OEM Klitso catalogue

Phone: +45 70 10 64 00 Fax: +45 70 10 64 10 E-mail: [email protected] Homepage: www.oemklitso.dk

2

The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, Henkel offers a paste that suits your requirements.

PRODUCT DesCRiPTiOn/APPLiCATiOn ALLOY % MeTAL LOAD

TACK (g./MM ²)

PRinT sPeeD MM/seC.

iPC/j-sTD CLAssifiCATiOn

MP218

- Outstanding humidity resistance- Colourless residues- Soft non-stick pin testable residues- Extended open time and tack-life - Suitable for fine pich, high speed printing

SN62/SN6363S4

(Anti-Tombstoning)

89.5 90.5

(Proflow)1.1 25-200 ROL0

Ws200- High performance water washable solder paste.- Residues are readily removed with DI water, without the need for a saponifier- Good open time with excellent print definition and soldering activity

SN62/SN63 90.5 0.8 25-100 OHR1

Leaded Solder Paste

SySTEm DESCRIPTION/APPLICATION ALLOy POWDER TyPE

%mETAL LOAD

TACK (G./mm²)

PRINT SPEED mm/SEC.

IPC/j-STD CLASSIfICATION

Lf318- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues- Extended open time and tack-life

96SC AGS (45-20 µm)

88.5 2.0 25-150 ROL0

Lf700

- No-clean- Low voiding - Excellent humidity resistance - Long abandon time- High printing speed

96SC97SC

DAP (38-20 µm)

1.82.4

1.82.4 20-150 ROL0

Ws300 - Lead-free water washable solder paste96SC97SC

AGS (45-20 µm)

0.9 0.9 25-100 OHR1

Lead Free Solder Paste

Tin Lead Lead free

Solder Paste

No CleanLead free

No CleanTin Lead

Water WashLead free

Water WashTin Lead

Lf318™ mP218™ WS300™ WS200™

Lf700™

Solder Paste


Solder Wire

No Clean Water Wash

C400™ Hydro-X™

C502™

362™

C511™

Cored Wire

PRODUCT DesCRiPTiOn hALiDe COnTenT iPC CLAss

ALLOY OPTiOns (sn/PB)

ALLOY OPTiOns (PB-fRee)

COnTenT (BYWeighT)

CRYsTAL 400

Halide free, no-clean, clear residue, in creased flux content for improved wetting ZERO ROL0 60/40, SN62 96SC, 99C, 97SC 2.2%

CRYsTAL 502

No-clean, clear residue, minimal activation for increased wetting speed 0.2% ROm1 60/40, SN62 96SC, 99C, 97SC 3%

CRYsTAL 511

No clean, clear residues, heat stable 1.1% ROm1 60/40 96SC, 97SC 2.7%

362 General purpose high activity for fast wetting 0.5% ROL1 60/40, SN62 96SC, 99C, 97SC 3%

hYDRO-X High activity water washable 3% ORH1 60/40, SN62 96SC, 99C, 97SC 2%

The line of cored wires features the renowned multiple flux cores technology to ensure even and consistent distribution of flux throughout the solder wire. This reliability makes Multicore solder wires the first choice for wire soldering processes.

96SC = Sn 95,5, AG 3,8%, Cu 0,7% melting point 217 °C99C = Sn 99,3%, Cu 0,7% melting point 227 °C97SC = Sn 96,5% Ag 3,0%, Cu 0,5% melting point 217-218 °C

Bolded text is normal warehouse products.

Use fume absorbers when soldering. More info on page 48-49

3

4

Fluxes

PRODUCT DesCRiPTiOn/APPLiCATiOn % sOLiDs % hALiDs ACiD vALUe iPC CLAss APPLiCATiOn

X32-10

- Clear residue - Wide process window- A general purpose halide-free low solids flux - Suitable for foam and spray flux application systems

2.2 ZERO 15.3 REm0 SPRAy/fOAm

Mf 388- Low residue - Halide free - Ideal for Pb-free wave soldering

3.5 ZERO 20 ROL0 SPRAy

5372- High temperature - Dipping flux- Suitable for all multicore alloys

75 0.12 38 - DIPPING

Alcohol Based Fluxes

The range of VOC-free (Volatile Organic Compound) fluxes offer reliable, high yield, no clean wave soldering whilst providing significant environmental and safety benefits due to the non flammable VOC-free (water based) flux carrier systems.


Mf300- General purpose VOC-free (water based)- No-clean, halide-free and resin-free flux - Compatible with Pb-free processes

4.6 ZERO 37 ORm0 SPRAy/fOAm

VOC-Free Fluxes


hYDRO-X/20

- IPA based- A high activity water washable flux - Unique activator package - Residues are readily and completely removed by water wash after soldering - Suitable for lead-free wave soldering

20 1.0 24 ORH1 SPRAy/fOAm

Water Washable Fluxes

Liquid fluxes

5372 mf300™ Hydro-X20™

mf388™ ROmL

No Clean Voc free Water Wash

SC01™Rework Small Areas

Cleanerspage 34

X32-10i™ REmO

Syntehetic Resin


5

Surface Mount Adhesives

PRODUCT DesCRiPTiOn/APPLiCATiOn COLOR*** CURe PROCess MeThiD sTORAge (PROTeCT fROM heAT)

sheLf Life**

3609 - for high-speed dispensing- Red for best vision pickup on light surfaces

RED90 sec. at 150 °C

or3-4 min at 125 °C

High Speed Dispensing

40,000+ DPH capable.5 °C ± 3 °C 6 months

DOm

3621 - Superior humidity resistance and electrical properties - Can be used in lead free solder applications - Room temperature storage capable



Very High Speed Dispensing

47,000 DPH capable. jettable.

5 °C ± 3 °C or 8 °C -21 °C for 30 days

10 months DOm

3627 - Specially formulated for excellent

high-speed dispensing- Room temperature storage capable

RED 90 sec. at 150 °C 3-4 min at 125 °C High Speed Dispensing 5 °C ± 3 °C 6 months

DOm

3629

- High reliability - Low temperature cure- Lead-free capable- flourescence under UV light

RED PINK

60 sec. at 150 °C110 sec. at 120 °C3 min. at 110 °C

Dispensing Printing 5 °C ± 3 °C 6 months DOm

Syringe Dispense Adhesive

Henkel is the world leader in developing cutting edge technology for high-speed syringe dispense and stencil print Chipbonders®. Innovative new surface mount adhesives are developed to meet the challenges of high speed assembly processes and high reliability end user requirements.

