Pb-Free BGAs in SnPb Assembly Process Project 08
Transcript of Pb-Free BGAs in SnPb Assembly Process Project 08
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Pb-Free BGAs in SnPb Assembly Process Project
Presented By:
Project Chair: Robert Kinyanjui, Ph.D. Sanmina-SCI Corporation
Project Co-Chair: Quyen Chu, Jabil
August 2008
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Project MotivationProject Motivation
• The Effect of the European Union (EU) directive on
Reduction of Hazardous Substances (RoHS) has created
supply chain constraints on SnPb components availability especially for the RoHS exempted sector of the industry
• This has heightened the need for soldering Pb-free SnAgCu BGA solder ball terminations in a Sn-Pb soldering
process without yield loss or reliability impact
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Project ScopeProject Scope
• For companies choosing to take the RoHS exemption and
continue to manufacture SnPb products beyond July 1,
2006, there will be a growing issue with the lack of availability of SnPb components
• Many companies may be compelled to use Pb-free BGAs in
a SnPb process, for which the process and reliability have
not yet been characterized
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ObjectivesObjectives
• Phase 1
– Preliminary determination of lower boundary of process window for soldering Lead-free SnAgCu BGA in SnPb solder paste
– Establish process boundary condition for Phase 2 in-depth mixing level characterization and reliability understanding
• Phase 2
– Characterize homogeneity of Lead-free SnAgCu BGAs in a SnPb process with the following considerations:
• Package Size/Ball Volume
• Reflow Temperature
• Time Above Liquidus
• Solder Paste Volume
• Phase 3
– Characterize thermal stress integrity of various mixing level of LF SAC BGA in SnPb solder paste through accelerated temperature cycling (ATC)
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Phase 1 Preliminary Investigation of Mixing Level
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Overview of the Phase 1Overview of the Phase 1
• Phase 1 Objectives
– Preliminary determination of lower boundary of process window for soldering LF BGA in SnPb solder paste
– Establish process boundary condition for Phase 2 in-depth mixing level characterization and reliability understanding
• DOE Considerations
– Varying peak temperatures from: 205, 210, 215, 220, and 225C
– Stencil considerations: 6mil thick and with 10% reduction in stencil-to-pad opening
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Mixed Alloy Solder Joints for a PBGA313 PackageMixed Alloy Solder Joints for a PBGA313 Package
• Observations
– Reflow temperature of 205C was determined to be the lower cliff that would provide marginal solder joint formation
– A peak reflow temperature of 210C and above should be primary focus for next phase development
Reflow @ 225oCReflow @ 205oC
Pb Elemental Map
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Phase 2Mixed Solder Joint Characterization
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ObjectiveObjective
• Characterize homogeneity of lead-free BGAs in a SnPb
process with the following considerations:
– Package size/ball volume
– Reflow Temperature
– Time Above Liquidus
– Solder paste volume
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3Perimeter80.5132A-CTBGA132-0.5mm-8mm
3Array190.8288A-CABGA288 0.8mm-19mm
3Perimeter231.00324A-PBGA324-1.0mm-23mm
3Perimeter451.27600A-SBGA600-1.27mm-45mm
Quantity per
Board
Ball AlignmentSize(mm)
Pitch(mm)
I/OComponent Part Numbers
Note:
• SnPb components
of each type were
used for baseline
run. 1.0mm
PBGA324
0.8mm CABGA
0.5mm CTBGA132
1.27mm
SBGA600
Pb-free BGA ball alloy: SAC405
Components ConsiderationComponents Consideration
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Populated Test VehiclePopulated Test Vehicle
• PCB Dimensions:
–6.800” x 4.075” x 0.093”
• Finish
–Electroless Nickel
–Immersion Gold (ENiG)
–Copper OSP
• Number of Layers
–8 Internal board Layers
• Thermal Properties
–Tg = 170C
–Td = 340C
Test vehicle populated with three of each of
the four types of components used
SBGA
600
PBGA324
CABGA288
CTBGA132
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Assembly ConsiderationAssembly Consideration
• Assembly Setup
– Two thermocouples were placed at the center and corner joints of each component type on a sample test board
– Five profiles were generated
• Peak Temp: 210C, 215, and 235C
• Time Above Liquidus (TAL): 60, 90, 120sec
• Stencil
– 6 mil foil thick
– Two aperture openings (1:1 and 10% Reduction)
• For the 0.5mm pitch component, the same aperture opening was
used for better paste release
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Summary of Assembly MatrixSummary of Assembly Matrix
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Representative Reflow ProfileRepresentative Reflow Profile
Reflow Profile Conditions: Peak Temp. = 120oC; TAL = 60sec
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Solder Joint Inspection after AssemblySolder Joint Inspection after Assembly
• A representative solder joint formation for the SBGA600 component reflowed at peak temperature of 210oC with 120 seconds above liquidus (Profile # 3)
• NOTE: At 120 TAL, the degree of mixing for the SBGA600 package between the SAC solder ball alloy and the SnPb solder paste appears to be partially mixed.
