OEM Catalog 2013

2013PRODUCT CATALOGEMBEDDED OEM MEMORY THAT COVERS LEGACY TO LEADING EDGE

1

1

Introduction

About Wintec Industries // 2

Flash Products

Flash Product Naming Guide // 4

CompactFlash® Cards // 5

Secure Digital Cards // 6

CFast Cards // 7

USB Flash Drives // 8

Embedded USB // 9

Solid State Drives

Solid State Drive Naming Guide // 10

2.5" SATA // 11

1.8" microSATA // 12

SATA DOM // 13

Slim SATA // 14

PCI-E ExpressCard // 15

Half Size mini PCI-Express mSATA // 16

Full Size mini PCI-Express mSATA // 17

Legacy SSD - 2.5" PATA // 18

Legacy SSD – DOM ATA/IDE // 19

Legacy SSD – ZIF PATA/IDE // 20

DRAM Modules

Naming Guide: DDR3 // 21

Naming Guide: DDR2, DDR // 22

DDR3 // 23

DDR2 // 24

DDR // 25

Modems

Modems // 26

Table of Contents

Table Of Contents

1

Thank you to all Wintec customers for your support and partnership through the years. We look forward to

leading the way in this continuously changing and challenging industry and the exciting opportunities ahead.

Thank you again for your partnerships and commitment to building long lasting relationships!

Special Thanks

Wintec Industries is built upon a culture of hard work, opportunity

creation, and delivery of our commitments. Proudly recognized as

a globally diverse company, we continually strive to be a leader in

innovative business practices as well as a responsible member of our

global community and our environment.

Wintec’s quality policy is the backbone upon which our products and

services are built. Our 90,000 sq. ft. facility is ISO 9001:2008 certified

and equipped with state of the art manufacturing and testing machinery.

In addition, our products are manufactured with components that have

passed a stringent AVL (Approved Vendor List) and qualification process.

Through our quality policy we are committed to providing outstanding

products and services to our customers. Our quality themes outline the

direction of our daily work and also our long term goals.

About Wintec Industries

Customers Are the Heart of Our Business

QUICK TURNAROUND

QUALITY KNOWLEDGE AND EXPERIENCE

SOURCING DIVERSITY

EXTENDED LIFE CYCLE PRODUCTS

SUPPORT

// Customer Satisfaction // Consistency in the Manufacturing Process // Continual Improvement in all Business practices

PROVIDE THE HIGHEST LEVEL OF SERVICE TO OUR

CUSTOMERS

Wintec’s Embedded OEM division provides a wide range of standard

and custom hardware designs, mechanical molding, and manufacturing

services to OEM customers. From concept to final product delivery,

we provide outstanding team level support in Sales, Engineering,

Production, Quality Assurance, and Logistics. Through teamwork and

communication, our goal is to achieve the highest level of customer

satisfaction and to build long-term relationships that enable successful

engineering projects and customer design wins.

Wintec Industries is a WMBE (Women Minority Business Enterprise)

and a certified ISO 9001-2000 company located in the heart of the

Silicon Valley. Our core products and services include the design

and manufacturing of Flash products and DRAM modules in a large

assortment of technologies and form factors. Our products are certified

from industry standards committees such as, JEDEC (Joint Electron

Device Engineering Council, CFA (Compact Flash Association), and the

SD Association (Secure Digital). Our experience in product design and

successful fulfillment of customer product needs span over 25 years.

2

Introduction

// Customer Satisfaction // Consistency in the Manufacturing Process // Continual Improvement in all Business practices

Customers Are the Heart of Our Business

1

3

Leading Provider of Flash and DRAM Technology Solutions Our Embedded OEM solutions provide a wide range of standard

and custom hardware designs, mechanical molding, and

manufacturing services to OEM customers. From concept to

final product delivery, we provide outstanding team level support

in Sales, Engineering, Production, Quality Assurance, and

Logistics. Our goal is to achieve the highest level of customer

satisfaction, to build long-term relationships, and to provide

solutions and expertise to our OEM customers.

Introduction

Custom Services

Custom Products

Wintec Industries Embedded OEM division offers customers a

full service design, engineering, and manufacturing resource for

OEM system designs. Wintec account managers, engineers, and

developers work closely with our customers through the early stages

of project discovery and initial requirements though development,

testing and product delivery. Our electronic and electrical design

services offer the flexibility and customization that our customers seek.

Our teams are well experienced with creating customized solutions

with time tested technologies as well as applications that utilize the

latest tech.

Wintec OEM customers find great value in our customized testing

solutions. Customer OEM products are often developed to serve

a highly unique application. We work closely with our customer’s

to recreate their usage environments to ensure the quality of our

embedded products and our customer’s final solution. As a leading

DRAM Memory Module, Flash product, and Solid State Drive

manufacturer, we place substantial emphasis on our testing and

quality control procedures. Wintec Industries employs a standard

policy of 100% individual mainboard testing for all of our products.

We offer a wide range of SSD form factors

for use in Enterprise, Commercial and

Industrial grade applications.

