Packaging - SEMICON SEA … · Fan-Out Packaging technology is not only a bridge to CPI mismatch in...

© 2019

Favier SHOO

Technology & Market Analyst

[email protected]

Fan-Out

PackagingFrom Technologies to Market

2019-May-8

SEMICON SEA 2019

2

YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences

& Healthcareo Microfluidics

o BioMEMS & Medical Microsystems

o Inkjet and accurate dispensing

o Solid-State Medical Imaging & BioPhotonics

o BioTechnologies

Power

& Wireless

o RF Devices & Technologies

o Compound Semiconductors & Emerging Materials

o Power Electronics

o Batteries & Energy Management

Semiconductor

& Software

o Package, Assembly & Substrates

o Semiconductor Manufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting

o Display

o MEMS, Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

SEMICON SEA 2019 | Fan-Out Packaging | www.yole.fr | ©2019

http://www.yole.fr/

3

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies


http://www.yole.fr/

4

DIGITAL NEW AGE: NEW TRENDS

2030

Imaging

1995 20062000 2010 2014 2017

TRENDS

1990 2020

Audio

Smartwatch

with AISmartphone

Virtual

assistant

Next-gen

assistant

Smartphone

with AI

Olfactometry

Smelling

AI

2040

Motion sensing

Holographic

interaction

Augmented

human

Robot home

Disruptive Technology

Hyper

Data Center

Driver-less

Mobile

HD Voice

Processing

PC Mobile Smart Robotics Human Augmentation


http://www.yole.fr/

5

TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE..

2014 2016 2018 2020 2022 2024

Assumed

Moore’s Law

Die to Substrate

Bump Pitch (μm)

RDL L/S (μm)

Solder Ball Pitch

(μm)

22nm 14nm 10nm 7nm

28nm 14nm 10nm 7nm 5nm 3nm

20nm 16nm 10nm 7nm 5nm 3nm

20nm 14nm (licensed) Stopped

Adva

nce

d N

odes*

Adva

nce

d P

ackag

ing

16/14nm 10nm 7nm 5nm 3nm

200 to 150 μm 150 to 80 μm 60 to 40 μm <40 μm

15/15 to 9/9 μm 10/10 to 8/8 μm 8/8 to 5/5 μm < 2/2 μm

400/350 μm 300 μm

6nm

Average trends of the various industry players

Non-exhaustive list of players listed


http://www.yole.fr/

6SEMICON SEA 2019 | Fan-Out Packaging | www.yole.fr | ©2019

FAN-OUT PACKAGING PRINCIPLE

01Tape lamination

Carrier

02

Pick and place

Carrier with foil and chips

03Wafer-level molding

Molding with liquid mold compound

04 Carrier removal (de-bonding)Reconstituted waferbackside after molding

05Standard WLP process

(Passivation, pattern, RDL, bonding)WLP Fan-Out wafer

06Dicing

After singulation

Fan-Out: Dies embedded in mold compound. No advanced substrate needed to fan out of chip surface.

eWLB example (chip-first face-down)Source: Infineon

http://www.yole.fr/

7

FAN-OUT PACKAGING:TECHNICAL CHALLENGES

Fan-Out

packaging

faces technical

challenges it

must

overcome to

enlarge its

scope of

compatible

applications.


Topography

Chip-to-mold

non-planarity

Die shiftReliability

Warpage

IC 1 IC 2

http://www.yole.fr/

8

APPLICATION PROCESSOR ENGINE (APE) - TRENDS IN SMARTPHONES

Processor packaging thickness*

2015 2016 2017 2018

MCeP

inFO-PoP

MCePMCeP

inFO-PoP

FCCSP FCCSPFCCSP

FC CSP

≥2019

inFO-PoP

ePLP-PoP

?

