MSP432P401R SimpleLink™ Microcontroller LaunchPad ...

1SLAU597F–March 2015–Revised March 2018Submit Documentation Feedback

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MSP432P401R SimpleLink™ Microcontroller LaunchPad™ Development Kit(MSP‑EXP432P401R)

User's GuideSLAU597F–March 2015–Revised March 2018

MSP432P401R SimpleLink™ Microcontroller LaunchPad™Development Kit (MSP‑‑EXP432P401R)

The SimpleLink™ MSP‑EXP432P401R LaunchPad™ development kit is an easy-to-use evaluationmodule for the SimpleLink MSP432P401R microcontroller. It contains everything needed to startdeveloping on the SimpleLink MSP432™ low-power + performance Arm® 32-bit Cortex®-M4Fmicrocontroller (MCU), including onboard debug probe for programming, debugging, and energymeasurements. The MSP432P401R device supports low-power applications requiring increased CPUspeed, memory, analog, and 32-bit performance.

Figure 1. MSP‑‑EXP432P401R LaunchPad™ Development Kit

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2 SLAU597F–March 2015–Revised March 2018Submit Documentation Feedback



Contents1 Getting Started ............................................................................................................... 32 Hardware...................................................................................................................... 53 Software Examples ........................................................................................................ 204 Resources ................................................................................................................... 275 FAQ .......................................................................................................................... 316 Schematics.................................................................................................................. 36

List of Figures

1 MSP‑EXP432P401R LaunchPad™ Development Kit .................................................................. 12 MSP-EXP432P401R Overview ............................................................................................ 53 Block Diagram................................................................................................................ 54 MSP432P401RIPZ Pinout .................................................................................................. 65 XDS110-ET Debug Probe .................................................................................................. 76 XDS110-ET Isolation Block................................................................................................. 87 Application Backchannel UART in Device Manager .................................................................... 98 EnergyTrace™ Technology Preferences ............................................................................... 119 EnergyTrace™ Windows.................................................................................................. 1210 MSP‑EXP432P401R Power Block Diagram ............................................................................ 1311 LaunchPad™ Development Kit to BoosterPack™ Plug-in Module Connector Pinout ............................ 1612 Differences Between Rev 1.0 (Black) and Rev 2.0 (Red) ............................................................ 1813 BSL Update Utility in TI Resource Explorer ............................................................................ 1914 Out-of-Box GUI Running Locally ......................................................................................... 2115 Out-of-Box GUI Running From TI Cloud Tools......................................................................... 2216 Importing and Converting an Image With MSP Image Reformer .................................................... 2317 Hardware Setup and Connections ....................................................................................... 2418 Determine COM Port Number Using Device Manager on Windows ................................................ 2519 Example Serial Terminal Configuration ................................................................................. 2520 Snapshot of Serial Terminal Connected to Running Fuel Gauge Demo ........................................... 2621 Using TI Resource Explorer to Browse MSP-EXP432P401R in SimpleLink SDK................................. 3022 SWD Mode Settings ....................................................................................................... 3123 Target Configurations...................................................................................................... 3224 Launch Selected Configuration........................................................................................... 3225 Show All Cores ............................................................................................................. 3326 Connect Target ............................................................................................................. 3427 MSP432_Factory_Reset Script........................................................................................... 3428 Schematics (1 of 6) ........................................................................................................ 3629 Schematics (2 of 6) ........................................................................................................ 3730 Schematics (3 of 6) ........................................................................................................ 3831 Schematics (4 of 6) ........................................................................................................ 3932 Schematics (5 of 6) ........................................................................................................ 4033 Schematics (6 of 6) ........................................................................................................ 41

List of Tables

1 Isolation Block Connections ................................................................................................ 72 Default Clock Operation ................................................................................................... 143 Hardware Change Log .................................................................................................... 174 Software Examples ........................................................................................................ 205 IDE Minimum Requirements for MSP‑EXP432P401R ................................................................ 20

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6 Source File and Folders ................................................................................................... 247 Source Files and Folders.................................................................................................. 278 How MSP Device Documentation is Organized........................................................................ 30

TrademarksSimpleLink, LaunchPad, MSP432, BoosterPack, Code Composer Studio, EnergyTrace, E2E aretrademarks of Texas Instruments.Arm, Cortex, Keil, µVision are registered trademarks of Arm Limited.Bluetooth is a registered trademark of Bluetooth SIG.IAR Embedded Workbench is a trademark of IAR Systems.Wi-Fi is a registered trademark of Wi-Fi Alliance.All other trademarks are the property of their respective owners.

1 Getting Started

1.1 IntroductionThe SimpleLink MSP‑EXP432P401R LaunchPad development kit is an easy-to-use evaluation module forthe MSP432P401R microcontroller. It contains everything needed to start developing on the MSP432 Low-Power + Performance Arm 32-bit Cortex-M4F microcontroller (MCU), including onboard debug probe forprogramming, debugging, and energy measurements. The MSP432P401R microcontroller supports low-power applications that require increased CPU speed, memory, analog, and 32-bit performance.

Rapid prototyping is simplified by access to the 40-pin headers and a wide variety of BoosterPack™ plug-in modules that enable technologies such as wireless connectivity, graphical displays, environmentalsensing, and many more. Free software development tools are also available such as TI's Eclipse-basedCode Composer Studio™ IDE, IAR Embedded Workbench™ IDE, and Keil® µVision® IDE. CodeComposer Studio IDE supports EnergyTrace™ technology when paired with the MSP432P401RLaunchPad development kit. More information about the LaunchPad development kit, the supportedBoosterPack plug-in modules, and the available resources can be found at TI's LaunchPad developmentkit portal. To get started quickly and find available resources in the SimpleLink MSP432 softwaredevelopment kit (SDK), visit the TI Cloud Development Environment.

1.2 Key Features• Low-power Arm Cortex-M4F MSP432P401R• 40-pin LaunchPad development kit standard that leverages the BoosterPack plug-in module ecosystem• XDS110-ET, an open-source onboard debug probe featuring EnergyTrace+ technology and application

UART• Two buttons and two LEDs for user interaction• Backchannel UART through USB to PC

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https://www.keil.com/demo/eval/arm.htm

http://www.ti.com/tool/energytrace

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1.3 What's Included

1.3.1 Kit Contents• One MSP‑EXP432P401R LaunchPad development kit• One Micro USB cable• One Quick Start Guide

1.3.2 Software Examples (Section 3)• Out-of-Box Software Example• BOOSTXL-K350QVG-S1 Graphics Library Example• 430BOOST-SHARP96 Graphics Library Example• BOOSTXL-BATPAKMKII Fuel Gauge Example• BOOSTXL-SENSORS Sensor GUI Example• BOOSTXL-SENSORS Sensor GUI with TI-RTOS Example

1.4 First Steps: Out-of-Box ExperienceAn easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstratessome key features of the LaunchPad development kit from a user level, showing how to use thepushbutton switches together with onboard LEDs and basic serial communication with a computer.

For a more detailed explanation of the out-of-box demo, see Section 3.

