Multimedia Expansion Board II (MEB II) User’s...

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© 2013-2014 Microchip Technology Inc. DS70005148B Multimedia Expansion Board II (MEB II) User’s Guide

Transcript of Multimedia Expansion Board II (MEB II) User’s...

© 2013-2014 Microchip Technology Inc. DS70005148B

Multimedia Expansion Board II (MEB II)User’s Guide

DS70005148B-page 2 © 2013-2014 Microchip Technology Inc.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

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The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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Printed on recycled paper.

ISBN: 978-1-62077-976-7

MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S

GUIDE

Table of Contents

Chapter 1. Introduction1.1 Kit Contents .................................................................................................. 111.2 System Diagram ........................................................................................... 111.3 Multimedia Features ..................................................................................... 131.4 MEB and MEB II Differences ........................................................................ 17

Chapter 2. Hardware2.1 Hardware Features ....................................................................................... 19

Appendix A. Board Layout and SchematicsA.1 Board Layout ................................................................................................ 32A.2 Schematics .................................................................................................. 35

Appendix B. Bill of Materials....................................................................................... 49

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MULTIMEDIA EXPANSION BOARD II

(MEB II) USER’S GUIDE

Preface

INTRODUCTIONThis chapter contains general information that will be useful to know before using the Multimedia Expansion Board II (MEB II). Items discussed in this chapter include:• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Web Site• Development Systems Customer Change Notification Service• Customer Support• Document Revision History

DOCUMENT LAYOUTThis document describes how to use the Multimedia Expansion Board II (MEB II) as a development tool to emulate and debug firmware on a target board. This user’s guide is composed of the following chapters:• Chapter 1. “Introduction” provides a brief overview of the starter kit, highlighting

its features and uses.• Chapter 2. “Hardware” provides the hardware descriptions of the starter kit.• Appendix A. “Board Layout and Schematics” provides a block diagram, board

layouts, and detailed schematics of the starter kit.• Appendix B. “Bill of Materials” provides the bill of materials for the components

used in the design and manufacture of the starter kit.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.

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CONVENTIONS USED IN THIS GUIDEThis manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONSDescription Represents Examples

Italic characters Referenced books MPLAB IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or dialog

“Save project before build”

Underlined, italic text with right angle bracket

A menu path File>Save

Bold characters A dialog button Click OKA tab Click the Power tab

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file [options]

Curly brackets and pipe character: { | }

Choice of mutually exclusive arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [, var_name...]

Represents code supplied by user

void main (void){ ...}

Notes A Note presents information that we want to re-emphasize, either to help you avoid a common pitfall or to make you aware of operating differences between some device family members. A Note can be in a box, or when used in a table or figure, it is located at the bottom of the table or figure. Note 1: This is a note used in a

table.

Note: This is a standard note box.

CAUTION

This is a caution note.

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Preface

RECOMMENDED READINGThis user’s guide describes how to use the starter kit. The following Microchip documents are available and recommended as supplemental reference resources.

Release Notes for the Multimedia Expansion Board For the latest information, Microchip has a dedicated web page for the Multimedia Expansion Board II (MEB II), which can be accessed at: http://www.microchip.com/meb2

Family Reference Manual SectionsFamily Reference Manual sections are available, which explain the operation of the PIC32 microcontroller family architecture and peripheral modules. The specifics of each device family are discussed in the individual family’s device data sheet.

Device Data Sheets

Refer to the appropriate device data sheet for device-specific information and specifications. These documents may be obtained from the Microchip web site or your local sales office.

Reference information found in these data sheets includes:• Device memory maps• Device pinout and packaging details• Device electrical specifications• List of peripherals included on the devices

PIC32MX Flash Programming Specification (DS60001145)Refer to this document for information on instruction sets and firmware development.

MPLAB® XC32 C/C++ Compiler User’s Guide (DS50001686)This document details the use of Microchip’s MPLAB XC32 Compiler for PIC32 microcontrollers to develop 32-bit applications.

MPLAB® X IDE User’s Guide (DS50002027)Consult this document for more information pertaining to the installation and implementation of the MPLAB X IDE software.

THE MICROCHIP WEB SITEMicrochip provides online support via our web site at http://www.microchip.com. This web site makes files and information easily available to customers. Accessible by most Internet browsers, the web site contains the following information:• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listings

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listings of seminars and events; and listings of Microchip sales offices, distributors and factory representatives

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DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.The Development Systems product group categories are:• Compilers – The latest information on Microchip C compilers and other language

tools• Emulators – The latest information on the Microchip in-circuit emulator, MPLAB

REAL ICE™• In-Circuit Debuggers – The latest information on the Microchip in-circuit

debugger, MPLAB ICD 3• MPLAB X IDE – The latest information on Microchip MPLAB X IDE, the

Windows® Integrated Development Environment for development systems tools• Programmers – The latest information on Microchip programmers including the

PICkit™ 3 development programmer

CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:• Distributor or Representative• Local Sales Office• Field Application Engineer (FAE)• Technical SupportCustomers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.Technical support is available through the web site at: http://support.microchip.com

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Preface

DOCUMENT REVISION HISTORY

Revision A (November 2013)This is the initial release of this document.

Revision B (March 2014)This revision includes the following updates:• Added item 9 (MPLAB REAL ICE In-Circuit Emulator) to 1.3 “Multimedia

Features”• Updated Figure 1-3: “Multimedia Expansion Board II (MEB II) Layout

(Bottom)”• Updated Figure 2-4: “EBI SRAM Memory”• Updated Figure 2-8: “802.11b/g Transceiver”• Updated Figure 2-11: “microSD Card Slot”• Updated Figure 2-14: “Push Button and User Controlled LEDs”• Updated Figure A-1: “MEB II Layout (Top Assembly)”• Updated Figure A-2: “MEB II Layout (Bottom Assembly)”• Updated all schematics (see Figure A-5 through Figure A-20)

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MULTIMEDIA EXPANSIONBOARD II (MEB II) USER’S GUIDE

Chapter 1. Introduction

Thank you for purchasing the Microchip Technology Multimedia Expansion Board II (MEB II). The MEB II is a compact, highly versatile development board, which in conjunction with a PIC32 starter kit and a display daughter board, provides a system for developing a wide range of multimedia applications. The MEB II kit includes a 4.3" WQVGA PCAP touch display daughter board and supports detachable display boards allowing for a variety of resolutions. This chapter covers the following topics:• Kit Contents• System Diagram• Multimedia Features• MEB and MEB II Differences

1.1 KIT CONTENTSThe Multimedia Expansion Board II (MEB II) contains the following items:• Multimedia Expansion Board II (MEB II) (Mother Board)• 4.3" WQVGA Display Board (Daughter Board)• Multimedia Expansion Board II (MEB II) Information Sheet

1.2 SYSTEM DIAGRAMThe MEB II system consists of the PIC32 Starter Kit, MEB II mother board, and a display daughter board (4.3" PCAP touch), as shown in Figure 1-1. MEB II is a mother board that contains all the necessary components and interfaces to support the multimedia features. PIC32 starter kit connects to MEB II through a 168-pin board-to-board connector and contains the PIC32 microcontroller with additional components (debug, memory, communication etc). Refer to http://www.microchip.com/meb2 for supported PIC32 Starter Kits and other additional information. The display daughter board is connected to the MEB II using a 60-pin board-to-board connector (detachable), providing flexibility to support a variety of displays.

Note: If you are missing any part of a kit, contact a Microchip sales office for assis-tance. A list of Microchip offices for sales and service is provided on the back page of this document.

