Name 2019 06 14 Altium XS6SOM X2.7z Id. 303 - QED Check … · 2019-07-05 · Copper Layer Minima &...

Single PCB View - Original

Top View Bottom View

Summary - General - Original

PCB Size 67.600 mm x 31.750 mm Surface Finish unknown

PCB Thickness 1.600 mm Max. Aspect Ratio on PTH 8.0

Customer Panel Size Drilled SMD Pads Yes

Copper Layers 6 SMD Pads Top 669

Solder Mask Both SMD Pads Bottom 265

Solder Mask Color unknown BGA Pads Top 352

Legend Both BGA Pads Bottom 0

Legend Color unknown Drill Hole Density 4761 Holes/dm2

Peeloff Mask None Pressing Stages 1

Carbon Mask None Number of Nets 368

Edge Connectors Yes Electrical Test Double Sided

1 2 3 4 5 6 7 8 9 10 11

12 13 14 15 16 17 18 19 20 21 22

Summary - Copper Layer Minima - Original

Layer Type CopperWidth

CriticalCopperWidth

TraceWidth

CriticalTraceWidth

Copper toCopper

Clr.

Trace toTrace Clr.

Same NetClr.

Ring Plated Copper toNPTH Clr.

Copper toOutline Clr.

mm mm mm mm mm mm mm mm mm mm mm

Outer 0.080 0.089 0.100 0.100 0.100 0.100 0.004 0.098 0.200 0.100 0.000

Inner 0.100 0.100 0.100 0.100 0.100 0.100 0.016 0.100 0.200 0.100 0.127

Summary - Sequences - Original

Type Sequences Tools Min. EndDia.

Max. EndDia.

Holes Routs Ring onOuter

Ring onInner

Hole toCopper Clr.

mm mm mm mm mm

PTH 1 4 0.200 0.700 1012 0 0.098 0.100 0.200

NPTH 1 2 1.800 1.800 2 0 >0.800 >0.800 0.100

Total 2 6 0.200 1.800 1014 0 0.098 0.100 0.100

Integr8tor v2019.05-190514 Page1The information on this document is not only based on files in a clearly defined format, but also on freely structured files and inference rules. Ucamcostrives to make it as accurate as possible, but it cannot guarantee the result in all situations. This information is used at the sole risk of its user.

Name 2019 06 14 Altium XS6SOM X2.7z Id. 303 - QED Check Todo's

Report Generated on 20-jun-2019 11:24:53

Summary - Rout - Original

Type Tools Min. End Dia. Max. End Dia. Draw Length

mm mm mm

Plated

NPTH

Total




Files - Original

Initial Renamed Format Function Position Color

XS6SOM_Pads_Top.gbr XS6SOM_Pads_Top_gbr gerx2 pads top

XS6SOM_Paste_Top.gbr XS6SOM_Paste_Top_gbr gerx2 paste top

XS6SOM_Legend_Top.gbr XS6SOM_Legend_Top_gbr gerx2 legend top unknown

XS6SOM_Soldermask_Top.gbr XS6SOM_Soldermask_Top_gbr gerx2 soldermask top unknown

XS6SOM_Copper_Signal_Top.gbr XS6SOM_Copper_Signal_Top_gbr gerx2 outer 1

XS6SOM_Copper_Signal_1.gbr XS6SOM_Copper_Signal_1_gbr gerx2 inner 2




XS6SOM_Copper_Signal_Bot.gbr XS6SOM_Copper_Signal_Bot_gbr gerx2 outer 6

XS6SOM_Soldermask_Bot.gbr XS6SOM_Soldermask_Bot_gbr gerx2 soldermask bottom unknown