PRODUCT DesCRiPTiOn/APPLiCATiOn COLOR*** CURe PROCess MeThiD sTORAge (PROTeCT fROM heAT)

sheLf Life**

3616 - Specifically formulated for metal stencil print applications - Especially well-suited for large components



Stencil Print(0.5-2"/sec.) 5 °C ± 3 °C 9 months

DOm

3627 - Excellent high-speed printing for finepitch components- Room temperature storage capable

RED 90 sec. at 150 °C 3-4 min at 125 °C

Dispense and Stencil Print 5 °C ± 3 °C 6 months

DOm

3629

- High reliability- Low temperature cure- Lead-free capable- flourescence under UV light

REDPINK

60 sec. at 150 °C110 sec. at 120 °C3 min. at 110 °C

Dispensing Printing 5 °C ± 3 °C 6 months DOm

Stencil Print/Pin Transfer Adhesives

PRODUCT DesCRiPTiOn/APPLiCATiOn sOLvenT TYPe fLAshPOinT CORROsive PROPeRTies

OzOne DePLeTiOn POTenTiAL

7360- Nozzle and dispense machine component cleaner- Excellent for removal of uncured adhesive from the board without causing the adhesive to gel

Aliphatic Ester Blend 100 °C None None

Clean Up Solvent


6

sYsTeM DesCRiPTiOn/CURe DesCRiPTiOn/APPLiCATiOn sheLf

Life*

LAPsheAR ADhesiOn (AL/AL)

CURe sCheDULes

Tg °C

CTe PPM/ °C

vOLUMe Resis-TiviTY (OhM-CM)

WORK Life AT ROOM TeMP.

3880 Heat Cure1-component

- Syringe or stencil dispense- Silver conductive adhesive for solder replacement - Long work life

6 months at

0-(-10 °C)

>1,000 psi 6.9

N/mm²

10 min at 125 °C6 min at 150 °C3 min at 175 °C

40 45 <.0.0005 7 days

3888 Room temperature 2-component

Room-temperature cure adhesive for applications requiring a com bination of good mechanical and electrical properties

6 months at

21-25 °C

>1,000 psi 6.9

N/mm²

24 hrs at 23 °C1 hr at 120 °C

30 min at 155 °C50 >50 <.0.0001 90 min.

Electrically Conductive Epoxy Adhesives

Loctite® Electrically Conductive Adhesives provide both a mechanical bond and an electrical interconnection between a device and a circuit board. Loctite® electrically conductive adhesives meet the industry’s need for lead-free alternatives to solder.

*Shelf life- 2-component materials have a one year shelf life at room temperature (21 °C-25 °C)

2-Component PackagesTypically used for sample evaluation and rework applications. These packages do not require special storage equipment. They can be stored up to 12 months at room temperature.

1-Component PackagesAll 1-component products are packaged in convenient syringes. These packages must be stored fROZEN at -40 °C. (The exception is product 3880 which is stored at 0 °C.)

Isotropical Conductive

Adhesive Clean-Up Solvent

3880™ 7360™

3888™

Electrically Conductive Adhesives

Screen Print/Pin Transfers

Dispense Adhesives

Cleaner

3616™ 3609™ 7360™

3627™ 3621™

3629™ 3627™

3629™

Chipbonder ™

Conductive Adhesives


7

Thermal Management Materials

PRODUCT DesCRiPTiOn/APPLiCATiOn

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 80 Psi

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 550 KPAi

TheRMAL COnDUCTiviTY (W/MK)

PhAse ChAnge TeMPeRATURe (ºC)

sUB-sTRATes ThiCKness (MM)

TOTAL ThiCKness (MM)

sUB-sTRATes MATeRiAL

Power-strate®

Xtreme™

Unsupported film with very low thermal impedance even at low pressure. fills gaps up to 0.2 mm (0.008") or collapses to form a thin interface. Direct attach to heat sink without heating. Suitable for semiconductor and power electronics applications

0.003 0.022 3.3 45 N/A 0.0080.2 None

Power-strate® 51r™

Low thermal impedance, reworkable grade. most suited to applications on lidded processors where the heat sink may have to be removed for rework.

0.008 0.052 3 51 0.051 0.074 to 0.083

AL 1145-0

Power-strate®

51,60™

Low thermal impedance, robust grade. Suited to a wide range of applications on bare die processors and other electronics devices.

0.008 0.052 3 51 or 61 0.051 0.064 to 0.16

AL 1145-0

PsX-D Thermal paste for stencil print or manual application 0.008 0.052 3.4 N/A N/A 0.254 All

silver-strate®

Excellent thermal performace, particularly at higher pressures. Typically used on Rf devices and SCRs where electrical conductivity is required, (Silverfilled).

0.003 0.022 3.14 51 0.051 0.102 to 0.127

AL 1145-0

Therm-strate®

TC™

Phase change compound in applicator bar. Ideal for prototyping, rework and small scale production.

0.021 0.137 0.47 60 N/A N/A None

Therm-strate®

2000™

Good thermal performance most suited to applications on power IGBTs, semiconductors, DC-DC converters and other isolated packages.

0.022 0.143 3 600.051

&0.128

0.076 to 0.191

AL 1145-0

Phase Change Thermal Interface Material

The PCTIMs are silicone-free and do not migrate or dry out like thermal greases. These innovative products are manufactured as a highly thixo-tropic phase change compound coated in a strictly controlled manner upon the surfaces of special grades of thin AL or CU foils, or to dielectric substrate films.

PRODUCT DESCRIPTION/APPLICATION

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 80 Psi

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 550 KPAi

TheRMAL COnDUCTiviTY (W/MK)

PhAse ChAnge TeMP. (ºC)

ThiCK-ness sUBsTRA-Tes (MM)

TOTAL ThiCK-ness (MM)

sUB-sTRATes MATeRiAL

DieLeCTRiC RATing vAC/MiL sUBsTRATe

UL YeLLOW CARD

UL fLAM-MABiLTY

isostrate® 2000™

Electrically isolating phase change material for use with a wide range of non-isolated components.

0.12 0.78 0.45 60 0.025 to 0.076

0.051 to

0.153

Polyi-mide >5000 None None

isostrate® j-series™

Electrically isolating phase change material. Ideal for non-isolated devices in high volume applications where high thermal performance is not required.

0.48 3.12 0.155 60 0.0051 0.076 Polyethy-lene >5000

See data sheet

See data sheet

MCM-strate®

Adhesive backed version of Isostrate. Allows pad to be postioned to facilitate assembly.

0.25 1.325 0.4 60 0.025 to 0.076

0.064 to

0.114

Polyi-mide >5000 E1049

35 94V-0

eMi-strate®

Unique combination of thermal and EmI management. Excellent choise for radiated EmI control.

