HIGH ENERGY, CLEAN PULSES

Ideal for industrial micromachining applications

The GENKI XP is designed to meet the demanding needs for picosecond ultrafast material processing at high power and high pulse energy.

The availability of higher harmonic wavelengths ensures that the GENKI XP is the flexible solution for the more demanding material machining applications.

OneFive GENKI XPHigh-energy industrial picosecond laser

Applications

• Metal drilling and cutting• Ceramic and polymer processing • Semiconductor scribing • Solar cell drilling and scribing• Medical device marking, drilling, and cutting• Glass and sapphire drilling, scribing, and cutting

High energy and very clean pulsesThe system is based on the ultra-stable GENKI seed laser and provides clean pulses shorter than 10 ps, which is an optimal pul-se duration window for many micromachining applications.

The GENKI XP proprietary monolithic mechanical and optical design pushes industrialization of high power and high energy picosecond lasers to another level.

Made for the 1064 nm industry standard To satisfy the increasing demand of picosecond laser workstations, the GENKI XP has been optimized to provide up to 100 W of avera-ge power and up to 300 μJ pulse energy at the industry standard wavelengths of 1064 nm.

Tailored to high-speed automated processesThe laser can be tailored to work at lower repetition rates with even higher energies or at several MHz to follow high-speed automated processes.

Cost-effective and robustThe GENKI XP has been designed for the easiest and most cost-effective possible system integration can be mounted in any direction and offers full remote control capability.

Second harmonic option for green lightSecond harmonic generation is attainable via an external module, giving a center wavelength of 532 nm. Also, please enquire for options in the UV range.

ONEFIVE GENKI XP

Model

Center wavelength

Pulse duration

Average power

Pulse energy

Spectral bandwidth

GENKI XP

1064 nm

< 10 ps

< 100 W

< 300 µJ

< 1 nm

Features

• Pulse energy up to 300 µJ• Single shot to 80 MHz adjustable rep rate• Burst mode• Excellent energy and pointing stability• Maintenance and alignment free• Second harmonic output option • Mountable in any direction• Remote access• 24/7 industrial reliability

SPECIFICATIONSTypical output power and pulse energyOptical 1)

1064

< 10

Up to 100

Up to 300

Single shot – 80 MHz

< 1

M2 < 1.3

> 20

< 1

1) Please inquire for possible combinations of pulse duration, average power, and repetition rate.2) Spectral bandwidth depends on pulse duration, pulse energy, and repetition rate.

Center wavelength [nm]

Pulse duration [ps] 2)

Average power [W] 2)

Pulse energy [µJ] 2)

Pulse repetition rate 2)

Spectral bandwidth [nm] 2)

Beam quality (TEM00)

Polarization / PER (vertical) [dB]

Amplitude noise (RMS) [%]

Mechanical/Electrical

Laser output

Warm-up time [min.]

Operation temperature [°C]

Storage temperature [°C]

Power supply requirements

Power consumption [W]

Dimensions (WxHxL) [mm3]

Weight [kg]

Cooling

Collimated free-space

< 10 (warm start)

< 30 (cold start)

18 – 32

-20 – 55

24 VDC / 25 A + 48 VDC / 21 A or

90-264 VAC, 47-63 Hz

< 1600

630 x 142.5 x 545

70

Water

0

20

40

60

80

100

120

1

10

100

1000

100 1000 10000 100000

Out

put p

ower

(W)

Puls

e en

ergy

(uJ)

PRF (kHz)

TECHNICAL DRAWINGS

OneFive_GENKI_XP_20190521

630

505

545

142.

5

Support and warranty

All GENKI products come with an industry leading reliability.

The product is covered by a comprehensive warranty. Service options are available. For details, please enquire.

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All OneFive products are pro-duced under our quality manage-ment system certified in accord-ance with the ISO 9001:2015 and ISO 13485:2016 standard.

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