Non-uniformSolder jointmicrostructureMixed
Non
Mixed
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Initial PCBA AnalysisInitial PCBA Analysis
• Analysis of as-reflowed BGA solder joints integrity through dye & pry and metallography
– Determine the solder joint structure
– Examine the degree of mixing between SnPb and SAC solder alloys
– Characterize the solder joint height/diameter
Dye & Pry
Metallography
Direction in reflow Oven
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Representative Dye & Pry ResultsRepresentative Dye & Pry Results
1.0mm PBGA324
0.8mm CABGA288
PCB Side
Package Side
• No dye intrusion was observed no signs of open joints
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Effect of Package Size (Pitch)Effect of Package Size (Pitch)
1.0mm
PBGA324
1.27mm
SBGA600
0.5mm
CTBGA132
0.8mm
CABGA288
Peak Temp: 210C and TAL: 60sec
The extent of alloy mixing is observed
to increase with increasing ball-to-
paste ratio for a peak temperature of
210oC and for all the TALs tested.
It was noted that approximately 40%
solder ball-to-paste volume ratio is
needed in order to achieve 100%
alloy mixing.
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The degree of mixing increases linearly
with the time above liquidus of 60, 90,
and 120secs for the 1.27,1.00 and
0.8mm pitch packages.
The Effect of Time Above The Effect of Time Above LiquidousLiquidous
1.0mm PBGA324 1.27mm SBGA600
TAL:120secTAL: 60sec TAL:120secTAL: 60sec
0%
20%
40%
60%
80%
100%
40 60 80 100 120 140
Time Above Liquidus (sec)
Pe
rce
nt
Mix
ed
(%
)
1.2 mm
1.0 mm
0.8 mm
Linear (0.8 mm)
Linear (1.0 mm)
Linear (1.2 mm)
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Little or no discernable difference was
observed in the degree of mixing for the
largest package (SBGA600) with pitch of
1.27mm.
However for the 1.0mm and 0.8mm pitch
BGAs, it was generally observed that
increasing the paste volume from a 90%
to 100% aperture opening increased the
degree of mixing.
90% Paste Volume 100% Paste Volume
1.0mm PBGA324 1.27mm SBGA600
90% Paste Volume 100% Paste Volume
0%
20%
40%
60%
80%
100%
120%
60 90 60 90 60 90
1.2 1.0 0.8
Package Pitch (mm), TAL (sec)
Pe
rce
nt
Mix
ed
(%
)
Aperture Opening 90%
Aperture Opening 100%
Effect of Paste VolumeEffect of Paste Volume
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Tpeak = 215C,
TAL = 60sec
Increasing the peak temperature by 5oC
with TAL = 60 sec, leads to an increased
degree of mixing for both PBGA324 and
SBGA600.
The extent of mixing increases from 50% to
100% for the PBGA324 package
1.0mm PBGA324 1.27mm SBGA600
Tpeak = 210C,
TAL = 60sec
0%
20%
40%
60%
80%
100%
120%
1.2 1.0
Package Pitch (mm)
Perc
en
t M
ixed
(%
)
210C, 90%apt
210C, 100%Apt
215C, 90%Apt
Tpeak = 215C,
TAL = 60sec
Tpeak = 210C,
TAL = 60sec
Effect of Peak TemperatureEffect of Peak Temperature
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Summary of ObservationsSummary of Observations
• The larger the package/ball volume, the lower the degree of mixing
observed.