0.4 2.6 0.69 60 See data sheet

See data sheet

Polyi-mide N/A N/A N/A

Phase Change Thermal Interface Material - Electrically Isolating Products


8

PRODUCT DesCRiPTiOn/APPLiCATiOn CURe/CheMisTRY

sPeCifiC gRAviTY visCOsiTY sheLf Life CURe

sCheDULes MODULUs Tg °C CTe PPM/ ºC

TheRMAL COnDUCTi-viTY

315Self-shimming for electrical isolation; room-temperature-curing adhesive.

1-component Activator*Acrylic

1.7 Paste 9 months at 5 °C

5 min. at 20 °C4-24 hr. at

20 °C

390,000 psi

2700 N/mm2

50 69 0.80W/mK

384 Repairable, room-temperature-curing adhesive utilized for parts subject to disassembly.

1-component Activator*Acrylic

1.6 Paste 9 months at 5 °C

5 min. at 20 °C4-24 hr. at

20 °C

400,000 psi

2800 N/mm2

50 110 0.76 W/mK

5404 Self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.

1-component Heat CureSilicone

2.4 280** g/min.

5 months at 4 °C

10 min. at 150 °C

587 psi****

4 N/mm2-40 104 1.0

W/mK

7386

7387 DEPEND is one component of a two part no mix adhesive system. It is solvent based and has a very low viscosity. 1.75 oz bottle

Heptane and Isopropanol 0.8 Very low on part life

2 months N/A N/A N/A N/A N/A

Thermal Adhesives

Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips while providing an efficient method of thermal transfer between heat generating electronics devices and their heat sinks.

* Use with activator 7386. ** Extrusion measured @ 50 psi/0.125" orifice. *** made to order. Initial order may require longer lead time. **** youngs modulus

Thermal management mtl.

Activator

7386™

Shimming

315™

5404™

Non- Shimming

384™

Adhesives Thermal Paste Specialty mtl.

PSX-D® EmI-Strate®

Thermal Pads

ElectricallyInsulating

Isostrate®

ElectricallyConductive

Silverstrate®

Non-Insulating

Powerstrate® Xtreme™

Powerstrate®

Thermstrate®

Thermal Management Adhesives


9

Silicones

PRODUCT feATURes MiX COLOUR DenCiTY g/CM³

visCOsiTYMPA s

POT Life23° C

CURe TiMe°C/iMe fOR 1 CM

hARDness COne MM/10 APPLiCATiOns

semicosil® 926

- Low viscosity- Ready-to-use, one-component- Rapid heat cure- Low content of uncured polymer- Low ion content

1K Transp. 0.96 150 6 H100˚/240 min130˚/40 min150˚/10 min

60Encapsulation of electronic components.

semicosil® 924

- Thixotropic flow- Low ion content- Low content of volatiles- Low content of uncured polymer- forms a soft gel on vulcanization

1K Transp. 0.98 35 000 2 500

3 month15˚C/

6 month

100˚/240 min130˚/40 min150˚/10 min

50

Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are expo-sed to extreme external influences.

Wacker silgel® 612

- Very low viscosity- Very low hardness (silicone gel)- Crystal clear vulcanizate- Pronounced tackiness- Excellent mechanical damping properites

1:1 Transp. 0.96 1 000 2 H23˚/8 hrs

70˚/15 min120˚/5 min

300

Encapsulation of electronic components and solar cells. Embedding of optical fibres. Production of shock absorbers.Sealing of clean-room filters.

elastosil® RT745s

- Very low viscosity- Low ion content

1K Transp. 0.97 1 000 >4 H80˚/30 min120˚/5 min150˚/2 min

5 37

Shore 00

Encapsulation of electronic components

Potting and Encapsulation Silicone gel addition-curing

Silicones offer highly diverse product properties for virtually unlimited applications. With their great versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability, weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating and dielectric characteristics.


visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10

APPLiCATiOns

elastosil® RT 601

- Low viscosity- medium cured hardness - Excellent tensile strength- Crystal clear vulcanizate

9:1 Transp 1,02 3 500 90 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

45All-round potting compound.manufacture of moulded articles by casting.

elastosil® RT 602

- Low viscosity- medium hardness - Excellent heat stability

9:1 Light Grey 1,17 3 500 80 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

30 All-round potting compound.

elastosil® RT 604

- Very low viscosity- Low hardness - Crystal clear vulcanizates

9:1 Transp 1,02 800 90 min

23˚/24 hrs70˚/30 min100˚/8 min 150˚/5 min

25Encapsulation of electrical and electronic components.

elastosil® RT607

- High hardness - Excellent heat stability- flame retardant

9:1 Reddish brown 1,43 10 000 80 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

55 All-round potting compound.

elastosil® RT 622

- Good processing due to low viscosity- Very good mechanical properties- Soft vulcanizates


23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

27

All-round potting compound.Technical mouldings.Encapsulation of electrical components.

elastosil® RT 675

- Low viscosity- Low hardness - fast curing at higher temperatures


23˚/24 H70˚/60 min100˚/30 min 150˚/10 min

80Encapsulation of electrical components.

elastosil® RT 743 Lv

- Extreme hardness- Excellent heat stability- Extremely high thermal conductivity

9:1 Grey 1,50 1 100 8 h 100˚/60 min 150˚/15 min 20

Encapsulation of electrical components.

Silicone Rubber Addition-Curing RTV-2


10

Encapsulaation and Coating Silicone Rubber


visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10 APPLiCATiOns

elastosil® 935

- Low viscosity- Very long pot life- fast curing at elevated temperatures- Low hardness- High flexibility- Low risk of inhibition by soldering or flux residues

1:1 Transp 0.97 3 500 7 days10˚C/14 d

80˚/30 min 120˚/10 min150˚C/5 min

15Coating of printed circuit boards.Encapsulation of electronic components.

