Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation...
Transcript of Next Generation Communication, Radar, Imaging Systems-on-Chip · 2017. 8. 7. · Next Generation...
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Next Generation Communication, Radar, Imaging
Systems-on-Chip
High-Speed Electronics Laboratory
(RTSP 2017, Poly Technical University of Bucharest)July 10, 2014
Prof. M.-C. Frank Chang
National Chiao Tung University, Hsinchu, Taiwan
Email: [email protected]
1
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Outline
� Introduction
� Advantages and Challenges in Building Radio, Radar and Imager at (Sub)-mm-Wave or Terahertz Frequency Range
� Mm-Wave to Terahertz CMOS Systems-on-Chip
� Wireless/Wireline Links
� Broadband Self-Healing Radio-on-a-Chip
High-Speed Electronics Laboratory
� Broadband Self-Healing Radio-on-a-Chip
� 144-495GHz Radar and Imaging
� Digital Controlled Artificial Dielectric (DiCAD) with Tunable Permittivity for Reconfigurable Terahertz Systems
� Historical Artificial Dielectric
� Synthesizing DiCAD in Deep-Scaled CMOS
� Reconfigurable/Scalable DiCAD Circuit Designs
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Electromagnetic Wave Spectrum
High-Speed Electronics Laboratory
1 Tera-Hertz = 1012/sec (one trillion times per sec)
(Courtesy JPL)US National GDP $16.8 trillion
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Galactic Evolution Since Big Bang
2.7K Cosmic Microwave Background from COBE
High-Speed Electronics Laboratory
Cosmic Microwave Background (CMB) was detected by Arno
Penzias and Rob Wilson in 1964 by using a Dicke Radiometer with
perfectly fitted Planck Blackbody radiation temperature of 2.7K Dicke Radiometer at Crawford
Hill of ATT Bell Laboratories
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Earth Science Applications
• Stratospheric and Tropospheric Chemistry
‐ ozone layer modeling
‐ economics vs. environment
‐ water distribution/pollutants
• Clouds: Global Warming
‐ ice crystal: size & distribution
• Aerosols, Volcanism, Dust
High-Speed Electronics Laboratory
Herschel Space
Observatory
Ozone at 2.5 THz
Remote Sensing with Fine Height Resolution (≈ 1 km) via Limb Scanning
heterodyne measurements yield Temp, Pressure, and ppm abundances
(Courtesy JPL)
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CMB Polarization at mm-Wave
High-Speed Electronics Laboratory
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Potential Advantages
• Higher data rate at a fixed fractional bandwidth
• Quasi-optical nature
• Easier formation of radiation beam
Terahertz Advantages & Issues
High-Speed Electronics Laboratory
Issues
• Technology constraints (Terahertz Gap)
• High Path loss due to H2O/O2 absorption
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Prof. J. C. Bose and Terahertz
High-Speed Electronics Laboratory
Prof. J. C. Bose laid the foundation of Terahertz Technology
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Can We Generate THz Signal Performance/Cost-Effectively ?
(By Using TSMC CMOS)
High-Speed Electronics Laboratory
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Generating THz Signals
• Quantum cascade lasers (QCL)
• Free electron lasers (FEL)
• Laser driven THz emitters
• Solid state circuits
• III/V technologies (multiplier chain in waveguides)
III/V in Waveguide
QCL FEL
Laser THz emitter
High-Speed Electronics Laboratory
chain in waveguides)
• Silicon SoC technologies (compact, monolithic integrated with digital circuits)
• SiGe HBT technologies
• CMOS technologies
CMOS THz source
2x2 mm2
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Terahertz Gap
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Ou
tpu
t P
ow
er
W
mWQuantum Cascade CMOS/SiGe
Gunn Diodes
GaAs/InP
Multiplier
BWO Gas Laser
High-Speed Electronics Laboratory
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
0.01 0.1 1 10
THz
Ou
tpu
t P
ow
er
µµµµW
Cascade Lasers
CMOS/SiGe
Multiplier
0.3 ∼ 30.3 ∼ 30.3 ∼ 30.3 ∼ 3 THz
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Generating Harmonics from Oscillator
C LR
I
Amp
+
‐
+
‐
...
Freq.
domain
Oscillation waveforms
High-Speed Electronics Laboratory
f 3f 5f
...
Question:
How to suppress power at fundamental frequency (f )but enhance signal power at specific harmonics (N*f ) ?
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THz Harmonic Oscillator
Enhancing 2nd harmonic:
Push-push oscillator
Triple-push oscillator
f 2f
...
Freq. domain
Freq. domainEnhancing 3rd harmonic:
High-Speed Electronics Laboratory
Triple-push oscillator
Quadruple …
Quintuple …
…
f 2f
...
Freq. domain
3f
Enhancing N-th harmonic:
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Phase Locked 550GHz Radiator Element
•TPCO front-end plus frequency dividers
•Digital back-end plus off-chip 106MHz reference source.