We specialize in applications with tolerance

requirements for industrial temperatures

and reliability.

We provide services and support for the

latest memory technology and extended

support for legacy modules.

We Make Your Project Visions RealityWe utilize X-ray technologies, heat chambers, and diagnostic

machinery, including AOI and dedicated burn-in chambers, to ensure

that only the highest quality memory products are delivered to our

customers.

Our manufacturing base, located in Milpitas, California, offers

our customers a significant advantage in time to market, plus the

capabilities to provide quick and clear communication and updates.

We specialize in both standard and customized manufacturing options.

Our packaging design capabilities provide customers a start-to-finish

solution from concept to delivery. From initial PCB layout to the final

programming and packaging of products, the services and solutions

that are available from Wintec Industries provides customers with the

widest array of options.

Wintec Industries Embedded OEM division has extensive experience

in creating customized products, labeling, serialization, software

and disk imaging. With full Field Engineering support offered for all

Wintec products and services, our experienced team ensures that our

customers will receive the most complete solution.

Electrical Design | PCB Layout | Software and Firmware | Packaging Design and Graphics | Testing | Logistics

4

Flash Products

Flash Productspg5 CompactFlash Cards pg6 Secure Digital Cards pg7 CFAST pg8 USB Flash Drives pg9 Embedded USB

Flash Naming Guide

W 7 C F 0 3 2 G 1 D A I - H 4 1 P M - 4 Q 2 . 0 1

Firmware Revisions

Flash Component Configuration

NAND Flash & Die Revision

Program Mode

Controller Manufacturer

Temperature Rating

A = Standard

Device ID

Configuration

Density

Flash Product Type

NAND Flash Type

W = Wintec OEM Product

001 = 1 NAND Flash, Single Die, 1-CE 01D = 1 NAND Flash, Dual Die, 1-CE 002 = 2 NAND Flash, Single Die 1-CE 02D = 2 NAND Flash, Dual Die, 1-CE2Q2 = 2 NAND Flash, Quad Die, 2-CE 2P4 = 2 NAND Flash, Dual Stacked, 4-CE4D2 = 4 NAND Flash, Dual Die, 2-CE 4Q2 = 4 NAND Flash, Quad Die, 2-CE4P4 = 4 NAND Flash, Dual Stack Package, 4-CE

x = Die Revision, e.g. M-Die, A-DiePx = Samsung Mx = MicronHx = Hynix Ix = Intel

0 = PIO Mode1 = DMA / UDMA Enabled2 = UDMA disabled, MDMA Enabled

Hx = Hyperstone Controller Jx=JMicronSx = SMI Controller

None = Commercial Temp (0°C to +70°C)I = I-Temp (-40°C to +85°C) SD Extended Temp (-25°C to +85°C)

X = Removable T = Fixed DiskD = Dual ID (True IDE = fixed, PC Card Memory Mode = removable)

1 = Standard Configuration H = SDHC

M = Megabyte G = Gigabyte064 = 64 512 = 512 004 = 4128 = 128 001 = 1 008 = 8256 = 256 002 = 2 016 = 16

CF = Compact Flash CardSD = Secure Digital CardUS = USB Flash DriveEU = Embedded USB Flash DriveMU = Mini USB Flash DriveCT = CFast Card

2 = MLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 = SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration

1

5

Flash Products

CompactFlash® Cards

// Density up to 8GB

// 32-bit RISC/DSP Controller

// Solid State Data Storage

// Dual 3.3V / 5V Interface

// Industrial Wear Leveling

// On-Board ECC - Corrects up to 6-bytes/Sector


// RISC/DSP Controller with built-in buffer support


// Dual voltage support (3.3V/5V)

// Power-down and idle mode

// Built-in hardware ECC circuit (BCH), support 13/24 bit ECC errors per 1024 bytes