1.5 Next Steps: Looking Into the Provided CodeTo get started, you need an integrated development environment (IDE) to explore and start editing thecode examples. See Section 4 for more information on IDEs and where to download them.

The out-of-box source code and more code examples can be downloaded from the MSP-EXP432P401Rtool folder. Find what code examples are available and more details about each example in Section 3. Allcode is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.

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Target Device

MSP432P401R

Crystal

48 MHz

Micro‐B

USB

EnergyTrace+

Current

Measure HW

LDO

5 V, 3.3 V

ESD

Protection

Power

Switch

Debug

MCU

LED

Red, Green

Power, UART, JTAG to Target

User Interface

Buttons and LEDs

40‐pin LaunchPad

standard headers

{EnergyTrace TechnologyReal-time power consumptionreadings and state updates from theMSP432P401R MCU viewablethrough the EnergyTrace GUI

40-pin BoosterPackplug-in module connector

(J1–J4) {Button/SwitchS2

User LEDsLED1 and LED2

Button/SwitchS1

Fanout of Unused Pins- Access to unused pins on the

MSP432P401R device- Support for bread-board connection

MSP432P401R MicrocontrollerMSP1

{

Jumper Isolation Block- J101- Power

- GND, 5V, and 3V3- Back-channel UART to the PC

- RXD, TXD- JTAG

- RST, TMS, TCK, TDO, TDI

XDS110 onboard debug probeEnables debugging and programmingas well as communication to the PC.The XDS110 can also provide power

to the target MCU.

ResetMSP432P401R Reset

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2 HardwareFigure 2 shows an overview of the EVM hardware.

Figure 2. MSP-EXP432P401R Overview

2.1 Block DiagramFigure 3 shows the block diagram.

Figure 3. Block Diagram

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1P10.1/UCB3CLK

2P10.2/UCB3SIMO/UCB3SDA

3P10.3/UCB3SOMI/UCB3SCL

4P1.0/UCA0STE

5P1.1/UCA0CLK

6P1.2/UCA0RXD/UCA0SOMI

7P1.3/UCA0TXD/UCA0SIMO

8P1.4/UCB0STE

9P1.5/UCB0CLK

10P1.6/UCB0SIMO/UCB0SDA

11P1.7/UCB0SOMI/UCB0SCL

12VCORE

13DVCC1

14VSW

15DVSS1

16P2.0/PM_UCA1STE

17P2.1/PM_UCA1CLK

18P2.2/PM_UCA1RXD/PM_UCA1SOMI

19P2.3/PM_UCA1TXD/PM_UCA1SIMO

20P2.4/PM_TA0.1

21P2.5/PM_TA0.2

22P2.6/PM_TA0.3

23P2.7/PM_TA0.4

24P10.4/TA3.0/C0.7

25P10.5/TA3.1/C0.626

P7.4

/PM

_TA

1.4

/C0.5

27

P7.5

/PM

_TA

1.3

/C0.4

28

P7.6

/PM

_TA

1.2

/C0.3

29

P7.7

/PM

_TA

1.1

/C0.2

30

P8.0

/UC

B3S

TE

/TA

1.0

/C0.1

31

P8

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CB

3C

LK

/TA

2.0

/C0

.0

32

P3.0

/PM

_U

CA

2S

TE

33

P3.1

/PM

_U

CA

2C

LK

34

P3.2

/PM

_U

CA

2R

XD

/PM

_U

CA

2S

OM

I

35

P3.3

/PM

_U

CA

2T

XD

/PM

_U

CA

2S

IMO

36

P3.4

/PM

_U

CB

2S

TE

37

P3.5

/PM

_U

CB

2C

LK

38

P3.6

/PM

_U

CB

2S

IMO

/PM

_U

CB

2S

DA

39

P3.7

/PM

_U

CB

2S

OM

I/P

M_U

CB

2S

CL

40

AV

SS

3

41

PJ.0

/LF

XIN

42

PJ.1

/LF

XO

UT

43

AV

SS

1

44

DC

OR

45

AV

CC

1

46

P8.2

/TA

3.2

/A23

47

P8.3

/TA

3C

LK

/A22

48

P8.4

/A21

49

P8.5

/A20

50

P8.6

/A19

51 P8.7/A18

52 P9.0/A17

53 P9.1/A16

54 P6.0/A15

55 P6.1/A14

56 P4.0/A13

57 P4.1/A12

58 P4.2/ACLK/TA2CLK/A11

59 P4.3/MCLK/RTCCLK/A10

60 P4.4/HSMCLK/SVMHOUT/A9

61 P4.5/A8

62 P4.6/A7

63 P4.7/A6

64 P5.0/A5

65 P5.1/A4

66 P5.2/A3

67 P5.3/A2

68 P5.4/A1

69 P5.5/A0

70 P5.6/TA2.1/VREF+/VeREF+/C1.7

71 P5.7/TA2.2/VREF-/VeREF-/C1.6

72 DVSS2

73 DVCC2

74 P9.2/TA3.3

75 P9.3/TA3.476

P6.2

/UC

B1S

TE

/C1.5

77

P6.3

/UC

B1C

LK

/C1.4

78

P6.4

/UC

B1S

IMO

/UC

B1S

DA

/C1.3

79

P6.5

/UC

B1S

OM

I/U

CB

1S

CL/C

1.2

80

P6.6

/TA

2.3

/UC

B3S

IMO

/UC

B3S

DA

/C1.1

81

P6.7

/TA

2.4

/UC

B3S

OM

I/U

CB

3S

CL/C

1.0

82

DV

SS

3

83

RS

Tn/N

MI

84

AV

SS

2

85P

J.2

/HF

XO

UT

86

PJ.3

/HF

XIN

87

AV

CC

2

88

P7.0

/PM

_S

MC

LK

/PM

_D

MA

E0

89

P7.1

/PM

_C

0O

UT

/PM

_TA

0C

LK

90

P7.2

/PM

_C

1O

UT

/PM

_TA

1C

LK

91

P7.3

/PM

_TA

0.0

92

PJ.4

/TD

I

93

PJ.5

/TD

O/S

WO

94

SW

DIO

TM

S

95

SW

CLK

TC

K

96

P9.4

/UC

A3S

TE

97

P9.5

/UC

A3C

LK

98

P9.6

/UC

A3R

XD

/UC

A3S

OM

I

99

P9.7

/UC

A3T

XD

/UC

A3S

IMO

100

P10.0

/UC

B3S

TE

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2.2 SimpleLink MSP432P401R MCUThe MSP432P401R is the first MSP432 family device featuring low-power performance with an ArmCortex-M4F core. Device features include:• Low-power Arm Cortex-M4F MSP432P401R• Up to 48-MHz system clock• 256KB of flash memory, 64KB of SRAM, and 32KB of ROM with SimpleLink MSP432 SDK libraries• Four 16-bit timers with capture, compare, or PWM, two 32-bit timers, and an RTC• Up to eight serial communication channels (I2C, SPI, UART, and IrDA)• Analog: precision ADC, capacitive touch, comparator• Digital: AES256, CRC, µDMA

Figure 4. MSP432P401RIPZ Pinout

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2.3 XDS110-ET Onboard Debug ProbeTo keep development easy and cost effective, TI's LaunchPad development kits integrate an onboarddebug probe, which eliminates the need for expensive programmers. The MSP‑EXP432P401R has theXDS110-ET debug probe, which is a simple low-cost debug probe that supports nearly all TI Arm devicederivatives.

