1M74K 500

TTTJ T1DE318421 YZMEA1G50G02 S9S08DZ60F1MLH LQFP64 1M74K 500

TTTJ T1DE318391 YZMEA1G50402 S9S08DZ60F1MLH LQFP64 1M74K 500

TTTJ T1DE318381 YZMEA1G4K402 S9S08DZ60F1MLH LQFP64 1M74K 500

KESC T1DE314191 YZMEA1EXME02 S9S08DZ60F1MLC LQFP32 1M74K 500

KESC T1DE306681 YZMEA1GA6401 S9S08DZ60F1MLC LQFP32 1M74K 500

KESC T1DE324821 YZMEA1GGBM01 S9S08DZ60F1MLC LQFP32 1M74K 500

KESC T1DE294601 YZMEA1EB7902 S9S08DZ60F1MLF LQFP48 1M74K 500

KESC T1DE292371 YZMEA1EB7B02 S9S08DZ60F1MLF LQFP48 1M74K 500

KESC T1DE306711 YZMEA1ENNA02 S9S08DZ60F1MLF LQFP48 1M74K 500



Slide 39

KESC T1DE306711 YZMEA1ENNA02 S9S08DZ60F1MLF LQFP48 1M74K 500

KESC T1DE318421 YZMEA1G50G01 S9S08DZ60F1MLH LQFP64 1M74K 500

KESC T1DE318391 YZMEA1G50401 S9S08DZ60F1MLH LQFP64 1M74K 500

KESC T1DE318381 YZMEA1G4K401 S9S08DZ60F1MLH LQFP64 1M74K 500


2.2.1 Requirements:





Req’d per

Correlation

Plan,

(Y / N?)


Pattern Verify



Lot quantity: 1

Units per lot: 5


BI Duration: N/A

Y


to array or other

product module(s)


type of product.



40

BI Duration: N/A

Type of units: good

Site: TTTJ

Equipment

Release






Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TTTJ

YApproval by

manufacturing CAB.


Burn-in Board

Voltages



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



PE/TE and R&QA.


burn-in board.

Package Case

Temperature



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Y

Less than 15%

variation or to be

agreed by PE/TE and

R&QA.





overheating.



Slide 41

Type of units: good

Site: TTTJ and KESC

overheating.

Ambient

Temperature (Ta)


Lot quantity: 1


Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TTTJ and KESC

Y

Less than 10%

variation or to be

agreed by PE/TE and

R&QA.




Burn-in Board

Current


Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



and R&QA.




on full board.

Three Lot Burn-in

Check


burn-in failures

Lot quantity: 3

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ

Y

Address manufactur-


issues.



yield

Lot quantity: 1Post BI yield within PDA



Slide 42

Burn-in Yield

Lot quantity: 1

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ and KESC

Optional


limit or agreed up by

PE/TE and R&QA.


Visual

Inspection



Y

Less than 2%

variation or agreed

upon by PE/TE and

R&QA.



Solderability

Test


YAs per

12MRM27364A





Table 1.

LQFP32: Burn-in Board


Unit 1 1M74K DZ60E_32LD Bin2 Check Pass Pass







Unit 1 1M74K DZ60_48LD Bin2 Check Pass Pass




Slide 43


















1) LQFP32


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V) Delta from

Target (mV)

Empty VDUT1 5.75 5.74 10 5.75 0

VDUT3 6.00 5.99 10 6.00 0

Full VDUT1 5.75 5.75 0 5.75 0

VDUT3 6.00 5.99 10 5.99 10

2) LQFP48


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V) Delta from

Target (mV)



44

(V) (V) Target (mV) Target (mV)

Empty VDUT1 5.75 5.75 0 5.75 0

VDUT3 6.00 5.99 10 5.99 10

Full VDUT1 5.75 5.75 0 5.74 10

VDUT3 6.00 6.00 0 5.99 10

3) LQFP64


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V) Delta from

Target (mV)

Empty VDUT1 5.75 5.74 10 5.74 10

VDUT3 6.00 5.98 20 5.99 10

Full VDUT1 5.75 5.74 10 5.75 0

VDUT3 6.00 5.99 10 5.98 20




Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the

oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one

socket at the center of the burn-in board (see Figure 1). The thermocouples were epoxied to the top of the device.


