Page 1 , Total 25 Pages - SparkFun...

, T otal 25 Pages

, Total 25 Pages

ADH Technology Co. Ltd.

OLED Module

AOC001602AYPP5N00001

WEB: http://www.adh-tech.com.tw E-mail: [email protected]

http://www.adh-tech.com.tw/

mailto:[email protected]

, Total 25 Pages

Contents

No. Item Page

1. Revision History 4

2. General Specification 4

3. Module Coding System 5

4. Interface Pin Function 6

5. Outline Dimension 7

6. Absolute Maximum Ratings 9

7. Electrical Characteristics 9

8. Optical Characteristics 10

9. OLED Lifetime 10

10. Reliability 11

11. Inspection specification 13

12. Precautions in use of Modules 20

, Total 25 Pages

1. Revision History

DATE VERSION REVIS ED PAGE NO. Note

2010/8/13 2011/7/1

2012/08/28

1 Firs t iss ue 2 Change vers ion 3 7 Correct count draw ing.

9 Mod if y CIE

17 Mod if y picture

2. General Specification

The Features is des cribed as follow:

„ Module dim ens ion: 80.0 x 36.0 x 10.0 (m ax.) m m 3

„ View area: 66.0 x 16.0 m m 2

„ Acti ve area: 56.95 x 11.85 m m 2

„ Num ber of dots : 16 Character x 2 Line

„ Pixel s ize: 0.55 x 0.65 m m 2

„ Pixel pitch: 0.60x 0.70 m m2

„ Character s ize: 2.95 x 5.55 m m2

„ Character pitch: 3.6 x 6.3 m m 2

„ Duty: 1/16

„ Em itting Color: Yellow

, Total 25 Pages

3. Module Coding System

1 2 3 4 5 6 7 8 9 10 11 12 13

A O C 001602 A Y P P 5 N 0 0 001

Item Description

1 A：ADH Technology Co. Ltd.

2 O：OLED

3 Dis play Type: C→Character Type, G→ Graphic Type

4 Num ber of dots ：16 Characters, 2Lines.

5 Serials code

6 Em itting Color

A： Am ber R：RED

B：Blue Y： Yellow

G：Green W：White

7 Polarizer P：With Polarizer; N: Without Polarizer

8 Dis play Mode P： Passive Matrix ; A: Acti ve Matri x

9 Driver Voltage 3: 3.0 V; 5: 5.0V

10 Touch Panel N： Without touch panel; T: With touch panel

11 Species 0:Normal, 1:Sunlight readable, 2:Transparent, 3:Flexible, 4:Lighting

12 Grade code 13 Serial No. 001: Sales code

, Total 25 Pages

4. Interface Pin Function

Pin No. Symbol Level Description

1 VSS 0V Ground

2 VDD 5.0V Supply Voltage for logic

3 NC －

4 RS H/L H: DATA, L: Ins truction code

5 R/W H/L H: Read(MPU→Module) L: Write(MPU→Module)

6 E H,H→L Chip enable s ignal

7 DB0 H/L Data bit 0








15 NC －

16 NC －

, Total 25 Pages

36.0

0

.5

25

.2

31

.0

18.3

5.7

2.5

6.3

5.5

5

0.7

5

2

0.7

0.6

5

11.8

5(A

A)

16.0

(VA

) 10.3

5. Outline Dimension

4.95

7.55

4.23

80.0 0.5

71.2 66.0(VA)

56.95(AA)

1 Vss

2 Vdd

3 NC

8.0 P2.54*15=38.1

1.8 16- 1.0PTH

4.8

10.0 Max 4 RS

5 R/W

6 E 1 16 7 DB0

8 DB1

9 DB2

10 DB3

40.55

2. 5 75.0

3.6

4- 2.5 PTH

4- 5.0 PAD

1.6

11 DB4

12 DB5

13 DB6

14 DB7

15 NC

16 NC

2. 95 0.6 0.55

0.65

The non-specified tolerance of dimension is 0.3 mm .

