NAND DRAM Multi Chip Package (MCP)

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NAND DRAM http://product.skhynix.com www.linkedin.com/company/sk-hynix Multi Chip Package (MCP) : Ultimate Solution for the Smart Mobile Life 1 of 2 | Optimized to ever-evolving mobile environments, our mobile memory solutions instill the best of SK hynix’s technology and market leadership, built over years of close collaboration and shared growth with our customers. Mobile Memory Solutions from a Memory Market Leader Multi Chip Package (MCP) Ultimate Solution for the Smart Mobile Life What trends are driving today’s mobile market?

Transcript of NAND DRAM Multi Chip Package (MCP)

Page 1: NAND DRAM Multi Chip Package (MCP)

NANDDRAM

http://product.skhynix.com www.linkedin.com/company/sk-hynix

Multi Chip Package (MCP) : Ultimate Solution for the Smart Mobile Life1 of 2 |

Optimized to ever-evolving mobile environments, our mobile memory solutions instill the best of SK hynix’s technology and market leadership, built over years of close collaboration and shared growth with our customers.

Mobile Memory Solutions from a Memory Market Leader

Multi Chip Package (MCP) Ultimate Solution for the Smart Mobile Life

What trends are drivingtoday’s mobile market?

http://product.skhynix.com
www.linkedin.com/company/sk-hynix
Page 2: NAND DRAM Multi Chip Package (MCP)

© 2020 SK hynix Inc. All rights reserved. Specifications and designs are subject to change without notice. All data were deemed correct at time of creation.SK hynix is not liable for errors or omissions.B-MCP-E01-201123-R00

Multi Chip Package (MCP) : Ultimate Solution for the Smart Mobile Life2 of 2 |

What’s in our Multi Chip Package (MCP) lineup?

What makes our mobile solutions competitive?

| uMCP

| A wide range of products for Mobile applications

A trusted memory provider with 30+ years of experience, SK hynix closely collaborates with global brands to offer advanced mobile memory solutions that are tailored to the market’s needs for slimmer, faster, and more reliable mobile devices.

Density(NAND+DRAM)

128~512GB+6~12GB

6400MbpsSpeed

297Ball

64~256GB+3~12GB

4266Mbps

254BallPKG

·DRAM: LPDDR5, LPDDR4X, LPDDR4 etc·NAND: UFS3.1, UFS2.2, eMMC5.1 etc

·UFS NAND and LPDDR DRAM stacked in a single package·Competitively thin form factor packing high densities with smaller footprint

| eMCP

Density(NAND+DRAM)

16~128GB+2~6GB

3733Mbps~4266MbpsSpeed

254BallPKG

·eMMC NAND and LPDDR DRAM stacked in a single package·Realizes 40% better space efficiency for mobile devices

Ultra-slim, compact packagefor mobile devices

Small and slim package savingup to 40% of space

World-leading technologyand performance

Advanced performance enabledby cutting-edge 1znm DRAM and128-layer 4D NAND Flash memory

Continuous productquality control

Stable quality supported bycontinuous sequality and customerservice improvement efforts


Memory Packaging Market and Technology Trends; · PDF filePoP format MCP format ... DRAM ASP reach historic high since last 5 yrs. ... Client SCM Mass Storage Memory Micro Controllers

Memory Packaging Market and Technology Trends; · PDF filePoP format MCP format ... DRAM ASP reach historic high since last 5 yrs. ... Client SCM Mass Storage Memory Micro Controllers

PRODUCT SELECTION - Samsung SELECTION GUIDE DISPLAYS, MEMORY AND STORAGE 1H 2017 CONTACTS DISPLAYS STORAGE MCP FLASH - SSD DRAM . MOBILE/WIRELESS NOTEBOOK PCs/ ULTRABOOKS™ DESKTOP

PRODUCT SELECTION - Samsung SELECTION GUIDE DISPLAYS, MEMORY AND STORAGE 1H 2017 CONTACTS DISPLAYS STORAGE MCP FLASH - SSD DRAM . MOBILE/WIRELESS NOTEBOOK PCs/ ULTRABOOKS™ DESKTOP

Micron MCPs for Embedded IoT Applications · NAND, e.MMC and LPDRAM technologies. We offer a broad product portfolio of industrial- and automotive-grade MCP memory solutions that

Micron MCPs for Embedded IoT Applications · NAND, e.MMC and LPDRAM technologies. We offer a broad product portfolio of industrial- and automotive-grade MCP memory solutions that

Micron Technology (MU) - UVACollab · PDF file• Hard-drive Solid State drive • SSD’s use NAND or DRAM • NAND+NOR play key role in smartphone and tablet chips 8. M c I n t i

Micron Technology (MU) - UVACollab · PDF file• Hard-drive Solid State drive • SSD’s use NAND or DRAM • NAND+NOR play key role in smartphone and tablet chips 8. M c I n t i

SERIAL MCP FLASH MEMORY - winbond.com combo reva 091317... · The W25M161AV (16M-bit Serial NOR + 1G-bit Serial NAND) Serial MCP (Multi Chip Package) Flash memory is based on the

SERIAL MCP FLASH MEMORY - winbond.com combo reva 091317... · The W25M161AV (16M-bit Serial NOR + 1G-bit Serial NAND) Serial MCP (Multi Chip Package) Flash memory is based on the

Richardson RFPD | Home | Richardson RFPD - Embedded ......CELL_FACH, Enhanced L2, EF-DPCH Memory configuration > 128 MB NAND + 64 MB DDR MCP Memory, storing one WCDMA, one CDMA and

Richardson RFPD | Home | Richardson RFPD - Embedded ......CELL_FACH, Enhanced L2, EF-DPCH Memory configuration > 128 MB NAND + 64 MB DDR MCP Memory, storing one WCDMA, one CDMA and

