Muon EDR material specification: Epoxy glue 16/04/20031T.Schneider/LHCb Muon EDR 1.Different...
-
Upload
jasmin-shelton -
Category
Documents
-
view
220 -
download
2
Transcript of Muon EDR material specification: Epoxy glue 16/04/20031T.Schneider/LHCb Muon EDR 1.Different...
16/04/2003 1T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue
1. Different application of epoxy glue in the muon chambersa) Wire fixation on Anode wire barb) Bar gluing on the cathode panelc) Peripheral gluing to close and seal the chamber
2. Epoxy glue requirements
3. Table of possible glue candidates
4. Additional test done for direct comparison:a) Viscosityb) Electrical resistivityc) Attachment properties (shear test ISO9664)
5. Conclusions for the different applications
16/04/2003 2T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue
1.a) Wire fixation on the anode wire bar
The 5mm wide glue line in front of the soldering has to keep the wires with a tension of 60g.
Low glue viscosity assures that the 30µm wire is well enclosed by the glue.
The glue line thickness shall not exceed 1mm as we have ground in only 2.5mm distance.
All Proto-types have been done with Adekit 145=> good experience
16/04/2003 3T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue1.b) Bar gluing on the cathode panel
Special tooling has been developed to glue the bars precise
(2.5mm ± 50μm) to the panel.
Function to the glue:
-Mechanical fixation of bars on the panel. Wires pull with ~300gr /cm on the bar-Filling the gap between bars and panel (0.1mm-0.6mm depends on thickness of the chosen bar material)-Provide sufficient gas tightness for the chamber
16/04/2003 4T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue1.c) Peripheral gluing to close and seal the
chamber
In some chamber design peripheral sealing is foreseen. Once
the HV and uniformity test of the assembled chamber aresatisfying this final procedure can be performed.
Function of the glue:
-Good attachment properties to keep the chamber mechanically together
-High viscosity to facilitate the work all around the chamber
-Provide sufficient gas tightness for the chamber
16/04/2003 5T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue
- Working time >30min- Manipulation time < 8h- Good adhesive behavior for FR4 to copper/gold- Low viscosity for wire gluing- Medium to high viscosity epoxy for bar gluing /gap
filling procedure to ensure mechanical strength and gas tightness
- High electrical resistance (risk of dark currents)- Good chemical resistance (CF4/radiation/high el.
field)- Good shock resistance (elastic behavior to avoid
cracks and consequent leaks)
2. Epoxy glue requirements
16/04/2003 6T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue3. Table of possible glue candidates
supplier AXSON/Adekit Ciba/Araldite Scotch 3Mrecomended recommended recommended recommended
personal wire gluing CERNpanel border HoneyC.Structureexperience PNPI INFN CERN bars gluing CERN
A145 A140 Araldite 2011 Araldite 2012 DP490 DP460 DP810shear force(on treated Al) 18 Mpa 21 Mpa 27 N/mm² 18 N/mm² 30 MPa 31.5 Mpa 4200 psiworking time 90 min 40 min 120 min 4 min 180 min 60 min 10 minmanipulation 12h (20º)time 6h (23º) 4.5h (23º) 4h (40º) 4h 4-6h 1h (50%)tolal polimerisation 72h 20h (50%) 8-24h
Thixotropeviscosity medium 430 PaS ok 30 PaS 520 PaS 16.000 cps 20.000 cpsshock good flexibleresistance 75Shore D (mix ratio) 25KJ/cm 75-80 Shore Delectrical < 0.1nA 0.9nA <0.1nA 0.8nA <0.1nAresistance 2.4*exp14Ω/cmchem. resistance ok ok50mlprice CHF/Kg 200 200 320 400 400400 or 200mlprice CHF/Kg 78.5 75 195 207 2072 components price CHF/Kg 35
Captiontests to be done Recommendation or good experience acceptable not acceptable no information
=>
=>
=>
16/04/2003 7T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.a) Viscosity test
Adekit 140 Adekit 145 Araldite 2011 3M DP490 3M DP460
16/04/2003 8T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.a) Viscosity test
Different Glue candidates have been applied to a declined surface “structural” “low viscosity” “structural” “medium viscosity”
Adekit 140 Adekit 145 Araldite 2011 3M DP490 3M DP460
16/04/2003 9T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Electrical resistivity test
• Samples for volume resistivity have been prepared.• 3KV have been applied to the samples under controlled condition
(T const, dry air)• Sensitivity of measuring device is 0.1nA
16/04/2003 10T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Electrical resistivity
Results:
A145 A140 Araldite2011 DP490DP460
<0.1nA 0.9nA <0.1nA 0.8nA <0.1nA (3.3TΩ; 130TΩcm) (3.7TΩ; 150TΩcm)
=>The 2 structural glues have lower volume resistivity !The test of volume resistivity is more an academic approach. Real conditions might be dominated by surface currents.Tests are ongoing to get some answers on surface resistivity from theepoxy glues. Reliable measurements are difficult to obtain due toenvironmental conditions such as humidity and temperature. Experience and results from Proto-types should enter into theseconsiderations.
