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OpenPOWER Foundation Overview

February 2014

Steve FieldsIBM Distinguished EngineerDirector of Power Systems Design

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Goal and Intent of OpenPOWER

Opening the architecture, providing ability to innovate across full Hardware and Software stack

– Simplify system design with alternative architecture– Includes SOC design, Bus Specifications, Reference Designs– Open Source Firmware + Operating System + Hypervisor

Driving an expansion of enterprise class Hardware and Software stack for the data center

Building a complete ecosystem to provide customers with the flexibility to build servers best suited to the POWER architecture

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The number of companies designing & building servers is increasing– Traditionally there have been few companies designing systems (HP, IBM, SUN, Dell etc…)– Today there are many more: Google, Microsoft, Facebook, Rackspace etc…– A fairly mature ecosystem including the Taiwanese ODMs is a key enabler of this trend

Two disruptive forces are impacting these custom system designs and driving designers to seek alternative architectures

– Technology integration is migrating what is board customization today to chip customization– A need for choice and options in processor sourcing

The POWER architecture is a proven server-class technology with a growing server software ecosystem

These trends creates an opportunity for a server targeted “chip-system-software” ecosystem

– OpenPOWER expands the opportunity for members to grow this ecosystem

There is an opportunity for POWER to participate in Web2.0 and large-scale data centers

Why form OpenPOWER?

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Giving ecosystem partners a license to innovate

OpenPOWER will enable datacenters to rethink their approach to technology

Member companies may use POWER for custom open servers and components for

Linux based cloud data centers

OpenPOWER ecosystem partners can optimize the interactions of server building

blocks – microprocessors, networking, I/O & other components – to tune performance

How will OpenPOWER Foundation benefit clients?

– OpenPOWER technology creates greater choice for customers

– Open and collaborative model on the Power platform will create more opportunity for innovation

– New innovators will broaden the capability and value of the Power platform

What does this mean to the industry?

– Game changer on the competitive landscape of the server industry–Will enable and drive innovation in the industry

–Provide more choice to the industry

How will OpenPOWER Foundation benefit clients?

– OpenPOWER technology creates greater choice for customers

– Open and collaborative model on the Power platform will create more opportunity for innovation

– New innovators will broaden the capability and value of the Power platform

What does this mean to the industry?

– Game changer on the competitive landscape of the server industry–Will enable and drive innovation in the industry

–Provide more choice to the industry

Platinum MembersPlatinum Members

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OpenPOWER Foundation – Structure

OpenPOWER is an industry foundation based on the POWER architecture, enabling an Open community for development and opportunity for member

differentiation and growth

Store

Channel Corp.

OPENEcosystemCommunity

Open Source Software Linkages to other groups Development workgroups

Chip Design Group Open IP Blocks Interface specifications

Development groups

System Design Group Specifications Reference Designs

Arc

hite

ctur

e &

S

peci

ficat

ion

Gro

up

Value Add

Num

erou

s Pa

rtic

ipan

ts

Development & Specification

Complementary“FOR PROFIT”

Ecosystem

OpenPOWER Compliance

Fee based component examples• Chip IP • IBM SW stack• Member SW stack• POWER on a card or board

To Ensure Compliance:All offerings must be validatedConsistent with Architecture &Interface Specifications

Store

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Proposed Ecosystem Enablement

CAPP

PCIe

POWER8

CAPI over PCIe

“Standard POWER Products” – 2014

Har

dwar

e

“Custom POWER SoC” – Future

Customizable

Framework to Integrate System IP on Chip Industry IP License Model

Multiple Options to Design with POWER Technology Within OpenPOWER

Power Open Source Software Stack Components

Firmware

CloudSoftware

OperatingSystem / KVM

Hardware

XCAT

ExistingOpen

Source Software

Communities

New OSS Community

Standard OperatingEnvironment

(System Mgmt)

System Operating Environment Software Stack

OpenPOWERTechnology

A modern development environment is emerging based on this type of tools and services

