PCB LAMINATES - royalcircuits.com · laminates are a balance between signal performance and...
Transcript of PCB LAMINATES - royalcircuits.com · laminates are a balance between signal performance and...
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PCB LAMINATESPresented by Royal Circuit Solutionsand Insulectro
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Royal Circuit Solutions
Quick Turn PCB Specialist:Over the last 20 years, Royal Circuits has become the leader in quick-turn, high-tech PCB manufacturing – with no minimum order quantity and single day turn-times. Using the latest technology and cutting-edge equipment, we are building the Factory of the Future with the capability to manufacture any kind of circuit board – from simple 2-layers to complex HDI boards - fast.
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Royal Circuit Solutions
RigidHollister, CA Quick turn, turn key, FR4, Polyimide, HSD and RF. Heavy copper (> 3.0 oz). Proto to production.
Flex and Rigid FlexSanta Fe Springs, CAQuick turn, specialty applications
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Offer a wide range of PCB materials from premier suppliers. Isola, DuPont, LCOA, CAC, Pacothane, Oak Mitsui, JX Nippon
Maintain the critical mass required to provide better access to products and technical support for the electronics industry.
Provide Local Inventory
Customers access material in hours
On-site technical support
ACT! Accomplish Change Together Support fabricators with their customers
Provide support for proper material selection
Insulectro: Electronic Materials
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Who needs a PCB?
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The Grundig: It has no PCB
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Going back to the 1940’s
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Materials for many technology Applications
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Design Success• PCB’s are no longer simple replacements for wires.
• They are an integral part of the design.
• You don’t need to be material science experts.
• Many of the new materials bring technology and/or performance advantages.
• We are here to help.
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PCB Rigid Laminates
Each component plays a role in providing the right properties for the design.
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Common Thin Core Construction
½ oz copper foil
Core dielectricTypically 3.0 to 8.0 mils
1 oz copper foil
Signal Circuitry
Plane
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What Royal Circuits does with the material
Blank layer , copper is on both sides with laminate (dielectric) in the middle.
After etching the copper in a pattern, the laminate in the middle is revealed. The copper is coated with a brown bond treatment.
SideView
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Copper clad thin cores are stacked to make a complex web of circuits.
6 Layer PCB 72 layer PCB
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Copper plating brings all of the layers together
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Copper clad thin cores are stacked to make a complex web of circuits.
Because of these…. Sometimes we
need to do this
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Some Important PROPERTIES
GLASSTRANSITION
TEMPERATURE
DECOMPOSITIONTEMPERATURE
COEFFICIENTOF THERMALEXPANSION
DIELECTRICCONSTANT
DISSIPATIONFACTOR
Dk DfTdTg
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Why and how we choose a PCB laminate
Impedance (Controlled Impedance)– Dk (dielectric constant)– Thickness
Signal Loss (loss tangent/Df dissipation factor)– Df of resin and glass
Skew Control– Spread glass, Dk matching
Embedded Passives– Buried capacitance, buried resistors
Cost and Availability
Cost vs performance to
meet your requirements
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Dk – Dielectric Constant
- Used for obtaining proper impedance, signal properties
- Often spec’d over a range because exact value will vary even within the same family depending on dielectric thickness and glass to resin ratio.
- Also dependent on temperature, moisture and frequency used in the design.
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PCB Dielectric Constant
- While the materials have a Dk rating, PCB fabrication requires the combination of “building blocks” such as prepreg and thin cores.
- Prepreg type, resin content and circuit design can have Dk effects.
- Your fabricator uses design software combined with use history to create effective stack-ups.
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So Many Materials
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Rigid Laminate: Glass Fabric
Standard MS GlassE-Glass Low Dk E-Glass Low Dk
Very Common
Excellent resin fill
Good for heavy copper
No good for skew at higher speeds
Same as E-glass, but with lower dielectric
constant.
Low signal skew
Good for Diff pairs
Very good thickness control
Same as MS E-glass, but with lower
dielectric constant.
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Fiberglass Standard Weave
SPECSAbout 2.0 mils
Great for fill of heavy coppers.
Least dimensionally stable.
106
SPECSAbout 2.5 milsGood for fill.
1080
SPECS3.0 to 3.5 mils
Some fill propertiesGood stability
2113
SPECS7.0 to 8.0 mils
Good for building thickness.
Best for dimensional stability.
7628
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Fiberglass Spread Weave
SPECSAbout 2.0 mils
Great for thickness controlGood for laser drilling
Low signal skewNot good for filling
1067
SPECSAbout 3.0 Mils
Great for thickness controlGood for laser drilling
Low signal skewNot good for filling
1086
SPECS3.0 to 4.0 milsAlso low skew
Great for thickness control
3313
SPECS5.0 to 6.0 milsAlso low skew
Great for thickness control
1652
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24
Differential Pairs and Skew
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PrePreg Skewed from glass weave 22.5°
38” wide prepreg, 81.9 linear inches for 4- 22.5° 18x24 sheets21.6 square feet to yield 12 square feet. (55.5% yield)
Helps with skew, but
very bad for cost.Material
Web
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Your PCB Fabricator
PCB Building BlocksYour fabricator will make recommendations for the best stack-up based on the design.
For example: An HSD design with 2 oz power planes will need open weave prepreg between these layers, not spread glass.Spread glass does not fill as well, and it’s also not needed between planes anyway (no need to reduce signal skew).
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Other Properties
Dissipation FactorA material property that characterizes signal loss. Resin, glass and copper foil all play a roll in this.