16/04/2003 11T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Attachment FR4 to Cu/Au
For good comparison for our special use (FR to Cu/au) a test for
“fatigue properties of structural adhesives in tensile shear”
( ISO 9664) has been performed in the CERN EST Division.
16/04/2003 12T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Attachment FR4 to Cu/Au
Five samples per candidate (5) and condition (Cu or Au) have been
prepared =>50 in total.Humidity and temperature were kept stable during this
operation.200mm wires were introduced as spacers to simulate the
realcondition of our chamber construction.
16/04/2003 13T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Attachment FR4 to Cu/Au
*Adekit 145 is only candidate for the wire gluing The 4 others are possible candidates for the bar gluing and peripheral gluing
EST/SM-MESection de métallurgie / Metallurgy sectionRapport expérimental / Investigation report
Glue Average of Samples Cu/FR4 Average of Samples Au/FR4
Samples N MPa Samples N Mpa
Araldite2011 1 to 5 3304 ± 366 10.6 ± 1.2 26 to 30 2053 ± 57 6.6 ± 0.2
3M DP 460 6 to 10 3642 ± 1065 11.6 ± 3.4 31 to 35 2482 ± 432 7.9 ± 1.4
3MDP 490 11 to 15 4174 ± 486 13.4 ± 1.6 36 to 40 2213 ± 648 7.1 ± 2.1
Adekit 140 16 to 20 3460 ± 329 11.1 ± 1.1 41 to 45 3269 ± 240 10.5 ± 0.8
Adekit 145* 21 to 25 1660 ± 311 5.3 ± 1.0 46 to 50 1483 ± 309 4.7 ± 1.0
16/04/2003 14T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue4.b) Attachment FR4 to Cu/Au
• Apart from the Adekit 145 the result
are “quite similar”.• Best result for FR4/Cu : DP490• Best result for FR4/Au : Adekit140
Comments:
The 2 structural glues (DP490/Adekit140)
break in the glue. The glue stays on both
surfaces. The 3 transparent less viscous
ones (DP460/Adekit145/Araldite2011)
break at the glue metal connection.
16/04/2003 15T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue5. Conclusions for the different
applicationssupplier AXSON/Adekit Ciba/Araldite Scotch 3M recomended recommended recommended recommended
personal wire gluing panel border gluing HC and bar gluingexperience CERN / PNPI / INFN CERN CERN / PNPI
A145 A140 Araldite 2011 DP490 DP460shear force NFr4/copper 1660 3460 3304 4174 3642FR4/gold 1483 3269 2053 2213 2482working time 90 min 40 min 120 min 180 min 60 minmanipulation 12h (20º)time 6h (23º) 4.5h (23º) 4h (40º) 4h 4-6htolal polimerisation 72h 20h (50%)
low viscosity high viscosity low viscosity high viscosity medium viscosityviscosity structural glue structural glue okshock flexibleresistance 75Shore D (mix ratio) 25KJ/cm 75-80 Shore Delectrical < 0.1nA 0.9nA <0.1nA 0.8nA <0.1nAresistance 130 TΩcm 150 TΩcmchem. Gif aging Gif agingresistance ok ok50mlprice CHF/Kg 200 200 320 400 400400 or 200mlprice CHF/Kg 78.5 80 195 207 2072 components price CHF/Kg 35
Caption
tests to be done Recommendation or good experience good acceptebale not acceptable
16/04/2003 16T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue5. Conclusions for the different
applications
Wire gluing:
• We agreed to continue with Adekit 145 as we had quite good feed back in all our proto types. It was satisfying all requirements for this application (attachment, el. resistifity, viscosity, chemical resistance)
• Calculating the attachment force corresponding to the wire surface in a 5mm wide gluing line the breaking limit is still factor 4 (2.3N0.6N wire tension) above our use.
16/04/2003 17T.Schneider/LHCb Muon EDR
Muon EDR material specification: Epoxy glue5. Conclusions for the different
applications
Bar and peripheral gluing:
• High viscosity to obtain good leak tightness as well as the attachment force are the most important properties for this application.
• A good candidate is the Adekit 145. We decided to use this glue for the next chambers. This will give us soon answers about the missing chemical and electrical properties.