PRODUCT feATURes MiX COLOR DenCiTY g/CM³

visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10

APPLiCATiOns

elastosil® A 07

- Ready to use, one-component system- Low viscosity- High flexibility - Primerless adhesion to many substrates

1 K Transp. 1.08 10 000-

3-5 min 5 20

multipurpose sealant and coating material.

elastosil® A 234

- Amine-curing system- flowable- Excellent heat stability- Excellent primerless adhesion to many substrates

1 K White 1.21 35 000 10-20 min 2 36

Gluing and sealing of steam chambers and sole plates of steam iron

elastosil® A 33

- Ready to use, one-component system- Good mechanical properties- Primerless adhesion to many substrates

1 K Ivory 1.16 -2

10-20 min 2 25

Adhesive for the coating and sealing at high temperatures.

elastosil® A 43

- Amine-curing system- flowable- Excellent heat stability- Excellent primerless adhesion to many substrates

1 KTransp. Black

1.09 350 00010-25 min

1-2 30General-purpose adhesive and coating for technical and medical applications

elastosil® n 2010

- Neutral curing system (alkoxy)- Sprayable- flowable- Primerless adhesion to many substrates- Good heat stability

1 K Transp. 1.01 20 000-

10-25 min 2-4 25

General-purpose adhesive and coating for technical applications

elastosil® n 2034

- Neutral curing system (alkoxy)- Short skin forming time- fast curing- flowable- Primerless adhesion to many substrates- Good heat stability

1 K Black 1.14 45 000-

20 min 2-4 36

General-purpose adhesive and for technical applications. CIPG- and fIPG-applications e.g. for headlamps.

elastosil® n 2197

- Neutral curing system- Solvent free- Non-slump- Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1 K Grey 1.24 N/A25 min

2-4 35 General-purpose adhesive and for technical applications.

elastosil® n 2199

- Neutral curing system- Solvent free- Non-slump- Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1 K Transp. 1.05 N/A25 min

2-4 40 General-purpose adhesive and for technical applications.

elastosil® n 9132

- One-part, ready-to-use- Neutral curing system- Non-slump- Excellent unprimed adhesion to most plastic, metal, glass and ceramic substrates- flame retardant:meets UL 94V-O

1 K

Grey

1.30 N/A 5-20 min 2-4 33

The fully cured rubber can withstand expansion-compression cycles for many years. Especially well suited for joining materials with different coefficients of thermal expansion.

n 9132 s White

elastosil® n 189

- Neutral curing system (oxime)- Non-slump- Good resistance against mineral oil and coolant fluids - Excellent heat stability- Excellent adhesion to many substrates

1 K Black 1.0 -10

10-25 min 1-2 60

General-purpose adhesive fortechnical applications.

fIPG- and CIPG-application

Bonding, Fixing and Sealing/Gasketing Room temperature Curing RTV-1

Silicones


11

Silicones


visCOsiTYMPA s

sheAR RATe. g/10s

CURe TiMe 23 °C

hARDness shORe A APPLiCATiOns

elastosil® RT 705

- Ready-to-use, one-component - flowable- Thixotropic- High extrusion rate- fast curing at high temperatures- Good heat stability- Excellent primerless adhesion to many substrates

1K Black 1.23 100 00013 000 26 min 140˚/20 min

200˚/3 min 45

Allround glue for houseware and metal industry.Useable for silk screen printing.

semicosil® 986/1K

- Ready-to-use, one-part system- Thixotropic- Translucent, medium hardness- High flexibility

1K Transp. 1.07 300 000 -

100 °/6 h 130 °/30

min 150 °/10min

51General purpose adhesive for the electronics industry.

semicosil® 987/1K

- Ready-to-use, one-component system- Low viscosity during dispensing non- slump after dispensing- medium hardness- High flexibility - Primerless adhesion to many substrates

1KTransp.

+ Grey.

1.1 300 00030 000 -

100˚/6 h130˚/1 h

150˚/10 min50

General purpose adhesive for the electronic industry. fIPG-and CIPG-applications.

Heat Cure SiliconeAdhesive Silicone Rubber Addition-Curing

PRODUCT feATURes COLOUR DenCiTY g/CM³

OPeRATing TeMP.

hARDness COne MM/10

APPLiCATiOns

silicone Paste P 4

- Good electrical properties- Good adhesion to metal and ceramic materials- Excellent water repellency

Transp. 1.0 -40 - +220 350Lubricants for shut-off valves. Release agents for compression moulding, extruder die rings.

silicone Paste P 12

- Soft, heat sink paste with marked thermal conductivity- Electrically insulating White 2.25 -30 - +200 300

Especially used in semiconductor technology as a heat sink paste.

geniosiln 550

- Silane modified polymere adhesive, free of isocyanates, tin catalysts and silicones - Neutral curing - Temperature range -50° C to 120 °C - Solvent free - Excellent adhesioin

Grey. 1.3 -50 - +120 Shore A55

Sealant/elastic adhesive for technical applications. Can be varnished with suitable paints in cured and uncured state.

Silicone Paste


12

Die Attach Adhesives

PRODUCT DesCRiPTiOn/APPLiCATiOn Resin fiLLeR Oven CURe/sKiP CURe

visCOsiTY 5RPM AT 25 °C


Tg (°C)

CTe 1/2

MODULUs AT 25°C

sTORAge TeMP.

QMi 536

Industry Standard Industry standard for die-to-die bonding; dielectric, high adhesive strength material for organic substrates.

BmI PTfE

15 min at 150 ˚C oven10 sec at 150 ˚C SC

9000 CPS 0.3 W/mk -31 93174 0.30 GPa -40 °C

QMi 550si

Low CTE CVersion of QmI 550Silica-filled for low shrinkage and low warpage on laminate and flex substrates.

BmI Silica

15 min at1 50 ˚C oven10 sec at 150 ˚C SC

17000 CPS 0.6 W/mk 33 4391 1.50 GPa -40 °C

QMi 550 eC

Electrically ConductiveSilver-filled version of QmI 550; very high adhesive and cohesive strength.

BmI Silver


17000 CPS 3.8 W/mk 2 46148 2.8 GPa -40 °C

Die Attach Adhesives for Non-Hermetic Packages For organic substrates including laminates, array, BGA and CSP packagers

Based on ultra-hydrophobic chemistry, Hysol® die attach adhesives offer very high adhesive strength, elongation at break, and cohesive energy at high reflow temperatures. These properties help electronic packages retain adhesive strength and structural integrity during moisture soak and absorb stresses during the deformations associated with lead free reflow processing.

PRODUCT DesCRiPTiOn/APPLiCATiOn Resin fiLLeRReCOM-MenDe CURe

visCOsiTY 5RPM AT 25 °C


Tg (°C)

CTe 1/2

MODULUs AT 25°C

sTORAge TeMP.

QMi 518

Electrically Conductive, Large dieSimilar properties to QmI 519, but formulated to have a low modulus to reduce stress on die larger than 500+500 mil./13-13µm.

BmI Silver


8500 CPS 1.4 W/mk -64 69152 0.10 GPa -40 °C

QMi 519

jEDEC L1 260C for SOIC, QfN Industry standard for QfN packages. Good for all preplated leadframes, and bare copper. Higher adhesion, excellent electrical and thermal performance.

BmI Silver

15 min at 185 ˚C oven

10 sec at 200 ˚C SC

9000 CPS 3.8 W/mk 75 40140 5.3 GPa -40 °C

QMi 519hT02l

High Thermal ConductivityVery high electrical and thermal conductivity while maintaining excellent adhesion. Suitable for high heat dissipating devises.