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FIGURE 1-1: MEB II SYSTEM DIAGRAM

MEB II System

StarterKit with(PIC32) EBI-SRAM or

EBI-PSRAM

VGA Camera

24-bit Audio

Bluetooth®

Accelerometer

Temperature

Dis

play

Con

nect

or

Display withPCAP touch

PIC

tail™

Con

nect

ormTouch™ Buttons

microSD

Sensor

Wi-Fi

Sta

rter K

it C

onne

ctor

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Introduction

1.3 MULTIMEDIA FEATURESThe component layout of the MEB II is shown in Figure 1-2 and Figure 1-3. As men-tioned previously, the MEB II kit also includes a 4.3" PCAP touch display board. The component layout of this board is shown in Figure 1-4 and Figure 1-5. The top side of the MEB II includes these key features, as shown in Figure 1-2:1. Display daughter board connector (60-pin Hirose board-to-board connector)2. mTouch™ buttons3. Push Button4. Power LED5. User LEDs6. VGA Camera (OVM7690)7. PICtail™ Connector8. Analog temperature sensor

FIGURE 1-2: MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (TOP VIEW)

62

1

854

3

7

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The bottom side of the MEB II includes these key features, as shown in Figure 1-3:1. Regulated 5V and 3.3V power supply for powering the board through a 9-15V DC

Adapter.2. PIC32 Starter Kit connector (168-pin Hirose board-to-board connector).3. 24-bit stereo audio codec (AK4953A).4. Integrated 802.11bg wireless module (MRF24WG0MA).5. Low-cost Bluetooth® HCI transceiver (BTM805).6. EBI SRAM memory (IS61WV102416BLL).7. microSD slot.8. Analog accelerometer (ADXL325).9. MPLAB® REAL ICE™ In-Circuit Emulator.

FIGURE 1-3: MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (BOTTOM VIEW)

1

2

6

45

7

8

3

9

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Introduction

The top side of the 4.3" WQVGA PCAP touch display board includes this key feature, as shown in Figure 1-4: 1) 4.3" WQVGA glass with PCAP touch panel.

FIGURE 1-4: WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (TOP VIEW)

1

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The bottom side of the 4.3" WQVGA PCAP touch display board includes these key features, as shown in Figure 1-5:1. 60-pin MEB II connector.2. Display panel connector.3. PCAP touch connector.4. Microchip touch controller (MTCH6301).5. 6-in PCAP touch connector for future use.6. PICkit™ Serial Analyzer interface (optional)

FIGURE 1-5: WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (BOTTOM VIEW)

1

23

4

6

5

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Introduction

1.4 MEB AND MEB II DIFFERENCESTable 1-1 describes the differences between the first (MEB) and second (MEB II) generation boards.

TABLE 1-1: MEB BOARD DIFFERENCESFeature MEB II MEB

Starter Kit Connector 160-pin Hirose FX10 series board-to-board connector

132-pin Hirose FX10 series board-to-board connector

Starter Kit Refer to: http://www.microchip.com/meb2 Refer to: http://www.microchip.com/mebDisplay Low-Cost Controllerless (LCC) graphics On-board graphics controller (SSD1926)

60-pin display connector N/AIncludes a 4.3" WQVGA display with projected capacitive touch(MTCH6301)

3.2" QVGA display with resistive touch

Supports up to 7" WVGA display through a connector

N/A

External SRAM (EBI) ISSI 2 MB external synchronous RAM (IS61WV102416BLL-10TLI)

N/A

VGA Camera Available on board N/AAudio 24-bit audio codec (AK4953A) 24-bit audio codec (WM8731)Bluetooth® Low cost Bluetooth™ HCI transceiver N/AWi-Fi IEEE 802.11b/g (MRF24WG0MA) transceiver

moduleIEEE 802.11b (MRF24WB0MA) transceiver module

Accelerometer ADXL325 3-axis analog accelerometer BMA150 3-axis digital accelerometer and temperature sensor

Temperature Sensor MCP9700T analog temperature sensor Temperature sensor in BMA150microSD Connects to Host CPU on the starter kit Connects to the graphics controllermTouch™ Buttons Two touch buttons; additional touch button

support through a PICtail™ connectorTouch button support through a PICtail™ connector

PICtail™ Connector Yes YesEEPROM N/A 128-byte EEPROM (24LC08)SPI Flash See Note 1 2 MB SST25VF016 serial FlashCPLD See Note 2 Xilinx XC2C64A for port enhancementJoystick N/A AvailableNote 1: Serial Quad Flash support through the PIC32 Starter Kit.

2: Port enhancement is not necessary due to extended connector and available device pins.

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MULTIMEDIA EXPANSION BOARD II

(MEB II) USER’S GUIDE

Chapter 2. Hardware

This chapter describes the hardware features used in the MEB II and the 4.3" WQVGA PCAP Touch Display Board.

2.1 HARDWARE FEATURES

2.1.1 Power SupplyPower can be supplied to the MEB II in two ways: 1) through the DC connector (J3) located on the MEB II (Figure 2-1), and 2) through the USB on the Starter Kit. By connecting a 9-15V power supply to the DC connector or the USB device on the Starter Kit, the MEB II, Display Daughter Board and the Starter Kit will receive the proper voltages. However, if the application plans to use multiple features of the MEB II, it is recommended to use a 9V to 15V DC power supply.

FIGURE 2-1: 9V TO 15V DC POWER SUPPLY

Note: Refer to Appendix A. “Board Layout and Schematics” and Appendix B. “Bill of Materials” for the schematics and manufacturer and part number information of the hardware components used in the Multimedia Expansion Board II (MEB II) and the 4.3" WQVGA PCAP Touch Display Board.

CAUTION

When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not have power applied to either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.

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Multimedia Expansion Board II (MEB II) User’s Guide

2.1.2 Starter Kit ConnectorThe starter kit connector, as shown in Figure 2-2, is a high-speed, 168-pin Hirose FX10 board-to-board connector that is used to connect the MEB II to PIC32 starter kits.

FIGURE 2-2: STARTER KIT CONNECTOR

After connecting a PIC32 starter kit, applications can be developed and run using the rich features of the MEB II. Table 2-1 shows the Starter Kit Connector pin and the MEB II component mapping.

CAUTION

When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not have power applied through either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.

TABLE 2-1: STARTER KIT CONNECTOR MAPPINGStarter Kit Connector MEB II

Pin Number Signal Pin

Type Component Description

1 SS1 O Audio Codec Left-Right Clock64 RH3 O Audio Power Down82 SDA2 I/O I2C Data94 SDI1 I Audio Serial Data Output96 REFCLKO1 O External Master Clock Input112 SCL2 I/O Serial Clock117 SDO1 O Audio Serial Data Input118 SCK1 O Audio Bit Clock7 RB1 O EBI-SRAM/Display Horizontal Sync.

68 EBIWE O Pixel Clock77 RJ3 O Reset78 EBICS2 O Chip Select

103 RB4 O Data Enable108 RH9 O Vertical Sync116 RH13 O Stand-by131 EBID15 I/O R0132 LCD_B7 I/O B7133 LCD_R1 I/O R1134 EBID3 I/O B6135 LCD_R2 I/O R2136 EBID2 I/O B5137 EBID11 I/O R3

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Hardware

138 EBID1 I/O EBI-SRAM/Display B4139 EBID12 I/O R4140 EBID0 I/O B3141 EBID13 I/O R5142 EBID4 I/O B2143 EBID14 I/O R6144 LCD_B1 I/O B1145 LCD_R7 I/O R7146 LCD_B0 I/O B0147 EBID10 I/O G0148 LCD_G7 I/O G7149 LCD_G1 I/O G1150 EBID9 I/O G6151 EBID5 I/O G2152 EBID8 I/O G5153 EBID6 I/O G3154 EBID7 I/O G4155 EBIOE O Pixel Clock13 MCLR I/O Touch Touch Controller Reset (System Reset in general)110 RH10 O Touch Wake-up124 SCL1 I/O Serial Clock126 SDA1 I/O Serial Data92 AN42 I mTouch button Touch Button B1111 AN28 I Touch Button B280 RJ7 O VGA Camera Power Down86 RA9 I Vertical Sync90 OC5 O System Input Clock

