NeSSI™ - Generation II The Elements & Power of an Automated Analytical System

Rob DuboisCPAC/NeSSI™ Workshop – AM Session

Seattle, Washington, USAMay 3-6, 2004

“the best way to predict the future is to create it”

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The Vision of Success

• We are able to…– design, auto-document &

assemble...an analytical system at our workbench.

• Lego®-like (unskilled) assembly

– increase reliability by predicting system failure by full, integrated automation

– reduce time to configure/install by 75%

– reduce total cost by 40%Gregor Rasputin – “Visionary”

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Courtesy of Dow Chemical, Fort Saskatchewan, Canada

Objective 1Facilitate the acceptance/implementation ofmodular, miniature & smart sample systemtechnology based on ANSI/ISA SP76standard substrate

Objective 2Provide a technology bridge to the process for...“sensor/lab-on-a-chip” micro-analytical devices

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Courtesy of Dow Chemical, Freeport, Texas

Objective 3Promote the concept of...field-mounted (By-Line) smart analytical systems

Objective 4Lay the groundwork for Pipe to Pixel™ open connectivity architecture for intrinsically safe transducer communications (e.g. CAN, ProfiBus, etc.) and industry standard communication protocols (e.g. Ethernet, OPC, etc.)

OPCGateway

T

Sample System

GasAnalyzer SAM

IS bus

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Today

NeSSI™ Development Progress

Gen III

Gen II

Gen I

Mechanical/4-20 mA

Electrical Networked & Smart

& Wireless

uAnalytical

END USER VALUE

2006-072004-05

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• Concept of Modular Sampling System based on SEMI design conceived at ISA AD Meeting, 1998

• Groundwork for NeSSI™ started at CPAC focus group. (Nov 99)

• NeSSI™ (CPAC Initiative) formally initiated in June 2000 at ISA

• SP76 (Gen I) standard approved by ANSI/ISA – June 2002

• Gen II Proof of Concept (POCA) delivered to Dow & ExxonMobil – Mar 2003

• $10 MM DoE Sensors and Wireless AWARDED to Honeywell in Nov. 2003• project will help co-fund 12 NeSSI™ prototype systems

• Chronology of events and Gen II specification can be found at …

http://www.cpac.washington.edu/NeSSI/NeSSI.htm

A Brief History of NeSSI™

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Today’s Technology – some room for improvement

Explosion-proof fittings and filled seals –

custom assembly by

skilled electrician

Custom purging

assemblies

Multiple fittings &

valves tubed by skilled inst.

fitter

Explosion-proof flow switches

Manual flow & pressure

control

Intrinsically Safe

Solenoid Valves

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• Reduce Cost to BuildReduce Cost to Build• Design, Engineering, Manufacturing, Installation

• Reduce Cost of OwnershipReduce Cost of Ownership• Infrastructure, Utility Usage, Support Costs

• Increase ReliabilityIncrease Reliability• Measurement & Communication Validation

What are the Drivers for Change?

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7 Elements of Generation II

1. Multi-Drop Intrinsically Safe Bus2. mini-Sensors3. “Combi”-Valve Actuators

4. SAM* – Sensor Actuator Manager 5. PC/PDA with HMI** [Local Wireless]6. Programmable Substrate Heater7. microClimate Enclosure

* SAM = Sensor Actuator Manager; **HMI = Human Machine Interface

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1a. Multi-drop Bus

• Intrinsically Safe Ex ib

• Utilizes FISCO low power concept

• Handles up to 25 transducers (IIB)– sensors and

actuators

VTP

A

“NeSSI™-bus”

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1b. Why not 4-20 mA for Gen II/III?

• labor intensive wiring• space hungry• expensive and difficult to

wire for hazardous electrical areas

NeSSI™-box Test Platform, Dow Chemical

“This Dog Don’t Hunt”

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1c. Early Gen II System (POCA*)

Features- serial connectivity (DeviceNet)- PC controlled – smart features- simple plug and play M8 connector

Benefits - predict failures before they happen- remote operation in hostile locations- decrease maintenance- increase confidence

GET SMART!

* POCA – Proof of Concept Apparatus - Dow, EMCC, Honeywell

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1d. Why an IS network?

The most compelling reason for an bus IS is the ability to operate miniature, modular transducers in a hazardous environment using “normal” wiring.

reduce electrical seals

no purging & pressurization

limited conduits/cables

no maintenance gas tests

no special maint. permits

min. X proof boxes

allows hot “disconnects”

plug and play

*POCA = Proof of Concept Apparatus

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2a. Mini-Sensors

• Doing analytical is not good enough!– sensors needed for validation

& health – predictive maintenance

model• General Needs

– Flow, Pressure, Temp.– Gas and/or liquid apps.– Encapsulated (IEC Ex m)– Intrinsically Safe (IEC Ex ib)– FOR: Div/Zone 1 Gps A-D

Substrate

A/D

Comm.

