Optimizing SiP Test Cost with a Platform Approach -SiP Conferences...2017/10/02 · ni.com...
Transcript of Optimizing SiP Test Cost with a Platform Approach -SiP Conferences...2017/10/02 · ni.com...
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Optimizing SiP Test Cost with a Platform Approach
SiP Conferences China 2017
Pearl He
Greater China Semi BDM – National Instruments
The World of Converged Devices
More capability defined in software
Functions change rapidly
Increasingly complex to design and test
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NI equips engineers and scientists with systems that
accelerate productivity, innovation, and discovery.
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National Instruments as a Test System Supplier
Semiconductor Production
Wireless Production
Automotive Electronics
Aerospace and Defense
Energy: Oil and Gas
Academic Research
Consumer Electronics
Mobile Devices
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d 150,000+ PXI Systems Shipped Since 1997
2,000+ Global Research and Development Engineers
1,000+ PXI Systems Deployed in Semiconductor Production
700+ Alliance Partners and System Integrators
300+ NI Semiconductor Test Systems Deployed
40+ Regional Application Engineering Support Offices
Unique Attributes of Smart Devices - Common Test Needs
More functionality
Ensure high reliability
Lowest cost
Fast time to market
CONVERGENCE LOWER PRICE RAPID CHANGE
Vendor Strategies for Test and Measurement
C L O S E D
• “Vendor knows best”
• Fixed-functionality
• Closed ecosystem
• Customer pays
P L A T F O R M
• “Customer knows best”
• Customizable solution
• Open, vibrant ecosystem
• Customer designs
A Smarter ApproachLabs
▪ Designed for automation
▪ Optimized for measurement quality
▪ Fast test cycles
Production Floor
▪ Designed for test cell
▪ Optimized for throughput
▪ Cost effective
Same Platform
▪ Maximize Leverage
▪ Code, setup, training
▪ Simpler correlation
▪ Faster test cycles
▪ Lower cost
Wireless Production Test
NI and the RF Semiconductor Industry
Production TestR&D (characterization)
time
Prototyping and Design
Semi Char.
Semi Prod.
Mobile Prod.
Prototyping
NI serves the complete RF semiconductor value chain
Markets for System-in-Package
RF and wireless devices
Integrated Passive Devices
Solid-state drives (SSDs)
Automotive applications
IoT for wearable and machine to machine (M2M) products
Power modules
Source: https://www.amkor.com/go/SiP
System-in-Package Implications on Test
Diverse markets and applications
Demand for plug-and-play
Demand for lower total cost
High volumes and rapid ramp
cycles
Economics of traditional test solutions disrupted!
Observed System-in-Package Test Challenges
• Algorithms not optimized for test throughput, often not multi-thread safe
• Parallel test becomes required due to test times, but difficult due to “black boxed” functionality
DUT control often “black-boxed”
• DUT control abstracted to higher-level protocols (TCP, USB, etc)
• Digital complexity reduced while Analog/RF complexity increased
Exposed functionality more abstracted than at component test
• Common requirement to integrate all test equipment into handler cabinet
Tester footprint must = zero
RF & Wireless, IOT
This is almost more like testing a phone than a chip!
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How can a platform approach help?