51

3 Feedthrough

Connector



Slide 45

4 2

Connector

(Driver-side)



1) LQFP32



2) LQFP48





Slide 46


3) LQFP64















DZ60E_32LD DZ60_32LD Full 0.79 0.79 0%



Slide 47

DZ60E_32LD DZ60_32LD Full 0.79 0.79 0% DZ60_48LD DZ60_48LD Full 0.82 0.82 0% DZ60_64LD DZ60_64LD Full 0.8 0.8 0%






Lot Package Burn-

in Site

Lot Size Burn-in

Result

YZMEA1EXME01 7X7 LQFP32 TTJ 500 Pass YZMEA1GA6402 7X7 LQFP32 TTJ 500 Pass YZMEA1GGBM02 7X7 LQFP32 TTJ 500 Pass YZMEA1EB7901 7X7 LQFP48 TTJ 500 Pass YZMEA1EB7B01 7X7 LQFP48 TTJ 500 Pass YZMEA1ENNA01 7X7 LQFP48 TTJ 500 Pass




Slide 48


2.8 Burn-in Yield:




YZMEA1EXME01 7X7 LQFP32 TTJ pass

YZMEA1GA6402 7X7 LQFP32 TTJ pass

YZMEA1GGBM02 7X7 LQFP32 TTJ pass

YZMEA1EB7901 7X7 LQFP48 TTJ pass

YZMEA1EB7B01 7X7 LQFP48 TTJ pass

YZMEA1ENNA01 7X7 LQFP48 TTJ pass

YZMEA1G50G02 10X10 LQFP64 TTJ pass

YZMEA1G50402 10X10 LQFP64 TTJ pass

YZMEA1G4K402 10X10 LQFP64 TTJ pass

YZMEA1EXME02 7X7 LQFP32 KESC pass

YZMEA1GA6401 7X7 LQFP32 KESC pass

YZMEA1GGBM01 7X7 LQFP32 KESC pass

YZMEA1EB7902 7X7 LQFP48 KESC pass

YZMEA1EB7B02 7X7 LQFP48 KESC pass

YZMEA1ENNA02 7X7 LQFP48 KESC pass

YZMEA1G50G01 10X10 LQFP64 KESC pass



Slide 49

YZMEA1G50G01 10X10 LQFP64 KESC pass

YZMEA1G50401 10X10 LQFP64 KESC pass

YZMEA1G4K401 10X10 LQFP64 KESC pass






TTTJ YZMEA1EXME01 7X7 LQFP32 500 Pass

TTTJ YZMEA1EB7901 7X7 LQFP48 500 Pass

TTTJ YZMEA1G50G02 10X10 LQFP64 500 Pass

KESC YZMEA1EXME02 7X7 LQFP32 500 Pass

KESC YZMEA1EB7902 7X7 LQFP48 500 Pass

KESC YZMEA1G50G01 10X10 LQFP64 500 Pass




LQFP package solderability test result refer to 9S08AW16A data. (Page15)




Slide 50


3.1 Conclusion

� Based on this report, 1M74K /2M74K passed all correlation requirements without any issues.

� TTTJ is capable to implement burn-in for S9S08DZ60 LQFP32&48 & LQFP64 package

3.2 Recommendation

� Burn-In for 1M74K /2M74K , LQFP32&48 & LQFP64(6300/6089/8426) can be released in

TTTJ.



51

TTTJ.






TM

24/09/2013, Sun Z.R

KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion

2M78G- S9S08DZ128 Correlation





53


1.1 Objective


for 2M78G. Complete list of affected parts is outlined in PCN15880.





1.2 Considerations



54






2.1 Introduction:

This report details the burn-in correlation plan and result of S9S08DZ128 LQFP48 & LQFP64 with correlation vehicle. So that the TrioTech-


and then processed in TTTJ, with the ambient burn-in temperature at 125C.