Softw

are

OpenPOWERFirmware

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TechnologyFAB

I/ONetworkingStorage

FWOpenSourceSYS

ODMOEM

SWLinuxISVOpen Source

Welcoming members at all levels

ChipSoC DevIP DevTechnology

FAB

I/ONetworkingStorage

FWOpenSourceSYS

ODMOEM

SWLinuxISVOpen Source

Welcoming members at all levels

ChipSoC DevIP Dev

Ecosystem Concept

WEB 2.0Data CenterMSPCloud

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Membership Options

Membership Level

Annual Fee FTEs IP contribution Technical Steering Committee

Board / Voting position

Platinum $100k 10 Desired significant, in addition to FTEs

One seat per member not otherwise represented

Includes board positionIncludes TSC position

Gold $60k 3 Not required May be on TSC if Project Lead

Gold members may elect up to one BOD member per three gold members

Silver $20k 0 Not required May be on TSC if Project Lead

One Board seat elected by all Silver members

Associate & Academic

$0 0 Not required May be on TSC if Project Lead

May be elected to one community observer board seat

Membership Levels

Organized as a distinct 501c6 Not-for-profit entity with a Board of Directors and a Technical Steering Committee.

• Membership levels provide either a default Board of Director position (Platinum) or an opportunity to be elected to the Board (Gold, Silver, and Assoc/Academic members). The Bylaws detail additional governance by the Board including maximum seats, terms, etc.

• Technical Steering Committee. Formed from the Project Leads from the core projects and one representative designated by each Platinum member

Includes tiered membership of Platinum, Gold, Silver, and individual memberships• Annual fee and dedicated full-time equivalent (FTEs) - verification of committed number of FTEs on honor system• Contributors, committers, and project leads influence Technical Steering Committee

Membership agreement, Bylaws, and IP Rights Policy available for reviewMembership agreement, Bylaws, and IP Rights Policy available for review

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OpenPOWER Foundation Progress

Completed legal formation activities

– Completed legal formation of entity as a standalone not-for-profit 501c6 entity, ratified Bylaws and IP Rights Policy

– Formalized Board of Directors and elected officers• Chairman: Gordon MacKean, Engineering Director, Platforms, Google• President: Brad McCredie, Vice President and IBM Fellow, IBM• Vice President: Michael Diamond, Senior Director Marketing, Nvidia

– Chartered Technical Steering Committee and initiated Work Groups:• System Software• Application Software• Open Server Development Platform• Hardware Architecture

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Work Groups and ProjectsWork Group Projects ParticipantsSystem Software Linux - Little Endian Public

(Open Source) KVM Public

Firmware–OpenPower FW Interface

Public

POWER LE ABI Public

Application Software

(Open Source)

System Operating Environment–OpenPOWER Software ecosystem enablement

Public

Toolchain Public

Open Server Development Platform

POWER8 Developer Board Restricted

POWER8 Reference Design Restricted

Hardware Architecture Compliance Member

OpenPOWER profile of architecture–POWER8 ISA Book 1, 2, 3

Restricted

Coherent Accelerator Interface Architecture (CAIA)

Restricted

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OpenPOWER Foundation Next Steps

Current initiatives to build industry momentum and strengthen organization– Make progress on work groups and projects, formalize process for initiating new work groups or

projects– Welcome new members via individual conversations, initiate on-boarding process– Develop identity / web site

March 2014 Launch with software development environment and preliminary hardware design

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Caches •512 KB SRAM L2 / core•96 MB eDRAM shared L3•Up to 128 MB eDRAM L4 (off-chip)

Memory•Up to 230 GB/s sustained bandwidth

Bus Interfaces•Durable open memory attach interface•Integrated PCIe Gen3•SMP Interconnect•CAPI (Coherent Accelerator Processor Interface)

Cores •12 cores (SMT8)•8 dispatch, 10 issue, 16 exec pipe•2X internal data flows/queues•Enhanced prefetching•64K data cache, 32K instruction cache

Accelerators•Crypto & memory expansion•Transactional Memory •VMM assist •Data Move / VM Mobility

Energy Management•On-chip Power Management Micro-controller•Integrated Per-core VRM•Critical Path Monitors

Technology•22nm SOI, eDRAM, 15 ML 650mm2

L3 Cache & Chip Interconnect

8M L3Region

Mem. Ctrl.Mem. Ctrl.