UL RatingUL-796 covers PWBUL-94 covers flame ratingUL 94-V0 is most commonOther: V1, V2, HB, etc.
Moisture AbsorptionUsually as a weight percent.Impacts assembly, Dk and Df
Time to DelaminationTest to determine thermal robustness. Sample are heated and kept hot until failure.
Df
Some materials from the same supplier are in the same UL family
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How Digital Designers Look at Materials
•Eye Patterns– Tells how well a signal is
transmitted through a link.– Random bits are driven and
averaged.– Variation in the x axis is
related to timing variations (jitter)
– Variation in the y axis is related to amplitude variations (noise)
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4” Stripline FR4
1 Gbps 3 Gbps 5Gps
8 Gbps 10 Gbps 12.5 Gbps
Using a lower loss material will open the “eye” at higher speeds.
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Combination of the following;Material loss (Df)Conductor (Copper Trace)
Trace roughnessTrace width and thicknessTrace Length
Total loss = Dielectric loss + Conductor Loss
• Signal integrity is often the most important need in a
design.
• As speed increases, loss becomes more important.
The same circuit at higher speeds will have higher loss.
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Overview: Resin Types
Type Properties ApplicationsMultifunctional
EpoxyThermoset
Easy to processStandard PCB
Most economicalPolyimide Thermoset
Very High TgHigh operating temp
Mil/AeroPPO/PPE
BlendsThermoset
Low loss (Df) and low DkProcessing can be easy to hard
High Speed Digital RF
PTFE ThermoplasticVery low Dk
Very high lamination temp
High Speed DigitalRF
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FR4 Material
FR = Flame Retardant- A wide variety from low Tg (not suitable for lead-free) to high Tg
like FR408HR (190°C)
- All epoxy based, but be specific on type
- Lead free specify Tg >170°C and Td (decomp) >325°C
- Some types stocked in house
- Heavy (thick) coppers available
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Unfilled vs. Filled resin system
33
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High Speed Material- Resin chemistry and glass type (if used) provide higher signal
performance over FR4
- Dissipation Factor & Dielectric constant are important considerations. Dk is <4.0 and Df is <0.010
- Low profile copper (HVLP) provides better results (Lower Loss)
- Get stack-up from VENDOR for future revisions
- Insulectro I-Tera MT40, FR408HR and I-Speed
- Nelco 4000-13
- Rogers RO4003
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High Frequency Material- RF designs
- Lowest Df and consistent Dk – Low Dk glass
- Often hybrid boards with one piece of high speed laminate and rest FR4
- Ceramic Rogers RO4000
- Teflon based Rogers RO3000 and Taconic
- I-Tera MT40
- Astra MT77
I-Tera MT40 and Astra MT77 laminate like and are highly compatible with FR4
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Electrodeposited Copper Foil Production
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Conductor (Cu Foil)As frequency / bit rate increases, the copper foil topography should be considered.
When more of the signal travels on the surface of the conductor, the rougher the surface, the higher the loss.
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Copper Roughness Impact
• When the roughness of the copper surface becomes close to the wavelength of the signal, the loss increases.
• This begins to be a big factor at frequencies of 10 GHz and higher.
• The benefits of a low loss laminate can be undone with rough copper.
Standard VLP2
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Copper Foil Types
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Low Profile copper Reduces Signal lossSEM’s of copper foil surfaces from
standard to VLP2
High performance laminates are a balance
between signal performance and
thermomechanical performance.
Yes, these are at the same magnification.
Typically, HVLP or VLP2 coppers come at a cost
premium
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Polyimide Material
- Very high glass transition temperature(>240°C) and low CTE
- High temperature / High reliability applications
- Able to do lots of repeated soldering
- Brittle
- Low outgassing
- Hygroscopic
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Important Questions• Signal loss: High speed digital (>2 GHz) , RF or both?
• Density
• Impedance control: Dk, overall thickness and layer count?
• High operating temperature?
• High Power: Heavy copper (>2.0 oz.)?
• High Voltage?
• Special mechanical requirements?• Flexibility, weight?
• Availability? Cost?
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Other PCB Technology• Embedded Capacitors
• Embedded Resistors
• Screenable Components
• Z-Axis Paste interconnets
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mSAP• Modified Semi-Additive Process
• Uses Ultra-Thin Foil
• Photo resist and copper plating forms circuit traces
• Below are 15/15 and 10/10 L/S plated to about 15 microns thick
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Flex materials Overview
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Kapton®
•Kapton was first produced in the 60’s
•Once used in space suits as a micrometeoriod barrier
•Still extensively Used in space
•LF adhesive was first produced around 1976
•Basis of many flexible PCB’s
•More applications in Rigid PCB
Apollo/Skylab A7L suit
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Pyralux®
•Aerospace
•Outer space
•Medical
•Exploration
Mars Rover
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Flex PCB Types
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Flexible Circuit Materials
Polyimide film is the “backbone” of flexible PCB’s– Usually Kapton Film, different from rigid
polyimide– Very good high temperature performance– Very good electrical performance– Cost goes up dramatically with thickness
above 2.0 mils – Can be used in rigid PCB’s for thin layers; i.e.
buried capacitance– Layers are joined with glass free acrylic or
epoxy adhesives
Most flexible copper clads will use RA (rolled annealed) copper foil.
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Flex Materials
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Questions?Email [email protected], [email protected] [email protected] with additional questions
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Thank you!