OOFELIE::Multiphysics fullyMagnetic MEMS MAGNETOSTATIC ACTUATOR Based on 25 μmthick SOI Magnetic...

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Sensor & Actuator Current Techniques

06/11/2014

Tokyo Seminar - MEMS

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OOFELIE::Multiphysics fully

addresses Today’s Advanced Design

Needs

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Electrostatics

ADVANCED MEMS PLATFORM FOR OPTICAL NETWORKS


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Piezoelectricity - SAW

SAW/BAW

Acoustic wave generation

using piezoelectric effect

2D/3D FEM models

AlN – anisotropic materials

PML FOR INFINITE MEDIUM

GYROSCOPIC EFFECT

ANALYSES

Modal

Harmonic

INTERDIGITAL TRANSDUCER

(IDT) DESIGN

INVESTIGATION OF THERMAL

EFFECTS


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PIEZOELECTRICITY - ACCELEROMETER

VIBRATING INERTIAL

ACCELEROMETER (VIA & DIVA) Piezoelectricity

Thermoelastic damping

ANALYSES

Modal

Harmonic

QUALITY FACTOR

MAXIMIZATION

CO-SIMULATION WITH IC RLC external circuit

PACKAGING EFFECTS

Air damping

Thermal stresses

FRAME OPTIMISATION

Mechanical losses


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Piezoelectricity - MEMS Micro-Mirror

Mirror substrate,

torsion bars and

frame in Silicon,

50 µm thick

Al layer, 0.3 µm thick

PZT actuators, 3 µm thick

PZT actuators, 3 µm thick

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Piezoelectricity - MEMS Micro-Mirror

Harmonic analysis

Elastic

deformation

Complete

deformation

Modal analysis

Rotation resonant mode at 15997 Hz

Dynamic analysis (and exportation to ZEMAX):

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Piezoelectricity - MEMS harvester


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Piezoelectric MEMS harvester


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PIEZORESISTIVITY - PRESSURE SENSOR

PIEZORESISTIVE EFFECT

Change of resistivity due to

mechanical stresses

PARAMETRIC MODEL

Geometry of gauges

Geometry of sensitive

mechanical elements

MATERIALS

Parameters identification

THIN-FILM BEHAVIOUR

Membrane elements

PRESTRESS

Due to temperature

Manufacturing process


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Magnetic MEMS

MAGNETOSTATIC ACTUATOR

Based on 25 μm thick SOI

Magnetic core and plunger made of 4 μm electroplated soft magnetic permalloy - NiFe

(80/20)

Windings are realized by electroplating 2 μm of Copper.

Isolation and planarization based on polymer deposition


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Acoustics - Micro-loudspeaker

Pressure field amplitude Pressure field amplitude

Radiated

acoustic power

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AUTONOMOUS SMART SYSTEMS

PIEZOELECTRIC HARVESTER

Mechanical vibrations

produces energy

ANALYSES

Modal

Harmonic

Random Vibration

THERMAL HARVESTER

Seebeck/Thomson effects

Temperature gradient

produces energy

ANALYSIS

Steady-state

Dynamic


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MP-F.S.I. – Piezo Micro-Pump Simulations

SEMICON Europa 2014

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MANUFACTURING PROCESS

OOFELIE::MULTIPHYSICS FOR ROBUST MICRO-SYSTEMS DESIGN

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Dealing With Pre-stress from Manufacturing Process

Full FAB-process Simulation

Step by step simulation of the

process

Pre – Stress Formula based Input

Estimated stress measured on the line

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PACKAGING

OOFELIE::MULTIPHYSICS FOR ROBUST MICRO-SYSTEMS DESIGN

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Packaging effects

IDENTIFY MOST APPROPRIATE PACKAGE FOR HARSH

ENVIRONMENTS

UNDERSTAND AND MASTER

Size, length and shape of bondwiring

The influence of gluing

The influence of the package on the functionality

Limit induced stresses caused by assembly process

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Simulation with To8 package

Study the energy losses through

the mounting parts

Optimize the resonance quality

Minimize the effect of thermal

stresses on the resonance

frequency.

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Thermal Management – Heat sink Simulations

OBTAIN THE BEST PERFORMANCES IN THE OPTIMAL

TEMPERATURE RANGE

SEMICON Europa 2014

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Consider all types of heat

transfer to cool the devices

Conduction

Dynamic Capacitive effects

External / Mutual / Orbital

Radiation

Natural / Forced Convection

Reproduce the

Heating Cycles

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Wafer level packaging

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Wafer level packaging

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TSV (Through Silicon Via) Simulations

SEMICON Europa 2014

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Create the best

meshes with

OOFELIE UI

Visualize the

thermomechanical

stress concentration

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CONCLUSION

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Technologies needed to cover & close the MEMS value chain


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OOFELIE::Multiphysics Key Features

INTEGRATED CAE ENVIRONMENT COMBINED WITH MEMS PRO® FOR EDA FLOW CONNECTION

ENGINEERING STANDARD, INTUITIVE, TIME-SAVING DESIGN FLOW INCLUDING

SCRIPTING, PARAMETERIZATION AND OPTIMIZATION

BROAD TRANSDUCER DOMAIN COVERAGE (ELECTROSTATICS, PIEZORESISTIVITY, PIEZOELECTRICITY, ELECTROMAGNETIC EFFECTS)

STRONGLY COUPLED MULTIPHYSICS APPROACH FOR FASTER AND MORE

ACCURATE CONVERGENCE IN DYNAMICS

EFFICIENT HANDLING OF LARGE SCALE AND COMPLEX INDUSTRIAL PROBLEMS

FINITE ELEMENT AND BOUNDARY ELEMENT METHODS COMBINED (FEM/BEM COUPLING)

MODEL ORDER REDUCTION TECHNIQUES FOR CO-SIMULATION WITH EDA SOLVERS (VERILOG A & VHDL-AMS)

MULTIPHYSICS FEA COMBINED WITH ZEMAX® FOR MOEMS DESIGN

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Engineering Standard Multiphysics Solutions When You Need To Get The Job Done!

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OOFELIE::Multiphysics fullyMagnetic MEMS MAGNETOSTATIC ACTUATOR Based on 25 μmthick SOI Magnetic...

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