DOT SI ZES SCALE 5/1

, Total 25 Pages

, Total 25 Pages

6. Absolute Maximum Ratings

Item Symbol Min Max Unit Notes

Operating Tem perature TOP -40 +80

Storage Tem perature TST -40 +80

Input Voltage VI -0.3 VDD V

Supply Voltage For Logic VDD-VSS -0.3 5.3 V

7. Electrical Characteristics

Item Symbol Condition Min Typ Max Unit

Supply Voltage For Logic VDD-VSS － 3.0 5.0 5.3 V

0.9 Input High Volt. VIH －

VDD － VDD V

Input Low Volt. VIL － GND － 0.1VDD V

0.8 Output High Volt. VOH IOH=-0.5m A

VDD － VDD V

Output Low Volt. VOL IOL=0.5m A GND － 0.2 VDD V

Supply Current IDD VDD=5V － 30 － mA

CIEx( Yellow) － x,y(CIE1931) 0.43 0.47 0.51 －

CIEy( Yellow) － x,y(CIE1931) 0.46 0.50 0.54 －

, Total 25 Pages

8. Optical Characteristics

Item Symbol Condition Min Typ Max Unit

(V)θ 160 deg View Angle

(H)φ 160 deg

Contras t Ratio CR Dark 2000:1 －－

T ris e － 10 µs Res pons e Time

T fall － 10 µs

Supply Voltage For Logic 5V

50% Check Board Brightness

With polarizer

150m W(5V*30m A)

125 nits

Note1

Supply Voltage For Logic 3V

50% Check Board Brightness

With polarizer 80 nits

Notes : 1.When random texts pattern is running , averagely , at any ins tance , about 1/2 of pixels

will be on.

2. You can to us e the display off m ode to m ake long life.

9. OLED Lifetime

ITE M Conditions Typ Rem ark

Operating Life Tim e

Notes :

Ta= 25 /Initial 50% checkboard

brightness 125nits

100,000 Hrs Note

1. Sim ulation pattern for operation tes t: interchanging with 50% checkboard.

The brightness decay does not exceed 50%

2. You can us e the dis play off m ode to m ake long life.

3. The average operating lifetime at room temperature is es tim ated by the accelerated operation

at high tem perature conditions .

, Total 25 Pages

10. Reliability

Content of Reliabilit y Test

Env ironmental Test

Test Item Content of Test Test Condition Applicable Standard

Hi gh

Temperature storage

Hi gh

Temperature Operation

Low

Temperature Operation

Hi gh

Temperature/ Humi di ty

Storage

Endurance test appl yi ng the high

storage temperature for a long ti me.

Endurance test appl yi ng the electri c stre ss (Vol tage & Current) and the

thermal stress to the el ement for a long time.

Endurance test appl yi ng the electri c

stre ss under l ow temperature for a l ong time.

Endurance test appl yi ng the high

temperature and high humi di ty storage for a l ong ti me.

Endurance test appl yi ng the l ow and

high temperature cycle.

80

240hrs ——

80

240hrs ——

-40

240hrs ——

60,90%RH

240hrs ——

Temperature

Cycl e -40 25 80 -40/80

—— 100 cycles

Mechani cal Test

30min 5mi n 30min

1 cycle

10~22Hz→1.5mmp-p

Vibrati on test Endurance test appl yi ng the vi brati on

during transportati on and usi ng.

Constructi onal and mechani cal

22~500Hz→1.5G ——

Total 0.5hrs

50G Half si gn

Shock test

Atmospheri c

pressure test

Others

endurance test appl yi ng the shock during transportati on.

Endurance test appl yi ng the atmospheri c pressure during transportation by ai r.

wave 11 msedc ——

3 ti mes of each di rection

115mbar

40hrs ——

Stati c electri ci ty test

Endurance test appl yi ng the electri c stre ss to the termi nal .

VS=800V,RS=1.5kΩ CS=100pF ——

1 ti me

***Supply voltage for logic s ys tem =5V. Supply voltage for LCD s ys tem =Operating voltage at

25

, Total 25 Pages

Test and measurement conditions

1. All m eas urements s hall not be s tarted until the s pecim ens attain to tem perature s tability. After

the com pletion of the des cribed reliability tes t, the s am ples were left at room temperature for

2 hrs prior to conducting the failure tes t at 23±5°C; 55±15% RH.

2. All-pixels -on is used as operation tes t pattern. 3. The degradation of Polarizer are ignored for High Tem perature s torage, High

Temperature/Hum idity Storage, Tem perature Cycle Evaluation criteria

1. The function tes t is OK.

2. No obs ervable defects .

3. Luminance: > 50% of initial value.

4. Current cons umption: within ± 50% of initial value. APP ENDIX :

RESIDUE IM AGE

Becaus e the pixels are lighted in different time, the lum inance of active pi xels may reduce or

differ from inactive pixels . Therefore, the res idue image will occur. To avoid the res idue im age,

every pixel needs to be lighted up uniform ly.