Figure 5. XDS110-ET Debug Probe

The XDS110-ET hardware can be found in the schematics in Section 6 and in the MSP‑EXP432P401RHardware Design Files.

2.3.1 XDS110-ET Isolation Block J101The J101 isolation block is composed of J101 jumpers shown in Table 1. The J101 isolation block allowsthe user to connect or disconnect signals that cross from the XDS110-ET domain into the MSP432P401Rtarget domain. This crossing is shown by the silkscreen dotted line across the LaunchPad development kitthrough J101. No other signals cross the domain, so the XDS110-ET can be completely decoupled fromthe MSP432P401R target side. This includes XDS110-ET power and GND signals, UART, and JTAGsignals.

Table 1 lists the signals that are controlled at the isolation block.

Table 1. Isolation Block Connections

Signal Description

GNDGND power connection between XDS110 and MSP432 target GND planes. The GND jumper ispopulated to connect the separate GND planes. This connection is required for proper operation with3V3, 5V, UART, and JTAG.

5V 5-V power rail, VBUS from USB3V3 3.3-V power rail, derived from VBUS by an LDO in the XDS110-ET domain

RXD << Backchannel UART: The target MCU receives data through this signal. The arrows indicate the directionof the signal.

TXD >> Backchannel UART: The target MCU sends data through this signal. The arrows indicate the direction ofthe signal.

RST MCU RST signal (active low)TCK_SWCLK Serial wire clock input (SWCLK) / JTAG clock input (TCK)TMS_SWDIO Serial wire data input/output (SWDIO) / JTAG test mode select (TMS)TDO_SWO Serial wire trace output (SWO) / JTAG trace output (TWO) (Also PJ.5)

TDI JTAG test data input (Also PJ.4)

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XDS110-ET

Debug Probe

MCU

J101

Isolation

Block

JTA

G a

nd

SW

D

Ap

pli

cati

on

UA

RT

3.3

V P

ow

er

5V

Po

we

r

MSP432P401R

Target MCU

XD

S1

10

-ET

MS

P4

32

Ta

rge

tUSB Connector

in out

LDO

Bo

ost

erP

ack

He

ad

er

Bo

ost

erP

ack

He

ad

er

USB

EnergyTrace

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SC

I_A

0

Hardware www.ti.com




Reasons to open these connections:• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power

measurements• To control 3-V and 5-V power flow between the XDS110-ET and target domains• To expose the target MCU pins for other use than onboard debugging and application UART

communication• To expose the UART interface of the XDS110-ET so that it can be used for devices other than the

onboard MCU.

Figure 6. XDS110-ET Isolation Block

2.3.2 Application (or "Backchannel") UARTThe XDS110-ET provides a "backchannel" UART-over-USB connection with the host, which can be veryuseful during debugging and for easy communication with a PC.

The backchannel UART allows communication with the USB host that is not part of the target application'smain functionality. This is very useful during development, and also provides a communication channel tothe PC host side. This can be used to create GUIs and other programs on the PC that communicate withthe LaunchPad development kit.

Figure 6 shows the pathway of the backchannel UART. The backchannel UART eUSCI_A0 is independentof the UART on the 40-pin BoosterPack plug-in module connector eUSCI_A2.

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On the host side, a virtual COM port for the application backchannel UART is generated when theLaunchPad development kit enumerates on the host. You can use any PC application that interfaces withCOM ports, including terminal applications like Hyperterminal or Docklight, to open this port andcommunicate with the target application. You need to identify the COM port for the backchannel. OnWindows PCs, Device Manager can assist.

Figure 7. Application Backchannel UART in Device Manager

The backchannel UART is the XDS110 Class Application/User UART port. In this case, Figure 7 showsCOM156, but this port can vary from one host PC to the next. After you identify the correct COM port,configure it in your host application according to its documentation. You can then open the port and begincommunication to it from the host.

The XDS110-ET has a configurable baud rate; therefore, it is important that the PC application configuresthe baud rate to be the same as what is configured on the eUSCI_A0 backchannel UART.

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2.3.3 Using an External Debug Probe Instead of the Onboard XDS110-ETMany users have a specific external debug probe that they prefer to use, and may wish to bypass theXDS110-ET debug probe to program the MSP432 target MCU. This is enabled by jumpers on isolationblock J101, and the connector J8. Using an external debug probe is simple, and full JTAG access isprovided through J8.1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO,

and TDI.2. Plug any Arm debug probe into J8.

a. J8 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.3. Plug USB power into the LaunchPad development kit, or power it externally.

a. Ensure that the jumpers across 3V3 and GND are connected if using USB power.b. External debug probes do not provide power, the VCC pin is a power sense pin.c. For more details on powering the LaunchPad development kit, see Section 2.4.

2.3.4 Using the XDS110-ET Debug Probe With a Different TargetThe XDS110-ET debug probe on the LaunchPad development kit can interface to most Arm Cortex-Mdevices, not just the onboard target MSP432P410R device. This functionality is enabled by the J102 10-pin Cortex-M JTAG connector and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold separatelyfrom the LaunchPad development kit).

Header J102 follows the Cortex-M Arm standard; however, pin 1 is not a voltage sense pin. The XDS110-ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide levelshifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can be sourced from theXDS110-ET when jumper JP102 is connected. This allows the XDS110-ET to power the external target at3.3 V through pin 1. By default JP102 is not populated as it does not explicitly follow the standard.1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO,

and TDI.2. Plug the 10-pin cable into J102, and connect to an external target.

a. J102 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.3. Plug USB power into the LaunchPad development kit, or power it externally

a. JTAG levels are 3.3 V ONLY.b. 3.3-V power can be sourced through J102 by shorting the JP102 jumper.

2.3.5 EnergyTrace+ TechnologyEnergyTrace™ technology is an energy-based code analysis tool that measures and displays theapplication's energy profile and helps to optimize it for ultra-low power consumption.

MSP432 devices with built-in EnergyTrace+[CPU State] (or in short EnergyTrace+) technology allow real-time monitoring of internal device states while user program code executes.

EnergyTrace+ technology is supported on the LaunchPad development kit MSP432P401R device +XDS110-ET debug probe. EnergyTrace technology is available as part of TI's Code Composer Studio IDE.During application debug, additional windows are available for EnergyTrace technology.

To enable EnergyTrace technology, go to:• Window > Preferences > Code Composer Studio > Advanced Tools > EnergyTrace™ Technology• Check the Enable Auto-Launch on target connect box

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Figure 8. EnergyTrace™ Technology Preferences

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Starting a debug session will now open EnergyTrace technology windows. These windows show energy,power, profile, and states to give the user a full view of the energy profile of their application.

Figure 9. EnergyTrace™ Windows

This data allows the user to see exactly where and how energy is consumed in their application.Optimizations for energy can be quickly made for the lowest power application possible.

