BYRAJA SHEEBA.R

III Yr,ECE

OVONIC UNIFIEDMEMORY(OUM)

Introduction Limitations of present memory technology Fundamentals of emerging memories Ovonic unified memory Amorphous vs. crystalline OUM architecture Basic device operation Features of OUM Advantages of OUM Conclusion References

ORGANISATION

† Semiconductors form the fundamental building blocks of the modern electronic world providing the brains and the memory of products all around us from washing machines to super computers

† Current memory technologies have a lot of limitations

† Material limited scaling - era

INTRODUCTION

DRAM – volatile & difficult to integrate

RAM – high cost & volatile

FLASH – slower writes - less number of write/erase cycles

Expansion in 2D space

Limitations of present memory technology

FeRAM

POLYMER MEMORY

NROM

MRAM

OVONIC UNIFIED MEMORY

Fundamentals of emerging memories

Most promising one. Material used is CHALCOGENIED Instead of using laser beam, use electric

current to heat the material Structural states: Amorphous - high temperature, high current, high

resistance Crystalline - low temperature, medium current, low

resistance

OVONIC UNIFIED MEMORY(OUM)

Amorphous Vs. crystalline

Oum Architecture

Basic Device Operation

† Non volatile

† High density

† Non destructive read

† Highly scalable

† Low cost

Features Of Oum

Reversible structural phase change

Small active storage medium

Low voltage single supply

High temperature resistance

Simple planar device structure

Simple manufacturing process

Reduced assembly and test costs

Advantages Of Oum

† Optimized OUM

† All mechanic dependency

† Oum offers low power operation and radiation tolerance

CONCLUSION

www.intel.com

www.ovonyx.com

www.baesystems.com

www.aero.org

REFERENCES

ANY QUERIES ?

THANK YOU