, Total 25 Pages

11. Inspection specification

NO Item Criterion AQL

1.1 Missing vertical, horizontal segment, segment contrast def ect. 1.2 Missing character, dot or icon. 1.3 Display malf unction.

01 Electrical Testing

Black or bright spots

1.4 No f unction or no display. 1.5 Current consumption exceeds product specif ications. 1.6 View ing angle def ect. 1.7 Mixed product types. 1.8 Contrast def ect.

2.1 Bright and black spots on display ≦0.25mm, no more than three

Bright or black spots present.

0.65

02 on OLED (display only)

2.2 Densely spaced: No more than tw o spots or lines w ithin 3mm 2.5

3.1 Round type : As follow ing draw ing Φ=( x + y ) / 2

2.5

Black spots, bright spots,

03 contaminatio n

(non-display) 3.2 Line type : (As follow ing draw ing)

Length Width Acceptable Q TY --- W≦0.02 Accept no dense

L≦3.0 0.02＜W≦0.03

L≦2.5 0.03＜W≦0.05 2

--- 0.05＜W As round type

2.5

04 Polarizer bubbles

If bubbles are visible, judge using black spot specif ications, not easy to f ind, must check in specif y direction.

Size Φ Acceptable Q TY

Φ≦0.20 Accept no dense

0.20＜Φ≦0.50 3

0.50＜Φ≦1.00 2

1.00＜Φ 0

Total Q TY 3

2.5

, Total 25 Pages


05 Scratche

s

Follow NO.3 black spots , bright s pots , contamination

Sym bols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED s ide length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel s urface and crack between panels :

z: Chip thickness

y: Chip width x: Chip length

06 Chipped

glass

Z≦1/2t Not over viewing area

1/2t＜z≦2t Not exceed 1/3k

x≦1/8a

x≦1/8a

2.5

If there are 2 or m ore chips , x is total length of each chip.

6.1.2 Corner crack:

z: Chip

thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing area

1/2t＜z≦2t Not exceed 1/3k

x≦1/8a

x≦1/8a

If there are 2 or m ore chips , x is the total length of each

chip.

, Total 25 Pages


Sym bols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED s ide length L: Electrode pad length 6.2 Protrusion over terminal :

6.2.1 Chip on electrode pad :

y: Chip width x: Chip

length z: Chip

thickness

y≦0.5m m x≦1/8a 0 ＜ z ≦ t

6.2.2 Non-conductive portion:

06 Glass crack

2.5

y: Chip width x: Chip length

z: Chip thickness

y≦ L x≦1/8a 0 ＜ z ≦ t

If the chipped area touches the ITO term inal, over 2/3

of the ITO m us t rem ain and be ins pected according to electrode terminal specifications .

If the product will be heat sealed by the cus tom er, the

alignm ent m ark not be dam aged. 6.2.3 Subs trate protuberance and internal crack.

y: width x: length

y≦1/3L x ≦ a

, Total 25 Pages

07


Cracked

glass The OLED with extens ive crack is not acceptable. 2.5

08 Bezel

8.1 Bezel m ay not have rus t, be deform ed or have fingerprints , s tains or other contam ination.

8.2 Bezel m us t com ply with job s pecifications .

2.5

0.65

9 PCB、 COB

9.1 COB s eal may not have pinholes larger than 0.2mm or contam ination.

9.2 COB s eal surface m ay not have pinholes through to the IC.

9.3 The height of the COB s hould not exceed the height indicated in the assem bly diagram .

9.4 There m ay not be m ore than 2mm of s ealant outs ide the s eal area on the PCB. And there s hould be no m ore than three places .

9.5 No oxidation or contam ination PCB term inals . 9.6 Parts on PCB m us t be the s ame as on the production

characteris tic chart. There should be no wrong parts , m issing parts or excess parts .