Fan-Out Fan-Out? Fan-Out?


http://www.yole.fr/

9

FAN-OUT APPLICATIONS

Orange: Devices that can be found in

FOWLP packages today

Green: Devices that could be found

in the future in FOWLPGrey: Devices that will likely remain on WLCSP or

flip-chip package or move to 3DIC or Embedded

die

Apple iPhone 8 and X (2017)A11 APE – InFO package (TSMC)

Samsung Galaxy S7 (2016)Qualcomm Audio Codec

WCD9335 – eWLB package by

Amkor Portugal (Nanium) or JCET

(STATS ChipPAC)

Bosch MRR1Plus Radar (2015)Infineon RASIC™ (77GHz RADAR System

IC Chipset) – eWLB Package

BK Ultrasound Sonic Window (2015)Multichip Module – eWLB Package Amkor Portugal

(Nanium)

Continental ARS400 Radar (2015)NXP MR2001 (77GHz multichannel

RADAR) – RCP Package

Applications out of mobile market

NXP SCM-iMX6Q (2017)APE, PMIC and Flash memory – Fan-Out PoP

(Nepes)

Apple iPhone 7 (2016)A10 APE – InFO package (TSMC)

Apple iPhone XS and XR (2018)

A12 APE – InFO package (TSMC)

Samsung Exynos 9110 ePLP (2018)APE, PMIC– FOPLP (SEMCO)


http://www.yole.fr/


FAN-OUT PACKAGING: RF CHIP AND ANTENNA IN PACKAGE

Technology inFO-AiP eWLB PoP eWLB F2F Mold-on-Mold

Schematics

ApplicationWireless HD and WiGig:

mmWave >60 GHz applications Radar: 77 GHz Transceiver 60 GHz WLAN

Source: TSMC Source: JCET (Stats ChipPac) Source: Infineon Technologies Source: IME

Creative designs to address transmission requirements with various Fan-Out Packaging Technologies

http://www.yole.fr/


WHAT ABOUT SAMSUNG FAN-OUT SOLUTION?

Samsung has lost Apple’s APE packaging fight to TSMC thrice in a row since 2016 BUT…

Source: Samsung

In 2018, SEMCO Fan-Out packaged APE+PMIC by panel-level manufacturing

Samsung Galaxy Watch: Exynos 9110

New Milestones

First FOPLP production volume in HVM

First multi-dies in FOPLP HVM for APE + PMIC

First HVM FOPLP in consumer market

Fan-Out Chipset Samsung’s Exynos 9110

Fan-Out Devices APE + PMIC

Package Area 74mm2

Package thickness (No bumps) 230um

I/O 660

RDL Layer: L/S 3x: 8um/14um

Market Range Core FO: Mid-End

http://www.yole.fr/


FAN-OUT PACKAGING APPLICATION: *LANDSCAPE OF KEY PLAYERS

Area of focus from standard, high-end to high-performance applications

MEMSCMOS Image Sensors

Display Drivers

Codec

DC-DC

Wifi

BB

PMU/PMIC

RF

Application

Processors

(APE) + BB

APE+DRAM

GPU,CPU+Memory

(Wide IO, etc…)

High Bandwith Memories

FPGA

Processors+Memories

IO count10000

1000

100

2x2 5x5 10x10 15x15 20x20 >20x20 >>20x20

Package size

(mm x mm)

Core Fan-OutStandard Devices: RF, PMU, BB etc.

High-Density Fan-Out:High-End: Mobile APE etc.

Ultra High-Density Fan-Out:High-Performance: HPC, networking, etc.

*Includes production, qualification and device-level demonstration. Does not include early stage engineering or R&D.

http://www.yole.fr/

13

FAN-OUT PACKAGING EVOLUTIONA long and volatile journey yet history is still in the making…

≤2007

Chip-First

Face-Up

Fan-Out

Chip-First

Face-Down

Fan-Out

eWLBcreation

RCPcreation

RCPlicensing

and first

volume

eWLBlicensing

and first

volume

2010 2012 20152013 20142008 2009 20162011

Early Fan-Out Activities(long history, high volume)