104 SDA3 I/O Serial Data106 SCL3 I/O Serial Clock19 INT2 I VGA Camera Pixel93 RE8 O VGA Camera

RegulatorShutdown

27 EBIA1/RK1 I/O EBI-SRAM/VGA Camera

Address 1/VGA Camera Data 131 EBIA3/RK2 I/O Address 3/VGA Camera Data 261 EBIA16/RK0 I/O Address 16/VGA Camera Data 063 EBIA17/RK3 I/O Address 17/VGA Camera Data 365 EBIA18/RK4 I/O Address 17/VGA Camera Data 467 EBIA19/RK5 I/O Address 17/VGA Camera Data 573 EBIA20/RK6 I/O Address 17/VGA Camera Data 675 EBIA21/RK7 I/O Address 17/VGA Camera Data 7

TABLE 2-1: STARTER KIT CONNECTOR MAPPING (CONTINUED)Starter Kit Connector MEB II

Pin Number Signal Pin

Type Component Description

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25 EBIA0 O EBI-SRAM Address 029 EBIA2 O Address 233 EBIA4 O Address 435 EBIA5 O Address 537 EBIA6 O Address 643 EBIA7 O Address 747 EBIA9 O Address 949 EBIA10 O Address 1051 EBIA11 O Address 1153 EBIA12 O Address 1255 EBIA13 O Address 1357 EBIA14 O Address 1459 EBIA15 O Address 1579 EBIA23 O Sleep Enable81 EBIBS0 O Bank Select 0 (Lower Bank)83 EBIBS1 O Bank Select 1 (Upper Bank)14 INT0 I Wi-Fi Wi-Fi Interrupt85 RH14 O Sleep89 SDI4 I Serial Data Out

105 SDO4 O Serial Data In95 SS4 O Chip Select

120 RJ0 O Reset114 SCK4 I/O Serial Clock87 SCK2 I Bluetooth Serial Transmit

107 RB2 O Regulator Enable122 U2RTS O Request-to-Send91 U2CTS I/O Serial Clear-to-Send88 U2TX O Serial Receive/mTouch Button Analog Channel119 AN6 O Accelerometer X-axis Out121 AN7 O Y-axis Out123 AN8 O Z-axis Out23 AN23 I Temperature Sensor Temp. Sense channel

163 SD_DATA3/SD_CD I/O microSD Data 3/Card Detect164 SD_DATA2 I/O Data 2165 SD_DATA1 I/O Data 1166 SD_DATA0 I/O Data 0167 SD_CLK O Clock168 SD_CMD O Command76 RJ5 I Mechanical Card Detect4 RA0 O Fire Button

113 RH0 O LED162 RH2 O LED2115 RH1 O LED392 RH6 O LED484 RH11 O LED5

TABLE 2-1: STARTER KIT CONNECTOR MAPPING (CONTINUED)Starter Kit Connector MEB II

Pin Number Signal Pin

Type Component Description

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Hardware

2.1.3 Display ConnectorThe MEB II supports display on a separate daughter card through a 60-pin Hirose DF12 board-to-board display connector, as shown in Figure 2-3.

FIGURE 2-3: DISPLAY CONNECTOR

The MEB II supports a variety of displays through the daughter board and the kit includes a 4.3" WQVGA Projected Capacitive (PCAP) Touch display. Refer to 2.1.15 “4.3” WQVGA PCAP Touch Display Daughter Board” for additional details. Table 2-2 shows the display connector functional mapping.

CAUTION

When connecting the Multimedia Expansion Board II (MEB II) to a starter kit or to the display daughter board, do not have power applied through either the starter kit or the DC power supply. Failure to heed this caution could result in hardware damage.

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TABLE 2-2: DISPLAY CONNECTORDisplay Connector

Pin Number Signal Pin Type Description

9 G4 I/O Display RGB Data10 G0 I/O11 G5 I/O12 G1 I/O13 G6 I/O14 G2 I/O15 G7 I/O16 G3 I/O17 R0 I/O18 B0 I/O19 R1 I/O20 B1 I/O21 R2 I/O22 B2 I/O23 R3 I/O24 B3 I/O25 R4 I/O26 B4 I/O31 R5 I/O32 B5 I/O33 R6 I/O34 B6 I/O35 R7 I/O36 B7 I/O37 PCLK I/O Display Pixel Clock38 STBYB I/O Display Stand-by39 VSYNC I/O Display Vertical Sync40 HSYNC I/O Display Horizontal Sync41 DE I/O Display Data Enable42 CS I/O Display Chip Select43 INT I/O Touch interrupt44 SCL I/O Touch Serial Clock45 WAKE I/O Touch Wake46 SDA I/O Touch Serial Data47 BLEN I/O Display Backlight Enable48 RESET I/O Display Reset55 MCLR I/O System Reset

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Hardware

2.1.4 EBI SRAM Memory (Optional)The MEB II includes an External Bus Interface (EBI) routed to support both asynchronous SRAM and pseudo-SRAM memories. By default, these memories are not populated on the board and users can populate them as needed. The interface is routed considering both ISSI SRAM (IS61WV51216BLL-10TLI) and pseudo-SRAM (IS66WVE4M16BLL-70BLI) memories, as shown in Figure 2-4.

FIGURE 2-4: EBI SRAM MEMORY

2.1.5 VGA Camera SensorThe MEB II includes an Omnivision OVM7690 VGA camera sensor with an active array size of 640 x 480 (VGA resolution), as shown in Figure 2-5. The PIC32 microcontroller uses the I2C interface to control the sensor and the sensor communicates the image data through an 8-bit (DATA7-DATA0) data bus.

FIGURE 2-5: VGA CAMERA SENSOR

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Multimedia Expansion Board II (MEB II) User’s Guide

2.1.6 24-bit Audio CodecThe MEB II includes an Asahi Kasei AKM4953A 24-bit audio codec for high-quality audio, as shown in Figure 2-6. The AK4953A is low power consumption 24-bit stereo codec with a microphone, headphone, and speaker amplifiers, which is suitable for portable applications with a recording/playback function. The I2C interface of the audio codec is used by the PIC32 device for control and the I2S interface is used for audio.

FIGURE 2-6: 24-BIT AUDIO CODEC

2.1.7 Bluetooth® HCI TransceiverThe Flaircomm BTM805 Bluetooth® Host Control Interface (HCI) module is included in the MEB II, adding Bluetooth capability, as shown in Figure 2-7. The PIC32 microcontroller communicates with the Bluetooth module through the UART interface.

FIGURE 2-7: BLUETOOTH® TRANSCEIVER

Note: In an application, since Bluetooth and microSD share the same pins on the board, only one can be used at any given time.

DS70005148B-page 26 © 2013-2014 Microchip Technology Inc.

Hardware

2.1.8 802.11b/g Wireless TransceiverThe MEB II includes 802.11b/g wireless connectivity through the Microchip MRF24WG0MA device, as shown in Figure 2-8. The PIC32 microcontroller uses the SPI bus interface to communicate to the wireless module.

FIGURE 2-8: 802.11b/g TRANSCEIVER

2.1.9 AccelerometerThe MEB II includes an Analog Devices ADXL325BCPZ analog 3-axis accelerometer, as shown in Figure 2-9. The ADXL325 is a small, low power, 3-axis accelerometer with signal conditioned voltage outputs that measures acceleration with a minimum full-scale range of ±5g. The accelerometer uses three analog channels from the PIC32 microcontroller for the three axes (x, y and z).