S9S08DZ128

Mask set: 2M78G

Production Line: G9FDZ28C/ G9FZDZ8B


• TTTJ

Hardware:







Slide 55



Burn-in Program(s) : dz128_48

dz128_64

• KESC

Hardware:






Burn-in Program(s) : dz128_48

dz128_64





TTTJ T1DE292411 YZMEA1EKVH01 S9S08DZ96F2VLF LQFP48 2M78G 500

TTTJ T1DE306771 YZMEA1EW4L01 S9S08DZ96F2VLF LQFP48 2M78G 500

TTTJ T1DE304361 YZMEA1EW4G01 S9S08DZ96F2VLF LQFP48 2M78G 500

TTTJ T1DE319521 YZMEA1G4KE02 S9S08DZ96F2CLH LQFP64 2M78G 500

TTTJ T1DE319541 YZMEA1G6J102 S9S08DZ96F2CLH LQFP64 2M78G 500

TTTJ T1DE319551 YZMEA1GDJ402 S9S08DZ96F2CLH LQFP64 2M78G 500

KESC T1DE292411 YZMEA1EKVH02 S9S08DZ96F2VLF LQFP48 2M78G 500

KESC T1DE306771 YZMEA1EW4L02 S9S08DZ96F2VLF LQFP48 2M78G 500

KESC T1DE304361 YZMEA1EW4G02 S9S08DZ96F2VLF LQFP48 2M78G 500

KESC T1DE319521 YZMEA1G4KE01 S9S08DZ96F2CLH LQFP64 2M78G 500

KESC T1DE319541 YZMEA1G6J101 S9S08DZ96F2CLH LQFP64 2M78G 500

KESC T1DE319551 YZMEA1GDJ401 S9S08DZ96F2CLH LQFP64 2M78G 500



Slide 56

KESC T1DE319551 YZMEA1GDJ401 S9S08DZ96F2CLH LQFP64 2M78G 500


2.2.1 Requirements:





Req’d per

Correlation

Plan,

(Y / N?)


Pattern Verify



Lot quantity: 1

Units per lot: 5


BI Duration: N/A

Y


to array or other

product module(s)


type of product.



57

BI Duration: N/A

Type of units: good

Site: TTTJ

Equipment

Release






Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TTTJ

YApproval by

manufacturing CAB.


Burn-in Board

Voltages



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



PE/TE and R&QA.


burn-in board.

Package Case

Temperature



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Y

Less than 15%

variation or to be

agreed by PE/TE and

R&QA.





overheating.



Slide 58

Type of units: good

Site: TTTJ and KESC

overheating.

Ambient

Temperature (Ta)


Lot quantity: 1


Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TTTJ and KESC

Y

Less than 10%

variation or to be

agreed by PE/TE and

R&QA.




Burn-in Board

Current


Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



and R&QA.




on full board.

Three Lot Burn-in

Check


burn-in failures

Lot quantity: 3

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ

Y

Address manufactur-


issues.


Burn-in Yield


yield

Lot quantity: 1






Slide 59


Temperature: BI Ta


Type of units: good

Site: TTTJ and KESC


PE/TE and R&QA.


Visual

Inspection



Y

Less than 2%

variation or agreed

upon by PE/TE and

R&QA.



Solderability

Test


YAs per

12MRM27364A





Table 1.



Unit 1 2M78G dz128_48 Bin2 Check Pass Pass










Slide 60






Conclusion: Passed requirment.






1) LQFP48


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V)

Delta from

Target (mV)

Empty VDUT1 6.00 5.98 20 5.99 10

VDUT3 6.00 6.00 0 6.00 0

Full VDUT1 6.00 5.99 10 5.98 20

VDUT3 6.00 5.98 20 5.98 20



61

2) LQFP64


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ(V)

Delta from

Target (mV)

Empty VDUT1 6.00 6.00 0 6.00 0

VDUT3 6.00 5.99 10 5.98 20

Full VDUT1 6.00 5.98 20 5.99 10

VDUT3 6.00 6.00 0 6.00 0









51

3 Feedthrough



Slide 62

4 2

Feedthrough

Connector

(Driver-side)