// 32-bit RISC/DSP controller

// Large internal SRAM provides firmware flexibility


// Internal voltage detector

// 20 Kbyte internal Boot ROM and 32 Kbyte internal SRAM

// On-Board ECC corrects up to 4 random bytes per 512 bytes


// RISC/DSP Controller with built-in buffer support



// Power-down and idle mode

// Built-in hardware ECC circuit

(BCH), support 15

H2 Series H4 Series S2 Series S4 Series

Series CF TypeNAND Type

Seq. Read/Write ECC Temp Range Density Status

H2 CFA 2.1 SLC 8MBps / 6MBps 6 bit Reed Solomon

0 - 70°C 64MB - 8GB MP

-40 - 85°C 64MB - 8GB MP

H4 CFA 4.1 SLC 42MBps / 20MBps4 Bit Reed Solomon

w/ CRC

0 - 70°C 128MB - 16GB MP

-40 - 85°C 128MB - 16GB MP

S2 CFA 4.1

SLC 60MBps / 40MBps 13/24 Bit BCH 0 - 70°C 1GB - 32GB MP

MLC 50MBps / 20MBps 13/24 Bit BCH 0 - 70°C 4GB - 128GB MP

S4 CFA 4.1

SLC 90MBps / 50MBps 8/15 Bit BCH 0 - 70°C 1GB - 32GB MP

MLC 80MBps /35MBps 8/15 Bit BCH 0 - 70°C 4GB - 128GB MP

ES MPEngineering Sample Mass ProductionCustomer SampleCSKEY End of LifeEOL

6

Flash Products




// Dual 3.3V / 1.8V Interface

// Industry Standard Compatibility

// > 2,000,000 Program/Erase

// On-chip ECC and CRC16 unit for flash data protection Cycles




// 3.3V flash Interface

// Industry Standard Compatibility

// 10,000 Program/Erase Cycles

// Hardware BCH Engine to configure ECC

H6 SeriesS3 Series

Secure Digital Cards

Series TypeNAND Type


S3 SD 2.0 MLC 20MBps / 10MBps 40 Bit BCH 0 - 70°C 4GB - 64GB MP

H6 SD 2.0 SLC 20MBps / 18MBps

4 Bit Reed Solomonw/ CRC

0 - 70°C 64MB - 8GB MP

4 Bit Reed Solomonw/ ECC

-25 - 85°C 64MB - 8GB MP


7

1Flash Products


// 32-bit RISC micro processor

// SLC/MLC NAND Flash

// SATA-II 3.0Gb/s operation (Backward compatible to SATA-I 1.5Gb/s operation)

// ECC capable of correcting up to 24 bits in 1KB double sector

// PFail handling and S.M.A.R.T support

// Partial/Slumber and PHYSLP power modes support


// SLC/MLC NAND Flash

// SATA-II 3.0Gb/s operation (Backward compatible to SATA-I 1.5Gb/s operation)

// > 100,000 Program/Erase Cycles

// On-Board ECC capable of correcting 16 or 24 bit errors per 1024 bytes

// S.M.A.R.T and TRIM Support

A2 SeriesJM-605 Series

CFast Cards

SeriesSATA Type

NAND Type


JM-605 SATA-II

MLC 160MBps / 85MBps 16 / 24 Bit BCH 0 - 70°C 8GB-128GB MP

SLC

160MBps / 110MBps 16 / 24 Bit BCH 0 - 70°C 8GB-32GB MP

160MBps / 110MBps 16 / 24 Bit BCH -40 - 85°C 8GB-32GB MP

A2 SATA-II

SLC

150MBps / 130MBps8 / 24 Bit BCH w/

CRC0 - 70°C 4GB-32GB CS Q1 2013

150MBps / 130MBps8 / 24 Bit BCH w/

CRC-40 - 85°C 4GB-32GB CS Q1 2013

MLC TBD8 / 24 Bit BCH w/

CRC0 - 70°C 32GB-128GB CS Q1 2013


1Flash Products


// Fully Compatible with USB v2.0 & v1.1

// True Plug and Play Functionality

// Built in LED to indicate power and transfer status

// Small form factor

W2MU-E5 Series W7MU-E5 Series


// Fully Compatible with USB v2.0 & v1.1


// Built in LED to indicate power and transfer status

// Small form factor


// Compatible with USB v3.0, v2.0,

and v1.0

// ECC capability up to 72 bits/1KB


// Built-in LED to indicate power and transfer status

W7US-S3 Series

USB Flash Drives

Series USB TypeNAND Type


W2MU-E5 USB 2.0 MLC 18MBps / 8MBps 24/48 Bit BCH 0 - 70°C 512MB - 32GB MP

W7MU-E5 USB 2.0 SLC 20MBps / 12MBps 24/48 Bit BCH0 - 70°C /-40 - 85°C

512MB - 16GB MP

W7US-S3 USB 3.0 SLC TBD TBD

0 - 70°C 512MB - 32GB ES Late Q1 2013

-40 - 85°C 512MB - 32GB ES Late Q1 2013


8

9

1Flash Products



// Embedded USB 2.0 Device

// SLC NAND type flash

// 5V & 3.3V operational voltage

// Various connector options

// RoHS Compliant


// Embedded USB 2.0 Device

// MLC NAND type flash

// 5V & 3.3V operational voltage

// Various connector options

// RoHS Compliant

// ES Late Q1 2013

Talk to an OEM sales representative for more information.

W7EU-E6W2EU-E5W7EU-E5

Embedded USB

SeriesUSB Type

NAND Type

Channels Seq. Read/Write ECC Temp Range Density Status

W7EU-E5 USB 2.0 SLC Single 20MBps / 18MBps 24/48 Bit BCH0 - 70°C

512MB - 16GB MP-40 - 85°C

W2EU-E5 USB 2.0 MLC Single 18MBps / 10MBps 24/48 Bit BCH 0 - 70°C 4GB - 32GB MP

W7EU-E6 USB 3.0

SLC Dual TBD 72 Bit BCH 0 - 70°C TBD

ES Late Q1 2013

MLC Dual TBD 72 Bit BCH0 - 70°C

TBD-40 - 85°C

1

Flash Productspg5 CompactFlash Cards pg6 Secure Digital Cards pg7 USB Flash Drives pg8 Embedded USB Flash pg9 CFast

