PCB Manufacturer China-Hpcb.com

8/10/2019 PCB Manufacturer China-Hpcb.com

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Pre-engineering

Pattern imaging

Etching

Laminating

Drilling

Cu plating

Hole plugging

Pattern imaging

Lamination

Laser Ablation

Mechanical drilling

Pattern imaging

Cu plating

Solder Mask

Surface Finished

Routing

Visual inspection

Electric test

Shipping


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Pre-engineering

Pattern imaging

Etching

Laminating

Drilling


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Desmear

Cu plating

Hole plugging

Cu plating

Belt Sanding


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Lamination

Laser Ablation

Mechanical drilling

Cu plating

Pattern imaging


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Solder Mask

Gold plating

Routing

Electrical test

Pattern imaging


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Hole counter

Shipping

Visual inspection


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* Raw material (Thin Core,Copper,Prepreg...)

Raw MaterialRaw MaterialRaw MaterialRaw Material :::: FRFRFRFR----4 (4 (4 (4 (Difuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,Tetrafuntional))))

SupplierSupplierSupplierSupplier : EMC ,Nan: EMC ,Nan: EMC ,Nan: EMC ,Nan----YaYaYaYa

Sheet sizeSheet sizeSheet sizeSheet size : 36: 36: 36: 36*48*48*48*48 , 40, 40, 40, 40*48*48*48*48 ,42,42,42,42*48*48*48*48

Core ThicknessCore ThicknessCore ThicknessCore Thickness : 0.003: 0.003: 0.003: 0.003,0.004,0.004,0.004,0.004,0.005,0.005,0.005,0.005,0.006,0.006,0.006,0.0060.0080.0080.0080.008,0.010,0.010,0.010,0.010,0.012,0.012,0.012,0.012,0.015,0.015,0.015,0.015

0.0210.0210.0210.021,0.031,0.031,0.031,0.031,0.039,0.039,0.039,0.039,0.047,0.047,0.047,0.047

Copper FoilCopper FoilCopper FoilCopper Foil : 1/3: 1/3: 1/3: 1/3 oz,1oz,1oz,1oz,1/2/2/2/2 oz,1.0oz,1.0oz,1.0oz,1.0 oz,2oz,2oz,2oz,2 ozozozoz

PrepregPrepregPrepregPrepreg typetypetypetype : 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630


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1. Innerlayer (THIN CORE)

Laminate

Copper Foil

( )

COPPER FOILCOPPER FOILCOPPER FOILCOPPER FOIL

Epoxy GlassEpoxy GlassEpoxy GlassEpoxy Glass


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Photo ResistPhoto ResistPhoto ResistPhoto Resist

2. Dry Film Resist Coat

(/)


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3. Inner Artwork Expose

ArtworkArtworkArtworkArtwork


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4. Inner layer immage Develop



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5. Inner Layer Etch



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6. Inner Layer Strip Resist


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7. Oxide Coating


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8. Lay-up Building

1

1

2

3

4


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9. Lamination


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1

.

.

.

0.5

,4

0.

,4

0.5

10101010----12121212

0.5

,4

0.

,4

0.5


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10. NC Drilling


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11. Desmear & Copper Deposition


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12. Hole Plugging

13. Belt Sanding


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14. Copper ReductionOption

15. Belt SandingOption


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16. Dry Film Lamination (Outer layer)

Photo

Resist


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17. Outerlayer Expose


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18. After Exposed


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19. Outerlayer Develop


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20. Etch


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20. Strip Resist


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21. Build-up Layer Lamination

RCCRCCRCCRCC((((RRRResinesinesinesin CCCCoatedoatedoatedoated CCCCopperopperopperopperfoil)foil)foil)foil)


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22. Conformal Mask


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23.Conformal Mask


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24. Conformal Mask (for Etching)


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25. Conformal Mask


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26. Laser Ablation and NC Drilling


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(...)

Laser Microvia(Blind Via)

27. Mechanical Drill


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28. Desmear & Copper Deposition


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29. Outerlayer Pattern imaging)

)


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30. Solder Mask Process


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HPCB94V-0

R305

31. S/M Developing

32. Legend Printing


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33. Electroless Ni/Au , HAL_lead free and Etc.

R305

HPCB94V-0


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R305

34. Outline Profile and Electrical Testing

HPCB 94V-0


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R305

R305

36. Final Inspection

37. O.S.P. (Entek plus Cu_106A.)

HPCB 94V-0

HPCB 94V-0


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&

A = THROUGH VIA HOLE

B = BURIED VIA HOLE

C = One Level Laser Blind Via

&

D = Two Level Laser Via

BBBB----STAGESTAGESTAGESTAGE

FR-4 Core

FR-4 Core

BBBB----STAGESTAGESTAGESTAGE


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A = THROUGH VIA HOLE

B = BURIED VIA HOLE

C = BLIND VIA HOLE

D = BLIND HOLE MLB VIA


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Conventional PCB

FR-4

Build-up

Layer

Build-up

Layer

Photo-viaPhoto-Imageable Dielectric (PID)

FR-4

Conventional PTH

Conventional PTH


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Conventional PCB

Blind Via PCB

PTH

3 mil line

SVHIV

H

Chip-on-

SVH

FR-4

Conventional PTH

Conventional PTH


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PCB Manufacturer China-Hpcb.com

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