1) LQFP48




3 Center of BIB 125.80 125.80 0.00%



2) LQFP64




Slide 63



3 Center of BIB 125.40 125.40 0.00%















dz128_48 DZ128_48LD Full 0.3 0.3 0%



Slide 64

dz128_48 DZ128_48LD Full 0.3 0.3 0%

dz128_64 DZ128_64LD Full 0.3 0.3 0%






Lot Package Burn-

in Site

Lot Size Burn-in

Result

YZMEA1EKVH01 7x7 LQFP48 TTTJ 500 pass

YZMEA1EW4L01 7x7 LQFP48 TTTJ 500 pass

YZMEA1EW4G01 7x7 LQFP48 TTTJ 500 pass

YZMEA1G4KE02 10x10 LQFP64 TTTJ 500 pass

YZMEA1G6J102 10x10 LQFP64 TTTJ 500 pass

YZMEA1GDJ402 10x10 LQFP64 TTTJ 500 pass




Slide 65


2.8 Burn-in Yield:



Lot Package Burn-in

Site

Burn-in

Result

YZMEA1EKVH01 7x7 LQFP48 TTTJ pass

YZMEA1EW4L01 7x7 LQFP48 TTTJ pass

YZMEA1EW4G01 7x7 LQFP48 TTTJ pass

YZMEA1G4KE02 10x10 LQFP64 TTTJ pass

YZMEA1G6J102 10x10 LQFP64 TTTJ pass

YZMEA1GDJ402 10x10 LQFP64 TTTJ pass

YZMEA1EKVH02 7x7 LQFP48 KESC pass

YZMEA1EW4L02 7x7 LQFP48 KESC pass

YZMEA1EW4G02 7x7 LQFP48 KESC pass

YZMEA1G4KE01 10x10 LQFP64 KESC pass



66

YZMEA1G4KE01 10x10 LQFP64 KESC pass

YZMEA1G6J101 10x10 LQFP64 KESC pass

YZMEA1GDJ401 10x10 LQFP64 KESC pass

Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement




BI Site Final Test Lot # Pacakge Inspection Qty Visual Yield

TTTJ YZMEA1EKVH01 7x7 LQFP48 500 Pass

TTTJ YZMEA1G4KE02 10x10 LQFP64 500 Pass

KESC YZMEA1EKVH02 7x7 LQFP48 500 Pass

KESC YZMEA1G4KE01 10x10 LQFP64 500 Pass

Conclusion: All correlation lots VM yield variation less than criteria, passed requirement



LQFP package solderability test result refer to 9S08AW16A data. (Page15)




Slide 67


3.1 Conclusion

� Based on this report, 2M78G passed all correlation requirements without any issues.

� TTTJ is capable to implement burn-in for S9S08DZ128 LQFP48 & LQFP64 package.

3.2 Recommendation

� Burn-In for 2M78G, LQFP48 & LQFP64(6089/8426) can be released in new Burn-In Site

TTTJ.



68

TTTJ.






TM

30/Sep/2013, Guo Xinlei

KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion1M15D/2M15D- S9S08QD4 Correlation





70


1.1 Objective

� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site for

1M15D/2M15D. Complete list of affected parts is outlined in PCN15880.

� This report details the correlation result of below FSL part# to demonstrate that KES-

China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.



1.2 Considerations



71

� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and verified

by dual site correlation analysis.




2.1 Introduction:

This report details the burn-in correlation plan and result of S9S08QD4 SOICNB8 with correlation vehicle. So that the TrioTech-Tianjin(TTTJ) site can

burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site and then processed in

TTTJ, with the ambient burn-in temperature at 125C.

S9S08QD4

Mask set: 1M15D/2M15D

Production Line: G9DZQD4A

Package code: 0095

• TTTJ

Hardware:






Slide 72




Burn-in Program(s) : QD4

• KESC

Hardware:






Burn-in Program(s) : QD4




BI Site Wafer Lot # Final Test Lot # Device Part ID Mask/Rev Qty.

KESC ZHPC2A165900 YZME007T1P00 S9S08QD4J1MSC 1M15D 500

KESC ZHPC2A166200 YZME007T1M00 S9S08QD4J1MSC 1M15D 500

KESC ZHPC2A166300 YZME007T1J00 S9S08QD4J1MSC 1M15D 500

TTTJ ZHPC2A165900 YZME007T1N00 S9S08QD4J1MSC 1M15D 500

TTTJ ZHPC2A166200 YZME007T1K00 S9S08QD4J1MSC 1M15D 500

TTTJ ZHPC2A166300 YZME007T1H00 S9S08QD4J1MSC 1M15D 500



Slide 73


2.2.1 Requirements:





Req’d per

Correlation

Plan,

(Y / N?)


Pattern Verify



Lot quantity: 1

Units per lot: 5


BI Duration: N/A

Y


to array or other

product module(s)


type of product.



