Packing for Shipment - Fujitsu · Packing for Shipment PACKAGE Fig. 1 Packing Form for Plastic SOP,...

DB81-10008-2E 1

Packing for Shipment

■ Packing formThe packaging used to deliver products consits of tubes, trays, tapes, inner boxes, and an outer

box. (See Figures 1 to 7.)

The tubes, trays, and tapes are designed to protect the products from damage. After unpacking

the products, however, handle them with care not to let ICs become loose or protrude to

prevent them from being damaged.

2 DB81-10008-2E

Packing for Shipment PACKAGE

Fig. 1 Packing Form for Plastic SOP, SOL, SSOP, TSSOP, Tubes

*1: For a product of witch part number is suffixed with "E1", a " " marks is display to the

moisture barrier bag and the inner boxes.

*2: The space in the outer box will be filled with empty inner boxes, or cushions, etc.

Note: The packing specifications may not be applied when the product is delivered via a distributer.

Tube

Dry pack

Inner box

Outer box

FUJITSUIC / LSI

For SOP

Aluminum Iaminated bag

Desiccant

Label I *1

Heat seal

Aluminum Iaminated bag(tubes inside)

Cushioning material

Inner box

Label I *1

box

Cushioning material

Use adhesive tapes.

Humidity indicater

Outer box*2

[Label I]

G Pb

DB81-10008-2E 3

Fig. 2 Packing Form for Plastic SOP, SSOP, TSOP, QFP Trays



*2: The size of the outer box may be changed depending on the quantity of inner boxes.



Tray

Dry pack

Inner box

Outer box

FUJITSUIC / LSI

Tray

Product

Humidity indicater

Desiccant

Cushioning material

Binding band or tape

Filled tray + one empty tray

Inner box

Binding bandor tape

Label I *1

Inner box

Cushioning material

Aluminum laminated bag

Heat seal

Label I *1

Outer box *2, *3

Use adhesive tapes.

[Label I]

G Pb

4 DB81-10008-2E


Fig. 3 Packing Form for Ceramic QFP, LQFP Trays






Tray

Inner box

Outer box

FUJITSUIC / LSI

Tray

Product

Inner box

Binding bandor tape

Label I *1

Inner box

Cushioning material

Outer box *2, *3

Binding bandor tape

Cushioningmaterial


Use adhesive tapes.

[Label I]

G Pb

DB81-10008-2E 5

Fig. 4 Packing Form for Plastic SOP, TSOP, BCC, QFP, LQFP, TQFP, BGA, T-BGA, FBGA, SCSP, FLGA, JEDEC Size Trays






Tray

Dry pack↓

Inner box

Outer box

Product

Tray

Desiccant

Binding bandor tape

Humidityindicater

Cushioning materialFilled tray + one empty tray

Label I *1

Heat seal


FUJITSUIC / LSI

Binding bandor tape

Inner box

Label I *1

Use adhesive tapes.

Inner box

Cushioning material

Outer box *2, *3

[Label I]

G Pb

6 DB81-10008-2E


Fig. 5 Packing Form for Ceramic QFP, LQFP JEDEC Size Tray






Tray

Antistatic bag

↓Inner box

Outer box

Product

Tray

Binding bandor tape


Cushioning material

FUJITSUIC / LSI

Binding bandor tape

Inner box

Label I *1

Inner box

Cushioning material

Outer box *2, *3

Use adhesive tapes.

[Label I]

G Pb

DB81-10008-2E 7

Fig. 6 Packing Form for Ceramic BGA Tray






Tray

Dry pack↓

Inner box

Inner box

Outer box

Sponge tray

Base TrayProduct

Cover Sponge cusion

Humidity indicater

Desiccant

Cushion material


Label I *1


Cushion material


Outer box *2, *3

Packing tape

Heat seal

Label I*1 [Label I]

G Pb

8 DB81-10008-2E


Fig. 7 Packing form (Embossed tapes)






Embossed tapes

Dry pack

Inner box

Outer box

Outside diameter: 330mm reel

FU

J I TS

U

Heat seal

Label I *1

Desiccant

Humidity indicator

Label I *1

Label I *1

Inner box


φ 330mm reel φ 254mm reel

FU

J I TS

U

FU

J I TS

U

FU

J I TS

U

FU

J I TS

U

FU

J I TS

U

Label I *1

Taping

Outer box *2, *3

Use adhesive tapes.

Outer box *2, *3

φ Outside diameter: 254mm reelφ

[Label I]

G Pb

DB81-10008-2E 9

■ Index mark orientation of a package on the tray

Package type

Tray size and index mark direction orientation

QFP ingeneral

PGA ingeneral

SOP ingeneral

F

16526

0

Index mark

Chamfered corner

315

F

135.9

Index mark

Chamfered corner

F

165

260

Index mark

Chamfered corner

F

Index mark25

9 or

220

219 or 260

230.3

125.