Recent Fan-Out InflectionCreation of many new technology and IP

RDL-First

R&DInFO

creation

2017

InFO first

volume

M-Series

creation

Chip-Last

Fan-Out

ePLP first

volume

2018

HD

FOWLP

made

possible

2019 2020

HD

FOPLP

Possible Scenario

FOWLP

vsFOPLP

1 new player in HD FOCost Pressure in Core FO

vs

vs

HD FO

Core FO

FOPLP

Milestone

Achieved


http://www.yole.fr/

14

258

105

2066

530

90

CONSUMER MARKET OVERVIEW:TOTAL UNITS IN 2018

MOBILE

68%

COMPUTING

9%

WEARABLES

3%

ENTERTAINMENT

17%

IoT

3%

3 Billion Units


http://www.yole.fr/


FAN-OUT COST EVOLUTION: MARKET TRENDS FOR CARRIERS

Fan-Out Production Ratio Forecast (%)

Breakdown by Carrier Types

200mm (300mm Wfr Eq) 300mm Panel (300mm Wfr Eq)

http://www.yole.fr/

16

FAN-OUT MARKET: BUSINESS MODEL EVOLUTION

100%

$244 M*

2015

OSAT only

65%

35%

$847 M*

2017

Foundry Impact

2019

IDM Entry

10%

71%

19%

$3,864 M*

2024

Foundry vs IDM

CAGR +51%

CAGR +23%

CAGR +19%

6%

65%

28%

$1,584 M*

*Total Market Value based on revenue

OSAT Foundry IDM


http://www.yole.fr/

17

Fan-Out Packaging technology is not only a bridge to CPI mismatch in pitch size but it is also a solution

for functional performance and package dimension, potentially for mmWave 5G and Cloud data server

applications.

In Core FO, existing players are expected go on a cost competition between wafer-level vs panel-level.

Especially within OSATs, the player who can capture the market share of Mid-End applications for

mobile and automotive will lead the way and set new standards.

In High-end (Mobile APEs) and High-Performance (HPCs/Networking) HD FO market, TSMC is still

the only player. HD FO is dominated by APE sales and volume. And a small portion of LVM qualification

for HPCs.

FOPLP production has commenced in 2018 thanks to SEMCO and PTI. Consequently, HD FO battle

stage is setup well for TSMC and SEMCO/Samsung Eletronics.

Fan-Out platform is increasingly viewed as one of the top packaging options. Fan-Out Packagingremains a fast-growing market with 25% CAGR2018-2024, reaching a market value of $3,864 M.


FAN-OUT PACKAGING:WRAP UP

http://www.yole.fr/

18

BUSINESS MODELS

o Consulting and Analysis• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization

of innovative optical systems

• Financial

diligence,

partner)

services (due

ourM&A with

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports o Media

• i-Micronews.com website

• i-Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

o Monitors

• Monthly and/or Quarterly

update

• Excel database covering supply,

demand, and technology

• Price, market, demand and

production forecasts

• Supplier market shares

www.i-Micronews.com/reports


http://www.yole.fr/

19

CONTACT INFORMATION

Follow us on

o CONSULTING AND SPECIFIC ANALYSIS, REPORT BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US & Canada

Email: [email protected]– + 1 310 600-8267

• Chris Youman, Senior Sales Director for Eastern US & Canada

Email: [email protected]– +1 919 607 9839

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business Development

(India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan & Singapore)

Email: [email protected] - +81-80-3577-3042

• Korea: Peter Ok, Business Development Director


• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership with Woodside Capital

Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o CUSTOM PROJECT SERVICES

• Jérome Azémar, Technical Project Development Director

Email: [email protected] - +33 6 27 68 69 33

o GENERAL

• Camille Veyrier, Director, Marketing & Communication

Email: [email protected] - +33 472 83 01 01

• Sandrine Leroy, Director, Public Relations

Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55

• Email: [email protected] - +33 4 72 83 01 80


http://www.yole.fr/

http://www.linkedin.com/company/yole-d-veloppement?trk=top_nav_home

https://twitter.com/Yole_Dev

http://fr.slideshare.net/Yole_Developpement

https://www.youtube.com/channel/UCxcAmfnGJgYXZn46VFs6ozQ

Thank you for your attention!

—

Favier Shoo

Yole DéveloppementFrom Technologies to Market

[email protected]

https://sg.linkedin.com/in/faviershoo

http://www.yole.fr/

Packaging - SEMICON SEA … · Fan-Out Packaging technology is not only a bridge to CPI mismatch in...

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