Flash Naming Guide

W 7 C F 0 3 2 G 1 D A I - H 4 1 P M - 4 Q 2 . 0 1

Firmware Revisions



Program Mode


Temperature Rating

A = Form-Factor

Device ID

Configuration

Density

Flash Product Type

NAND Flash Type


001 = 1 NAND Flash 01D = 1 NAND Flash, Dual Die, 1-CE 002 = 2 NAND Flash, Single Die 1-CE 02D = 2 NAND Flash, Dual Die, 1-CE2Q2 = 2 NAND Flash, Quad Die, 2-CE 2P4 = 2 NAND Flash, Dual Stacked, 4-CE4D2 = 4 NAND Flash, Dual Die, 2-CE 4Q2 = 4 NAND Flash, Quad Die, 2-CE4P4 = 4 NAND Flash, Dual Stack Package, 4-CE


0 = PIO Mode1 = DMA / UDMA Enabled2 = UDMA disabled, MDMA Enabled

Hx = Hyperstone ControllerSx = SMI Controller

None = Commercial Temp (0°C to +70°C)I = I-Temp (-40°C to +85°C) SD Extended Temp (-25°C to +85°C)

X = Removable T = Fixed DiskD = Dual ID (True IDE = fixed, PC Card Memory Mode = removable)

1 = Standard Configuration H = SDHC

M = Megabyte G = Gigabyte

064 = 64 512 = 512 004 = 4128 = 128 001 = 1 008 = 8256 = 256 002 = 2 016 = 16

CF = Compact Flash CardSD = Secure Digital CardUS = USB Flash DriveEU = Embedded USB Flash DriveMU = Mini USB Flash DriveCT = CFast Card

2 = MLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 = SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration

10

Solid State Drives

Solid State Drive Naming Guide

pg11 2.5" SATA SSD pg12 1.8" micro SATA SSD pg13 SATA DOM pg14 Slim SATA pg15 PCI-E ExpressCard pg16 Half Size mSATA pg17 Full Size mSATA pg18 2.5" PATA pg19 DOM ATA/IDE pg20 ZIF PATA/IDE

Solid States Drives

4D2 = 4 NAND Flash, Dual Die 2-CE4Q2 = 4 NAND Flash, Quad Die, 2-CE 08D = 8 NAND Flash, Dual Die 1-CE 8Q2 = 8 NAND Flash, Quad Die, 2-CEAS2 = 12 NAND Flash, Single Die, 2-CE AQ4 = 12 NAND Flash, Quad Die 4-CE BD2 = 16 NAND Flash, Dual Die, 2-CE BQ4 = 16 NAND Flash, Quad Die, 4-CEBO4 = 16 NAND Flash, Octal Die, 4-CECD2 = 20 NAND Flash, Quad Die, 4-CE

(blank) = 4x nm and higher3 = 3x nm2 = 2x nm


1 = SATA2 = PATA (DMA / UDMA Enabled)

Dx = SandForce Ex = EastWhoJx = JMicron Sx = SMI

I = I-Temp (-40°C – +85°C)None = Commercial Temp (0°C – 70°C)

A = 2.5" B = 3.5" C = 1.8"

G = Gigabyte001 = 1 016 = 16 064 = 64 160 = 160002 = 2 025 = 25 100 = 100 200 = 200004 = 4 032 = 32 120 = 120 240 = 240008 = 8 050 = 50 128 = 128 480 = 480

ES = Embedded (DOM, Slim SATA)EM = mSATAEX = ExpressCardSS = Solid State Drives (1.8", 2.5") ZF = ZIF PATA

2 = MLC NAND Flash3 = eMLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 =SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration

