nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and...
Transcript of nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and...
nCapsulate free-form: plastic encapsulation for
MEMS and Sensors
Delivering system benefits by embedding mechanical and electronic elements
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Mission
Our mission is to be world class competence center offering development and manufacturing of functional semiconductor assembly solutions.
– Focus on (MEM’s) sensor systems.
– Development from scratch to a manufacturing solution.
– Meeting quality demand of Automotive industry.
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Facts & Figures
• Young company with a long history (since 1987)
• Development & production in the Netherlands
• Captive volume assembly in the Phillipines
• TS16949 & ISO 14001 certified
• > 100,000,000 sensor assemblies for automotive
• Move to Novio Tech Campus Nijmegen November-2015
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Proposition
• Core business:
– Development of functional plasticencapsulation solutions.
– Volume manufacturing of functional packaging.
• Other services:
– Ceramic / plastic fast turn prototyping
– Product & process qualification
– Component supply management
– Wafer processing
Development for manufacturing
– From packaging idea to manufacturing solution.
– Design for manufacturing.
– Local industrialization assures manufacturable solution.
Transfer intomanufacturing
Packagedevelopment& prototyping
IndustrialisationConcept
engineering
SENCIO
Research institutes
Volume manufacturers
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Functional encapsulation solutions
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Key aspects for (MEMS) sensors
• Access of the environment to the (sensor) chip surface
– Chemicals
– Blood
– Others…
• Protection of sensitive electronics against this environment
– Interconnect; wired interface of Sensor (bond pads)
– data processing IC.
– Other active or passive components
Exposed die molding
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
Exposed die molding
Principal:– Overmolding with duroplast leaving only the sensor
area free of molding compound.
– Gold wires encapsulated, sensor area exposed.
Technologies:– Patented insert technology.
– FAM molding technology
Exposed die molding
Highlights:
– Interconnection reliability similar to standard plastic packaging
– Ideal solution for harsh environments
– Applicable for a wide range of plastic packages
– Cavity format & size can be tuned to the application, through hole has been achieved
– Can be applied with multi chip [sensor(s) + ASIC]
– Automotive application for temperatures up to 150°C
Insert or FAM technology
• Cavity Ø 900 µm.
400 µm
Soft-touchtm
technology
MICROCAVITY by SOFT TOUCH™
QFN package 4x4mm.
NEW
Soft touchtm & FAM
• Cavity Ø 400µm
• Cavity Ø 200µm (in development)
Oil pressure sensor package
Outline:• SOIC 24 wide body outline.
Advanced Technologies:• Integrated passive components
• Multichip module
• Exposed die overmoldng
• pressure sensor with only
pressure hole exposed.
Mission Profile notes:• Oil pressure measurement
• Lifetime immersed in motor oil.
• Temperature -40 to 150°C
Product developed by Hella Fahrzeugkomponenten GmbH
Package developed by Sencio.
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Functional encapsulation solutions
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
nCapsulate™
Adding an extra dimension to the encapsulation of your MEMS device /system
• Protection
• Additional functionality
Examples:
• Functional shapes.
• Combination of mechanics with electronics (mechatronics).
nCapsulate – functional shapes
Encapsulation shape adapted to the application.
• Accurate dimensional shape, stable over temperature
• Applications:
– Alignment features
– Mounting support
– Custom specific shape
Combination mechanics & electronics
Adding mechanical elements to encapsulated electronics
– Alignment features
– Supporting features
– …
Advantages:
– Improved alignment (measurement accuracy)
– Improved thermal contact
– Simplified design
– Improved efficiency
Integration of screw-thread
Improved alignment between nut & sensor/semiconductor
Integration of nut applications
Direct mounting of heat sink
Integration of nut applications
Mounting of tube access for sensor application
Integration of nut applications
Fixation of optical elements (lens, fiber..)
Integration of bearing
Improved alignment between bearing & semiconductor
Integration of bearing
Application examples:– Magnetic sensor (Hall, AMR) angle
measurement
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Example
Medical sensor application
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Medical sensor encapsulation
Glass on die
nCapsulate
Medical sensor encapsulation
• Compatibility encapsulation materials with the bio / life science - materials.
– Resistance of compound against the bio-materials
– Influence of the compound on the bio-materials
• Limited data available
– Very limited support from suppliers.
– Extensive testing needed.
MrCyte, Life-Science Project
• Magnetic flow cytometry
• Concentration measurement of (rare) cells in blood, by counting cells marked with magnetic nanoparticles.
– Cancer diagnostics.
– Blood analysis.
• Integration of sensor package in microfluidics unit.
MrCyte
MrCyte Packaging aspects
Exposed die molding
• Exposed magnetic sensor with small structures to guide nanoparticle flow.
• Integrated ASIC
nCapsulate
• Small micro structures on package to guide nano particle flow to sensor.
• Contact pins (no leads)
• Alignment holes for fixation
MrCyte pictures of the application
Integrated in microfluidic
Cartridge filled with blood
Read out equipment
Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
Summary & Conclusion
• Packaging major contribution in the functionality of a sensor systems for (MEMS) sensor application.
• Exposed die molding proper technology to make sensor area accessible
• nCapsulate adding more functionality to the encapsulation
Sencio BVMicroweg 1-11 | 6545 CL NIJMEGEN | NetherlandsPhone: + 31 24 3714490 | Fax: + 31 24 [email protected] | www.sencio.nl
Protecting your technology with ours!