NanoFab Trainer Nick Reeder [email protected] June 28, 2012.
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Transcript of NanoFab Trainer Nick Reeder [email protected] June 28, 2012.
![Page 2: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/2.jpg)
NanoFab Trainer
• Educational tool that lets user see the results of performing sequences of basic nano-fabrication operations on a silicon (Si) wafer.
• Runs under Windows operating system.• Written in LabVIEW 2009; requires LabVIEW
2009 Run-Time Engine (free download at http://joule.ni.com/nidu/cds/view/p/id/1600/lang/en).
![Page 3: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/3.jpg)
User Operations
• Ion implantation (“doping”)• Thermal oxidation• Photolithography• Depositing layers of material• Removing material
![Page 4: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/4.jpg)
Ion Implantation
• Modifies the electrical characteristics of the silicon wafer. Such modification is the key technique underlying the operation of semiconductor devices (diodes, transistors, thyristors).
• Implanting boron results in “p-type” doping.• Implanting phosphorus results in “n-type”
doping.
![Page 5: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/5.jpg)
![Page 6: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/6.jpg)
Example: Fabricating a MOSFET
• MOSFET = Metal-oxide-semiconductor field effect transistor
![Page 7: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/7.jpg)
Thermal oxidation
• Grows a layer of silicon dioxide (SiO2) on the wafer surface.
• Key properties of SiO2:– Impervious to ion implantation.– Can be etched away by immersion in hydrofluoric
acid (HF), which does not etch silicon.
![Page 8: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/8.jpg)
Photolithography
• Steps in photolithography:– Spin-coat photoresist.– Create and place mask. Mask defines which
areas will be exposed to UV light and which areas will be shaded.
– Expose with UV light.– “Develop” the photoresist: UV-exposed areas are
removed, while shaded areas remain.• Wikipedia http://en.wikipedia.org/wiki/Photolithography
![Page 9: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/9.jpg)
Depositing Layers
• Methods of depositing layers of material– Electron-beam evaporation– Chemical vapor deposition (CVD)– Sputtering
• The materials deposited may be metals, dielectrics, or semiconductors.
![Page 10: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/10.jpg)
Removing material
• Methods of removing material – Wet etching• Low-tech• Immerse wafer in a bath of liquid acid or solvent
– Dry etching• High-tech• Expose wafer to plasma beam
![Page 11: NanoFab Trainer Nick Reeder nick.reeder@sinclair.edu June 28, 2012.](https://reader035.fdocuments.us/reader035/viewer/2022070403/56649f325503460f94c4e762/html5/thumbnails/11.jpg)
Other Features of Trainer• Maintains history of user operations.• Will track cost, time, and quality of user
operations.• “Tutorial” page will provide photos and
videos of operations being performed in the lab, along with text explaining theory.