– CTBGA132 (0.5mm Pitch) showed a 100% mixing at 210C and 60sec time
above liquidus
• Doubling the time above liquidus (from 60sec to 120sec), increased the
degree of mixing (~30% increase in mixing was observed).
• For the small packages (reduced SAC solder ball volume), increased
paste volume corresponds to increased degree of mixing.
– However, for the largest (SBGA600) package no significant change in mixing
was observed.
• Increasing the peak temperature from 210C to 215C led to a significant
increase in the degree of mixing (almost doubled) the extent of mixing.
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Phase 3Mixed Solder Joint Reliability
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ObjectiveObjective
• Characterize thermal stress integrity of various mixing
level of LF BGA in SnPb solder paste
– Accelerated thermal cycling (ATC) of -40C to 125C
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459
309060215Sn-PbSn-Ag-Cu8
609060235Sn-Ag-CuSn-Ag-Cu7(Control)
6390120210Sn-PbSn-Ag-Cu4
6010090210Sn-PbSn-Ag-Cu6
609090210Sn-PbSn-Ag-Cu3
6310060210Sn-PbSn-Ag-Cu5
609060210Sn-PbSn-Ag-Cu2
639060210Sn-PbSn-Pb1(Control)
OSPENIG
Number of Boards for ATC Testing (Range: -40oC to
125°C)
Stencil Aperture Opening
(%)
Time Above Liquidus (TAL)
(seconds)
Peak Temp. (°C)Solder Paste Alloy
BGA Ball AlloyAssembly Process Flow
Assembly Test Matrix for ATC Test Assembly Test Matrix for ATC Test
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Mixed/OSP/90% FixedTAL varies, 60, 90, 120
Characteristic life:
η60 =1055η90 =1267η120 =1331
• Observation:
– The longer the TAL, the better the solder joint reliability • Solder joint reliability is highest for TAL =120sec > 90 sec > 60 sec
Impact of Time Above Impact of Time Above LiquidusLiquidus on CTBGA132 SJRon CTBGA132 SJR
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CTBGA132
The number of cycles to 63% solder joint failure for the CTBGA132 packages
increased with increasing TAL
Impact of TAL on Characteristic Life Impact of TAL on Characteristic Life -- CTBGA132 PackageCTBGA132 Package
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Number of 1% Failures for Mixed CTBGA132 PackageNumber of 1% Failures for Mixed CTBGA132 Package
TAL = 60secs
TAL =120secs
TAL = 90secs
Reflow profile: 210oC, OSP, 90% solder paste
Cycle
s t
o F
ailu
re
• Observations:
– The 60 seconds TAL exhibits the least number of cycles at 1% cumulative failure.
– The number of cycles to failure increases by about twice when TAL is increased from 60 to 120 seconds
CTBGA132
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Solder Joint Observed Failure ModesSolder Joint Observed Failure Modes
Optical & SEM images showing the
most commonly observed failure mode
for the CTBGA132 package
IMC Layer
The solder joints are completely open on the package side while the
crack is only partial on the board side
Representative Solder Joints for the CTBGA132 PackageRepresentative Solder Joints for the CTBGA132 Package
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Mixed/OSP/90% Fixed
TAL varies, 60, 90, 120
Characteristic life:
η60 =473
η90 =446
η120 =619
η60 = 1007(SnPb)
η60 = 1281 (SAC)
Impact of Time Above Impact of Time Above LiquidusLiquidus on CABGA288 SJRon CABGA288 SJR
The solder joint reliability of the mixed joints is lower than that of “pure”
SnPb or SAC
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Time Above Liquidus (secs)
Mixed Solder Joints
SnPb
Chara
cte
ristic L
ife
(Cycle
s t
o f
ailu
re @
63%
)
LF
PCB Finish: OSP
and Peak temp.