BmI Silver


18800 CPS 7.3 W/mk 49 42104 6.70 GPa -40 °C

For inorganic substrates incl. CU, Pd, Ag & Au plating, ceramic and black oxide


13

Encapsulants

PRODUCT DesCRiPTiOn/APPLiCATiOn POT Life AT 25 ºC

ReCOMMen-DeD CURe

fLOW PROPeRTies

visCOsiTY AT 25ºC Tg. ºC CTe (1)

(PPM/ºC) % fiLLeR sTORAge TeMP.

fP4451 flow Control Barrier 24 hrs.

30 min. at 125 °C

+ 90 min. at 165 °C

None 860,000 cps 145 24 72 -40 °C

Semiconductor Liquid Encapsulants Flow Control / Dam Materials

Semiconductor Liquid Encapsulants.

Henkel´s co-cure dam and fill encapsulants cure in one easy step, requiring no pre-cure of the dam material. High purity liquid epoxy encapsulants are designed to work together as dam and fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mechanical damage and corrosion.

Chip on Board Liquid Encapsulants.

These products cure to form void-free globs when exposed to heat, with formulations for low CTE, minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense, minimize induced stresses, provide improved temperature cycling performance, and offer excellent chemical resistance.


ReCOM-MenDeD CURe

fLOW PROPeRTies



fP4450 ICs, COB, BGA, PGA 3 days

30 min. at 125 °C

+ 90 min. at 165 °C

High 50,000 cps 155 22 73 -40 °C

fP4470 Lead-free Packages 5 days

30 min. at 125 °C

+ 90 min. at 165 °C

High 48,000 cps 148 18 75 -40 °C

Fill Encapsulants


ReCOM-MenDeD CURe

fLOW PROPeRTies



eO1016 COB, Watch ICs 3 months 15 min. at 150 °C medium 70,000 cps 115 40 40 4 °C

eO1060 Chip on Board 25 days 4-6 hrs. at 125 °C High 15,000 cps 125 40 61 4 °C

fP4401 Chip on Board 24 hrs.

3 hrs. at 170 °C or

6 hrs. at 150 °C

Low 375,000 cps 160 22 75 -40 °C

Clip on Board Liquid Encapsulants


14

Circuit Board Protection Underfills

Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, providing electrical insulation, and increasing vibration and shock resistance.

PRODUCT DesCRiPTiOn TYPe POT Life visCOsiTY CPs CURe CYCLe seCOnDARY CURe

DeLeCTRiC sTRenghT (v/MiL/Kv/CM)

TeMP. RAnge

PC 18

- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative.- Application by non-atomized selective spray coating equipment.- Components and joints may be repaired by heating the coating with a soldering iron for easy removal.

Urethane 60 min.tack free 350

Heat 2 hrs. at 125 °C

5-7 days at RT 1200/472continuous

up to 110 ºC

PC 28

- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray procedures

Urethane 60 min.tack free 35

Heat 5-7 days at

25 °C

Air Dry 30-60 min. followed by

2-4 hrs. at 60 °C1500/591

continuous up to

110 ºC

PC 62

- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance.- Apply by brush, dip or spray to meet mIL-I-46058C, Type PUR, requirements

Acrylic confor-

mal

5 min. tack free 40-60 24 hours

at 25°C45 minutes

at 75°C N/A –40 -125°C

5293

- UV Silicone for severe temperature cycling environments.- High reliability automotive- No solvents- Low VOC

Silicone N/A 600UV 20-40

sec.75mW/cm2

moistureTack free:2-6 hrs.full cure: 72 hrs

406/160 -40 -204 °C

Conformal Coatings

PRODUCT DesCRiPTiOn/APPLiCATiOn visCOsiTY AT 25°C POT Life CURe

sCheDULe Tg. °C CTe(1) (PPM/°C)

CAPiLLARY fLOW sTORAge TeMP.

3513 Reworkable CSP 4,000 cps 2 days 30 min at 100 °C 69 70 N/A 2 °C - 8 °C

3593 Snap Cure Rapid flow CSP 4,500 cps 7 days 5 min at 150 °C 110 50 100 sek. 2 °C - 8 °C

Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants

Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer easy reworkability as well as excel-lent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life.


15


Optilia Instruments AB is manufacturer of high quality flexible video and digital microscopes for visual inspection, quality control, software analysis & measurements and digital image recording & documentation.

W10x

• Inspectioncamerawithbuilt-inlaserpointer

• 10xopticalzoomandautofocusfunction

• Analogvideosignal(PAL)

Flexia Visual Inspection & Documentation kit

• ESDProtectedandApproved

• DigitalImageRecording&Documentation

• HighImageQuality

Inspection

16

PRODUCT DesCRiPTiOn/APPLiCATiOn PACKing size

sC01 - SC01 is designed for the stencil cleaning and hand cleaning of solder process residues. - A highly effective cleaner that dries rapidly (fast evaporation). 5 L

MCf800 - mCf800 is designed for post soldering cleaning using cleaning process equipment. - Highly effective cleaner, requires rinse using either water or solvent. 8 mL

sPOT OnsOLDeR MAsK

- Temporary solder resists used with circuit boards prior to soldering. - Ideal for prevention of PTH hole filling and for the protection of contact surfaces e.g. edge connections. - Suitable for use with hand, robotic, pneumatic or template screening applications and brush. - Peelable for easy removal.

250 mL5 L

TTC-Lf

- Handy, non-abrasive solder iron tip-tinner. - Easily wets hot solder irons leaving a brightly tinned tip. - Improves hand soldering efficiency and extends tip life. - Adhesive pad allows easy mounting on or near the solder iron holder.

15 G

sTW 001 - Stencil Wipes 100 wipes/can

Cleaners and other products

PRODUCT DesCRiPTiOn/APPLiCATiOn TYPe AvAiLABLe WiDThs

nO-CLeAn DesOLDeRing

WiCKs

- fast, easy means of removing solder. - No-clean, High activity flux means minimal cleaning is required. - Comprehensive range available

NC-00 NC-AA NC-AB NC-BB

0.8 mm 1.5 mm 2.2 mm 2.7 mm

PRODUCT DesCRiPTiOn/APPLiCATiOn RAnge AvAiLABLe

Mini fLUXeRs & CLeAneRs

- Controlled release flux and cleaner pen applicators. - Ideal for controlled application of flux when carrying out SmT re-work. - Cleaner pen easily removes residues.