On the LaunchPad development kit, EnergyTrace technology measures the current that enters the targetside of the LaunchPad development kit. This includes all BoosterPack plug-in modules plugged in, andanything else connected to the 3V3 power rail. For more information about powering the LaunchPaddevelopment kit, see Section 2.4.

For more information about EnergyTrace technology, see www.ti.com/tool/energytrace.

For more details and questions about setting up and using EnergyTrace technology with theMSP432P401R MCU, see the Code Composer Studio™ IDE 7.1+ for SimpleLink™ MSP432™Microcontrollers User's Guide.

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http://www.ti.com/tool/energytrace

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2.4 PowerThe board was designed to accommodate various powering methods, including through the onboardXDS110-ET and from an external source or BoosterPack plug-in module.

Figure 10. MSP‑‑EXP432P401R Power Block Diagram

2.4.1 XDS110-ET USB PowerThe most common power-supply scenario is from USB through the XDS110-ET debug probe. Thisprovides 5-V power from the USB and also regulates this power rail to 3.3 V for XDS110-ET operation and3.3 V to the target side of the LaunchPad development kit. Power from the XDS110-ET is controlled bythe isolation block 3V3 jumper, ensure this jumper is connected for power to be provided to the targetMCU side.

Under normal operation, the LDO on the XDS110-ET can supply up to 500 mA of current to the target sideincluding any BoosterPack plug-in modules plugged in. However, when debugging and using theEnergyTrace technology tool, this current is limited to 75 mA total. Be aware of this current limitation whenusing EnergyTrace technology.

2.4.2 BoosterPack Plug-in Module and External Power SupplyHeader J6 is present on the board to supply external power directly. It is important to comply with thedevice voltage operation specifications when supplying external power. The MSP432P401R has anoperating range of 1.62 V to 3.7 V. More information can be found in MSP432P401xx SimpleLink™Mixed-Signal Microcontrollers.

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2.5 Measure Current Draw of MSP432 MCUTo measure the current draw of the MSP432P401R MCU, use the 3V3 jumper on the jumper isolationblock. The current measured includes the target device and any current drawn through the BoosterPackplug-in module headers.

To measure ultra-low power, follow these steps:1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.2. Consider the effect that the backchannel UART and any circuitry attached to the MSP432P401R may

have on current draw. Disconnect these at the isolation block if possible, or at least consider theircurrent sinking and sourcing capability in the final measurement.

3. Make sure there are no floating input I/Os. These cause unnecessary extra current draw. Every I/Oshould either be driven out or, if it is an input, should be pulled or driven to a high or low level.

4. Begin target execution.5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a

stable measurement. It is easier to measure quiescent states.

For a better look at the power consumed in the application, use EnergyTrace+ Technology. EnergyTrace+Technology allows the user to see energy consumed as the application progresses. For more detailsabout EnergyTrace+ Technology, see Section 2.3.5.

2.6 ClockingThe MSP‑EXP432P401R provides external clocks in addition to the internal clocks in the device.• Q1: 32-kHz crystal (LFXTCLK)• Q2: 48-MHz crystal (HFXTCLK)

The 32-kHz crystal allows for lower LPM3 sleep currents and a higher-precision clock source than thedefault internal 32-kHz REFOCLK. Therefore, the presence of the crystal allows the full range of low-power modes to be used.

The 48-MHz crystal allows the device to run at its maximum operating speed for MCLK and HSMCLK.

The MSP432P401R device has several internal clocks that can be sourced from many clock sources.Most peripherals on the device can select which of the internal clocks to use to operate at the desiredspeed.

The internal clocks in the device default to the configuration listed in Table 2.

Table 2. Default Clock Operation

Clock Default Clock Source Default ClockFrequency

Description

MCLK DCO 3 MHz Master ClockSources CPU and peripherals

HSMCLK DCO 3 MHz Subsystem Master ClockSources peripherals

SMCLK DCO 3 MHz Low-speed subsystem master clockSources peripherals

ACLK LFXT (or REFO if nocrystal present) 32.768 kHz Auxiliary clock

Sources peripherals

BCLK LFXT (or REFO if nocrystal present) 32.768 kHz Low-speed backup domain clock

Sources LPM peripherals

For more information about configuring internal clocks and using the external oscillators, see theMSP432P4xx SimpleLink™ Microcontrollers Technical Reference Manual.

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2.7 BoosterPack Plug-in Module PinoutThe MSP‑EXP432P401R LaunchPad development kit adheres to the 40-pin LaunchPad development kitpinout standard. A standard was created to aid compatibility between LaunchPad development kit andBoosterPack plug-in module tools across the TI ecosystem.

The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad developmentkits like the MSP‑EXP430FR4133. This allows some subset of functionality of 40-pin BoosterPack plug-inmodules to be used with 20-pin LaunchPad development kits.

While most BoosterPack plug-in modules are compliant with the standard, some are not. TheMSP‑EXP432P401R LaunchPad development kit is compatible with all 20-pin and 40-pin BoosterPackplug-in modules that are compliant with the standard. If the reseller or owner of the BoosterPack plug-inmodule does not explicitly indicate compatibility with the MSP‑EXP432P401R LaunchPad development kit,compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad development kitto ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing theMSP432P401R device pin function configuration in software. More information about compatibility canalso be found at www.ti.com/launchpad.

Figure 11 shows the 40-pin pinout of the MSP‑EXP432P401R LaunchPad development kit.

Note that software configuration of the pin functions plays a role in compatibility. The MSP‑EXP432P401RLaunchPad development kit side of the dashed line in Figure 11 shows all of the functions for which theMSP432P401R device's pins can be configured. This can also be seen in the MSP432P401R data sheet.The BoosterPack plug-in module side of the dashed line shows the standard. The MSP432P401R functionwhose color matches the BoosterPack plug-in module function shows the specific software-configurablefunction by which the MSP‑EXP432P401R LaunchPad development kit adheres to the standard.

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Figure 11. LaunchPad™ Development Kit to BoosterPack™ Plug-in Module Connector Pinout

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2.8 Design Files

2.8.1 Hardware Design FilesSchematics can be found in Section 6. All design files including schematics, layout, bill of materials(BOM), Gerber files, and documentation are available in the MSP‑EXP432P401R Hardware Design Files.

2.9 Hardware Change LogTable 3 lists the hardware revisions.

Table 3. Hardware Change Log

PCBRevision Date Description MSP432P401R Device

Revision

MSP-EXP432P401RHardware and SoftwareDownload Version (for

Downloading ZipPackages Only)

Rev 1.0 March 2015 Preproduction release XMS432P401R Rev B 2_00_00_03

Rev 2.0 June 2016 Production silicon release

XMS432P401R Rev C orMSP432P401R Rev C

(check device markings todetermine version)

3_00_00_03

Rev 2.1 January 2018Production silicon release with updatedsilkscreen for CE compliance and latestLaunchPad standards

MSP432P401R Rev C 3_00_00_03

2.9.1 MSP-EXP432P401R Rev 1.0 (Black) LaunchPad Development KitAs shown in Table 3, this was the initially released LaunchPad development kit, with XMS432P401R RevB silicon. Connecting any debugger to this version of the MSP432 MCU will generate a warning telling theuser to update their silicon. TI will continue to support this board for the foreseeable future. However,upgrading to the latest LaunchPad development kit gets you all the silicon upgrades and the finalproduction version of Driver Library in ROM.

