Outline - Nanyang Technological Universitynews.ntu.edu.sg/rc-VIRTUS/Documents/2014-S401.pdf · AFE...
Transcript of Outline - Nanyang Technological Universitynews.ntu.edu.sg/rc-VIRTUS/Documents/2014-S401.pdf · AFE...
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A High-frequency Transimpedance Amplifier for CMOS Integrated 2D CMUT Array towards 3D Ultrasound Imaging
Xiwei Huang1, Jia Hao Cheong2, Hyouk-Kyu Cha3, Hongbin Yu2, Minkyu Je4, and Hao Yu1* 1. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore
2. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research) 3. Dept. of Electrical Engineering and Info. Tech., Seoul National University of Science and
Technology, Seoul, Korea 4. Dept. of Info. and Communication Engineering, Daegu Gyeongbuk Institute of Science and
Technology (DGIST), Korea
02-Oct-2014
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Outline 1. Introduction 2. CMUT-array based Ultrasound Receiver 3. TIA Circuit Design and Implementation 4. Measurement Results 5. Conclusions
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3D-UBM Introduction Glaucoma imaging by 3D ultrasound bio-microscope: High-frequency (>30MHz) high-resolution CMOS readout with integrated CMUT array
CMUT+ Analog front-end IC and supporting electronics
High-frequency High Bandwidth AFE
3-D Imaging 2-D Transducer Array
Receiving
Transmitting Targets
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Ultrasound Imaging System
C
MU
T T
rans
duce
r ar
ray
HV
Tx/
Rx
Swit
ch
HV pulser
Digital Signal Processing and Control
Preamp
Analog Front-End
LPF
Imag
e P
roce
ssin
g/D
ispl
ay
Transmitted acoustic
wave
Received reflected acoustic
wave ADC
TGC (VGA)
Key components: CMUT array + analog-front-end (AFE)
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Capacitive Micromachined Ultrasonic Transducer CMUT Device A transducer that converts ultrasound acoustic waves into electrical signals and vice versa The energy transduction is due to capacitance change between membrane and substrate Easier CMOS integration with wider bandwidth
(a) Diagram of CMUT array, (b) one CMUT element, (c) one CMUT cell, (d) cross-section view of CMUT cell, (e) top view of CMUT cells.
Table I. Design Parameters for in-house fabricated CMUT
Equivalent simulation model for CMUT
Parameter Values CMUT array (elements) 16×16 CMUT cells per element 20×20
CMUT cell geometrical profile
Width 28μm Depth 28μm
Thickness 3μm Gap size 0.1μm
CMUT element dimension 600μm×600μm CMUT excitation voltage (VP-P) 20V
Bandwidth 17.5-52.5MHz Capacitance variation 2.12aF/Pa
Capacitance per element (deflated) 44pF
C=44pF
R=4.785kΩ
L=31μH
C=1.6aF
i
(d) (e)
Trench Connection
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CMUT-array based AFE Receiver
Rf
CMUT2_EN
OUT_EN
VBias
CMUT1
CMUT2
CMUT1_EN
Pulser1(Transmitter)
Pulser2(Transmitter)
TIARB CB
VBias
RB CB
Cparasitic
1. One preamplifier shared by two AFE channels considering bonding area constraint for 600μm×600μm CMUT element
2. Additional parasitic capacitance of 1pF included in simulation considering bonding for CMUT element and preamplifier
3. HV protection switch using HV double-diffused lateral MOS (DMOS) transistor to isolate preamplifier and avoid possible breakdown in transmission mode
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AFE Preamplifier Circuit Specifications
Parameters Specs. Supply Voltage 6V
Gain 61.18dbΩ 3dB Bandwidth 52.5MHz
Input Referred Noise 1.15uArms Max Output Voltage 1VP-P
Output Load 3.2pF//310KΩ
Table. Design specs for preamplifier Preamplifier: trans-impedance amplifier (TIA) with specs by CMUT device and system dynamic range Receiving Bandwidth: 100% fractional bandwidth of the CMUT center frequency 35MHz Gain: output of the preamplifier able to produce a maximum of 1VP-P voltage to the TGC in next stage considering the maximum CMUT capacitance variation Input referred noise: determined by the case when the minimum acoustic-wave pressure echo signal is received Output load: determined by the input impedance of the next stage TGC on PCB
• Attenuation rate: -0.5 dB/MHz/cm • Target focal depth: 1.2 cm
• Input signal DR: centre frequency + focal depth (back and forth) = 35MHz*2*0.5*1.2= 42dB • 256 gray-scale display DR: 20*log(256)=48dB
=90dB
AFE Receiver DR
=> ADC: 6.02*10+1.76=61.96dB, TGC=90-61.96=28.2dB
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AFE Preamplifier Circuit Design
Resistive feedback TIA schematic
MP1 MP2 MP3
MSW1
MSW2
MN1
MN2 MN4
MN3
MSW3
VDD
GND
IbiasRf
CMUT1
CMUT2
RX_IN_EN1
RX_IN_EN2
OUT_EN
Resistive feedback TIA Low-noise detection Ease of biasing high bandwidth capability
Rf = 1.15KΩ => Gain=20*log(1.15K)= 61.2dBΩ
( )parasiticCMUTINdBTIA CCR +=−
13,ω
2
_
2_
22_
2__
11
++×++=
fin