No clean flux x335-07i penCleaner mCf-800 pen

multicore NC-BB™

SOLDER ACCESSORIES

mini fluxers (flux Pen) Wicks

multicore Spot-On™

Solder masks mini Cleaners Tip Tinners

multicore mCf800™

multicore SC01™

multicore TTC-Lf™

multicore NC-00™

multicore NC-AA™

multicore NC-AB™

No Clean

multicore x33S-07i

SWEDEN FINLAND DENMARK NORWAY ESTONIA +46 (0)75 24 24 650 +358 (0)20 7528 700 +45 87 42 66 66 +47 32 21 05 80 +372 510 05 05 +46 (0)75 24 24 651 +358 (0)20 7528 770 +45 87 42 66 77 +47 32 21 05 81 +372 445 65 70 [email protected] [email protected] [email protected] [email protected] [email protected] www.cyncrona.se www.cyncrona.fi www.cyncrona.dk www.cyncrona.no www.cyncrona.com

Phone:Fax:

E-mail:Homepage: 17

SolderingStationsSoldering Stations 2010

18

Soldering Stations

19

Soldering Stations

20

sYsTeM/ PART nO DesCRiPTiOn nOMinAL POWeR TOTAL PeAK POWeR TeMP. seLeCTiOn BeTWeen

BD-2BABD-2SA

Digital soldering station with 2-lines readout display and menu for modification of values from original setting 75W 60/140 W 90-450 °C

CD-2BASoldering station 230V for general electronics jobs. Includes control unit BD, handpiece T245-A, cartridges C245-003 and C245-007

75W 140 W 90-450 °C

CD-2SASoldering station 230Vfor high precision solder joints.Incudes control unit BD, handpiece T210-A, cartridge C210-001 and 210-008

75W 60 W140 W 90-450 °C

Entry line soldering stations

Soldering and desoldering stations

Single line soldering stations


Cf-2A

Solder feed station 230VDesigned for repetitive soldering or when you need a free hand. Equiped with solder feed iron of 1mm diameter.Includes AP control unit, AP-A solder feed iron, C130-403 cartridge.

75W 140 W 90-450 °C

CP-2Amicro tweezers station 230Vfor soldering and desoldering SmD components with micro-tweezer. Includes control unit PA, PA-A micro hot tweezers and 2 x C120-002 cartridge.

2 x 20W 2 x 40 W 90-450 °C

Single line desoldering stations


CS-2A

Electric system 230VElectric suction system powered by control unit DSV or electric vacuum pump mS-A.Includes control unit DSV, DS-A micro desoldering iron with tip C360-004, mS-A electric vacuum pump.

20W 30 W 300-450 °C

CV-2A

Pneumatic system 230VPneumatic suction system with dial for temperature selection. Includes control unit DSV, DS-A micro desoldering iron with tip C36-004, pneumatic suction system feeded by compresed air max 6 bar.

20W 30 W 300-450 °C


21


sYsTeM/ PART nO DesCRiPTiOn nOMinAL

POWeRTOTAL PeAK POWeR

TeMP. seLeCTiOn BeTWeen WeighT

DIT-2A Soldering station 230Vfor general electronic applications. Includes control unit DI-2A, stand AD-SA, soldering iron T245-A and cartridge C245-003

75 W 140 W 300-450 ºC 2 kg

DIR-2ASoldering station 230Vfor high and medium precision solder-joints.Includes control unit DI-2A, soldering iron T210-A, cartridge C210-001 ad stand AD-SA

75 W 140 W60 W 300-450 ºC 2 kg

DIT and DIR Soldering Stations, one channel

DIS Desoldering Station




DIS-2A

Desoldering station 230V.for desoldering insertion componenets and cleaning circuits with SmD components.Includes control unit DI-2A, desoldering iron with tip C560-003, stand DR-SA, mS-A suction module electric system and accessories set.

75 W 140 W 300-450 ºC 2 kg

DSS-2A

micro desoldering station 230V.for desoldering small and medium-sized insertion components; high-precision station with small measurements. Includes control unit DI-2A, desoldering iron DS-A with tip C360-004, stand DS-SA, mS-A suction module electric system and accessories set.

75 W 140 W 300-450 ºC 2 kg

DIN Nitrogen Soldering Station 230V




DIN-2A

The DIN-2A nitrogen soldering station combines 2 ways of transferring heat: - By direct contact between the solder tip and the solder joint, just like a normal soldering iron. - By nitrogen which is heated when flowing through the soldering tip. Includes DI-SA control unit, stand DN-SA, nitrogen handpiece T245-NA with C245-003.mN-A nitrogen flow regulator. N2 flow regulation:: 0,5-3,5 LPm at 5 Bar.max pressure:6 Bar.

75 W 140 W 90-450 ºC 1,2 kg

PRODUCT/PART nO DesCRiPTiOn

GN-A

Compressed air pressure: 4 to 6 Bar•Gas N2 concentration: up to 99,9%•Concentraded N2 gas flow: 1 to 2 NL/min.•Weight: 2 kg•

GN-A Nitrogen module generator

An externa nitrogen circuit is needed or the nitrogen generator from jBC GN-A


22

sYsTeM/PART nO DesCRiPTiOn nOMinAL POWeR

TOTAL PeAK POWeR

sLeeP MODe POWeR

hiBeRnATiOn MODe POWeR WeighT

TeMP. seLeCTiOn BeTWeen

DDsT-2A

Soldering and desoldering station 230 V The station offers a complete solution for fast and safe repair of insertion component circuits by suction of hte solder. The station can also be used for cleaning pads in SmD circuits.

2 x 75W 2 x 140W 2 x 10W 2 x 4W 4.5 kg 90-450 °C

DDST Rework Station


sYsTeM/PART nO DesCRiPTiOnMAXi-MUM POWeR

TeMP.seLeCTiOn

TeMP. ROOM

AiR fLOW RegULATiOn

PROTeCTeD AgAinsT AnTisTATiC DisChARge

TOTAL WeighT

jT-2A

A high power hot air station used for desoldering all types of SmD's. Its powerful heater desolders even the biggest QfPs and PLCCs quickly and safely. Desoldering small and mediumsized BGAs is done in a very short time.

1000 W °C room -

450°C and "cool"

6-45 l/min yes 8,7 kg

JT High Power Hot Air Station 230 V

sYsTeM/PART nO DesCRiPTiOnPOWeR MAX OUT

TeMP. seLeCTiOn

vARiABLe AiR fLOW seTTings

TOTAL WeighT

Te-2AA precision hot air station ideal for soldering and desoldering small and medium-sized SmD components.Autonomus hot air station, digital, thermo regulated with air flox control.