TPCO: triple-push Colpitts oscillator
ILFD: injection-locked frequency divider
PLL: phase locked loop
High-Speed Electronics Laboratory
PLL: phase locked loop
SSPD: sub-sampling phase detector
Gm: transconductance cell
LPF: low pass filter
DiCAD enables 2nd and 3rd ILFDs to work in a wide band range from 41 to 52 GHz, potentially support THz range from 0.49 to 0.62THz.
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Generating Locked Signal at 550GHz Using SoC
Slot antenna
VGG
TLbias
1/4 λ@fund.
0o
120o
240o
60o
180o
300o
0o
120o
240o
60o
180o
300o
120o
0o
240o
60o
300o
120o
240o
120o
240o
60o
300o
120o
0o
240o
0o
120o
240o
60o
180o
300o
120o
240o
60o
300o
120o
0o
240o
0o
120o
240o
60o
180o
300o
120o
240o
60o
300o
120o
0o
240o
0o
180o
0o
180o
0o
180o
0o
180o Antenna Design
Simulated Antenna Input Matching
High-Speed Electronics Laboratory
Osc. Element: Source Core:
300120
0o 180
o0
o 180o
120 300
0o 180
o
120 300
0o 180
o
120 300
0o
180o
0o
180o
0o
180o
0o
180o
Phase of fundamental current (in black): 180o
Note:Phase of third harmonic current (in red): 180
o
Sync. Bridge:
• 2x4 differential antenna array driven by 8 pairs of synchronized VCOs at 550GHz.
• In-phase feeding enabling spatial power combining
550GHz Coherent VCO array
[3] Yan Zhao, M.-C. Frank Chang, et. al, “A 0.54-0.55 THz 2x4 Coherent Source Array with EIRP of 24.4 dBm in 65nm CMOS Technology", to be presented in IEEE International Microwave Symposium (IMS), 2015,
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Radiation Power Test Setup
Golay
Cell THz
Power
Meter
Frequency &
Phase Noise
Measurement
0.55THz die
+Si-lens+PCB
Horn+
harmonic mixer
(500-700GHz)
Radiation
Power
0.55THz die
+Si-lens+PCB
Lockin
Amp.
IF (0-40GHz)
LO (Ka-band)
To Spectrum Analyzer
From Freq Synth.
RBW=300kHz
Marker Delta=-24.5dB
P.N.=-79.3dBc/Hz@1MHz
Characterizing 0.54-0.55THz VCO Array Radiator
High-Speed Electronics Laboratory
• Silicon lens on backside of Si-substrate
• 0.54 to 0.55 THz frequency tuning range
• 126uW total radiation power at 0.55 THz
• -79dBc/Hz@1MHz phase noise at 0.55 THz
• 4 separate antenna beams in E-plane
Meter
Optical
Chopper
Measurement
Pulse Gen.15Hz
15Hz
Non-transparent
membrane to
block IR radiation
Assembled THz source
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Can We Receive THz Signal Performance/Cost-Effectively?
(By Using TSMC CMOS)
High-Speed Electronics Laboratory
(By Using TSMC CMOS)
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Passive Image Capture Testing
Person 1 HeadImage Capture Experiment Details
�Uses a 20dBi standard horn
�No reflectors or lens so λ/D is terrible
�Shows that we are sensitive
�Scans of 100 x 100 pixels
�Integration time of 10ms
�Scan time of about 6 minutes (yes we had to stand still this long)
High-Speed Electronics Laboratory
Person 2
Arm
Head
(yes we had to stand still this long)
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Block Diagram of Hybrid Radiometer
High-Speed Electronics Laboratory
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CMOS SoC Photograph
Heterodyne Receiver SoC
�Integrated ADC for calibration
�Integrated power and temp sensors
�Integrated USB control port
Block Power
RX Chain 60 mW
LO 55 mW
High-Speed Electronics Laboratory
LO Amplifier
55 mW
Synthesizer 79 mW
IF Amplifier 10 mW
Control 3 mW
ADC 20 mW
CMOS Total 227 mW
InP Pre-Amp 30mW
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Packaged Passive Imager Prototype
Probe
SoC
High-Speed Electronics LaboratoryWE3F-2
InP MMICs
SoC in Package
Pre-Amplifiers
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InP MMIC Pre-amplifiers
High-Speed Electronics Laboratory
MMIC Pre-Amplifier� Traditional MMIC techniques in awesome NGC technology (InP HEMT 35nm)
� Reasonable 25-30 dB gain in the frequency band of interest.
� Burns about 30mW total for both stages.