Firmware Revision


Geometry


Program Mode


Temperature Rating

Form Factor

T = Fixed Disk

1 = Standard Configuration

Density

SSD Type

NAND Flash Type


W 7 S S 1 2 0 G 1 TA I - D 1 1 M A 2 - B D 2 . A 2

11

1Solid State Drives


// 40G, 80G, 160G, 320G,

400G available

// EastWho EWS-800 controller with external DRAM buffer

// Up to 40 bits correctable per 1KB sector

// Hardware AES engine with ECB/ XTS encryption mode


// SandForce SF-2382 controller with internal cache buffer

// DuraWrite TM technology

// RAISE Data Protection

// Up to 55 bits correctable per 512 byte sector

// Industrial SSD



// Intelligent Block Management & Wear Leveling

// Up to 24 bytes correctable per 512B sector


// JMicron 612 controller with external SDRAM buffer

// Data Integrity under power cycling

// BCH ECC correction supports 16/24 bit ECC


// SandForce Enterprise SF-2582 controller with internal cache

// DuraWriteTM technology

// RAISETM Data Protection

// Up to 55 b/512 byte sector BCH ECC engine

// Enterprise SSD

// Tatalum PFAIL protection


// JMicron 662 controller with external DDR2 buffer

// Supports global wear-leveling

// Dynamic power management

// S.M.A.R.T Attribute Support

// BCH8/16/24/40 bits ECC



// Intelligent Block Management

& Wear Leveling

// Up to 55 bits correctable per 512B sector

SF-2281SF-1222JM-612

SF-2582 JM662

EWS-800

SF-2382

2.5" SATA SSD

SeriesSATA Type

NAND Type Seq. Read/WriteRandom

Read/WriteTemp Range Density Status

EWS-800 SATA-II MLC/SLC 200MBps / 150MBps 5K IOPS/1.5K IOPS 0 - 70°C / -40 - 85°C 32GB - 512GB MP

JM-612 SATA-II MLC 230MBps / 200MBps 10K IOPS/1K IOPS 0 - 70°C / -40 - 85°C 16GB - 512GB MP

SF-1222 SATA-II MLC/SLC 285MBps / 275MBps 30K IOPS/10K IOPS 0 - 70°C / -40 - 85°C32GB - 128GB

(SLC)/512GB (MLC)MP

SF-2281 SATA-IIIMLC/SLC

(Async/Sync*)550MBps / 500MBps 60K IOPS/20K IOPS 0 - 70°C 32GB - 512GB MP

SF-2382 SATA-III MLC/SLC 500MBps / 500MBps 60K IOPS/20K IOPS 0 - 70°C / -40 - 85°C 30GB - 480GBES Late Q1 2013

SF-2582 SATA-III SLC/eMLC 550MBps / 500MBps 60K IOPS/60K IOPS 0 - 70°C / -40 - 85°C 50GB - 400GB MP

JM662 SATA-III MLC 500MBps / 300MBps 50K IOPS/20K IOPS 0 - 70°C 32GB - 512GB MP


*Sync MLC drives perform better under uncompressed data loads

12

Solid State Drives


// JMicron 612 controller with external SDRAM buffer

// Data Integrity under power cycling

// BCH ECC correction supports 16/24 bit ECC

// Enhanced endurance by dynamic/static wear leveling


// Jmicron 662 controller with external DDR2 buffer

// Supports global wear-leveling


// S.M.A.R.T. Attribute support


// TRIM and S.M.A.R.T. Support

JM-612 JM-662

1.8" microSATA SSD

SeriesSATA Type

NAND Type

Seq. Read/Write Random Read/Write Temp Range Density Status

JM-612 SATA-II SLC/MLC 230MBps / 160MBps 10K IOPS/1K IOPS 0 - 70°C / -40 - 85°C 32GB - 256GB MP

JM-662 SATA-III MLC 500MBps / 300MBps 50K IOPS/20K IOPS 0 - 70°C 32GB - 256GBES LateQ1 2013


Solid State Drives

13

SATA DOM


// JMicron 605 controller

// Bad Block Management & Wear Leveling


// Data Integrity under power-cycling

JM-605

SeriesSATA Type

Channel NAND Type Seq. Read/WriteTempRange

Density Status

JM-605 SATA-II

4 Channel / 2 Flash

MLC 60MBps / 20MBps 0 - 70°C 4GB-64GB MP

4 Channel / 2 Flash

SLC 80MBps / 50MBps 0 - 70°C / -40 - 85°C 1GB-16GB MP


Solid State Drives

14






// Density up to 256 GB

// JMicron 667 controller with external DDR3 buffer


// Data integrity under power-cycling



JM-605 JM-667

Slim SATA

SeriesSATA Type

NAND Type

Seq. Read/WriteRandom

Read/WriteTempRange

Density Status

JM-605 SATA-II

MLC 140MBps / 60MBps 8.5K IOPS / 600 IOPS 0 - 70°C 8GB-128GB MP

SLC 160MBps / 100MBps 8.5K IOPS / 1.5K IOPS

0 - 70°C 8GB-32GB MP

-40 - 85°C 8GB-32GB MP

JM-667 SATA-III MLC 500MBps / 300MBps 50K IOPS / 20K IOPS 0 - 70°C 32GB-256GB ES Mid Q1 2013


Solid State Drives

15

// Up to 128GB

// Intelligent Wear Leveling - Includes Dynamic/Static Block Management

// Spares & Bad Block Management

// On-Board ECC – Corrects up to 24 bits/ 1KB sector

// High Environmental Tolerance

// SMART (Self-Monitoring, Analysis, Reporting Technology)