300 Wroom -

450°C and "cool"

between 4 and 11 l/

min6,7 kg 90-450 °C

TE Hot Air Station 230V

inCLUDes

Control unit DD-2AHandspiece T245-ACartridge C245003Desoldering DR-ATip C560-003Stand AD-SA and DR-SASuction electrical system mS-ASet of tools and accessories

inCLUDes jT-2A inCLUDes jT-2QA

Control unit jTE-2AHeater 1000 WExtractor stand with 5 extractors, 5 protectors and 2 tripodsHeater standSet of accessories

Control unitStandHeater handle 1000 W No accessories

inCLUDes Te-2A inCLUDes Te-2QA

Control unit jTE-2AHeater 300 WHeater stand jT-SAAccessoriesExtractor stand with 2 tripods, 3 extractros and 5 protectors

Control unitStandHeater handle 300 W No accessories


23



TOTAL PeAK POWeR

sLeeP MODe

hiBeRnATiOns MODe

TeMP. RAnge WeighT

HD-2A Ideal solution for high thermal demand and prolonged heavy duty soldering applications. Specifically designed for extensive soldering of multi-layerd circuits and parts which require high remperatures.

145 W 270 W 20 W 9 W 90-500ºC 4,5 kg

HD Heavy Duty Station 230 V

AL Automatic Solder Feed Station 230 V

PRODUCT DesCRiPTiOn PART nO

AL-iA Indispensable for using the AL system while having both hands free. for this purpose it is also necessary to use the pedal set

0964551

AL-IA Hands-free soldering arm for soldering iron AL


TOTAL PeAK POWeR

sLeeP MODe

hiBeR-nATiOns MODe

sOLDeR WiRe DiAM-TeRs

TeMP. RAnge WeighT

AL-2A Ideal solution for extensive soldering application, and any soldering application that requires one or two free hands.

75 W 140 W 10 W 4 W 0,5 - 1,5 mm 90-500ºC 3,2 kg

AM Rework Station 230 V


PeAK POWeR

POWeR hOT AiR UniT

sOLDeRing iROn TeMP RAnge

DesOLDeRing iROn TeMP RAnge

hOT AiRTeMP. RAnge

AM-2A

Designed for rework and repair of through-hole and SmT boards. The station´s 4 modules offer the following rework/repair operations: - Desoldering of SmD components of any size by hot air.- Desoldering SmT and through-hole components.- Pick & Place tip for placing components. - Soldering of any kind of components.

2 x 75 W 2 x 140 W 900 W 90-450ºC 300-450ºC 150-450ºC

inCLUDes

Control unit HD-2AHandspiece T245-ACartridge C470003Stand AD-SA

inCLUDes

Control unit AL-2AComplete handle AL-ACartridge C250403Stand AL-SATubes set and guides for: wires ø 0,9 - 1 mm: 00024101

inCLUDes AiR fLOW RegULATiOn

vACUUM PUMP fOR hOLDing iCs WeighT sLeeP MODe hiBeRnATiOns

MODe

Control unit Am-2AT245 handpiece with cartridge C245003DR-A desoldering iron with the C560-003 tip heater 1000W.mP 2260 Pick & Place Extractor stand with.5 extractors, 5 prtectors and 2 tripods.Stands for soldering iron, desoldering iron and heater. Set of accessories.

6-45 l/minx 8,1 kg 2 x 10 W 2 x 6 W


24


PeAK POWeR TeMP RegULATiOn WeighT

nAsT-2A A complete station designed for micro soldering and desoldering of small-size components like chips 0201, 0402 etc.

15W 30W 90-450 °C 2.6 kg

NAST Nano Station 230 V



PeAK POWeR

sLeeP POWeR

hiBeRnATiOn POWeR

TeMP. seLeCTiOn WeighT

Di-2A 1-tool digital control unit features a digital read-out display for accurate temperature and tool control.

75 W 140 W 10 W 4 W 90-450 °C 2 kg

DI-2A 1 Tool Control Unit


TOTAL PeAK POWeR

sLeeP POWeR

hiBeRnATiOns POWeR

TeMP.seLeCTiOn WeighT

DD-2A

2 tools control unit 230 VOffers connectivity for working with 2 tools simultaneously.. Designed for production and rework applications with high thermal requirements.

2 x 75W 2 x 140W 2 x 10W 2 x 4W 90-450 °C 3,5 kg

DM-2A

4 tools control unit 230 VOffers connectivity for working with 4 tools simultaneously.. Designed for production and rework applications with high thermal requirements.

4 x 75W 4 x 140W 4 x 10W 4 x 4W 90-450 °C 4,5 kg

DD and DM 2- & 4- Tools digital Control Units

inCLUDes

Control unit NA-2ANano soldering iron NT205-ANano tweezers NP105-ACartridge set (10 pcs)

fOR A COMPLeTe sTATiOn fOLLOWing is neeDeD

Control unitOne tool with corresponding stand & cartridge

fOR A COMPLeTe sTATiOn fOLLOWing is neeDeD

Control unitfrom 1 to 4 tools with its corresponding stand & cartridge


25


sYsTeM/PART nO DesCRiPTiOn POWeR sUPPLY TYPiCAL sURfACe ResisTAnCe

ReCOMMenDeD AiR PRessURe WeighT

Ms-AmS-A electric suction moduleElectric suction module with overdrive startup funtion that offers quick collection of solder before it cools down. This suction system is regulated by the control unit.

12 W 24 V 1015-1011 - 1,7 kg

Mv-A

mV-A pneumatic suction moduleThis pneumatic suction module uses compressed air and a Venturi valve. This system offers outstanding desoldering results because of its immediate suction responsiveness. This suction system is powered by compressed unit.

3 W 24 V 1015-1011 5 Bar (max 6) 1,4 Kg

MS-A and MV-A Desoldering Suction Modules

Tip tinner TT-A

for chemical cleaning and tinning the tip at the same

time. Very efficient.

Cleaning sand CL6780

The most "aggressive" method to clean even the most oxidated tips.

Metal wool CL6205

Dry cleaning method, indispensable for lead-free soldering. Removes oxidation and facilitates tinning.

Metal brush CL6217

Cleans tips, tweezers and desoldering irons the same way as metal wood.