In addition to the hardware being different, the device revision also changes with the LaunchPaddevelopment kit revisions. Because of this, you must download a software package that matches yourexact hardware. The software example files for older versions of the LaunchPad development kit areavailable from MSP‑EXP432P401R Software Examples – navigate to previous release versions accordingto Table 3.

2.9.2 MSP-EXP432P401R Rev 2.0 (Red) LaunchPad Development KitAs shown in Table 3, this is the updated LaunchPad development kit for the production silicon, withXMS432P401R Rev C or MSP432P401R Rev C silicon. In addition to the latest silicon, several updateswere made to the LaunchPad development kit hardware to enhance the user experience (seeSection 2.9.2.1).

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2.9.2.1 MSP-EXP432P401R UpdatesFrom the perspective of the board, all of the changes are aesthetic or make the kit easier to use (seeFigure 12). For example, moving the user buttons to the side of the board makes them easier to reachwhen you have a BoosterPack plug-in module connected to the top of the LaunchPad development kit.The button placement has changed, but the physical button connections are the same. The mostsignificant change is the addition of an extra 10-pin Arm JTAG connector. This connector lets you use theLaunchPad development kit as a stand-alone XDS110 debug probe.

Figure 12. Differences Between Rev 1.0 (Black) and Rev 2.0 (Red)

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2.9.2.2 MSP432P401R Device Revision DifferencesThe primary MSP432P401R silicon differences are the differences between Rev. B and Rev. C devices.For details of the differences, see Moving From Evaluation to Production With SimpleLink™MSP432P401x Microcontrollers.

The first shipments of Rev 2.0 (Red) LaunchPad development kit have XMS432P401R Rev C.preproduction silicon before the final production version of MSP432P401R Rev C. silicon is released.Which device is on a particular LaunchPad development kit can be determined by looking at the markingson the MSP432P401R device. The XMS version have a marking of "XMS" instead of "MSP". For detailson the differences between the preproduction and production silicon, see XMS432P401x Rev. CPreproduction Advisories.

To work around Advisory 1 in the document above, and as a general way to update to the latest deviceBSL, TI provides a utility to download the latest BSL. This utility is available inside of TI Resource Explorer(see Figure 13). Alternatively, the BSL can be updated by running Program_MSP432_BSL.bat in thesource files for MSP432P401R BSL update.

Figure 13. BSL Update Utility in TI Resource Explorer

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3 Software ExamplesTable 4 lists the software examples that are included with the MSP‑EXP432P401R LaunchPaddevelopment kit. These examples can be downloaded with the SimpleLink MSP432 SDK.

Table 4. Software Examples

Demo Name BoosterPack Required Description More Details

Out-of-Box Software Example N/A The out-of-box demo programmed on theLaunchPad development kit from the factory. Section 3.1

BOOSTXL-K350QVG-S1Graphics Library Example BOOSTXL-K350SVG-S1

A simple example showing how to use MSPGraphics Library (grlib) to display graphicsprimitives and images and implementtouchscreen functionality

Section 3.2

430BOOST-SHARP96Graphics Library Example 430BOOST-SHARP96

A simple example showing how to use MSPGraphics Library (grlib) to display graphicsprimitives and images

Section 3.3

BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401R

BOOSTXL-BATPAKMKIIDemonstrates how to initialize bq27441-G1 fuelgauge configurations and how to control andread data registers

Section 3.4

BOOSTXL-SENSORS_SensorGUI_MSP432P401R

BOOSTXL-SENSORSDemonstrates how to sample data from the fiveonboard digital sensors and communicate thatover UART in a JSON payload

Section 3.5

BOOSTXL-SENSORS_TI-RTOS_SensorGUI_MSP432P401R

BOOSTXL-SENSORSDemonstrates how to sample data from the fiveonboard digital sensors and communicate thatover UART in a JSON payload using TI-RTOS

Section 3.6

To use any of the software examples with the LaunchPad development kit, you must have an integrateddevelopment environment (IDE) that supports the MSP432P401R device (see Table 5).

Table 5. IDE Minimum Requirements for MSP‑‑EXP432P401R

Code Composer Studio™ IDE IAR Embedded Workbench® IDE Keil® µVision® MDK-Armv6.1 or later v7.10 or later v5 or later

For more details on how to get started quickly and where to download the latest TI, IAR, and Keil IDEs,see Section 4.

3.1 Out-of-Box Software ExampleThis section describes the functionality and structure of the out-of-box software that is preloaded on theEVM. The source code can be found in the SimpleLink MSP432 SDK.

The out-of-box software extends a basic blink LED example to allow users to control the blink rate andcolor of an RGB LED on the MSP432 LaunchPad development kit.

This software example is created to work with TI-RTOS or FreeRTOS, with a POSIX layer to make itcompatible with both kernels. There are many advantages to using a Real Time Operating System overbare-metal code. An RTOS manages many aspects of the system, which allows a developer to focus onthe application. Typically, an RTOS is used when the application needs to do more than a few simpleactions.

This Out-of-Box example is intentionally designed to be much simpler than what would typically beexpected of an RTOS project. The purpose of this design is to provide the user with a very simple andstraight-forward example of how to use an RTOS kernel. Using an RTOS kernel in this example requiresmore overhead in memory than bare-metal code, but it allows the user more modularity and flexibilitywhen adding peripherals or modules. This becomes particularly useful with more complex systems suchas when using connectivity devices. For more information, go to the MSP432 SimpleLink Academytraining on TI Resource Explorer.

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3.1.1 OperationUpon powering up the out-of-box demo, the RGB LED2 blinks red at 1 Hz. Switch S1 can be tappedrepeatedly at a constant rate to set the blink frequency of LED2. Switch S2 cycles LED2 through fourdifferent color settings: Red, Green, Blue, and random RGB color. Each color setting retains its own blinkfrequency.

A PC GUI accompanies the out-of-box demo to allow user to set the color and blink rate of the RGB LED.Connect the LaunchPad development kit to a computer using the included USB cable. The out-of-box GUIcan be opened from within CCS using the TI Resource Explorer: Software > SimpleLink MSP432 SDK >Development Tools > MSP-EXP432P401R > Demos > outOfBox_msp432p401r, and launch the Out ofBox Experience GUI.

Figure 14. Out-of-Box GUI Running Locally

The GUI can also run directly from the TI Cloud Tools (see Section 4.1.2).

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Figure 15. Out-of-Box GUI Running From TI Cloud Tools

Click on the Connect button to connect to the LaunchPad development kit then open the serial COM port.Once the connection has been established and the GUI indicates, "Target Status: Running…," you canuse the color wheel or the Red, Green, and Blue color sliders to set the color of the LaunchPaddevelopment kit RGB LED. Changing the LED Beats Per Minute input box sets the RGB LED blink rate.