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip …5. P/N:PM2066. MX63UxG. 130-Ball MCP . RV. 1.3, MAR. 11, 2016. 3. PART NAME DESCRIPTION. MX63 U D 12 XN I 00. Product Grade

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip …5. P/N:PM2066. MX63UxG. 130-Ball MCP . RV. 1.3, MAR. 11, 2016. 3. PART NAME DESCRIPTION. MX63 U D 12 XN I 00. Product Grade

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi ......SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip Package) MX63UxGxxx Key Features NAND Flash Features: • Low Power Dissipation

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi ......SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip Package) MX63UxGxxx Key Features NAND Flash Features: • Low Power Dissipation

SERIAL MCP FLASH MEMORY - Winbond combo reva 08… · The W25M121AV (128M-bit Serial NOR + 1G-bit Serial NAND) Serial MCP (Multi Chip Package) Flash memory is based on the popular

SERIAL MCP FLASH MEMORY - Winbond combo reva 08… · The W25M121AV (128M-bit Serial NOR + 1G-bit Serial NAND) Serial MCP (Multi Chip Package) Flash memory is based on the popular

Reliability (and Security) Issues of DRAM and NAND Flash ... · 8/7/2014  · The DRAM Scaling Problem ! DRAM stores charge in a capacitor (charge-based memory) " Capacitor must be

Reliability (and Security) Issues of DRAM and NAND Flash ... · 8/7/2014  · The DRAM Scaling Problem ! DRAM stores charge in a capacitor (charge-based memory) " Capacitor must be

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip … · 5. P/N:PM2066. MX63UxG. 130-Ball MCP . RV. 1.3, MAR. 11, 2016. 3. PART NAME DESCRIPTION. MX63 U D 12 XN I 00. Product

SLC NAND FLASH and LPDDR 130-Ball MCP MCP (Multi-Chip … · 5. P/N:PM2066. MX63UxG. 130-Ball MCP . RV. 1.3, MAR. 11, 2016. 3. PART NAME DESCRIPTION. MX63 U D 12 XN I 00. Product

MCP: Code Directory (mcp code dir)

MCP: Code Directory (mcp code dir)

Co-Architecting Controllers and DRAM to Enhance DRAM ...camelab.org/uploads/Main/Co-Architecting Controllers and DRAM to... · Co-Architecting Controllers and DRAM to Enhance DRAM

Co-Architecting Controllers and DRAM to Enhance DRAM ...camelab.org/uploads/Main/Co-Architecting Controllers and DRAM to... · Co-Architecting Controllers and DRAM to Enhance DRAM

International Technology Roadmap for Semiconductors … ·  · 2017-09-07ITRS Team •Three of us are ... Test Complexity Drivers ... DRAM NAND RF & AMS LCD Drivers

International Technology Roadmap for Semiconductors … ·  · 2017-09-07ITRS Team •Three of us are ... Test Complexity Drivers ... DRAM NAND RF & AMS LCD Drivers

ClearPath MCP Update - assets.unisys.com · For Deploying MCP-Based Applications Feature MCP Gold MCP Silver MCP Bronze Licensing/ Pricing Metric Capacity or Consumption CVUs Capacity

ClearPath MCP Update - assets.unisys.com · For Deploying MCP-Based Applications Feature MCP Gold MCP Silver MCP Bronze Licensing/ Pricing Metric Capacity or Consumption CVUs Capacity

Project #1: NAND Simulatorcsl.skku.edu/uploads/ICE3028F18/Project1_nandsim_2018.pdf · Project 1 •Develop a NAND simulator –Simulate NAND flash memory using host DRAM –4B for

Project #1: NAND Simulatorcsl.skku.edu/uploads/ICE3028F18/Project1_nandsim_2018.pdf · Project 1 •Develop a NAND simulator –Simulate NAND flash memory using host DRAM –4B for

137-Ball NAND Flash with LPDDR MCP · 2020. 9. 21. · NAND Flash with Mobile LPDDR 137-Ball MCP MT29C2G24MAAAAKAKD-5 IT, MT29C2G24MAABAKAKD-5 IT, MT29C2G24MAAAAKAHH-5 AIT Features

137-Ball NAND Flash with LPDDR MCP · 2020. 9. 21. · NAND Flash with Mobile LPDDR 137-Ball MCP MT29C2G24MAAAAKAKD-5 IT, MT29C2G24MAABAKAKD-5 IT, MT29C2G24MAAAAKAHH-5 AIT Features

DRAM & NAND Service, Memory Research; · 2019. 3. 28. · • DRAM revenue reached a new high in 2019 on strong pricing trends and modest shipment growth • The emergence of significant

DRAM & NAND Service, Memory Research; · 2019. 3. 28. · • DRAM revenue reached a new high in 2019 on strong pricing trends and modest shipment growth • The emergence of significant

InternaonalTechnology Roadmap*for*Semiconductors* · PDF file · 2014-06-12ITRS*Team* • ... Loranger • Test*Working*Group* – More!than!70!professionals! ... DRAM NAND* RF&*

InternaonalTechnology Roadmap*for*Semiconductors* · PDF file · 2014-06-12ITRS*Team* • ... Loranger • Test*Working*Group* – More!than!70!professionals! ... DRAM NAND* RF&*

Xperi Investor Presentation Q2 2020...• Push beyond Moore’s Law with 3D integration technology in Image Sensors, RF, NAND, DRAM and Logic devices Focus Areas Growth Opportunities

Xperi Investor Presentation Q2 2020...• Push beyond Moore’s Law with 3D integration technology in Image Sensors, RF, NAND, DRAM and Logic devices Focus Areas Growth Opportunities