FIGURE 2-9: ACCELEROMETER

© 2013-2014 Microchip Technology Inc. DS70005148B-page 27

Multimedia Expansion Board II (MEB II) User’s Guide

2.1.10 Temperature SensorThe MEB II includes a Microchip MCP9700T analog temperature sensor, as shown in Figure 2-10. The MCP9700T uses one analog channel on the PIC32 microcontroller. The MCP9700 Linear Active Thermistor™ IC is an analog temperature sensor that con-verts temperature to an analog voltage. The MCP9700 provides a low-cost solution for applications that require measurement of a relative change of temperature with ±1°C accuracy at room temperature.

FIGURE 2-10: TEMPERATURE SENSOR

2.1.11 microSD Card SlotThe MEB II includes a microSD card slot that interfaces to the PIC32 microcontroller through an SD Interface, as shown in Figure 2-11.

FIGURE 2-11: microSD CARD SLOT

2.1.12 Touch ButtonsThe MEB II includes two touch buttons that use the Microchip mTouch™ technology, as shown in Figure 2-12. These two touch buttons are interfaced to the PIC32 through two analog channels.

FIGURE 2-12: TOUCH BUTTONS

Note: In an application, since Bluetooth and microSD share the same pins on the board, only one can be used at any given time.

DS70005148B-page 28 © 2013-2014 Microchip Technology Inc.

Hardware

2.1.13 PICtail™ ConnectorThe MEB II includes an I/O expansion slot, which enables the use of several of Micro-chip's PICtail™ daughter boards, as shown in Figure 2-13. For more information on how to interface to the board, as not all daughter boards are compatible, refer to the specific PICtail daughter board schematic.

FIGURE 2-13: PICtail™ CONNECTOR

2.1.14 Push Button and User Controlled LEDsThe MEB II includes one power LED, five user-controlled LEDs, and one Push Button, as shown in Figure 2-14.

FIGURE 2-14: PUSH BUTTON AND USER CONTROLLED LEDS

2.1.15 4.3” WQVGA PCAP Touch Display Daughter BoardThe 4.3" WQVGA PCAP touch display daughter board includes a 4.3" WQVGA display and a Microchip MTCH6301 touch controller to support the PCAP touch screen overlay on the display. The daughter board connects to the MEB II Development Board through a 60-pin board-to-board connector. Refer to 1.3 “Multimedia Features” for additional information on the display daughter board component layout. Figure 2-15 shows the display connector.

FIGURE 2-15: DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT

© 2013-2014 Microchip Technology Inc. DS70005148B-page 29

Multimedia Expansion Board II (MEB II) User’s Guide

2.1.16 MTCH6301 Touch ControllerThe MTCH6301 is a turn-key PCAP controller that allows easy integration of multi-touch and gestures to create a rich user interface. The MTCH6301 supports up to 13 receive (RX) and 18 transmit (TX) channels, and sensor sizes up to 4.3". The MTCH6301 communicates with the PIC32 microcontroller through a serial I2C bus and an interrupt, as shown in Figure 2-16.

FIGURE 2-16: MTCH6301 TOUCH CONTROLLER

DS70005148B-page 30 © 2013-2014 Microchip Technology Inc.

MULTIMEDIA EXPANSION BOARD II

(MEB II) USER’S GUIDE

Appendix A. Board Layout and Schematics

This appendix provides examples of the board layout and component schematics for the Multimedia Expansion Board II (MEB II) and includes the following figures:• Figure A-1: “MEB II Layout (Top Assembly)”• Figure A-2: “MEB II Layout (Bottom Assembly)”• Figure A-3: “4.3” WQVGA PCAP Touch Board Layout (Top Assembly)”• Figure A-4: “4.3” WQVGA PCAP Touch Board Layout (bottom Assembly)”• Figure A-5: “Power Supply”• Figure A-6: “Starter Kit Connector”• Figure A-7: “Display connector”• Figure A-8: “EBI SRAM Memory”• Figure A-9: “VGA Camera Sensor and 2.8V Regulator”• Figure A-10: “24-bit Audio Codec”• Figure A-11: “Bluetooth® Transceiver”• Figure A-12: “802.11b/g Transceiver”• Figure A-13: “Accelerometer”• Figure A-14: “Temperature Sensor”• Figure A-15: “microSD Card Slot”• Figure A-16: “Touch Buttons”• Figure A-17: “PICtail™ Connector”• Figure A-18: “Push Button and User Controlled LEDs”• Figure A-19: “Display Panel Connector and Backlight Circuit”• Figure A-20: “Touch Controller”

© 2013-2014 Microchip Technology Inc. DS70005148B-page 31

Multimedia Expansion Board II (MEB II) User’s Guide

A.1 BOARD LAYOUT

FIGURE A-1: MEB II LAYOUT (TOP ASSEMBLY)

DS70005148B-page 32 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-2: MEB II LAYOUT (BOTTOM ASSEMBLY)

FIGURE A-3: 4.3” WQVGA PCAP TOUCH BOARD LAYOUT (TOP ASSEMBLY)

© 2013-2014 Microchip Technology Inc. DS70005148B-page 33

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-4: 4.3” WQVGA PCAP TOUCH BOARD LAYOUT (BOTTOM ASSEMBLY)