9.7 The jum per on the PCB should conform to the product characteris tic chart.

9.8 If s older gets on bezel tab pads , zebra pad or s crew hold pad, make s ure it is sm oothed down.

9.9 The Scraping tes ting s tandard for Copper Coating of PCB

2.5 2.5 0.65 2.5

2.5 0.65

0.65 2.5 2.5

X

Y X * Y<=2mm

2

10 Soldering 10.1 No un-melted s older pas te may be present on the PCB.

10.2 No cold s older joints , miss ing solder connections , oxidation or icicle.

10.3 No res idue or s older balls on PCB. 10.4 No s hort circuits in com ponents on PCB.

2.5

2.5 2.5 0.65

, Total 25 Pages


11 General

appearance

11.1 No oxidation, contam ination, curves or, bends on interface Pin (OLB) of TCP.

11.2 No cracks on interface pin (OLB) of TCP. 11.3 No contamination, solder res idue or s older balls on

product. 11.4 The IC on the TCP may not be damaged, circuits . 11.5 The upperm os t edge of the protective s trip on the

interface pin mus t be pres ent or look as if it caus es the interface pin to s ever.

11.6 The res idual rosin or tin oil of s oldering (component or chip com ponent) is not burned into brown or black color.

11.7 Sealant on top of the ITO circuit has not hardened. 11.8 Pin type m us t match type in s pecification s heet. 11.9 OLED pin loos e or m issing pins . 11.10 Product packaging m us t the s am e as s pecified on

packaging s pecification s heet. 11.11 Product dimens ion and s tructure mus t conform to

product s pecification sheet.

2.5

0.65

2.5

2.5

2.5

2.5

2.5

0.65

0.65

0.65

0.65

, Total 25 Pages

Standard：

Defect item Sorting Defect judgment

No Dis play Major

Dark criss cross line Major

Short Major

Mis s line Major

Wrong Display Major

, Total 25 Pages

Dis play Uneven Major

Dark dot and light

line

Major

, Total 25 Pages

12. Precautions in use of Modules

1. Avoid applying excess ive s hocks to the module or m aking any alterations or m odifications

to it.

2. Don’t m ake extra holes on the printed circuit board, m odify its s hape or change the

components of OLED m odule.

3. Don’t dis assem ble the OLED module.

4. Don’t operate it above the abs olute maxim um rating.

5. Don’t drop, bend or twis t OLED module.

6. Soldering: only to the I/O term inals .

7. Storage: pleas e s torage in anti-s tatic electricity container and clean environm ent.

8. ADH have the right to change the pass ive com ponents (Resis tors , capacitors and other

pass ive com ponents will have different appearance and color caus ed by the different

s upplier.)

9. ADH have the right to change the PCB Rev. 12.1 Handling Precautions

(1) Since the display panel is being m ade of glass , do not apply m echanical im pacts such us

dropping from a high position.

(2) If the display panel is broken by s om e accident and the internal organic subs tance leaks out,

be careful not to inhale nor lick the organic subs tance.

(3) If pres sure is applied to the dis play s urface or its neighborhood of the OLED dis play m odule,

the cell s tructure m ay be dam aged and be careful not to apply pressure to thes e s ections .

(4) The polarizer covering the s urface of the OLED dis play m odule is s oft and easily s cratched.

Pleas e be careful when handling the OLED dis play m odule.

(5) When the s urface of the polarizer of the OLED dis play m odule has s oil, clean the s urface. It

takes advantage of by us ing following ADHes ion tape.

* Scotch Mending Tape No. 810 or an equivalent

Never tr y to breathe upon the s oiled surface nor wipe the s urface us ing cloth containing s olvent

Als o, pay attention that the following liquid and s olvent m ay s poil the polarizer:

* Water

* Ketone

* Arom atic Solvents

(6) Hold OLED dis play m odule very carefully when placing OLED dis play m odule into the

, Total 25 Pages

Sys tem hous ing. Do not apply excess ive s tress or pressure to OLED dis play m odule. And,

do not over bend the film with electrode pattern layouts . Thes e s tresses will influence the

dis play perform ance. Als o, secure s ufficient rigidity for the outer cas es .

(7) Do not apply s tress to the LSI chips and the s urrounding m olded s ections .

(8) Do not dis assem ble nor m odify the OLED dis play m odule.

(9) Do not apply input s ignals while the logic power is off.

(10) Pay s ufficient attention to the working environments when handing OLED dis play m odules

to prevent occurrence of element breakage accidents by s tatic electricity.

* Be s ure to m ake hum an body grounding when handling OLED dis play m odules .