3

F

Index mark

F

165

260

Index mark direction

Chamfered corner

F

135.9

315

Chamfered corner

❍ = Positive bend index mark direction● = Reverse bend 1st pin index

10 DB81-10008-2E


TSOP I

TSOP II

BGAT-BGAFBGABCCFLGA

Package type

Tray size and index mark direction orientation

F

165

260

❍ = Positive bend 1st pin index● = Reverse bend 1st pin index

Chamfered corner

F

135.9

315


Chamfered corner

F

165

260


Chamfered corner

F

135.9

315


Chamfered corner

F

165

260

Chamfered corner

Index mark direction F

135.9

315

Chamfered corner

Index mark direction

DB81-10008-2E 11

■ Dimensions for Containers

● Dimensions for inner box•TypeA

• Type B

• TypeC

• TypeD

• TypeE

L W

H

L

W

H

L

W

H

L

W

H

L

W

H

12 DB81-10008-2E


(Dimensions in mm)

● Dimensions for outer box

(Dimensions in mm)

Packing TypeInner type

Dimensions for inner box

L W H

Tube A 550 125 75

Tray Dimensions

165 × 260 B 180 275 45

135.9 × 322.6

B 165 360 75135.9 × 314.96

135.9 × 315

135.89 × 314.96

220 × 260 B 236 277 41

219 × 259 C 225 265 15

Emboss Reelφ330 Tape width

12.16

D

365 345 40

24.32 365 345 50

44 365 345 65

φ254 E 265 265 50

L

W

H

Packing TypeDimensions for outer box

L W H

Tube 570 270 175

Tray Dimensions

165 × 260 395 315 150

135.9 × 322.6

385 355 195135.9 × 314.96

135.9 × 315

135.89 × 314.96

220 × 260395 315 150

219 × 259

Emboss Reelφ330 Tape width

12.16

425 410 32524.32

44

φ254 570 270 175

Packing handling precautions

1. Because outer boxes gradually weaken during storage as a result of moisture, stacking, etc.,inventory should be handled on a first-in, first-out basis.

2. Although the IC packing materials (such as tubes) are designed to protect againstelectrostatic damage, full precautions against electrostatic damage must be taken whenremoving the products from their packing.

3. Handle the inner and outer boxes gently. Rough handling can dislodge the tubes stoppers,allowing the products to fall out of the tubes and possibly bend their leads.Rough handling of boxes containing ceramic packages in particular can cause chips, cracks,or leak defects.

4. Because the inner and outer boxes are made of corrugated cardboard, do not allow them tobecome wet. Do not store the boxes outside or in a hot and humid location under anycircumstances.

5. Do not throw, drop or otherwise roughly handle the outer boxes (corrugated cardboardboxes) containing products under any circumstances.

6. QFPs are packed in trays, but it is very easy to accidentally bend their leads when removingthem from their original packing and placing them in other packing. Therefore, strictlyobsever the following items.

a) When cutting the bindingtape, hold the trays securelyin place with one hand.

b) Hold the trays firmly in place while removing the tape so that the trays do not shiftposition. (If the trays shift, the packed ICs may be dislodged and the leads may bend.)

c) Check after packing the packagesBefore stacking the trays containing the IC packages, check the following points.

- Make sure that the packages are properly positioned on the ribs.

- If any packages are not positioned on the ribs, , check for bent leads and thenreposition the packages.

Note: When handling the packages, make sure to take electrostatic countermeasures, such as wearing finger sleeves or a grounded wrist strap. Use air tweezers, and avoid touching the leads if possible.

CutHandUse adhesive tapes

Tray

Ribs(Correct) (If another tray is stacked on top of this one, the leads will be bent)

Is the package on top of the ribs?

Is the package centered properly?

DB81-10005-1E 1

Packing handling precautions PACKAGE

d) Check after stacking the trays

- Make sure that there are no abnormal gaps between the stacked trays.

- Handle the stacked trays carefully when using packing tape or packing bands tosecure the trays. (Secure the trays only after making sure that there are no gaps.)

7. When removing stoppers from containers, be careful not to let the stopper jump out of thecontainer.

8. A container, coated with antistatic, may be sticky.

9. Heat resistant tray has a label entitled "HT" or " heat proof temperature" (e.g. 125 °CMAX). The heat resistant tray allows 125 °C heat being applied for 24 hours. It may causewarp on heating or cooling. To minimize the warp, it is be heated or cooled on a flatsurface. Avoid the abrupt cooling.

Large gap

(Correct) (Incorrect)

2 DB81-10005-1E

Packing for Shipment - Fujitsu · Packing for Shipment PACKAGE Fig. 1 Packing Form for Plastic SOP,...

Documents

Transcript of Packing for Shipment - Fujitsu · Packing for Shipment PACKAGE Fig. 1 Packing Form for Plastic SOP,...