DS70005148B-page 34 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

A.2 SCHEMATICSFIGURE A-5: POWER SUPPLY

+5V

16V10uF

C580.1uFC1

2.2uF10V

C49

GNDGND

+3.3V

3V Power Supply

VIN1

GND2VOUT 3

TAB(GND)4

U5

MCP1826S-3302E/DB

D1

16V10uF

C5616V10uF

C57

GNDGND

LPS4018-472M4.7uH

L1

0RR1

R35DNP

10K

R17

+5V

22uFC66

22uFC67

GND

0.022uF

C55

+9V

NC6

VIN11

VIN2

FB 5

SW 13

SW 1

PGND

14

SGND

4

VIN3

EN9

NC7

SW 16

SW 12BOOST

10

EP17 PG 8

PGND

15

U4

MCP

16322T

-500

E/NG

GND

+9V

2

3

1

J3

GND

© 2013-2014 Microchip Technology Inc. DS70005148B-page 35

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-6: STARTER KIT CONNECTOR

OC1/LCD_BLEN

RA1/ CAM_HREF

RA0/PUSH_BUTTON

GND

+5V+5V

GND

EBIA2

GND

+3.3V

GND

+3.3V

EBIA8

EBIA15

RH2/LED2

GND

+3.3V

GND

+3.3V

LCD_RESET

SDA2/AUDIO_SDA

RH11/LED5

RH14/WIFI_SLEEP

SCK3/U2TX/BT_RX

SD12/SDI4/WIFI_SDO

AN12/SDO2/U2CTS/BT_RTS RH6/LED4/AN42

REFCLKO1/AUDIO_MCKISS4/WIFI_CS

AN32/SDI1/AUDIO_SDTO

GND

+3.3V

GND

+3.3V

SS2

LCD_DE

AN3/SDO4/WIFI_SDI

CAM_SDA

CAM_SCL

LCD_VSYNC/RA9

RH0/LED1

SCL2/AUDIO_SCL

SCK4/WIFI_SCK/SDI3

LCD_STBYB

SCK1/AUDIO_BICKAN5/SDO1/AUDIO_SDTI

AN6/ACCEL_XOUT

AN7/ACCEL_YOUT

AN8/ACCEL_ZOUT SCL1/TOUCH_SCL

SDA1/TOUCH_SDA

GND

+3.3V

GND

+3.3V

LCD_G4/EBID7LCD_G3/EBID6

LCD_G2/EBID5

LCD_G1

LCD_G0/EBID10

LCD_B6/EBID3

LCD_B7

LCD_G5/EBID8

LCD_B5/EBID2

LCD_B4/EBID1

LCD_B3/EBID0

LCD_B1

LCD_B2/EBID4

LCD_G6/EBID9

LCD_G7

LCD_R0/EBID15

LCD_R1

LCD_R2

LCD_R3/EBID11

LCD_R4/EBID12

LCD_R5/EBID13

LCD_R6/EBID14

LCD_R7

SD_DATA3/SD_CD

GNDGND

+5V +5V

EBIBS1

AN14/SCK2/U2RX/BT_TX

U2RTS/BT_CTS

INT0/WIFI_INT

AN23/TEMP_SENSE

RH1/LED3

RH3/AUDIO_PDN

EBIWE/LCD_PCLK

AN28/RA10

RK0/CAM_DATA0/EBIA16

RK3/CAM_DATA3/EBIA17

RK4/CAM_DATA4/EBIA18

RK5/CAM_DATA5/EBIA19

RK6/CAM_DATA6/EBIA20

RK7/CAM_DATA7/EBIA21

RK1/CAM_DATA1/EBIA1

RK2/CAM_DATA2/EBIA3

+3.3V

+3.3V

+3.3V

INT1/TOUCH_INT

LCD_HSYNC

MCLR

EBIA0

EBIA4

EBIA5

EBIA6

EBIA7

EBIA9

EBIA10

EBIA11

EBIA12

EBIA13

EBIA14

EBICS0

EBICS2/LCD_CS

CAM_PWDN

EBIBS0

CAM_VSYNC

BT_VREG_EN

RJ0/WIFI_RESET

SD_DATA2

SD_DATA1

SD_DATA0SD_CLK

SD_CMD

TOUCH_WAKE

SS1/AUDIO_LRCK

EBIOE/LCD_PCLK

117 118

111 112

105 106

99 100

93 94

87 88

81 82

75 76

69 70

57 58

51 52

45 46

39 40

33 34

27 28

21 22

15 16

9 10

3 4

119 120

107 108

109 110

113 114

115 116

95 96

97 98

101 102

103 104

83 84

85 86

89 90

91 92

71 72

73 74

77 78

79 80

59 60

61 62

65 66

67 68

47 48

49 50

53 54

55 56

35 36

37 38

41 42

43 44

25 26

29 30

23 24

19 20

13 14

17 18

11 12

7 8

1 2

5 6

31 32

63 64

121 122

123 124

125 126

127 128

129 130

135 136

137 138

131 132

133 134

141

140

143

142

145

144

147 148

149 150

151 152

153 154

159 160

161 162

155 156

157 158

163 164

165 166

167 168

146

139

J1

FX10

A-168

S-SV

R231.1K

R261.1K

R241.1K

R251.1K

LCD_B0

R381.1K

R371.1K

+3.3V

+3.3V

OC5/CAM_XVCLK/SS3

INT2/CAM_PCLK

RB0/CAM_LDO_SHDN

RJ5/CD

RJLSE6206101T

123456

J10

MCLR+3.3V

GND

PGD2PGC2

PGD2

PGC2

DS70005148B-page 36 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-7: DISPLAY CONNECTOR

GND GND

+3.3V+3.3V

GND GND

+3.3V+3.3V

+5V +5V

GNDGND

GNDGND

TOUCH_WAKE

SCL1/TOUCH_SCL

SDA1/TOUCH_SDA

LCD_G1

LCD_R1

LCD_R2

LCD_R7 LCD_B7

LCD_B0

LCD_B1

LCD_G7

OC1/LCD_BLEN

LCD_DE

LCD_STBYB

EBIWE/LCD_PCLK

EBIOE/LCD_PCLKLCD_PCLK

LCD_HSYNC

MCLR

LCD_RESET

EBICS2/LCD_CS

LCD_R0/EBID15

LCD_B6/EBID3

LCD_B5/EBID2

LCD_B4/EBID1

LCD_B3/EBID0

LCD_B2/EBID4

LCD_G4/EBID7

LCD_G5/EBID8

LCD_G6/EBID9

LCD_R3/EBID11

LCD_R4/EBID12

LCD_R5/EBID13

LCD_R6/EBID14

LCD_G0/EBID10

LCD_G3/EBID6

LCD_G2/EBID5

LCD_PCLK

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

47 48

49 50

51 52

53 54

55 56

57 58

59 60

6162J4

DF1

2(3.0)-60D

P-0.5V

(86)

INT1/TOUCH_INT

12

3J9

LCD_VSYNC/RA9

© 2013-2014 Microchip Technology Inc. DS70005148B-page 37

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-8: EBI SRAM MEMORY

EBIA2

RK1/CAM_DATA1/EBIA1

RK2/CAM_DATA2/EBIA3

EBIA0

EBIA4 EBIA5

EBIA6

EBIA8

EBIA15

RK0/CAM_DATA0/EBIA16

RK3/CAM_DATA3/EBIA17

RK4/CAM_DATA4/EBIA18

EBIA7

EBIA9

EBIA10

EBIA11

EBIA12

EBIA13

EBIA14

EBIWE/LCD_PCLK

EBICS0

EBIBS1

EBIBS0

LCD_R0/EBID15

LCD_B6/EBID3

LCD_B5/EBID2

LCD_B4/EBID1

LCD_B3/EBID0

LCD_B2/EBID4 LCD_R3/EBID11

LCD_R4/EBID12

LCD_R5/EBID13

LCD_R6/EBID14

LCD_G0/EBID10

LCD_G4/EBID7 LCD_G5/EBID8

LCD_G6/EBID9LCD_G3/EBID6

LCD_G2/EBID5

0.1uFC27

0.1uFC26

0.01uFC31

0.01uFC30

GND

GND+3.3V

+3.3V

48pin-TSOP

EBIOE/LCD_PCLKA05

A14

A23

A32

A41

CE7

I/O08

I/O19

I/O210

I/O311

VDD12

GND13

I/O414

I/O515

I/O616

I/O717

WE18

A5 48

A6 47

A7 46

A8 45

A9 30

A10 29

A11 28

A12 27

A13 26

A14 25

NC 31

I/O8 32

I/O9 33

I/O10 34

I/O11 35

VDD 36

GND 37

I/O12 38

I/O13 39

I/O14 40

I/O15 41

LB 42

UB 43

OE 44

A1524

A1623

NC6

A1920

A1821

NC19

A1722

U11

IS64WV102416BLL_48TSOP

RK5/CAM_DATA5/EBIA19

R39 150R 0.1%

R42 150R 0.1%

R41 150R 0.1%

R43 150R 0.1%

R40 150R 0.1%

DS70005148B-page 38 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-9: VGA CAMERA SENSOR AND 2.8V REGULATOR

+3.3V

0.1uFC2

16V10uF

C59

3.3uH

L2

ADJ 4

Vout 5

GND2

SHDN3

Vin1

U7

TC1071GND

470KR32 3.3uH

L3

3.3uH

L4

0.1uFC3

16V10uF

C60

0.1uFC4

16V10uF

C61

GND

GND

AVDD

348kR33

+2.8V

CAM_GND

DOVDD

RB0/CAM_LDO_SHDN

OVM7690-R20A

DATA4E3

DATA5D3

DATA0B3

DATA7E1DATA6E2

DOVDD E4

PCLKD1

HREFC1

VSYNCC2

VREF1 A4

VREF2 A3

AGND C3

AVDD A2

XVCLKD2

PWDNA1

SCLB2

SDAB1

DATA1B4

DATA2C4

DATA3D4

U6

CAM_GND GND

0.1uFC8

0.1uFC7

0.1uFC6

0.1uFC5

DOVDD

AVDD

TP1

TP3

TP2RA1/ CAM_HREF

RK1/CAM_DATA1/EBIA1

RK2/CAM_DATA2/EBIA3

INT2/CAM_PCLK

RK0/CAM_DATA0/EBIA16

RK3/CAM_DATA3/EBIA17

RK4/CAM_DATA4/EBIA18

RK5/CAM_DATA5/EBIA19

RK6/CAM_DATA6/EBIA20

CAM_PWDN

CAM_VSYNC

OC5/CAM_XVCLK/SS3

CAM_SDA

CAM_SCL

RK7/CAM_DATA7/EBIA21

© 2013-2014 Microchip Technology Inc. DS70005148B-page 39

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-10: 24-BIT AUDIO CODEC

AGND

AGND

SPKR OUT

HP OUT

MIC IN

HPL

MPWR2

LIN2

2.2KR31

SPN

SPP

(STEREO)