* Be s ure to ground tools to us e or ass embly s uch as s oldering irons .

* To s uppress generation of s tatic electricity, a void carrying out ass em bly work under dry

environm ents .

* Protective film is being applied to the s urface of the dis play panel of the OLED dis play m odule.

Be careful s ince s tatic electricity m ay be generated when exfoliating the protective film .

(11) Protection film is being applied to the s urface of the dis play panel and removes the

protection film before ass embling it. At this tim e, if the OLED dis play m odule has been

s tored s urface of the dis play panel after removed of the film . In s uch cas e, rem ove the

residue material by the m ethod introduced in the above Section 5.

(12) If electric current is applied when the OLED dis play m odule is being dewed or when it is

placed under high hum idity environm ents , the electrodes may be corroded and be careful

to avoid the above.

12.2 Storage Precautions

(1) When s toring OLED dis play m odules , put them in s tatic electricity preventive bags avoiding

expos ure to direct s un light nor to lights of fluores cent lam ps . And, also, avoiding high

tem perature and high hum idity en vironment or low tem perature (less than 0°C)

environm ents .(We recomm end you to s tore thes e modules in the packaged s tate when they

were shipped from ADH Optronics Inc. At that tim e, be careful not to let water drops

ADHere to the packages or bags nor let dewing occur with them .

(2) If electric current is applied when water drops are ADHering to the s urface of the OLED

dis play m odule, when the OLED dis play m odule is being dewed or when it is placed under

, Total 25 Pages

high humidity environm ents , the electrodes may be corroded and be careful about the

above.

12.3 Designing Precautions

(1) The absolute maxim um ratings are the ratings which cannot be exceeded for OLED dis play

m odule, and if thes e values are exceeded, panel damage m ay be happen.

(2) To prevent occurrence of m alfunctioning by nois e, pay attention to s atis fy the VIL and VIH

s pecifications and, at the s am e tim e, to make the s ignal line cable as s hort as possible.

(3) We recomm end you to ins tall excess current preventive unit (fus es , etc.) to the power circuit

(VDD). (Recomm end value: 0.5A)

(4) Pay s ufficient attention to avoid occurrence of m utual noise interference with the neighboring

devices .

(5) As for E MI, take necessary m eas ures on the equipment side bas ically.

(6) When fas tening the OLED dis play m odule, fas ten the external plas tic hous ing s ection.

(7) If power s upply to the OLED display m odule is forcibly s hut down by s uch errors as taking

out the m ain battery while the OLED dis play panel is in operation, we cannot guarantee the

quality of this OLED dis play m odule. Connection (contact) to any other potential than the

above m ay lead to rupture of the IC.

, Total 25 Pages

Module Sample Estimate Feedback Sheet

Module Number：

Page: 1

1、Panel Specification：

1. Panel Type： Pass NG ,

2. Numbers of Pixel： Pass NG ,

3. View Area： Pass NG ,

4. Acti ve Area： Pass NG ,

5.Em itting Color： Pass NG ,

6.Uniform ity： Pass NG ,

7.Operating

Temperature： Pass NG ,

8.Storage Tem perature： Pass NG ,

9.Others ：

2、Mechanical Specification：

1. PCB Size： Pass NG ,

2.Fram e Size： Pass NG ,

3.Materal of Fram e： Pass NG ,

4.Connector Pos ition： Pass NG ,

5.Fix Hole Pos ition： Pass NG ,

6. Thickness of PCB： Pass NG ,

7. Height of Frame to

PCB：

Pass NG ,

8.Height of Module： Pass NG ,

9.Others ： Pass NG ,

3、Relative Hole S ize：

1.Pitch of Connector： Pass NG ,

2.Hole s ize of

Connector：

Pass NG ,

3.Mounting Hole size： Pass NG ,

4.Mounting Hole Type： Pass NG ,


＞＞ Go to page 2 ＜＜

, Total 25 Pages

Module Number：

4、Electronic Characteristics of Module：

1.Input Voltage： Pass NG ,

2.Supply Current： Pass NG ,

Page: 2

3.Driving Voltage for

OLED： Pass NG ,

4.Contras t for OLED： Pass NG ,

5.Negative Voltage

Output： Pass NG ,

6.Interface Function： Pass NG ,

7.ESD tes t： Pass NG ,


5、Summary：

Sales signature：

Customer Signature： Date： / /

, Total 25 Pages

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