SMP LinksAccelerators

SMP LinksPCIe

POWER8 Processor

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CoreCore

L2L2

L3L3

POWER8 Building Blocks

System Infrastructure(SMP interconnect, memory,

I/O, energy mgmt, etc)

System Infrastructure(SMP interconnect, memory,

I/O, energy mgmt, etc)

• Flexible dynamic threading up to SMT8

• 64B L2 to L1 data bus

• 64KB Data Cache

• 32KB Instruction Cache

• Flexible dynamic threading up to SMT8

• 64B L2 to L1 data bus

• 64KB Data Cache

• 32KB Instruction Cache

• 512KB 8-way L2 cache per core

• 12-core chip provides 96MB L3 (12 x 8MB 8-way Banks)

• 12-core chip interconnect

• 150 GB/sec x 12 segments/direction = 3.6 TB/sec

• 512KB 8-way L2 cache per core

• 12-core chip provides 96MB L3 (12 x 8MB 8-way Banks)

• 12-core chip interconnect

• 150 GB/sec x 12 segments/direction = 3.6 TB/sec

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…with 16MB of Cache…

MemoryBuffer

DRAMChips

DDR InterfacesDDR Interfaces

POWER8POWER8LinkLink

Scheduler &Scheduler &ManagementManagement

16MB16MBMemoryMemoryCacheCache

Memory Buffer Functions•Memory Scheduling logic for 4 DIMM channels•L4 Cache for performance & energy efficiency•Energy Mgmt, RAS decision point

Processor Interface•9.6 Gbit/s interface•Robust error detection & dynamic lane sparing •Extensible protocol for innovation build-out

System Design Points•Support buffer on motherboard or on DIMM•Support 1, 2, 4 or 8 buffers per processor socket

• Up to 230 GB/sec per processor socket• Up to 128 GB of L4 Cache per processor socket

POWER8 Memory Buffer

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CustomHardware

Application

POWER8

CAPP

Coherence Bus

PSL

FPGA or ASIC

POWER8

PCIe Gen 3Transport for encapsulated messages

Processor Service Layer (PSL)• Present robust, durable interfaces to applications• Offload complexity / content from CAPP

Virtual Addressing• Accelerator can work with same memory addresses that the

processors use• Pointers de-referenced same as the host application• Removes OS & device driver overhead

Hardware Managed Cache Coherence• Enables the accelerator to participate in “Locks” as a normal

thread Lowers Latency over IO communication model

POWER8 CAPICoherent Accelerator Processor Interface (CAPI)

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CAPI for Hardware Acceleration

Custom Hardware Acceleration Unit (FPGA or ASIC)– Implement specific system, middleware or application function– Written to durable interface provided by PSL

Accelerator function operates as part of application– Behaves as another hardware thread running the application– Eliminates overhead associated with traditional PCIe attach

CustomHardware

Application

PSL

FPGA or ASIC

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CAPI for Attachment of I/O Devices

I/O Device can operate at user level– Behaves as another hardware thread running the application– Eliminates overhead associated with traditional I/O Device Driver model

• No pinned pages or memory copies required• Ability to address all of system memory

Advantages of CAPI protocol being transported over PCIe Gen3 interfaces– Compatible with industry ASIC design capabilities– Same device able to operate in PCIe and CAPI modes– CAPI devices have access to system tailstock for external connectivity

I/OController

PSL

FPGA or ASICNetwork or

Storage Interface

Network or Storage Interface

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OpenPOWER Foundation Benefits

System Design

Open the POWER Architecture to enable broader usage and collaboration

Enable and drive innovation in the industry

Data Center

Enable innovation across the stack to optimize deployment

Enable choice in architecture and processor sourcing

Customer

Greater choice

New levels of capability through innovation and broad collaboration in the POWER platform

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Membership Application and Inquiries

Membership Level

Annual Fee FTEs IP contribution Technical Steering Committee

Board / Voting position

Platinum $100k 10 Desired significant, in addition to FTEs

One seat per member not otherwise represented

Includes board positionIncludes TSC position

Gold $60k 3 Not required May be on TSC if Project Lead

Gold members may elect up to one BOD member per three gold members

Silver $20k 0 Not required May be on TSC if Project Lead

One Board seat elected by all Silver members

Associate & Academic

$0 0 Not required May be on TSC if Project Lead

May be elected to one community observer board seat

Membership Levels

Membership agreement, Bylaws, and IP Rights Policy available for reviewMembership agreement, Bylaws, and IP Rights Policy available for review

Very simple 2-page application:•Contact information for Representative, Accounts Payable contact, Technical contact, Marketing/Communications contact

•Desired Level of Membership

•Signature

For further information email info@open-power.org

Very simple 2-page application:•Contact information for Representative, Accounts Payable contact, Technical contact, Marketing/Communications contact

•Desired Level of Membership

•Signature

For further information email info@open-power.org

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20IBM Confidential20 Confidential

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© 2013 OpenPOWER