(STEREO)

(MONO)1uF

C36

C68

47uF, Tant

C69

47uF, Tant

R27

6.8R

R28

6.8R

R30100R

R29100R

C510.22uF

C500.22uF

HPR

AGND

AGND

5

1

4

3

2

J6

5

1

4

3

2

J5

5

1

4

3

2

J7

SS1/AUDIO_LRCK

SDA2/AUDIO_SDA

REFCLKO1/AUDIO_MCKI

SCL2/AUDIO_SCL

AN5/SDO1/AUDIO_SDTI

MPWR1 1

LIN1/DMDAT 2

RIN1/DMCLK 3

PDN4

CSN/SDA5

CCLK/SCL6

CDTIO/CAD07

SDTI8

LRCK9

BICK10

SDTO11

TVDD12

VSS213

MCKI14

MCKO15

I2C16

SVDD17

VSS418

SPN 19

SPP 20

DVDD21

HPL 22

HPR 23PVEE24

VSS325CP 26

CN 27

AVDD28

VSS129

REGFIL30

VCOM31

LIN3 32

RIN3 33

LIN2 34

RIN2 35

MPWR2 36

T-PA

D37

U1

AK4953A

SPP

SPN

HPR

2.2uF10V

C42

2.2uF10V

C41

AGND

2.2uF10V

C40

2.2uF10V

C39

0.1uFC220.1uF

C21

0.1uFC19

0.1uFC20

SVDD

CAVDD

SCK1/AUDIO_BICK

RH3/AUDIO_PDN

TVDD+3.3V

+3.3V

+3.3V

DVDD+1.8V

TVDD

AGND

MPWR2

LIN2

HPL

TP8

TP7TP6

TP5

AN32/SDI1/AUDIO_SDTO

TP4AGND

100K

R36

AGND0.1uF

C18

16V

10uF

C65

FB4 0R

R5

0.1uF

C17

GND

AGND+1.8V

DVDD

VIN

3

GND

1

VOUT

2U10

MCP

1700T_

1802E/TT

1uF

C34

1uF

C35

GND

GND

+3.3V

+1.8V Output

0.1uFC14

0.1uFC13

GND

0.1uFC16

16V10uF

C64FB3

0R

R4

0.1uFC15

GND AGND

AGND

+3.3V

0.1uFC12

16V10uF

C62FB1

0RR2

0.1uFC11

GND AGND

TVDD

+3.3V

CAVDD

SVDD

+3.3V

+3.3V

0R

R3

FB2

16V10uF

C63

DS70005148B-page 40 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-11: BLUETOOTH® TRANSCEIVER

FIGURE A-12: 802.11b/g TRANSCEIVER

NC1

GND2

VDD_AUX3

PIO_04

PIO_35

PIO_16

VDD_DIG7

PIO_48

PIO_29

PIO_510

VDD_PADS11

VREG_EN_RST#12 VDD_IN 13VREG_OUT_HV 14

UART_TX 15UART_RX 16UART_RTS 17

UART_CTS 18

VDD_RADIO 19SPI_PCM#_SEL 20

SPI_MOSI 21

CLK 22

SPI_CS# 23SPI_MISO 24

GND

25

GND

26

GND

27

GND

28

NC

GND

VDD_AUX

PIO_0

PIO_3

PIO_1

VDD_DIG

PIO_4

PIO_2

PIO_5

VDD_PADS

VREG_EN_EE RST# VDD_INII

VREG_OUT_HV

UART_TX

UART_RXRR

UART_RTS

UART_CTS

VDD_RADIRR O

SPI_PCM#_SEL

SPI_MOSI

CLK

SPI_CS#

SPI_MISO

GND

NN

GND

NN

GND

NN

GND

NN

U2

Bluetooth_BTM805CL2BGND

2.2uF10V

C43

2.2uF10V

C44

2.2uF 10VC45

GND+3.3V

0.1uFC23

2.2uF10V

C47

GND

2.2uF10V

C48

2.2uF10V

C46

GND

AN14/SCK2/U2RX/BT_TX

TP14

TP15

TP16

TP17

BT_VREG_EN

SCK3/U2TX/BT_RX

AN12/SDO2/U2CTS/BT_RTS

U2RTS/BT_CTS

+3.3V

GND

+3.3V

1.0uF

C37

1.0uF

C38

+3.3V

4.7KR16

10K

R22

4.7KR12

4.7KR13

4.7KR14

4.7KR15

INT0/WIFI_INT

SS4/WIFI_CS

SD12/SDI4/WIFI_SDO

SCK4/WIFI_SCK/SDI3

RH14/WIFI_SLEEP

TP9

TP10

TP11

TP12

TP13

GND

GND

GND

GND

GND1

NC2

NC3

RESET7

NC8

NC9

GND10

NC11

NC12

NC13

NC14

NC15

WP16

VDD17

GND18 GND 19

HIBERNATE 20

NC 21NC 22CS 23NC 24

GND 25

DEBUG_RX 26DEBUG_TX 27

GND 28VDD 29GND 30

NC 31

SDO 32INT 33SCK 34SDI 35

GND 36GND

NC

NC

RERR SET

NC

NC

GND

NC

NC

NC

NC

NC

WP

VDD

GND GND

HIBERNATRR E

NC

NC

CS

NC

GND

DEBUG_RXRR

DEBUG_TX

GND

VDD

GND

NC

SDO

INTII

SCK

SDI

GND

NC4

NC5

NC6

U3

MRF24WG0MA-I/RM

RJ0/WIFI_RESET

AN3/SDO4/WIFI_SDI

© 2013-2014 Microchip Technology Inc. DS70005148B-page 41

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-13: ACCELEROMETER

FIGURE A-14: TEMPERATURE SENSOR

0.1uFC10

+3.3V

GND

GND

AN6/ACCEL_XOUT

AN7/ACCEL_YOUT

AN8/ACCEL_ZOUT

NC

1ST2

COM3

NC

4

COM5 COM6 COM7

ZOUT 8

NC

9

YOUT 10

NC

11

XOUT 12

NC

13

VS14 VS15

NC

16

EP17

U9 ADXL325

GND

GND

C5247nF

C5347nF

C5447nF

GND3

VOUT 2VDD1U8

MCP9700T-E/TT

+3.3V

0.1uFC24

GND

0.1uFC25120R

R34

GND

AN23/TEMP_SENSE

DS70005148B-page 42 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-15: microSD CARD SLOT