NI SERVICES AND SUPPORT
NI MODULAR HARDWARE
ONE-PLATFORM APPROACH
Support 700+ Field Engineers
700+ Support Engineers
50+ Worldwide Offices
Open Connectivity10,000+ Instrument and Device Drivers
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Add-Ons400+ Software Add-Ons
5M+ Tools Network Downloads
Community300,000+ Online Members
450+ User Groups
9,000+ Code Examples
Partners1,000+ Alliance Partners
Industry-Leading Technology Partners
Academia8,000+ Classrooms Worldwide
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NI PRODUCTIVE
DEVELOPMENT SOFTWARE
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PXI System Overview
PXI Backplane
• Data Transfer
• Timing
• Synchronization
• Triggering
PXI Chassis
• Power
• Cooling
• System Monitoring
• Enclosure
PXI I/O Modules
• 600+ Products
• RF, DC, DIO…
Multicore
Embedded
Controller
Broad Modular Instrumentation Portfolio
Multifunction I/O
FPGA / Reconfigurable I/O
Digital I/O
Analog Input / Output
Vision and Motion
Counter / Timer / Clock
DAQ and Control
Oscilloscopes
High-Speed Digital I/O
DMM & SMU
Signal Generators
Switching
RF Analyzers & Generators
Instrumentation
GPIB, USB, LAN
RS232 / RS485
CAN, LIN, DeviceNet
SCSI, Ethernet
VXI - VME
Boundary Scan / JTAG
Interfaces
• FPGA-based servoing for
measurement acceleration
• Up to 1 GHz instantaneous bandwidth
for wide range of wireless technologies
• R&D-grade measurement performance
with up to -50 dB EVM for 802.11ax
Key Instruments for Semiconductor Test
NI Vector Signal Transceiver
(VST)
• Broad IV range: 200V(20W), 3A
• (10A pulse)
• Current resolution to 10fA
• Max sampling to 1.8MS/s
• SourceAdaptTM Technology for fast
settling in presence of capacitive loads
• Best in class channel density
NI Source Measure Units (SMUs)
• ATE-class digital (with PPMU) in PXI
• Out of the box Digital Pattern
Editor software
• Time sets, drive formats, opcodes,
HRAM, Source and capture,
history RAM, Shmoo
NI Digital Pattern Instrument
NI Semiconductor Test Software▪ Suite of software for test development, execution, and debug
▪ TestStand + TestStand Semiconductor Module
▪ Sequence Editor/Operator Interface
▪ Binning, Handler Integration, Pin/Channel Map, STDF, Multisite
▪ Built-in steps for common measurements (e.g. continuity, Vcc, etc)
▪ Open interface to integrate 3rd party instruments with multi-site support
▪ Digital Pattern Editor
▪ Code module development with NI LabVIEW/LabVIEW FPGA or C#/.NET
▪ STS Calibration and Diagnostics Software
Common Platform that Scales
NI STS T1NI PXI NI STS T4NI STS T2
PXI Chassis and Controller
PXI Instrumentation and Measurement Software
LabVIEW or C# (Code Module Development) and TestStand (Test Management)
STS Standardized Docking and Cabling Interface
Observed System-in-Package Test Challenges
▪ Traditional testers do not have parallel capacitance/inductance instruments at
low cost
▪ Traditional boxes missing factory integration features
• Production-ready Operator Interface
• Handler Control
• Binning
• Standard Datalogging (STDF)
• System calibration and diagnostics
Integrated Passive Devices
Case Study – SLT for Connectivity SiP
• The NI STS T1 is used for SiP(WiFi +BT) Test
• Quad site tester that communicates to a custom-designed handler
• STS Benefits:
• Vendor-supported ATE platform
• Test time: 17s vs 65s rack & stack solution
• Lower tester capital cost
• Zero footprint
BlueTooth
WiFi
DC Power Supplies
Bench Instruments Industrial PC
IPD Test Solution Overview
▪ PXIe Instrumentation
▪ 32x PXIe-4139 ±60 V, 3 A Precision System PXI Source Measure Units
▪ NI Software
▪ LabVIEW, TestStand, TestStandSemiconductor Module
▪ Handler Integration
▪ STDF Datalogging
▪ STS T2
▪ Manipulator Support
▪ Electrical interface
▪ Docking interface
Integrated Passive Device
STS T2
Semiconductor Test Partner Ecosystem
Test Development Services
Load Board Design Services
Manipulators/Docking Systems
Mechanical Customizations Enterprise Data Analytics
Summary
The diversity of SiP markets and applications require test solutions that can scale to meet targeted needs.
Traditional approaches for IC package and module test over-serve some requirements while not meeting others.
A platform approach to SiP test allows customers to use the elements they need while avoiding the elements (and costs) they don’t.
When these elements are available on the same platform or within the ecosystem they can be effectively leveraged to reduce overall cost of test.
P L A T F O R M
• “Customer knows best”
• Customizable solution
• Open, vibrant ecosystem
• Customer designs