3.2 BOOSTXL-K350QVG-S1 Graphics Library ExampleThis software is available in the SimpleLink MSP432 SDK (see Section 4.3).

The demo shows how to use the MSP Graphics Library, or "grlib," in a project with the Kentec display.This demo shows the user how to enable the touch screen, create buttons, and use graphics primitivesincluding colors and images.

The program begins by calibrating the touch screen. There is a routine that detects the four cornercoordinates to determine if an eligible rectangle boundary is formed. If the calibration was incorrect, amessage displays on the screen to indicate that the calibration failed. When successful, the calibrationprovides a reference for all button presses throughout the rest of the program.

The next step is to select the mode of the program: display primitives or images. Each mode simply cyclesthrough without user interaction to demonstrate features of the display. In the graphics primitives mode,the following primitives are shown:• Pixels• Lines• Circles• Rectangles• Text

The application is heavily commented to ensure it is very clear how to use the grlib APIs. The aboveprimitives are shown as well as the underlying concepts of grlib including background and foregroundcolors, context, fonts, opacity, and more.

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The images mode shows the drawing of a few different images both compressed and uncompressed.Image compression can have a big impact to drawing speeds for simple images. To draw images with theMSP Graphics Library, they must first be converted into the right file format. These files can be generatedby the Image Reformer tool that comes packaged with grlib. Launch this tool from the grlib folder ordirectly from TI Resource Explorer.• File Path: <grlib root>\utils\image-reformer\imagereformer.exe

The Image Reformer tool allows you to import images and output into grlib specific files to add to yourgrlib project. Image Reformer does not manipulate any images (such as color modifications, rotation, orcropping), any image manipulation must be done before importing into the Image Reformer tool. Moreinformation about MSP grlib and the Image Reformer tool can be found in Design Considerations WhenUsing the MSP430 Graphics Library.

Figure 16. Importing and Converting an Image With MSP Image Reformer

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3.3 430BOOST-SHARP96 Graphics Library ExampleThis software example is similar to the BOOSTXL-K350QVG-S1 Graphics library example. It shows howto use the MSP Graphics Library, or "grlib," in a project with the Sharp 96×96 display. The Sharp 96×96display BoosterPack plug-in module does not support touch or color, it is a simple monochrome LCD. It isa great LCD for ultra-low power display applications and has a unique mirrored pixel display.

This demo cycles screens without user interaction to show simple graphics primitives.• Pixels• Lines• Circles• Rectangles• Text• Images

This demo introduces the functions to configure grlib such as initialization, color inversion, and usingforeground and background colors properly.

3.4 BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401RThis section describes the functionality and structure of the BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401R demo that is included in the SimpleLink MSP432 SDK (seeSection 4.3).

3.4.1 Source File StructureThe project is split into multiple files (see Table 6). This makes it easier to navigate and reuse parts of itfor other projects.

Table 6. Source File and Folders

Name DescriptionLibrary: driverlib Device driver library (MSP432DRIVERLIB)startup_msp432p401r.c MSP432™ MCU family interrupt vector table for CGTHAL_BQ27441.c Driver for communicating with the bq27441-G1 fuel gaugeHAL_I2C.c Board specific support driver for I2C communicationHAL_UART.c Board specific driver for UART communication through Application/User UARTmain.c The main function of the demo, global variables, and more

3.4.2 Running the Fuel Gauge ExampleAfter the compiling and loading the BOOSTXL-BATPAKMKII_FuelGauge_MSP432P401R project ordownloading the prebuilt firmware binary onto the MSP-EXP432P401R LaunchPad development kit, followthe steps below to run the demo firmware.

Figure 17. Hardware Setup and Connections

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1. Attach the BOOSTXL-BATPAKMKII Battery BoosterPack plug-in module to the LaunchPaddevelopment kit.

2. Flip the switch to the "ON" position on the side of the BOOSTXL-BATPAKMKII Battery BoosterPackplug-in module.

3. Connect the MSP-EXP432P401R LaunchPad development kit to a computer via micro-USB cable.4. Launch a serial terminal application and connect to the COM port for "XDS110 Class Application/User

UART" at 115200 baud rate (see Figure 18 and Figure 19).

Figure 18. Determine COM Port Number Using Device Manager on Windows

Figure 19. Example Serial Terminal Configuration

5. Press the reset button on the MSP-EXP432P401R LaunchPad development kit.6. Observe serial data displaying Fuel Gauge configuration and Battery Information (see Figure 20).

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Figure 20. Snapshot of Serial Terminal Connected to Running Fuel Gauge Demo

3.4.3 Firmware OverviewSee the Quick Start Guide for bq27441-G1 and the bq27441-G1 Technical Reference Manual for detaileddescription of the Battery Fuel Gauge usage.

The demo program begins by initializing a number of configuration parameters in the bq27441-G1 tomatch the target battery. Four important parameters are Design Capacity, Design Energy, TerminateVoltage, and Taper Rate. Values are determined based on the target battery properties and bq27441-G1documentation.

Next, the host MSP432P401R MCU clears the BIE (Battery Insert Enable) bit in the fuel gauge operationconfiguration register. When BIE is cleared, the battery detection relies on the host to issue aBAT_INSERT subcommand to indicate battery presence, bypassing the J6 BIN jumper on the BOOSTXL-BATPAKMKII BoosterPack plug-in module that the fuel gauge relies on for battery detection by defaultwhen BIE is set (J6 shorted = battery inserted; J6 open = battery removed). This is done to ensure thatthe demo application works whether or not J6 is connected.

In end user applications, a switch or the host MCU is more likely to control the BIN state of the fuel gaugedepending on battery connection. However, this is not implemented on the BoosterPack plug-in moduleand a jumper is used to manually toggle between battery insertion and removal.

When the bq27441-G1 has been configured properly, the main loop repeatedly reads backDESIGN_CAPACITY, REMAINING_CAPACITY, STATE_OF_CHARGE, TEMPERATURE, VOLTAGE,and AVERAGE_CURRENT from the fuel gauge. Results are formatted and transmitted throughApplication/User UART.

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3.5 BOOSTXL-SENSORS_SensorGUI_MSP432P401RThe Sensors BoosterPack kit (BOOSTXL-SENSORS) is an easy-to-use plug-in module for adding digitalsensors to your LaunchPad development kit design. The SimpleLink MCU LaunchPad development kitallows developers to use this BoosterPack plug-in module to start developing sensor applications usingthe onboard gyroscope, accelerometer, magnetometer, pressure, ambient temperature, humidity, ambientlight, and infrared temperature sensors. For information on the Out-of-Box experience and how to use theBOOSTXL-SENSORS BoosterPack plug-in module, see the BOOSTXL-SENSORS BoosterPack™ Plug-inModule User's Guide.

3.6 BOOSTXL-SENSORS_TI-RTOS_SensorGUI_MSP432P401RThis section describes the functionality structure of the BOOSTXL-SENSORS_TI_RTOS_SensorGUI_MSP432P401R demo that is included in the SimpleLink MSP432 SDK(see Section 4.3).

This example requires TI-RTOS MSP43x version 2_16_01_14 to be installed in CCS.