FIGURE A-16: TOUCH BUTTONS

10KR18

10KR19

10KR20

10KR21

0.1uFC9

GND

GND

+3.3V

MICRO SD

SD_DATA3/SD_CD

SD_DATA2

SD_DATA1

SD_DATA0

SD_CLK

SD_CMD

RJ5/CD

DATA18

CLK5

DATA32

DATA07VSS6

CMD3

VDD4

DATA 21

DATA1

CLK

DATA3

DATA0

VSS

CMD

VDD

DATA 2

SWITCH9

GND10GND11GND12

J8

Amph

enol P/N: 1

01-005

81-59

GND

10KR44

10KR45

B2

B1

AN28/RA10

RH6/LED4/AN42

© 2013-2014 Microchip Technology Inc. DS70005148B-page 43

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-17: PICtail™ CONNECTOR

+3.3V

+3.3V

GND

SS4/WIFI_CS

SCL2/AUDIO_SCL

SS2

SCL1/TOUCH_SCL

SDA1/TOUCH_SDA

SCK4/WIFI_SCK/SDI3

SCK4/WIFI_SCK/SDI3

SDA2/AUDIO_SDA

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

J2

SCK1/AUDIO_BICK

SS1/AUDIO_LRCK

SS1/AUDIO_LRCK

AN14/SCK2/U2RX/BT_TX

AN32/SDI1/AUDIO_SDTO

AN3/SDO4/WIFI_SDI

AN28/RA10 AN3/SDO4/WIFI_SDI

AN5/SDO1/AUDIO_SDTI

TP18

SCK3/U2TX/BT_RXSCK3/U2TX/BT_RX

OC5/CAM_XVCLK/SS3

SD12/SDI4/WIFI_SDO SD12/SDI4/WIFI_SDO

RB0/CAM_LDO_SHDN

AN12/SDO2/U2CTS/BT_RTS

LCD_VSYNC/RA9

DS70005148B-page 44 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-18: PUSH BUTTON AND USER CONTROLLED LEDS

Green

D2

Red

D3

Red

D4

Red

D5

Red

D6

Red

D7

GND

470R

R6

470R

R7

470R

R8

470R

R9

470R

R10

470R

R11

+3.3V

S1

RH11/LED5

RH0/LED1

RH1/LED3

RH2/LED2

RA0/PUSH_BUTTON

RH6/LED4/AN42

© 2013-2014 Microchip Technology Inc. DS70005148B-page 45

Multimedia Expansion Board II (MEB II) User’s Guide

FIGURE A-19: DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT

MCP1650S-E/MS

CS 3

NC6

FB 4

EXT 1GND2

SHDN5

NC 7

VIN8U1

16V10uF

C1

10KR3GND

GND

LPS3015-153ML

15uHL1

AO3424Q1 7.68K

R2SD107WS-7-F

D1

GNDGND

LED+

470RR4

LED-

10uF35V

C3

0.5R

R1

OC1/LCD_BLEN GND

+3.3V

GND

XF2M

-401

5-1A

38

35

32

29

26

23

20

17

14

11

8

5

2

3940

3637

2728

3031

3334

2425

1516

1819

2122

1213

34

67

910

1J2

+3.3V

GND

+3.3V

+3.3V

+5V

GND

GND

SCL1/TOUCH_SCL

SDA1/TOUCH_SDA

LCD_G1

LCD_G0

LCD_B7

LCD_B0

LCD_B1

LCD_HSYNC

LCD_B6

LCD_B5

LCD_B4

LCD_B3

LCD_B2

LCD_G2

LCD_G3

+3.3V

+3.3V

+5V

GND

GND

INT1/TOUCH_INT/PGD

TOUCH_WAKE

LCD_R0

LCD_R1

LCD_R2

LCD_R3

LCD_R4

LCD_R5

LCD_R6

LCD_R7

LCD_G4

LCD_G5

LCD_G6

LCD_G7

OC1/LCD_BLEN

LCD_DE

MCLR

LCD_VSYNC

LCD_R0

LCD_R1

LCD_R2

LCD_R3

LCD_R4

LCD_R5

LCD_R6

LCD_R7

LCD_G4

LCD_G1

LCD_G0

LCD_G2

LCD_G3

LCD_G5

LCD_G6

LCD_G7

LCD_B0

LCD_B1

LCD_B4

LCD_B3

LCD_B2

LCD_B7

LCD_B6

LCD_B5

LCD_PCLK

LCD_DE

LCD_VSYNC

LCD_HSYNC

LCD_RESET

LED+

LED-

LCD_PCLK

LCD_CS

LCD_CS

LCD_RESET

GND GND

GND1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

47 48

49 50

51 52

53 54

55 56

57 58

59 60

6162J1

DF1

2-60DS-0.5V

(86)

16V10uF

C2

GND

GND

TP1

TP2

TP3

TP4

DS70005148B-page 46 © 2013-2014 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-20: TOUCH CONTROLLER

SDA1

TX172

TX163

TX154

TX145

VSS6

VCAP7

INT8

NC9

RX1210

RX1111

TX1312

TX1213

RX1014

RX915

VSS16

VDD17

RESET18

RX819

RX720

RX621

RX522 RX4 23

RX3 24

RX2 25

RX1 26

RX0 27

VDD 28

VSS 29

TX3 30

TX2 31

TX1 32

TX0 33

TX4 34

TX8 35

TX7 36

TX6 37

TX5 38

VSS 39

VDD 40

TX9 41

TX10 42

TX11 43

SCL 44

U2

MTCH6301

0.1uFC5

0.1uFC4

0.1uFC6

10uF

C8

52271-06793

2

4

1

5

6

J3+3.3V

GND

SCL1/TOUCH_SCL

SDA1/TOUCH_SDA

INT1/TOUCH_INT

TOUCH_WAKE

SCL1/TOUCH_SCL

XF2M

-301

5-1A

29

26

23

20

17

14

11

8

5

2

2728

30

2425

1516

1819

2122

1213

34

67

910

1J4

T0T1

T2T3

T4T5

T6T7

T8

GND

T9T10

T11T12

T13T14

T15T16

CS0CS1

CS2CS3

CS4CS5

CS6CS7

CS8CS9

T1

T3

T5

T7

T9

T11

T13

T15

CS0

CS2

CS4

CS6

CS8

T0

T2

T4

T6

T8

T10

T12

T14

T16

CS1

CS3

CS5

CS7

CS9

GND

GND GND

+3.3V+3.3V

GND

+3.3V

SDA1/TOUCH_SDA

MCLR

PICkit Serial AnalyzerConnection

+3.3V

GND

NC 1

+V 2

GND 3

SDA 4

SCL 5

INT 6

J5 DNP

( DNP )

TP5

TP7

TP6

INT1/TOUCH_INT/PGD

PGC

© 2013-2014 Microchip Technology Inc. DS70005148B-page 47

Multimedia Expansion Board II (MEB II) User’s Guide

NOTES:

DS70005148B-page 48 © 2013-2014 Microchip Technology Inc.

MULTIMEDIA EXPANSION BOARD II

(MEB II) USER’S GUIDE

Appendix B. Bill of Materials

TABLE B-1: MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALSQty. Reference Description Manufacturer Part No.27 C1, C2, C3,

C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C25, C26, C27

Cap, Ceramic, 0.1 µF, 50V X7R TDK Corporation C1608X7R1H104M

2 C30, C31 Cap, Ceramic, 0.01 µF 50V X7R TDK Corporation C1608X7R1H103M

5 C34, C35, C36, C37,

C38

Cap, Ceramic, 1 µF 16V X5R TDK Corporation C1608X5R1C105K

11 C39, C40, C41, C42, C43, C44, C45, C46, C47, C48,

C49

Cap, Ceramic, 2.2 µF 10V 20% X5R 0603 TDK Corporation C1608X5R1A225M/0.80

2 C50, C51 Cap, Ceramic, 0.22 µF 16V Y5V 0603 Murata Electronics North America GRM188F51C224ZA01D

3 C52, C53, C54

Cap, Ceramic, 0.047 µF 50V 10% X7R 0603 TDK Corporation C1608X7R1H473K080AA

1 C55 Cap, Ceramic, 0.022 µF 50V 20% X7R 0603 Murata Electronics North America GRM188R71H223MA01D

10 C56, C57, C58, C59, C60, C61, C62, C63, C64, C65

Cap, Ceramic, 10 µF 16V X5R Taiyo Yuden EMK212BJ106MG-T

2 C66, C67 Cap, Ceramic, 22 µF 16V 10% X5R 0805 TDK Corporation C2012X5R1C226K

2 C68, C69 Cap, Tantalum, 47 µF 6.3V 20% 1206 Kemet T494A476M006AT

5 R1, R2, R3, R4, R5

Resistor, 0.0 Ohm 1/10W 0603 SMD Rohm Semiconductor MCR03EZPJ000

6 R6, R7, R8, R9, R10, R11

Resistor, 470 Ohm 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX4700

5 R12, R13, R14, R15,

R16

Resistor, 4.70K Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF4701V

8 R17, R18, R19, R20, R21, R22, R44, R45

Resistor, 10K Ohm 1/10W 1% 0603 SMD Stackpole Electronics Inc. RMCF0603FT10K0

6 R23, R24, R25, R26, R37, R38

Resistor, 1.10K Ohm 1/10W 1% 0603 SMD Panasonic Electronic Components ERJ-3EKF1101V