Stand accesory + sponge S7080

Dry cleaning system + Metal wool CL6760

Dry cleaning + sand CL6780

Stand

Cleaning of Tips


26

Stands and Tools

sYsTeM/PART nO fOR hAnDPieCe inCLUDes

AD-SAT210-A•T245-A•

Dry cleaning module with metal wool•3 cartridges extractor magazine for C210 or C245•Quick cartridges change•Sleep mode•

PA-SA for PA-A micro hot tweezers• Sponge stand •Sleep mode•

DR-SA for DR-A desoldering iron• Brush and sponge stand•Sleep mode•

AP-SA for AP-A solder feed iron• Sponge stand •Sleep mode•

HT-SA for HT-A hot tweezers• Sponge stand•Sleep mode•

AD-SA for AP-A solder feed iron• Sponge stand •Sleep mode•

HT-SA for HT-A hot tweezers• Sponge stand•Sleep mode•

DS-SA for DS-A micro desoldering iron• Brush and sponge stand•Sleep mode•

TOOLs sYsTeM/PART nO DesCRiPTiiOn

NANOThe smallest soldering tools available in the market

NP-A• Uses cartridges C105•Perfect for soldering and desoldering very smal-sized chip components.•

NT-A• Uses cartridges C105•for high-precision soldering jobs•

Handpiece T-210-A•for precision applications•Used with C210 cartridges•Offers quick cartridge change•

T245Handpiecefor general soldering jobs in elec-tronics

T-245• Offers • quick cartridge change

T245-fA• A screw in this handpi• ece allows fixation of cartridges, ideal for high-intensity jobs that do NOT require frequent change of cartriges.

T245Comfort handpiecesSame characteristics as T245.Neoprene grip, thermally isolating and giving more comfort to the user. Ideal for intensive soldering.

T245-CA• Quick cartridge change•

T245-TA• Handpiece incorporates a screw that allows to fix the cartridges•Ideal for high intensity jobs where NO cartridge change is needed•

T245-SA• A screw in this handpiece helps to securely fix the cartridge, ideal for extensive soldering jobs that do NOT •require frequent cartridge changes. Supplied with a cable of 3 m lenght.


27

Tools and Cartridges

TOOLs sYsTeM/PART nO DesCRiPTiOn

microtweezers

PA-A• Designed for soldering and desoldering SmD micro components•Each cartridge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature•The available range of cartridge is made for desoldering a wide range of components.•Connected to jBc stations, DI, DD, Dm, Am and single line AP.•Supplied without cartridges.•

TweezersHT-A• Specially for soldering and desoldering small and medium-sized SmD components. A cable strip cartridge is also available.•

Each cartrdge is individually controlled by the control unit, guaranteeing fast heating-up, accuracy and recovery of temperature.•Conntcted to jBC station DI, DD, Dm Am and single line AP•

microdesoldering ironsDS-A• Adapts to the ever-decreasing size of new components.•

Very easy cleaning and maintenance. Tips are easily inserted by gentle pushing•Contacted to jBC stations DS-2A, DV-2A, DI, DD, Dm, Am and single line AP•Supplied with tip C360-004•

Desoldering ironDR• Very easy cleaning and maintenance•

Two different types of solder residue chambers are available: metal and glass•Tips are easily palced by thread•Supplied with tip C560-003•

Soldering wire feeding ironAP-A• Offers a "third hand" by feeding soldering wire from diamters 0.8 to 1 mm. Specifically helpful for high-volume soldering jobs, •

and whenever an extra hand is needed.Connected to jBC stations DI, DD, Dm, Am and single line AP•Supplied wiht cartrigde C130-403•

Solder reelsSN5450• Solder reels for AP-A•

The soldering irons are fitted with lead free solder reel - 99% Sn/0.3% Ag/0.7 Cu - with 50g solder.•

Cartridges


28

WorkEnvironmentWork Environment 2010

Cartridges

WorkEnvironmentWork Environment 2010

The outline of your workplace is an important part in your work environment. It is not just about machines and premises. Access to good air, safe surroundings, beautiful interior

constructions, ergonomic furniture and tools makes the work environment better.

30

The world technical leader in air pollution systems

Filtronic's business concept is to develop and manufacture mobile filter systems by creating a better workbench environment and protect individuals and products from hazardous gases and particles.

Filter System

High Airflow Systems

Extract Arm Concept

CBC-Clean Bench Concept

High Vacuum Systems


31

sYsTeM DesCRiPTiOn

MAX sUCTiOn CAPACiTY M3/h

BLOWeR CAPAsiTY M3/h

sOUnD LeveL DB(A), AT 1 M.

MiCROfiLeR sePARATiOn DegRee DOP%

gAs fiLTeR-CheMi-sORBTiOn-sePARATiOn DegRee %

POWeRsize(WhD) WeighT

ReMOTe COnTROL

PART nO

vOLTAge PRe fiLTeR

Mg 75

High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The mG75 is a filter unit with connection for one extraction arm. Remote control for

75 100 38-49 >99.97 >95

100465mm640mm220mm

15 kg

yes

750-1000-ESD750-1010-ESD

100/-250V Accessory

Mg 95

High efficiency fume extraction with a wide range of filters depending on applications. It meets the demands for work in cleanroom. The mG95 is a filter unit with connection for one or two extraction arms. Remote control

100 140 38-50 >99.97 >95

100465mm640mm220mm

18 kg

yes950-1000-ESD950-1010-ESD

100/-250V Accessory

Mg 100

fume extraction system with high efficiency filter. Connection for one or two arms. The system can be set in variable speed and has an alarm

100 140 <52 >99.97 >95

100W460mm640mm210mm

15 kg

No100-1000-ESD100-1032-ESD100-1055-ESD100/-

250V Accessory

Mg 200

High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter. Wide range of filters depending on application. meets the demands for work in cleanroom. Remote control for

200 310 <55 >99.95 >95

300W400mm1016mm402mm

43 kg

yes

200-1000-ESD

115/-230V yes

Mg 400

High efficiency fume extraction system with integrated pre filter and a combined particle and gas filter. Wide range of filters depending on application. meets the demands for work in cleanroom. Remote control for

400 450 >55 99.97 >95

300W796mm1016mm402mm

68 kg

yes

450-1000-ESD

115/-230V yes

Filter System

sYsTeM DesCRiPTiOn TeChniCAL DATA PART nO

Pre-filterA pre-filter for the high airflow systems mG 75, 95 and 100. •The pre filter is mounted on the filter system. •The filter media is of a “bag” type model with a high separation degree.•

Pre filter bag active area 25 dm²Pre filter bag Class f8

Pf-1200

TrolleyTrolley for mG75 and mG95. An easy solution to get the filter system even more mobile. •Arm brackets for the extraction arm is included

450 x 450 x 750 mm (WxDxH)) 950-3202-EDS

Bench mounting set Bench mounting set for mG100. To be mounted on the edge of the workbench.• 780-3001-ESD

Remote control Remote control to mG units . • 700-3057

Connection hoseConnection hose with quick-connection, aluminium covered •Available from 1-5 meter length.

ø 65 mm (diameter) On request

Accessories


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