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For Radar and Imaging Systems
High-Speed Electronics Laboratory
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Digital Regeneration Receiver(Non-Coherent Receiver)
High-Speed Electronics Laboratory
Adding a digital latch circuit allows the oscillator
to restart each clock. When the oscillator starts it
triggers the digital reset creating a pulse width
inversely proportional to input power
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183GHz CMOS Active Imager Measurement Value
Frequency 183 GHz
NF 9.9 dB
Power 13.5mW
Sensitivity -72 dBm
Area 13100 um2
NEP 1.5fw/Hz0.5
Gain 1.3ms/W
Electrical Measurements
Frequency Response Time-Encoded Output
Imaging Results
High-Speed Electronics Laboratory
Frequency Response Time-Encoded Output
Sample-Targets (metals and non-metals)A) Metallic Wrench B) Computer floppy diskC) Football D) Roll of tape*All items were concealed in cardboard boxes
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495 GHz CMOS Super-Regenerative Receiver495 GHz Regenerative Receiver
based on 40nm TSMC CMOS technology
with total power consumption of
5mW under 1V supply voltage
High-Speed Electronics Laboratory
495GHz Image Capture
495 GHz Chopper Signal1. Sensitivity measurement of antenna-less 245 GHz
http://www.ee.ucla.edu/~atang/250_demo.mp42. 495 GHz antenna-less imager
http://www.ee.ucla.edu/~atang/494_demo.mp43. Imaging Radar Demo
http://www.ee.ucla.edu/~atang/Radar_Demo.mp4
Terahertz System Demonstrations
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Tri-Color (350/200/50GHz) IRR Imager(Inter-modulated Regenerative Receiver)
• First reported architecture for RX to operate above Fmax
High-Speed Electronics Laboratory
Chopper Sync
350 GHz Chopper Response350 GHz Chopper Response
CMOS Tri-band ReceiverCMOS Tri-band Receiver
• First reported architecture for RX to operate above Fmax
• Fastest reported silicon receiver (SiGe or CMOS)• First multi-band sub-millimeter-wave receiver (3 bands)
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144 GHz CMOS Sub-Ranging 3D ImagingRadar with <0.7cm Depth Resolution (Coherent Receiver)
High-Speed Electronics Laboratory
• First mm-wave 3D imaging radar in silicon!
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For Communications
High-Speed Electronics Laboratory
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Near Field Coupled “WaveConnector”
High-Speed Electronics Laboratory
• Near-field-Communication at multi-Giga-Bit/sec– Ultra-high data rate (>10Gbps) for short distance and
secured communications
– Protocol-transparent, near-universal applications
1 cm mm-Wave Wireless Link:
http://www.youtube.com/watch?v=WH92oeedNlU
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1Gbps 100m Optically Collimated Link at 160GHz
High-Speed Electronics Laboratory
100 cm mm-Wave Wireless Link: https://www.youtube.com/watch?v=uFDrHLZKNuM
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1Gbps 100m Optically Collimated Link at 160GHz
High-Speed Electronics Laboratory
Data Link Energy Efficiency: ~3pJ/bit/meter
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Terahertz Link through Plastic Waveguide
Solid Dielectric Waveguide
PA/modulator coupler coupler
Choice of material: Non-polar plastic materials with low loss tangent.
High-Speed Electronics Laboratory
Material εr
tanδ (××××10-4)
<1GHz [1]
tanδ (××××10-4)
in Ka-band [2]
Teflon 2-2.1 <2 2-3
Polyethylene 2.2-2.4 <2 3-4
Polystyrene 2.4-2.6 <5 8-10
Polypropylene 1.5-2.2 <5 5
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Terahertz via Hollow Plastic Cable
Noble gas filled Hollow Dielectric Waveguide
PA/modulator coupler coupler
Lowest order mode
High-Speed Electronics Laboratory
r1
r2
123
1,3: air2: dielectric
HE11 (dipole mode)
Plastic Cable for (sub)-mm-Wave Communications: https://www.youtube.com/watch?v=WQRSOdLNlGk
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Reduced Loss via Hollow Plastic Cable
Thick Thin
High-Speed Electronics Laboratory
Solid Cable Thick
Hollow CableHollow Cable
with Cladding
Thin
Hollow Cable
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Transceiver Circuits and System for Hollow Plastic Cable Data Link
High-Speed Electronics Laboratory
Transceiver diagrams with an air-core hollow plastic waveguide
Link system power budget and transceiver schematics
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Multi-Giga-bit/sec Data Link via Hollow Plastic Water Cable
High-Speed Electronics Laboratory
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• Terahertz communication is constrained by technology / air absorption, but may be benefitted from its quasi-optical characteristics
• Terahertz has great potential to offer multi-Giga-bit/sec inter-server / container data links for modern data centers with low power (<1pJ/bit/m) and low cost by using
� Collimated beam transmission in free space
Summary
High-Speed Electronics Laboratory
� Collimated beam transmission in free space
� Guided I/O signaling via plastic cable
• Circuit/Device Innovations are key enablers to facilitate Radio, Radar and Imaging Systems-on-Chip with high performance yield and cost-effectiveness
� On-Chip Self-healing for performance yield
� DiCAD for dynamic permittivity tuning