JM-612

PCI-E ExpressCard SSD

Series SATA Type NAND Type Seq. Read/Write Temp Range Density Status

JM-612 SATA-II MLC 165MBps / 120MBps 0 - 70°C 64GB - 128GB MP


16

Solid State Drives

Half Size mini PCI-Express mSATA SSD




// ECC Engine: Up to 24 bits correctable per 1KB sector


// S.M.A.R.T. attribute support


// Advanced Wear leveling & Block Management

// SMART feature and data security support

// SSDLifeGuardTM and SSDLifeSaverTM for SSD life monitoring and extension

// 15-bit/512B data error checking and correcting capability

JM-605 SM611/SM631


JM-605 SATA-II


SLC 80MBps / 50MBps 0 - 70°C 4GB-64GB MP

SLC 80MBps / 50MBps -40 - 85°C 1GB-16GB MP

SM611/SM631 SATA-II




17

Solid State Drives


// SandForce SF-2141/2181/2281 controller with internal cache buffer


// Intelligent Data Retention optimization



// JMicron 667 controller with external DDR3 cache

// Global wear leveling







// ECC Engine: Up to 24 bits correctable per 1KB sector



// SandForce SF-2141/2181/2281 controller with internal cache buffer


// Intelligent Data Retention

optimization



// EWS800 Controller with SDRAM cache

// Up to 40bits correctable per 1KB sector

// Hardware AES engine with ECB/XTS encryption

// TRIM and S.M.A.R.T. attribute support

SF-2281 JM-667 SF-2141/2181 JM-605

EWS800

Full Size mini PCI-Express mSATA SSD


SF-2281 SATA-III MLC 550MBps / 505MBps 0 - 70°C 32GB-256GB MP

JM-667 SATA-III MLC 500MBps / 300MBps 0 - 70°C 32GB-256GB ES Mid Q1 2013

SF-2141 / 2181 SATA-II MLC 270MBps / 250MBps 0 - 70°C 32GB-128GB MP

JM-605 SATA-II



SLC 160MBps / 80MBps -40 - 85°C 2GB-32GB MP

EWS800 SATA-II MLC/SLC 180MBps / 90MBps0 - 70°C /-40 - 85°C

4GB-128GB ES Mid Q1 2013


18

1


// 32 bit high speed controller

// Standard ATA/IDE Bus interface

// Internal Static and Dynamic Wear Leveling

// Spares & Bad Block Management

// BCH ECC: 12 bit per 512 Byte

EWS720

Legacy SSD - 2.5" PATA SSD

Solid State Drives

Series NAND Type Seq. Read/Write Random Read/Write Temp Range Density Status

EWS720

MLC 125MBps / 90MBps 4800 IOPS / 300 IOPS 0 - 70°C 32GB - 256GB MP

SLC 125MBps / 110MBps 4800 IOPS / 300 IOPS0 - 70°C 8GB - 64GB MP

-40 - 85°C 8GB - 64GB MP


19

1Solid State Drives

Legacy SSD – DOM ATA/IDE


// Low power, 3.3V and 5V Power Supply

// Capable of withstanding high impact and vibration shocks

// Hardware 13/24 bit BCH-ECC engines capable of correcting 24-bit errors per 1024 byte data

// Write Endurance 100K cycles per block (SLC)

// Data Retention greater than 5 years

SM2231

Series Pin NAND Type Seq. Read/Write ECC Temp Range Density Status

SM2231 40 Pin

MLC 40MBps / 16MBps 24 Bit BCH 0 - 70°C 512MB - 32GB MP

SLC 40MBps /30MBps 24 Bit BCH

0 - 70°C 512MB - 16GB MP

-40 - 85°C 512MB - 16GB MP


20


// 8MB Cache buffer

// 32 bit high speed controller

// ZIF IDE/ATA 40-pin interface

// Internal Static and Dynamic Wear Leveling

// BCH ECC: 18 bit per 512 Byte

EWS720

Solid State Drives

Legacy SSD – ZIF PATA/IDE

Series NAND Type Seq. Read/Write Random Read/Write Temp Range Density Status

EWS720

MLC 125MBps / 90MBps 4800 IOPS / 300 IOPS 0 - 70°C 16GB - 256GB MP

SLC 125MBps / 110MBps 4800 IOPS / 300 IOPS 0 - 70°C 4GB - 32GB MP


21

1DRAM

pg23 DDR3 pg24 DDR2 pg25 DDR

W L 3 R E V 9 1 G 1 3 I S E

Die Revision

DRAM Manufacturer

Module Latency

Module Speed

Module Density

Module Type

Device Type


M = M-Die C = C-DieA = A-Die D = D-DieB = B-Die

S = Samsung H = HynixM = Micron E = Elpida

I = CL6 N = CL11J = CL7 P = CL13L = CL9Note: Latency will be specified only on non-register (No Buffer) DIMMs

I = Inphi D = IDT M = MontageNote: For Registered DIMM this will be used for register identification

80 = 800Mbs @ CL6 16 = 1600Mbs @ CL1110 = 1066Mbs @CL7 18 = 1866Mbs @ CL1313 = 1333Mbs @ CL9Note: For Registered DIMM latency will not be specified using additional letter.

(0)1G =1GB (0)8G = 8GB(0)2G = 2GB (1)6G = 16GB(0)4G = 4GB 3(2)G = 32GBNote: For VLP DIMM (0) (1) (2) will be ignored.