XS6SOM_Legend_Bot.gbr XS6SOM_Legend_Bot_gbr gerx2 legend bottom unknown

XS6SOM_Paste_Bot.gbr XS6SOM_Paste_Bot_gbr gerx2 paste bottom

XS6SOM_NPTH_Drill.gbr XS6SOM_NPTH_Drill_gbr gerx2 unplated 1-6

XS6SOM_PTH_Drill.gbr XS6SOM_PTH_Drill_gbr gerx2 plated 1-6

XS6SOM_Pads_Bot.gbr XS6SOM_Pads_Bot_gbr gerx2 pads bottom

XS6SOM_Drawing_1.gbr gerx2 document

XS6SOM_Drillmap_1.gbr XS6SOM_Drillmap_1_gbr gerx2 drillmap none

XS6SOM_Mechanical_1.gbr XS6SOM_Mechanical_1_gbr gerx2 mechanical none









XS6SOM_Profile.gbr XS6SOM_Profile_gbr gerx2 cad_outline none

Status Report.Txt text document

XS6SOM-macro.APR_LIB text document

XS6SOM.EXTREP text document

XS6SOM.REP text document

XS6SOM.RUL text document

XS6SOM.apr text document

PCB (Single) - Original

PCB Size Outline Type Outline Length Outline Area Copper Layers PCB Thickness

mm x mm mm dm2 mm

67.600 x 31.750 real 210.832 0.2130 6 1.600




Copper Layer Minima & Area - Original

File Pos. Copper Width CriticalCopper Width

Trace Width Critical TraceWidth

Copper toCopper Clr.

Same NetClr.

Copper Area

mm mm mm mm mm mm dm2 %

XS6SOM_Copper_Signal_Top_gbr

1 0.080 0.089 0.100 0.100 0.100 0.004 0.1407 66

XS6SOM_Copper_Signal_1_gbr

2 0.125 >0.500 >0.400 >0.400 0.100 0.016 0.1975 93


3 0.100 0.100 0.100 0.100 0.100 0.026 0.1524 72


4 0.100 0.100 0.100 0.100 0.100 0.016 0.1498 70


5 0.122 0.254 0.350 0.350 0.100 0.019 0.1920 90

XS6SOM_Copper_Signal_Bot_gbr

6 0.100 0.100 0.100 0.100 0.100 0.008 0.1704 80

Copper Layer Minima - Copper vs Drill - Original

File Pos. Ring Copper vs Drill Clr. Copper to Outline Clr.

Overall Via Laser Via Comp. Mech. Plated NPTH Overall Pad toOutline

Track toOutline

Region toOutline

mm mm mm mm mm mm mm mm mm mm mm

XS6SOM_Copper_Signal_Top_gbr

1 0.099 0.099 0.150 0.200 0.100 0.000 0.250 0.718 0.000


2 0.100 0.100 0.150 0.200 0.100 0.127 0.910 >1.600 0.127


3 0.100 0.100 0.150 0.200 0.100 0.127 0.910 0.895 0.127


4 0.100 0.100 0.150 0.200 0.100 0.127 0.910 1.191 0.127


5 0.100 0.100 0.150 0.200 0.100 0.127 0.309 >1.600 0.127

XS6SOM_Copper_Signal_Bot_gbr

6 0.098 0.098 0.150 0.200 0.100 0.044 0.250 1.016 0.044

Copper Layers - Clearance Details - Original

File Pos. Copper to Copper Clr.

Overall Pad to Pad Pad to Track Track to Track Trace to TraceClr.

mm mm mm mm mm

XS6SOM_Copper_Signal_Top_gbr 1 0.100 0.100 0.100 0.100 0.100

XS6SOM_Copper_Signal_1_gbr 2 0.100 0.100 0.100 >0.500 >0.500

XS6SOM_Copper_Signal_2_gbr 3 0.100 0.100 0.100 0.100 0.100

XS6SOM_Copper_Signal_3_gbr 4 0.100 0.100 0.100 0.100 0.100

XS6SOM_Copper_Signal_4_gbr 5 0.100 0.100 0.100 0.100 >0.500

XS6SOM_Copper_Signal_Bot_gbr 6 0.100 0.100 0.100 0.100 0.100




Copper Areas - Original

Side Total Free of Edge Connectors

Solder Mask(as supplied)

Solder Mask(open vias)

Gold Mask Silver Mask Fingers Finger Size Total Area

dm2 dm2 dm2 dm2 dm2 mm x mm dm2

Top (incl. 1/2 plated holes and routs) 0.1897 0.0398 0.0937 100 0.450 x 2.300 0.0104

Bottom (incl. 1/2 plated holes and routs) 0.2194 0.0277 0.0816 100 0.450 x 2.300 0.0104

Total (incl. plated holes and routs) 0.4090 0.0675 0.1753 200 0.0208

Drill Tools - Original

File ToolNr.