2 R27, R28 Resistor, TF 6.8 Ohm 1% 0.1W 0603 Stackpole Electronics Inc. RMCF0603FT6R80

2 R29, R30 Resistor, 100 Ohm 1/10W 1% Yageo RC0603FR-07100RL

1 R31 Resistor, 2.20K Ohm 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX2201

1 R32 Resistor, 470K 1/10W 1% Panasonic - ECG ERJ-3EKF4703V

1 R33 Resistor, TF 348K Ohm 1% 0.1W 0603 Stackpole Electronics Inc. RMCF0603FT348K

1 R34 Resistor, 120 Ohm, 1/10W 1% Stackpole Electronics Inc. RMCF0603FT120R

1 R36 Resistor, 100K Ohm 1/10W 1% 0603 SMD Stackpole Electronics Inc. RMCF0603FT100K

© 2013-2014 Microchip Technology Inc. DS70005148B-page 49

Multimedia Expansion Board II (MEB II) User’s Guide

5 R39, R40, R41, R42,

R43

Resistor, 150 OHM 1/10W 1% 0603 SMD TE 3-1676481-5

1 D1 DIODE SCHOTTKY 1A 100V SMA Micro Commercial Co. SS110-TP

1 D2 LED, SMD, GRN, 0603 package Kingbright Corp. APT1608SGC

5 D3, D4, D5, D6, D7

LED, SMD, RED, 0603 package Kingbright Corp. APT1608EC

1 J1 Hirose FX10_ 168-pin Receptacle/ESK MH Hirose Electric Co. Ltd. FX10A-168S-SV

1 J2 Connector, FEMALE 28 POS DL .1" R/A TIN Sullins Connector Solutions PPTC142LJBN-RC

1 J3 Connector, POWER JACK 2.5 X 5.5 MM HI CUR CUI Inc. PJ-002BH-SMT

1 J4 Connector, HDR 60 POS 0.5 MM SMD GOLD Hirose Electric Co. Ltd. DF12(3.0)-60DP-0.5V(86)

3 J5, J6, J7 Connector, JACK STEREO 5 POS 3.5 MM SMD Switchcraft Inc. 35RASMT4BHNTRX

1 J8 Connector, Mini microSD 8-PIN PCB GOLD Amphenol 101-00581-59

1 J9 Connector, HEADER 3 POS .100 RT/A SMD Sullins Connector Solutions GBC03SBSN-M89

1 J10 Connector, MOD JACK R/A 6P6C SMD Amphenol RJLSE6202101T

1 L1 4.7 µH 20% CoilCraft LPS4018-472M

3 L2, L3, L4 INDUCTOR MULTILAYER 3300 NH 0603 Abracon Corporation AIML-0603-3R3K-T

4 FB1, FB2, FB3, FB4

FERRITE CHIP 600 OHM 500 MA 0805 TDK Corporation MMZ2012Y601B

1 U1 CODEC (24-bit Stereo) AKM AK4953A

1 U2 Dual-mode Bluetooth HCI Flaircomm FLC_BTM805

1 U3 TX RX RF 2.4 GHz PCB ANT 802.11b Microchip Technology Inc. MRF24WG0MA-I/RM

1 U4 IC REG BUCK SYNC 5V 2A 16-VQFN Microchip Technology Inc. MCP16322T-500E/NG

1 U5 IC LDO REG 1000 mA 3.3V SOT223-3 Microchip Technology Inc. MCP1826S-3302E/DB

1 U6 SENSOR CAMERA CMOS 20 CAMERACUBE OmniVision Technologies Inc OVM7690-R20A

1 U7 IC REG LDO ADJ 50 mA SOT23A-5 Microchip Technology Inc. TC1071VCT713

1 U8 LP Linear Active Thermistor SOT-23-3 Microchip Technology Inc. MCP9700T-E/TT

1 U9 Accelerometer ADXL325 Analog Devices Inc ADXL325BCPZ-RL7

1 U10 LDO Voltage Regulator 1.8V 250 mA Microchip Technology Inc. MCP1700T-1802E/TT

1 U11 SRAM 16M (1M x 16) 10 ns Async SRAM Integrated Silicon Solution Inc. IS61WV102416BLL-10TLI

1 S1 SWITCH TACTILE SPST-NO 0.05A 12V C&K Components PTS635SK25SMTR LFS

1 GND TP-115 * 50_SMT Keystone Electronics 5015

TABLE B-2: DISPLAY BOARD BILL OF MATERIALSQty. Reference Description Manufacturer Part No.

1 4.3" Display 4.3" Display w/ TP AMTouch USA P3003-02-1-01 Touch Panel/LCD assembly

3 C1, C2, C7 Cap, Ceramic, 10 µF 16V X5R Taiyo Yuden EMK212BJ106MG-T

1 C3 Cap, Ceramic, 10 µF 35V 10% X5R 1206 Taiyo Yuden GMK316BJ106KL-T

3 C4, C5, C6 Cap, Ceramic, .10 µF 50V X7R 0603 TDK Corporation C1608X7R1H104M

1 D1 Diode, Schottky, 30V 100 mA SOD323 Diodes Inc. SD107WS-7-F

1 J1 Connector, RCPT 60 POS 0.5 mm SMD GOLD Hirose Electric Co. Ltd. DF12(30)-60DS-0.5V(86)

1 J2 Connector, FPC 40 POS 0.5 mm PITCH SMD Omron Electronics Inc., EMC Div XF2M-4015-1A

1 J4 Connector, FPC 30 POS 0.5 mm PITCH SMD Omron Electronics Inc., EMC Div XF2M-3015-1A

1 L1 15 µH ±20% CoilCraft LPS3015-153ML

1 Q1 MOSFET N-CH 30V 2A SOT23 Alpha & Omega Semiconductor Inc. AO3424

1 R1 Resistor, .50 Ohm 1/3W 1% 0805 SMD Susumu RL1220S-R50-F

1 R2 Resistor, 7.68K Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF7681V

1 R3 Resistor, 10K Ohm 1/10W 1% 0603 SMD Stackpole Electronics Inc. RMCF0603FT10K0

1 R4 Resistor, 470 Ohm 1/10W 1% 0603 SMD Rohm Semiconductor MCR03EZPFX4700

1 U1 MCP1650-E/MS_BOOST Microchip Technology Inc. MCP1650S-E/MS

1 U2 MTCH6301 Microchip Technology Inc. MTCH6301-I/PT

1 J3 Connector, FFC 6 POS 1 mm R/A ZIF SMD Molex Connector Corporation 52271-0679

TABLE B-1: MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALS (CONTINUED)Qty. Reference Description Manufacturer Part No.

DS70005148B-page 50 © 2013-2014 Microchip Technology Inc.

© 2013-2014 Microchip Technology Inc. DS70005148B-page 51

NOTES:

DS70005148B-page 52 © 2013-2014 Microchip Technology Inc.

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EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - DusseldorfTel: 49-2129-3766400Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Germany - PforzheimTel: 49-7231-424750Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Italy - VeniceTel: 39-049-7625286 Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Poland - WarsawTel: 48-22-3325737 Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820

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10/28/13