UE(V)8 = 240-Unbuffered ECC, X8, 18-Chips, 2-RankUE(V)9 = 240-Unbuffered ECC, X8, 9-Chips, 1-RankUN(V)8 = 240-Unbuffered Non-ECC, X8, 8-Chips, 1-RankUN(V)6 = 240-Unbuffered Non-ECC, X8, 16-Chips, 2-RankRE(V)8 = 240-Registered ECC, X8, 18-Chips, 2-RankRE(V)9 = 240-Registered ECC, X8, 9-Chips, 1-RankRE(V)6 = 240-Registered ECC, X8, 36-Chips, 4-RankRE(V)4 = 240-Registered ECC, X4, 18-Chips, 1-RankRE(V)3 = 240-Registered ECC, X4, 36-Chips, 2-RankSE(V)8 = 204-SO-DIMM ECC, X8, 18-Chips, 2-RankSE(V)9 = 204-SO-DIMM ECC, X8, 9-Chips, 1-RankSE(V)8 = 204-SO-DIMM Non-ECC, X8, 8-Chips, 1-RankSE(V)6 = 204-SO-DIMM Non-ECC, X8, 16-Chips, 2-RankNote: For Standard DIMM (V) will be ignored. Mini RDIMM will use (NE), Mini UDIMM (OE), LRDIMM (DE), SO-RDIMM (AE).

(I)D3 = 1.5V DDR3 SDRAM(I)L3 = 1.35V DDR3 SDRAMNote: For I-Temp DRAM use (ID) or (IL)

DDR3 Naming Guide

DRAM

22

1

W D 3 R E 0 8 G X 4 1 8 V - 1 3 3 3 L - P E I

Buffer/Register Set (Registered Modules Only)

DRAM Manufacturer and Die Revision

CAS Latency

Module Speed (MHz)

Module Height

Memory Footprints

Chip Configuration

Module Density

Module Type

Technology Type


I = Inphi L = Intel D = IDT

P = Samsung H = Micron A = A-Die C = C-DieC = Hynix J = Nanya B = B-Die D = D-Die E = Elpidia I = ISSI

A = CL 2 B = CL 2.5 C = CL 3G = CL 5 I = CL 6 J = CL 7 K = CL 8 L = CL 9 N = CL 11E = CL4

1600 (DDR3) 1333 (DDR3) 1066 (DDR3) 800 (DDR3/DDR2) 667 (DDR2) 533 (DDR2) 400 (DDR2/DDR) 333 (DDR) 266 (DDR) 133 (SDR) 100 (SDR)

U = Ultra Low Profile V = Very Low Profile None = Standard height PCB

02 = 2-Chip 04 = 4-Chip 05 =5-Chip (ECC) 08 = 8-Chip 09 = 9-Chip (ECC) 16 = 16-Chip 18 = 18-Chip (ECC) 32 = 32-Chip 36 = 36-Chip (ECC) 72 = 72-Chip (ECC)

X4 = x4 Mono Die H8 = x8 Stack DieX8 = x8 Mono Die Q4 = x4 Quad Die x4X16 = x16 Mono Die Q8 = x8 Quad Die x8D4 = x4 Dual/Twin Die D8 = x8 Dual/Twin Die

G = Gigabyte M = Megabyte

064 = 64 128 = 128 256 = 256512 = 512 001 = 1 002 = 2004 = 4 008 = 8 016 = 16

RE = Registered ECCModuleLE = Low Power Registered ECC (DDR3L)UE = Unbuffered ECCUN = Unbuffered Non-ECCAE = Registered ECC SODIMMSE = Unbuffered ECC SODIMMSN = Unbuffered Non-ECC SODIMMOE = Unbuffered ECC MiniDIMMNE = MiniDIMM Registerd-ECCPE=Unbuffered ECC SODIMM w/PLL

D3 = DDR3 D1 = DDRD2 = DDR2 SD = SDR

DDR2, DDR Naming Guide

DRAM

23

1DRAM



// Unbuffered, Unbuffered ECC, Registered ECC

// Standard Profile (1.181") and VLP (0.74")

Registered ECC High end server type applications

Unbuffered ECCNon-mission critical servers, networking Hubs/Routers and embedded

Unbuffered Non-ECCConsumer applications such as PC, Gaming machines and POS



// Standard Profile (1.181")

Registered ECC Systems requiring large amounts of data traffic

Unbuffered ECCPC104 Boards and mini ITX boards

Unbuffered Non-ECCConsumer applications such as Notebook/Laptop


// Unbuffered ECC and Registered ECC


Registered ECC Networking systems, routers, hubs

Unbuffered ECCLess data intensive applications like compact network equipment systems


// Registered ECC


Registered ECC Datacenters in need for greater scalability in both capacity and bandwidth

240 DIMM 244 mini-DIMM 204 SO-DIMM 240 LR-DIMM

DDR3

Technology Pins Profile UnbufferedUnbuffered

ECCRegistered

ECCPC3-6400 800 MT/s

PC3-8500 1066 MT/s

PC3-10600 1333 MT/s

PC3-12800 1600 MT/s

PC3-149001866 MT/s

DDR3

240 DIMM

Standard

1.5V 1GB - 8GB

1.5V 1GB - 8GB

1.5V 1GB - 16GB

MP MP MP MPCS

(Unbuffered)

