New TESP/TESPA Silicon AFM Probes · 2015. 1. 22. · Bruker AFM Probes has introduced an improved...
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Bruker AFM Probes has introduced an improved version of its popular TESP/TESPA AFM probes. Bruker’s new line of TESP high-quality, premium etched silicon probes set the industry standard for imaging in TappingMode™ and non-contact mode in air and force measurements. The new TESP/TESPA AFM probe design provides: Tighter dimensional specifications for improved probe-to-probe consistency Improved alignment of the tip apex to the cantilever, resulting in easier laser positioning over the tip Improved probe quality and aesthetics New TESP/TESPA Silicon AFM Probes Industry Standard for TappingMode and Non-Contact Imaging Modes Innovation with Integrity Atomic Force Microscopy Image of media disk using Dimension Icon® and TESPA-V2 probes, 1µm image, 3Hz scan rate, 512x512, TappingMode. Image of C60 using Dimension Icon and TESPA-V2 probes, 500nm image, 1Hz scan rate, 512x512, TappingMode. Image of Celgard using Dimension Icon and TESPA-V2 probes, 2µm image, 1Hz scan rate, 256x256, TappingMode.
Transcript of New TESP/TESPA Silicon AFM Probes · 2015. 1. 22. · Bruker AFM Probes has introduced an improved...
Bruker AFM Probes has introduced an improved version of its popular TESP/TESPA AFM probes. Bruker’s new line of TESP high-quality, premium etched silicon probes set the industry standard for imaging in TappingMode™ and non-contact mode in air and force measurements.
The new TESP/TESPA AFM probe design provides:
Tighter dimensional specifications for improved probe-to-probe consistency
Improved alignment of the tip apex to the cantilever, resulting in easier laser positioning over the tip
Improved probe quality and aesthetics
New TESP/TESPA Silicon AFM ProbesIndustry Standard for TappingMode and Non-Contact Imaging Modes
Innovation with IntegrityAtomic Force Microscopy
Image of media disk using Dimension Icon® and TESPA-V2 probes, 1µm image, 3Hz scan rate, 512x512, TappingMode.
Image of C60 using Dimension Icon and TESPA-V2 probes, 500nm image, 1Hz scan rate, 512x512, TappingMode.
Image of Celgard using Dimension Icon and TESPA-V2 probes, 2µm image, 1Hz scan rate, 256x256, TappingMode.
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Bruker Nano Surfaces Division
Santa Barbara, CA • USA Phone +1.805.967.1400/800.873.9750 [email protected]
www.BrukerAFMprobes.com
AFM Expertise Built into Every Probe
Bruker is the only AFM instrument company that also manufactures AFM probes and, along with our experienced applications support, offers unparalleled comprehensive AFM solutions. Our extensive line of AFM Probe products include highest quality silicon, silicon nitride, and proprietary PeakForce Tapping® and specialty probes to meet the needs of most AFM users. Our dedication to manufacturing probes, coupled with our expertise in AFM, ensures that we are uniquely equipped to deliver the most complete AFM solution for the widest variety of applications.
Industry-leading probe shape and quality.
Improved alignment of the tip apex to the cantilever.
Improved dimensional specifications.
TESP-V2/TESPA-V2 Specifications
Units Target Min Max
Tip
Shape - Pyramidal - -
Resistivity Ω-cm 0.018 0.010 0.025
Tip Radius nm 8.0 - 12.5
Tip Height, H µm 12.5 10.0 15.0
Tip Set Back µm 13.5 11.0 16.0
Tip Front Angle deg 25.0 22.5 27.5
Tip Back Angle deg 17.5 15.0 20.0
Tip Side Angle deg 20.0 17.5 22.5
Cantilever
Resistivity Ω-cm 0.018 0.010 0.025
Shape - Rectangular - -
Cantilever Thickness µm 3.4 2.65 4.15
Length (L) µm 125 115 135
Width (W) µm 40 38 42
Flexural Stiffness (k) N/m 42 20 80
Flexural Resonant Frequency (fo)
kHz 320 230 410
Body
Material - Single Crystal Si - -
Type - Anisotropic Etch - -
Resistivity Ω-cm 0.018 0.010 0.025
Dopant - Antimony - -
Thickness µm 300 295 305
Backside Reflective Coating
TESPA-V2 Material - Aluminum - -
Thickness nm 40 30 50
Legacy TESP/TESPA Specifications
Model # Description
TESPPack of 10 unmounted probes; TappingMode and non-contact modes
TESP-W One wafer of unmounted probes; TappingMode and non-contact modes
TESPAPack of 10 unmounted probes; TappingMode and non-contact modes; Al backside cantilever coating
TESPA-WOne wafer of unmounted probes; TappingMode and non-contact modes; Al backside cantilever coating
Units Nom Min Max
Lever Length µm 125 110 140
Lever Width µm 40 30 50
Lever Thickness µm 4 3.25 4.75
Tip Height µm 12.5 10 15
Tip Setback µm 15 5 25
Frequency kHz 320 230 410
Stiffness N/m 42 20 80
Estimated Tip Radius nm 8 - 12.5
New TESP-V2/TESPA-V2 Specifications
Model # Description
TESP-V2Pack of 10 unmounted probes; TappingMode and non-contact modes
TESPW-V2One wafer of unmounted probes; TappingMode and non-contact modes
TESPA-V2Pack of 10 unmounted probes; TappingMode and non-contact modes; Al backside cantilever coating
TESPAW-V2One wafer of unmounted probes; TappingMode and non-contact modes; Al backside cantilever coating
Units Nom Min Max
Lever Length µm 125 115 135
Lever Width µm 40 38 42
Lever Thickness µm 3.40 2.65 4.15
Tip Height µm 12.5 10 15
Tip Setback µm 13.5 11 16
Frequency kHz 320 230 410
Stiffness N/m 42 20 80
Estimated Tip Radius nm 8 --- 12.5
Model Comparison