= 210C
The “pure” solder joints outperforms mixed solder joints
Impact of Time Above Impact of Time Above LiquidusLiquidus on CABGA288 SJRon CABGA288 SJR
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Number of 1% Failures for the CABGA288 PackageNumber of 1% Failures for the CABGA288 Package
• NOTABLE OBSERVATIONS:
– At 1% failure, “pure” SnPb and “pure” SAC joints are better than mixed SnPb/SAC solder joints• “Pure” SnPb outperforms mixed joints by ~ 5 times
• “Pure” SAC outperforms mixed joints by ~ 3 times
Mixed
Pure
60 90 120 60 60
Cycle
s to F
ailu
re
SAC
SnPb
Test Condition: 210°C profile, OSP,
10% paste volume reduction
CABGA288Time Above Liquidus (secs)
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Optical images showing the most commonly observed failure mode for
the CABGA288 package
The solder joints are completely open on the package side while the crack is only
partial on the board side
Representative Solder Joints for the CABGA288 PackageRepresentative Solder Joints for the CABGA288 Package
Solder Joint Observed Failure ModesSolder Joint Observed Failure Modes
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These fractures could not be confirmed by electrical testing during thermal cycling.
The most commonly observed joint fractures on the PBGA324 and SBGA600
packages
Representative Solder Joints for the PBGA324 and SBGA600 packages
Solder Joint Observed Failure ModesSolder Joint Observed Failure Modes
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018/189/99/918/189/918/1818/1818/189/918/18CTBGA132
018/1818/189/918/189/918/1818/1818/189/918/18CABGA288
0/1817/180/180/90/180/90/180/180/189/90/18PBGA324
0/184/180/180/90/180/90/180/180/189/91/18SBGA600
8765B5A4B4A321B1AAssembly Process Flow
OSPOSPOSPENIGOSPENIGOSPOSPOSPENIGOSPPCB Finish
Number of Failed Packages After 3559 ATC testing Cycles
• NOTABLE OBSERVATIONS:
– All the standard and mixed alloy CTBGA132 and CABGA288 packages failed at the end of the ATC testing
– All mixed alloy, SBGA600 and PBGA324 packages survived at the end of ATC testing
A summary of Number of Failed Packages at the end of 3559 Cycles
Decre
asin
g P
ackag
e S
ize
Electrical Testing Results at the End of ATC TestElectrical Testing Results at the End of ATC Test
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Summary of ObservationsSummary of Observations
• The CTBGA132 and the CABGA288 packages showed a significant number of failures across all of the assembly test conditions, while no failures were recorded for the PBGA324 and SBGA600 packages for the mixed alloy assemblies.
• The following conclusions are drawn from this work:
– For the smallest, CTBGA132 package, all three TAL conditions hadfull solder alloys mixing.
• The solder joint reliability of the fully mixed test assemblies for all TALs(= 60, 90, and 120 seconds) exceeds that of Sn-Pb and is at least equal to that of pure SAC.
– For the larger, CABGA288 package, increasing the TAL does not provide complete solder alloy mixing.
• The solder joint reliability of all TALs tested (TAL = 60, 90, and 120 seconds) is less than that of both pure Sn-Pb and pure SAC.
• The longest TAL condition displayed a better solder joint reliability among the three TAL conditions.
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Summary of ObservationsSummary of Observations
• For the two largest packages, PBGA324 and SBGA600, despite lack of complete solder alloy mixing, the solder joint reliability was better than that of either “pure” Sn-Pb or “pure” SAC solder joints.
• Full Sn-Pb and SAC solder alloys mixing is not a sufficient condition toguarantee good reliability.
– For small packages with low fatigue life requirements, full solder alloys mixing and homogeneous microstructure is required
• while for large packages with long fatigue/extended life requirement, full solder alloy mixing is not necessary for acceptable solder joint reliability.
• In general, the OSP-copper had better performance than the ENIG surface finish. However, the failure locations were almost exclusively at the package side of the solder joint and within the bulk solder.
– At this time no microstructural correlation has been identified linking surface finish and improved or reduced reliability.
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Thank You
Questions?
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Acknowledgement Acknowledgement