1.35V 1GB - 8GB

1.35V 1GB - 16GB

MP MP MP MP

VLP

1.5V 1GB - 8GB

1.5V 1GB - 8GB

MP MP MP MP

1.35V 1GB - 8GB

1.35V 1GB - 8GB

MP MP MP MP

244 mini-DIMM

Standard1.5V

1GB - 8GB1.5V

1GB - 8GBMP MP MP MP

VLP1.5V

1GB - 8GB1.5V


204 SO-DIMM

Standard1.5V

1GB - 8GB1.5V

1GB - 8GB1.5V


240 LR-DIMM

Standard

1.5V 8GB - 32GB

MP MP MP

1.35V 8GB - 32GB

MP MP MP

24

1





Registered ECC

Data storage and servers with 24/7 data

intensive operations

Unbuffered ECC

Non-mission critical servers, networking hubs/routers and embedded applications that handle

less data traffic

Unbuffered Non-ECC)

Consumer applications such as PC, Kiosk and POS terminals




Registered ECC

Applications that do not require address parity

Unbuffered ECC

Applications that do not require address parity




Registered ECC

Telecommunications and similar applications that

handle large amounts of data

Unbuffered ECC

Embedded applications such as non-critical or low traffic networking equipment

Unbuffered Non-ECC

Consumer applications such as Notebooks / Laptops

240 DIMM 200 SO-DIMM 244 mini-DIMM

DDR2

DRAM


ECCRegistered


PC2-4200 533 MT/s

PC2-5300 667 MT/s

PC2-6400 800 MT/s

DDR2

240 DIMM

Standard1.8V

1GB - 4GB1.8V

1GB - 4GB1.8V


VLP1.8V


200 SO-DIMM

Standard1.8V

1GB - 4GB1.8V

1GB - 4GB1.8V


244 mini-DIMM

Standard1.8V

1GB - 4GB1.8V

1GB - 2GB1.8V


VLP1.8V

1GB - 2GB1.8V


25

1DRAM





Registered ECC

High end server applications

Unbuffered ECC / Non-ECC

Embedded applications such as POS and kiosk systems




Unbuffered ECC / Non-ECC

Notebook and small form factor appliances such as routers, networks, 1U servers and POS that uses embedded boards.

184 DIMM 200 SO-DIMM

DDR


ECCRegistered


PC2-2700 333 MT/s

PC2-3200 400 MT/s

DDR

184 DIMM

Standard2.5V

512MB - 1GB2.5V

256MB - 1GB2.5V

256MB - 1GBMP MP MP

200 SO-DIMM

Standard2.5V

128MB - 1GB2.5V

256MB - 1GBMP MP MP

26

Modems


Series Part Number Maximum SpeedError Correction

SupportData Compression

Support

RoHSCompliant

6/6

FCCCertified

Status

SL-SU

SL2404SU 2.4Kbps (V.22bis) V.42 V.42bis Yes Yes MP

SL2415SU 14.4Kbps (V.32bis) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SL2434SU 33.6Kbps (V.34) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SL2457SU 56Kbps/33.6Kbps (V.90) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SL2493SU 56Kbps/48Kbps (V.92) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SLM

SLM2404(-I) 2.4Kbps (V.22bis) V.42 V.42bis Yes Yes MP

SLM2415(-I) 14.4Kbps (V.32bis) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SLM2434(-I) 33.6Kbps (V.34) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SLM2457(-I) 56Kbps/33.6Kbps (V.90) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

SLM2493(-I) 56Kbps/48Kbps (V.92) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP

USBModem

(Hardware)

WUMHV92-A1CN.01-xxx

56Kbps/48Kbps (V.92)14.4Kbps Fax (T.31/V.17)

V.42 / MNP2-4 V.44 / V.42 / MNP5 Yes Yes MP

USBModem

(Software)

WUMSV92-E1LS.01-xxx

56Kbps/48Kbps (V.92)14.4Kbps Fax (T.31/V.17)

V.42 / MNP2-4 V.44 / V.42 / MNP5 Yes Yes MP

// 24-pin DIP Small form-factor 1.4”x0.9”

// Low power consumption 26mA at 3.3V supply

// Parallel Phone detection and caller ID Detection

// Over-Voltage and Current Protection: 70V and 200mA

// Hardware and Software

// USB 2.0

// 56Kbps / 48Kbps (V.92)

// 14.4Kbps Fax (T.31/V.17)

// RoHS Compliant

// FCC Certified

// Supports Windows 98/2000/ XP/Vista/7 and Linux

// 24-pin DIP Small form-factor 2.0” x 1.0”

// Low power consumption

26mA at 3.3V supply

// Serial and Parallel mode support


// Over-Voltage and Current Protection: 70V and 200mA

SL-SU Series SLM Series USB Modem

Modems

website // www.wintecind.com/oem email // [email protected] phone // 408.856.0565

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OEM Catalog 2013

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