Span Type Method Filled Via Counter Dia. Tol. Min Tol.Plus

Holes(in

PCB)

Routs(in

PCB)

DoubleHits (in

File)

PredrillHits (in

File)mm mm mm

XS6SOM_NPTH_Drill_gbr

109 1-6 NPTH mech. unknown unknown 1.800 0.000 0.000 1 0 0 0

XS6SOM_NPTH_Drill_gbr

110 1-6 NPTH mech. unknown unknown 1.800 0.000 0.000 1 0 0 0

XS6SOM_PTH_Drill_gbr

111 1-6 PTH mech. unknown unknown 0.700 0.000 0.000 2 0 0 0







Drill Tools - Drill vs Copper - Original

File Tool Nr. Span Type Method Dia. Ring onOuter

Ring onInner

Pad Size

mm mm mm mm

XS6SOM_NPTH_Drill_gbr 109 1-6 NPTH mech. 1.800 >0.800 >0.800

XS6SOM_NPTH_Drill_gbr 110 1-6 NPTH mech. 1.800 >0.800 >0.800

XS6SOM_PTH_Drill_gbr 111 1-6 PTH mech. 0.700 0.150 0.150 1.000




Sequences - Original

Span Type Tools Min. EndDia.

Max.End Dia.

Holes Ring onOuter

Ring onInner

Hole toCopper

Clr.

Hole toHole Clr.,

within Seq.

Overlapping Holes,

within Seq.

Hole toHole Clr.,between

Seqs

Hole toOutline

Clr.

Min. Slotto

OutlineClr.

mm mm mm mm mm mm mm mm mm

1-6 PTH 4 0.200 0.700 1012 0.098 0.100 0.200 0.219 No >0.800 0.409 disabled

1-6 NPTH 2 1.800 1.800 2 >0.800 >0.800 0.100 >1.600 No 0.302 1.100 disabled

All All 6 0.200 1.800 1014 0.098 0.100 0.100 0.219 No 0.409 disabled

Rout Tools - Original

File Tool Nr. Type Tool Dia. End Dia. Draw Length Nibble Count

mm mm mm




Routed Holes - Original

File Hole Nr. Instances X Size Y Size Draw Length Nibble Count

mm mm mm

Bare Board Test - Original

Side Testable Points(TPs)

Max. TP Density SMD Pads Min. SMD Pad Pitch of Min. SMDPad

Fingers

TP/dm2 mm mm

Top 812 6623 669 0.240 0.400 100

Bottom 408 2534 265 0.450 0.900 100

Both 1220 6623 934 0.240 0.400 200

Todo's - Original

Functional copper outside or touching outline. Please check outline 'XS6SOM_Copper_Signal_Top_gbr'

Input Remarks - Original

Gerber import: Standard attribute '.FileFunction' with value 'Drawing' is invalid for %TF, continuing. 'XS6SOM_Drawing_1.gbr' (at line 5)

Gerber import: Non-standard .FileFunction attribute value Drawing, interpreted as extra layer 'XS6SOM_Drawing_1.gbr' (at line 4530)

Gerber import: Self-intersecting contours are detected, continuing with an interpretation of the contours. 'XS6SOM_Legend_Top.gbr' (at line 3381)

Stackup - Original

Pressing Stages 1

Sequences Analysis - Original

File Pos. StackedVias

Overlapped Vias

Min. ViaPlug Clr.

Top Tool Bottom Tool

Top Drill File Tool Nr. Dia. Bottom Drill File Tool Nr. Dia.

mm mm mm




Scoring - Minimum Clearance - Original

File Pos. Copper to ScoreTop

Copper to ScoreRight

Copper to ScoreBottom

Copper to ScoreLeft

mm mm mm mm

XS6SOM_Copper_Signal_Top_gbr 1 0.133 0.422 0.250 0.000

XS6SOM_Copper_Signal_1_gbr 2 0.127 0.163 0.254 0.127




XS6SOM_Copper_Signal_Bot_gbr 6 0.112 0.078 0.250 0.212

Scoring - Routing (based on outline analysis) - Original

Side Lines Min. Score Lines Clr. Saved Routing Remaining Routing

mm mm mm

Horizontal Score Lines

Top 1 0.112 >1.600

Mid 0

Bottom 1 0.250 >1.600

Vertical Score Lines

Left 1 0.000 >1.600

Mid 0

Right 1 0.078 >1.600

All Score Lines4 0.000 179.950 30.882

Solder Mask - Original

Side Min. Mask toMask Clr.