More information on the use of TI-RTOS can be found in the TI-RTOS user’s guides, available in the TI-RTOS tool folder.

3.6.1 Source File StructureTable 7 lists the source files and folders.

Table 7. Source Files and Folders

Name DescriptionOS: TI-RTOS Real-time operating system using TI-RTOS kernelLibrary: driverlib Device driver library (MSP432DRIVERLIB)bme280.c Driver for communicating with the environmental sensorbme280_support.c Support driver for communicating with the environmental sensorbmi160.c Driver for communicating with the IMU and magnetometer sensorsbmi160_support.c Support driver for communicating with the IMU and magnetometer sensorsMSP_EXP432P401R.c Driver for setting up board specific items (for example, I2C and UART)main.c The demo’s main function, tasks, semaphores, global variables, and moreopt3001.c Driver for communicating with the ambient light sensortmp007.c Driver for communicating with the infrared temperature sensor

3.6.2 Working With the GUICollaboration with the Sensor GUI is identical to , except for programming the device directly from theGUI. The .out file located within the GUI is specific to the BOOSTXL-SENSORS_SensorGUI_MSP432P401R example project. To download the program, you must use aseparate IDE, such as CCS or IAR, and the BOOSTXL-SENSORS_TI_RTOS_SensorGUI_MSP432P401Rsource code in the SimpleLink MSP432 SDK.

4 Resources

4.1 Integrated Development EnvironmentsAlthough the source files can be viewed with any text editor, more can be done with the projects if they'reopened with a development environment like Code Composer Studio (CCS) IDE, Keil µVision, IAREmbedded Workbench, or Energia.

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4.1.1 SimpleLink MSP432 SDKThe MSP432P401R device is part of the SimpleLink microcontroller (MCU) platform, which consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, and host MCUs. All share a common, easy-to-use developmentenvironment with a single core software development kit (SDK) and rich tool set. A one-time integration ofthe SimpleLink platform lets you add any combination of devices from the portfolio into your design. Theultimate goal of the SimpleLink platform is to achieve 100 percent code reuse when your designrequirements change. For more information, visit www.ti.com/simplelink.

4.1.2 TI Cloud Development ToolsTI's Cloud-based software development tools provide instant access to SimpleLink SDK content and aweb-based IDE.

4.1.2.1 TI Resource Explorer CloudTI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentationfound in SimpleLink SDK without having to download files to your local drive.

Try the TI Resource Explorer Cloud now at dev.ti.com.

4.1.2.2 Code Composer Studio™ Cloud IDECode Composer Studio Cloud is a web-based IDE that allows code edit, compile and download to devicesright from your web browser. It also integrates seamlessly with TI Resource Explorer Cloud with the abilityto import projects directly on the cloud.

A full comparison between Code Composer Studio Cloud and Code Composer Studio Desktop is availablehere.

See Code Composer Studio Cloud now at dev.ti.com.

4.1.3 Code Composer Studio™ Desktop IDECode Composer Studio Desktop is a professional integrated development environment that supports TI'sMicrocontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of toolsused to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source codeeditor, project build environment, debugger, profiler, and many other features.

NOTE: The MSP432 LaunchPad development kit requires CCS Version 6.1.0 or later. See theCode Composer Studio™ IDE 7.1+ for SimpleLink™ MSP432™ Microcontrollers User'sGuide for detailed instructions of using the IDE with MSP432. To use the SimpleLinkMSP432 SDK, CCS Version 7.1.0 or later is required.

Learn more about CCS and download it at www.ti.com/tool/ccstudio.

4.1.4 Keil® µVision® IDEThe µVision IDE is an embedded project development environment included in Keil's MicrocontrollerDevelopment Kit Version 5, that provides an source code editor, project manager, and make utility tool.µVision supports all the Keil tools including C/C++ Compiler, Macro Assembler, Linker, Library Manager,and Object-HEX Converter.

NOTE: The MSP432 LaunchPad development kit requires µVision IDE/MDK Version 5 or later. Seethe Arm® Keil® MDK Version 5 for SimpleLink™ MSP432™ Microcontrollers User's Guide fordetailed instructions of using the IDE with MSP432.

Learn more about Keil µVision and download it at www.keil.com/arm/mdk.asp.

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4.1.5 IAR Embedded Workbench® for Arm IDEIAR Embedded Workbench for Arm IDE is another very powerful integrated development environment thatallows you to develop and manage complete embedded application projects. It integrates the IAR C/C++Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IARC-SPY Debugger.

NOTE: The MSP432 LaunchPad development kit requires the IAR Embedded Workbench for ArmIDE Version 7.10 or later. See the IAR Embedded Workbench for Arm 7.x for SimpleLink™MSP432™ Microcontrollers User's Guide for detailed instructions of using the IDE withMSP432. To use the SimpleLink MSP432 SDK, IAR Version 7.80.3 or later is required.

Learn more about IAR Embedded Workbench and download it at https://www.iar.com/iar-embedded-workbench/arm.

4.1.6 EnergiaEnergia is a simple open-source community-driven code editor that is based on the Wiring and Arduinoframework. Energia provides unmatched ease of use through very-high-level APIs that can be usedacross hardware platforms. Energia is a light-weight IDE that does not have the full feature set of CCS,Keil, or IAR. However, Energia is great for anyone who wants to get started very quickly or who does nothave significant coding experience.

Learn more about Energia and download it at energia.nu.

4.2 LaunchPad Development Kit WebsitesMore information about the LaunchPad development kit, supported BoosterPack plug-in modules, andavailable resources can be found at:• MSP‑EXP432P401R tool folder: Resources specific to this particular LaunchPad development kit• TI's LaunchPad development kit portal: Information about all LaunchPad development kits from TI

4.3 SimpleLink SDK and TI Resource ExplorerTI Resource explorer is a tool integrated into CCS that allows you to browse through available designresources. TI Resource Explorer will help you quickly find what you need inside packages includingSimpleLink SDK for the SimpleLink MCUs such as MSP432, CC3200, CC2640, and more. TI ResourceExplorer is well organized to find everything that you need quickly, and you can import software projectsinto your workspace, find documentation, and browse libraries in your workspace in just a few clicks.

TI Resource Explorer Cloud is one of the TI Cloud Development tools and is tightly integrated with CCSCloud. See Section 4.1.2 for more information.

The SimpleLink SDK is a collection of code examples, software libraries, data sheets, and other designresources for all SimpleLink MCU devices delivered in a convenient package – essentially everythingdevelopers need to become SimpleLink experts.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware,software, and tool options for customers developing wired and wireless applications. With an ultimate goalof 100 percent code reuse across host MCUs, Wi-Fi, Bluetooth low energy, Sub-1 GHz devices, andmore, choose the MCU or connectivity standard that fits your design. A one-time investment with theSimpleLink software development kit (SDK) lets you reuse often, opening the door to create unlimitedapplications. For more information, visit ww.ti.com/simplelink.

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Figure 21. Using TI Resource Explorer to Browse MSP-EXP432P401R in SimpleLink SDK

Inside TI Resource Explorer, these examples and many more can be found and easily imported into CCSwith one click.