µP

Mem

ory

A

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2b. Conceptual Sensor for NeSSI™

Process Cavity- no unswept voids

- low volume

BARRIER- Process Seal- Electrical Isolation- Thermal

Insulation Skirt- engineered

A/D

Comm.

Sensor

Base - 316 SS- pressure rated

µP

Mem

ory

Body- encapsulated

“Top Hat” Comm. Chip

A

Port- standard size/pin

- daisy chain

1.50”

Digital “Smart” Sensor- engineering units

- memory

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3a. COMBI-valve Actuators

• Take control…– Zero/Span/Stream Select– F, P, T control

• General Requirements– Gas and/or liquid service– Encapsulated (IEC Ex m)– Intrinsically Safe (IEC Ex ib)– FOR: Div/Zone 1 Gps A-D– on/off (Vo) & modulating (Vm)

• Challenge to meet low power requirements (1-2 mA/unit)

A

Air Actuator

Inst

Air

ValveVent

Vent

Comm.

D/ASolenoid

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3b. “Combi”-Valve Actuator

A

Actuator

Valve

Vent

Vent

Comm.

D/A

Solenoid

“TopHat” Comm. Chip

DeviceNet

3-way “pilot” solenoid valve - Intrinsically Safec/w o-ring std interface

to actuator

Actuator- NO or NC

Engineered InsulationSkirt

Single Female Port- M8 - daisy chain/trunk

Digital On-Board- Eng. Data Sheet

Thermal Barrier

SAE x 1/8 tube connections

40-110 psig inst. air

Aug. 26,03

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3c. Other actuator options

• Direct mount solenoid valves– useful for non-hazardous

applications– limited by physics

• Motorized electro/hydraulic valves

SV

Comm.

SP76 Actuator

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4b. SAM-Sensor Analytical Manager**

- stand-alone

Standalone SAM

AnalyticalSensor

VTP

A

**hockey-puck/PC

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4c. SAM - Sensor Analytical Manager**

- embedded

Embedded SAM

Anyone’s

Analyzer

VTP

A

**hockey-puck/PC

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Gateway to an Ethernet LAN(DCS/maintenance systems) can use multiple com protocols

- OPC/HTTP/FF/PB, etc.

- Remote Wireless (Gen III)Host Port for…

(1) Intrinsically Safe NeSSI™-Bus (2 chan.)

(2) Remote I/O

PDA/PC Local Field Port

- Local Wireless

Software Applets for Sampling System Repetitive Tasks

- AppLI (monitoring/control)

Provides “Open” Development

Space for Developers Custom Software (e.g. microAnalytical)

SAM

4d. Distributed Control is Essential- Sensor Actuator Manager

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4e. SAM AppLI* Repetitive Tasks

Validation – zero/span Control…

• Sample pressure, flow, temperature• Enclosure/substrate heating• Heat Tracing• Pumps

Health of analytical system (F, P, T) Short term historical data Stream Switching DCS** interface protocol

* AppLI = Application**DCS = Distributed Control System

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5. Graphical HMI*Div II , Portable Field PC/PDA “Tool”

• Purpose– Allows field (local)

adjustment and interrogation of an analytical system. (mimics remote PC)

– A Graphical User Interface– System information

• instruction manuals• parts list• maintenance procedures• application data

PDA/PC

HMI

VTP

A

* HMI = Human Machine Interface

SAM

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6. Programmable substrate heater

• Purpose:– maintain temperature

above dewpoint – provide special zone

heating for permeation calibrations

– supports microAnalytical & microreactor applications

• temperature controlled via the NeSSI™-bus and SAM.

• Ex d explosion proof heater

AC Power

TE

Div/Zone 1GP. A-D

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7. MicroClimate Enclosure

• Purpose:– safe environment for

analytical systems– allow usage in various

climatic conditions for by-line applications

– temp. control via NeSSI™-bus & SAM.

– Ex d X-Proof Heater

120/240 VAC

NEMA or IP RatedEnclosure

Div/Zone 1GP. A-D

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Need to design & certify electrical components to global

requirements...• UL or FM (USA)• CSA (Canada)• ATEX Directive

(Europe)• GOST (Russia)

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Programmable Substrate Heater

What will a Gen II system look like?

VP

A

F SAM

NeSSI™-bus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

dcs

o&muserEthernet LAN

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Summary & Conclusion

• NeSSI™ Gen II ready for development– working spec/prototype design

complete– alpha prototypes demonstrated

• DOE program– 12 systems to be built– End Users provide field test locations

• What can your involvement be?