News from CMS Process Quality Control

Thomas BergauerHEPHY Vienna

CMS TK Week, 29.1.2003, CERN

Thomas Bergauer, HEPHY Vienna 2

Centers Three Process Qualification Centers:

FlorenceAnna Macchiolo

Carlo Civinini

Mirko Brianzi

StrasbourgJean-Charles Fontaine

Jean-Marie Helleboid

Jean-Laurent Agram

ViennaThomas Bergauer

Margit Oberegger

Characterization by QTC

Process stability on test structures with 9 different measurements

Thomas Bergauer, HEPHY Vienna 5

CVmos at different temperatures

• Just a test (Vienna coolingbox was available)

•CVmos at 5 different temperatures

•CVmos chosen because it is the simplest measurement

No temperature dependence of Vfb

-25 -20 -15 -10 -5 0 5 10 15Voltage (V)

Capacitance (F)

0

1E-10

2E-10

3E-10

4E-10

5E-10

6E-10

+20°C +10°C 0°C -10°C -20°C -30°C

Thomas Bergauer, HEPHY Vienna 6

Thicker Aluminium

Rho_Alu Histogram

0

2

4

6

8

10

12

14

16

0-5 5-10 10-15 15-20 20-25 25-30 30-35

39 Teststructures from PQC Florence•Perugia 12 (prod.week 34/02)•Perugia 13 (03/02)•Perugia 14 (06/02 and 23/02)

Average data:• before Week 20/02: 26,09mOhms/sq. • After week 20/02: 14,34mOhms/sq.

Before week 20/02after

•Pisa 59 (08/02)•Pisa 60 (24/02)

Influence to rho_Alu

Also: slightly lower C_ac value:•17,01pF (before week 20/02) -> •16,65pF (after)

Thomas Bergauer, HEPHY Vienna 7

Mask Problem W7B

Cac R (Al, p+, poly) Ivgcd Cint IVbaby Rint CVdiode CVMOS& IV diel

•Misalignment of 3 structures at the standard half moon•Not able to contact with probecard in one cycle•W7B: 1440 pcs.

Thomas Bergauer, HEPHY Vienna 8

Mask Problem W7B

3 structures on the standard half moon affected

Sensor mask is OK

Options: new probecard

design OR new wafer mask

design

GCD C_int

Thomas Bergauer, HEPHY Vienna 9

Inter-calibration

Circulation of 5 Teststructures Vienna -> Strasbourg Strasbourg -> Florence Florence -> Vienna

-> Florence-> Vienna-> Strasbourg(Exchange of TS during this Tracker Week)

Results: (up to now)

• Good agreement in all measurements• Higher Leakage current of Vienna Probecard causes lower R_int and higher IV_dielectric and GCD problems (fit)• small differences in capacitances values caused by stray capacitances. (<1pF)

Thomas Bergauer, HEPHY Vienna 10

Software New Software allows re-read of local files

Up to now: Stand-alone program Re-analyze Re-write XML file

Acquisition Analysis DB Interface

Future: Fully integrated into acquisition software

Local files

Acquisition Analysis DB Interface

Local files

Analysis DB Interface

Thomas Bergauer, HEPHY Vienna 11

Database

322 teststructures successfully loaded into db 61 faulty (status: 28.1.03)