ampinampNRampNtotalinN R
CR
viiif
ω
Transimpedance Gain
3dB Bandwidth
Input Referred Noise
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AFE Operation Principle
Basic timing diagram for ultrasound analog front-end (AFE)
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AFE Implementation and Measurement
1. Tapeout Process: Global Foundry 0.18-μm Bipolar/CMOS/DMOS (BCD) 2. A unity gain analog buffer is included on chip for driving external load of the
probe with over 280MHz bandwidth 3. CMUT array wire boned on PCB within a barrel glued on the PCB (QFN24
package) 4. External power supply of 6V and 80μA input bias current
TIA testing chip photo TIA testing PCB photo
400μm
250μm
CMUT Array
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AFE Preamplifier AC + Noise Measurement Results
Simulated closed-loop frequency response AC simulation vs. measurement Results
Input referred noise simulation result Input referred noise measurement result
Parameters Simulation Measurement Transimpedance Gain 61.18dBΩ 61dBΩ
-3dB Bandwidth 75MHz 100MHz Input Referred Noise 16.8pA/√Hz 27.5pA/√Hz
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AFE Acoustic Measurement Setup
1. Immerse CMUT array in the vegetable oil contained in the barrel to mimic the underwater testing environment
2. Choose one CMUT element from the CMUT array for transmitting and provided it with 20V DC bias voltage
3. Choose one other CMUT element for receiving the acoustic wave resulting from the reflection at the oil-air layer interface
4. A hydrophone was immersed into the oil to measure the acoustic pressure as a reference to the TIA output voltage signal
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AFE Preamplifier Acoustic Measurement Results
1. The delay of the received echo can show the pulse-echo distance, which is the depth of the oil inside the barrel
2. Our in-house fabricated CMUT device successfully generated a 6mV acoustic pulse with the triggering from external pulser
3. The peak-to-peak voltage of our first echo signal was about 7mV, which also successfully demonstrated the functionality of the developed TIA of the analog-front-end receiver
(a) CMUT transmitted acoustic pulse signal captured by hydrophone
(b) TIA received echo signals from CMUT.
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Conclusions
A CMOS analog front-end (AFE) receiver integrated with CMUT array is demonstrated (0.18-µm BCD process) for high frequency 3D ultrasound imaging The primary component, a transimpedance amplifier (TIA), achieves 61dBΩ gain with 17.5MHz to 100MHz bandwidth, and low input referred noise of 27.5pA/√Hz The TIA was successfully integrated with CMUT and the receiving functionality has been demonstrated with a pulse-echo acoustic testing Our future work is to demonstrate the whole 3D ultrasound imaging system with digital image processing
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References [1] P. Levesque and M. Sawan, “Novel low-power ultrasound digital preprocessing architecture for wireless display,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, vol. 57, no. 3, pp. 757-767, Mar. 2010. [2] I. O. Wygant, et. al., “An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, vol. 56, no. 10, pp. 2145-2156, Oct. 2009. [3] K. K. Shung, J. Cannata, Q. Zhou, and J. Lee, “High frequency ultrasound: A new frontier for ultrasound,” Int. Conf. of the IEEE Engineering in Medicine and Biology Society (EMBC), pp. 1953-1955, 2009. [4] I. O. Wygant, et. al., “Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, vol. 55, no.2 pp. 327-342, Feb. 2008. [5] I. Ladabaum, X. Jin, H. T. Soh, A. Atalar, and B. T. Khuri-Yakub, “Surface micromachined capacitive ultrasonic transducers,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, vol. 45, no. 3, pp. 678–690, May 1998. [6] T. R. Gururaja, “Piezoelectric transducers for medical ultrasonic imaging,” IEEE Int. Symp. on Applications of Ferroelectrics (ISAF), pp. 259-265, 1992. [7] I. Kim, et. al., “CMOS Ultrasound Transceiver Chip for High-Resolution Ultrasonic Imaging Systems,” IEEE Trans. Biomed. Circuits Syst., vol. 3, no. 5, pp. 293-303, Oct. 2009. [8] G. Gurun, P. Hasler, and F. L. Degertekin, “Front-end receiver electronics for high-frequency monolithic CMUT-on-CMOS imaging arrays,” IEEE Trans. Ultrason. Ferroelectr. Freq. Control, vol. 58, no. 8, pp. 1658–1668, Aug. 2011. [9] L. R. Cenkeramaddi, A. Bozkurt, F. Y. Yamaner, and T. Ytterdal, “A low noise capacitive feedback analog front-end for CMUTs in intra vascular ultrasound imaging,” IEEE Ultrason. Symp. (IUS), pp. 2143-2146, 2007.
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Thank you! http://www.ntucmosetgp.net
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