Min. Web Min. Ring onCu Defined

Pads

Min. Ring onSM Defined

Pads

Min. Mask toCopper Clr.

Fully CoveredVia Holes

Partly CoveredVia Holes

Half Mask Vias

mm mm mm mm mm

Top >0.250 0.160 0.069 0.000 0.100 Yes Yes

Bottom 0.015 0.015 >0.250 0.000 0.081 Yes Yes

Both 0.015 0.015 0.069 0.000 0.081 Yes Yes Yes

SMD (Including BGA Pads) - Original

Side SMD Pads(Total)

Min. SMDPad

Pitch of Min.SMD Pad

Solder MaskDefined Pads

SMD Pads(Excl. BGA)

BGA Pads BGA Min.Pitch

All Tracks inBGA

Centered

BGA Drilled

mm mm mm

Top 669 0.240 0.400 6 317 352 0.750 No No

Bottom 265 0.450 0.900 3 265 0

Both 934 0.240 0.400 9 582 352 0.750 No No




DFM Classes - Original

Standard Advanced

3 4 5 6 7 8 9 10 11 12

Track & Gap min Clearance (Track-Track / Track-Pad / Pad-Pad)

0.100 300.000 200.000 150.000 120.000 100.000 100.000 85.000 75.000 60.000 <

min Track Width / minThermal Gap

0.089 300.000 200.000 150.000 120.000 100.000 100.000 85.000 75.000 60.000 <

Ring for IPCClass 2

min Outer Layer AnnularRing

0.098 200.000 175.000 150.000 120.000 100.000 100.000 75.000 75.000 60.000 <

min Inner Layer AnnularRing

0.100 225.000 200.000 175.000 145.000 125.000 125.000 100.000 100.000 85.000 <

Aspect Ratio max aspect ratio forPlated hole

8.000 3.200 3.600 4.000 4.600 5.300 6.400 6.400 - - -

Drill - Cu distance Plated hole toPlated hole

0.219 750.000 600.000 500.000 410.000 350.000 350.000 285.000 275.000 230.000 <

distance Non-plated holeto Cu on inner layers

0.100 IAR +25

IAR +25

IAR +25

IAR +25

IAR +25

IAR +25

IAR +25

IAR +25

IAR +25

<

distance Non-plated holeto Cu on outer layers

0.100 350.000 300.000 250.000 200.000 200.000 200.000 150.000 100.000 75.000 <

Cu Thickness maximum total Cuthickness that can beetched (no minimum)

105.000 70.000 60.000 50.000 35.000 35.000 20.000 15.000 15.000 <

Solder Mask solder mask annular ring& track overhang

0.069 150.000 100.000 75.000 60.000 50.000 50.000 42.500 37.500 30.000 <

solder mask solderweb 0.015 200.000 150.000 125.000 100.000 100.000 100.000 87.000 87.000 75.000 <




1 2

3 4

5 6

Summary Minimum Design Characteristics - Locations - Original

Copper WidthOuter Layers0.080 mm

Critical Copper WidthOuter Layers0.089 mm

Trace WidthOuter Layers0.100 mm

Critical Trace WidthOuter Layers0.100 mm

Copper to Copper Clr.Outer Layers0.100 mm

Trace to Trace Clr.Outer Layers0.100 mm




7 8

9 10

11 12

Same Net Clr.Outer Layers0.004 mm

RingOuter Layers0.098 mm

PlatedOuter Layers0.200 mm

Clr. to NPTHOuter Layers0.100 mm

Copper to Outline Clr.Outer Layers0.000 mm

Copper WidthInner Layers0.100 mm




13 14

15 16

17 18

Critical Copper WidthInner Layers0.100 mm

Trace WidthInner Layers0.100 mm

Critical Trace WidthInner Layers0.100 mm

Copper to Copper Clr.Inner Layers0.100 mm

Trace to Trace Clr.Inner Layers0.100 mm

Same Net Clr.Inner Layers0.016 mm




19 20

21 22

RingInner Layers0.100 mm

PlatedInner Layers0.200 mm

Clr. to NPTHInner Layers0.100 mm

Copper to Outline Clr.Inner Layers0.127 mm




Name 2019 06 14 Altium XS6SOM X2.7z Id. 303 - QED Check … · 2019-07-05 · Copper Layer Minima &...

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