74

BI Duration: N/A

Type of units: good

Site: TTTJ

Equipment

Release






Temperature: BI Ta

BI Duration: N/A

Type of units: N/A

Site: TTTJ

YApproval by

manufacturing CAB.


Burn-in Board

Voltages



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



PE/TE and R&QA.


burn-in board.

Package Case

Temperature



Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Y

Less than 15%

variation or to be

agreed by PE/TE and

R&QA.





overheating.



Slide 75

Type of units: good

Site: TTTJ and KESC

overheating.

Ambient

Temperature (Ta)


Lot quantity: 1


Temperature: BI Ta

Type of units: good

BI Duration: N/A

Site: TTTJ and KESC

Y

Less than 10%

variation or to be

agreed by PE/TE and

R&QA.




Burn-in Board

Current


Lot quantity: 1


Temperature: BI Ta

BI Duration: N/A

Type of units: good

Site: TTTJ and KESC

Y



and R&QA.




on full board.

Three Lot Burn-in

Check


burn-in failures

Lot quantity: 3

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ

Y

Address manufactur-


issues.



yield

Lot quantity: 1Post BI yield within PDA



Slide 76

Burn-in Yield

Lot quantity: 1

Units per lot: 500

Temperature: BI Ta


Type of units: good

Site: TTTJ and KESC

Optional


limit or agreed up by

PE/TE and R&QA.


Visual

Inspection



Y

Less than 2%

variation or agreed

upon by PE/TE and

R&QA.



Solderability

Test


YAs per

12MRM27364A





Table 1.

SOIC NB8: Burn-in Board


Unit 1 1M15D QD4 Bin2 Check Pass Pass








Slide 77






1) SOIC NB8


(V)

KESC

(V)

Delta from

Target (mV)

TTTJ

(V)

Delta from

Target (mV)

Empty VDUT1 6.00 5.98 20 5.97 30

VDUT3 6.00 5.98 20 5.99 10

Full VDUT1 6.00 5.99 10 5.98 20

VDUT3 6.00 5.98 20 5.99 10



Slide 78




Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the

oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one socket

at the center of the burn-in board (see Figure 1). The thermocouples were epoxied to the top of the device.


51

4 2

3 Feedthrough

Connector

(Driver-side)



Slide 79





3 Center of BIB 125.20 125.10 0.08%




4 2











1) SOIC NB8




Slide 80


QD4 QD4 Full 0.35 0.35 0%






Lot Package Burn-

in Site

Lot Size Burn-in

Result

YZME007T1K00 SOIC NB8 TTTJ 500 pass

YZME007T1N00 SOIC NB8 TTTJ 500 pass

YZME007T1H00 SOIC NB8 TTTJ 500 pass




Slide 81


2.8 Burn-in Yield:



Lot Package Burn-in

Site

Burn-in

Result

YZME007T1M00 SOIC NB8 KESC pass

YZME007T1K00 SOIC NB8 TTTJ pass

YZME007T1P00 SOIC NB8 KESC pass

YZME007T1N00 SOIC NB8 TTTJ pass

YZME007T1J00 SOIC NB8 KESC pass

YZME007T1H00 SOIC NB8 TTTJ pass

Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement




Slide 82




BI Site Final Test Lot # Inspection Qty Visual Yield

KESC YZME007T1M00 500 Pass

TTTJ YZME007T1K00 500 Pass

Conclusion: All correlation lots VM yield variation less than criteria, passed requirement


2.10 Solderability Test Table 9 shoes the result of solderability test post burn-in. Note: Test were done using 20 sample parts type

Table 9.Solderability Test

BI Site Final Test Lot # Package Test Qty Result

TTTJ YZME007T1K00 SOIC NB8 20 Passed

SOIC sample photo:



Slide 83



3.1 Conclusion

� Based on this report, 1M15D/2M15D passed all correlation requirements without any

issues.

� TTTJ is capable to implement burn-in for S9S08QD4 SOICNB8 package.

3.2 Recommendation

� Burn-In for 1M15D/2M15D, SOICNB8(0095) can be released in new Burn-In Site



84

� Burn-In for 1M15D/2M15D, SOICNB8(0095) can be released in new Burn-In Site

TTTJ.

TM



PCN15880- Burn-In Site Expansion to TTTJ S9S08AW16A/AW60 ...

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Transcript of PCN15880- Burn-In Site Expansion to TTTJ S9S08AW16A/AW60 ...