4.4 MSP432P401R

4.4.1 Device DocumentationAt some point, you will probably want more information about the MSP432P401R device. For every MSPdevice, the documentation is organized as shown in Table 8.

Table 8. How MSP Device Documentation is Organized

Document For MSP432P401R Description

Device family user's guideMSP432P4xx SimpleLink™Microcontrollers TechnicalReference Manual

Architectural information about the device, including all modulesand peripherals such as clocks, timers, ADC, and so on

Device-specific data sheet MSP432P401xx SimpleLink™Mixed-Signal Microcontrollers

Device-specific information and all parametric information for thisdevice

4.4.2 MSP432P401R Code ExamplesInside of the SimpleLink MSP432 SDK, a set of very simple MSP432P4xx code examples can be foundthat demonstrate how to use the entire set of MSP432 peripheral: serial communication, precision ADC,Timer_A, Timer_B, and so on. These examples show both the direct register access and driver librarymethods.

Every MSP derivative has a set of these code examples. When starting a new project or adding a newperipheral, these examples serve as a great starting point (see Section 4.3).

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4.4.3 MSP432 Application Notes and TI DesignsThere are many application notes that can be found at www.ti.com/msp432, as well as TI Designs withpractical design examples and topics.

4.5 Community Resources

4.5.1 TI E2E™ CommunitySearch the E2E forums at e2e.ti.com. If you cannot find your answer, post your question to thecommunity.

4.5.2 Community at LargeMany online communities focus on the LaunchPad development kit; for example, www.43oh.com. You canfind additional tools, resources, and support from these communities.

5 FAQQ: I can't program my LaunchPad development kit; the IDE can't connect to target. What's wrong?

A: Check the following:• Are the JTAG jumpers on J101 populated (GND, RST, TMS, TCK, TDO, TDI)?• Check for power to the target

– Are the 3V3 and GND jumpers on J101 populated and USB cable plugged in?– If using an external debug probe, is USB power provided as shown above? Otherwise is external

power provided to the target?• Check the debug probe settings: change to Serial Wire Debug (SWD) without SWO.

1. Under targetconfigs, double-click the *.ccxml file.2. Click the Advanced tab at the bottom.3. Click on Texas Instruments XDS110 USB Debug Probe.4. Under Connection Properties, change SWD Mode Settings to Use SWD Mode with SWO Trace

Disabled.

Figure 22. SWD Mode Settings

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http://www.ti.com/msp432

http://www.ti.com/general/docs/refdesignsearch.tsp

http://e2e.ti.com/

http://www.43oh.com/

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5. When the settings of Port J (PJSEL0 and PJSEL1 bits) are changed, full JTAG access is preventedon these pins. Changing to use SWD allows access through the dedicated debug pins only.

• If even this cannot connect, reset the device to factory settings:1. Click View → Target Configurations. CCS shows the target configuration.

Figure 23. Target Configurations

If using the onboard debug probe, XDS110-ET is shown.2. Right click Launch Selected Configuration.

Figure 24. Launch Selected Configuration

3. The debug probe now connects to the device (which is still possible) but does not try to halt theCPU, write to registers, or even download code (which would not be possible). The Debug view thatis spawned shows the CPU core but marks it as disconnected.

4. Right click Show all cores.

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Figure 25. Show All Cores

The MSP432 Debug Access Port, or DAP, is shown under Non Debuggable Devices.5. Right click Connect Target

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Figure 26. Connect Target

Now run a script to return the device back to factory settings:

Scripts > default > MSP432_Factory_Reset

Figure 27. MSP432_Factory_Reset Script

• These instructions are generally the same for all IDEs, but the exact steps may vary slightly by IDE.See the following IDE user's guides for additional details:– Code Composer Studio™ IDE 7.1+ for SimpleLink™ MSP432™ Microcontrollers User's Guide– Arm® Keil® MDK Version 5 for SimpleLink™ MSP432™ Microcontrollers User's Guide– IAR Embedded Workbench for Arm 7.x for SimpleLink™ MSP432™ Microcontrollers User's Guide

Q: How do I use the LaunchPad development kit and my Segger J-Link to debug the target externally? Itwon't connect to the onboard connector.

A: The Segger J-Link does not come with an adapter for the 10-pin small-pitch Arm connector. Theadapter cable is available from Segger.

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http://shop-us.segger.com/J_Link_9_Pin_Cortex_M_Adapter_p/8.06.02.htm

www.ti.com FAQ




Q: Problems plugging the MSP432 LaunchPad development kit into a USB3.0 port.

A: It has been observed that when the MSP432 LaunchPad development kit is connected to USB3.0 portsprovided by a certain combination of USB3.0 host controller hardware and associated device drivers thatthe IDE is unable to establish a debug session with the LaunchPad development kit, resulting in an errormessage like "CS_DAP_0: Error connecting to the target: (Error -260 @ 0x0) An attempt to connect to theXDS110 failed." in the case of Code Composer Studio IDE. In this case the CCS-provided low-levelcommand line utility ‘xdsdfu' will also not be able to establish a connection with the LaunchPaddevelopment kit.

Specifically, this issue was observed on PCs running Windows 7 that show the "Renesas Electronics USB3.0 Host Controller" and the associated "Renesas Electronics USB 3.0 Root Hub" in the device manager.After updating the associated Windows USB drivers to more recent versions obtained from the hardwarevendor the issue went away. There might be other USB3.0 hardware and device driver combinations thatwill lead to the same issue. If you think you might be affected, try to contact your PC vendor or try tolocate and install more recent versions of the USB3.0 device drivers. Alternatively, connect the LaunchPaddevelopment kit to an USB2.0 port on your PC, if one is available.

Q: I can't get the backchannel UART to connect. What's wrong?

A: Check the following:• Do the baud rate in the host's terminal application and the eUSCI settings match?• Are the appropriate jumpers in place on the isolation jumper block?• Probe on RXD and send data from the host. If you do not see data, it might be a problem on the host

side.• Probe on TXD while sending data from the MSP432. If you do not see data, it might be a configuration

problem with the eUSCI module.• Consider the use of the hardware flow control lines (especially for higher baud rates).

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Target MCU:

MSP432P401R

LQM21PN4R7NGR

GND

100n100n

22p

22p

GND

4u7

4.7uH

MSP432

GND

100n100n 10u

0R

GND

91kOhm, 0.1%, 25ppm/C

GND

100n+3V3

22p

22p

GNDHFX

LFX

AnalogVCC VCC

Digital

DC-DC

C2C1 C5

C6

C10

L1

P10.1/UCB3CLK1

P10.2/UCB3SIMO/UCB3SDA2

P1.0/UCA0STE4

P1.1/UCA0CLK5

P1.2/UCA0RXD/UCA0SOMI6

P1.3/UCA0TXD/UCA0SIMO7

P1.4/UCB0STE8

P1.5/UCB0CLK9

P1.6/UCB0SIMO/UCB0SDA10

P1.7/UCB0SOMI/UCB0SCL11

P2.0/PM_UCA1STE16

P2.1/PM_UCA1CLK17

P2.2/PM_UCA1RXD/PM_UCA1SOMI18

P2.3/PM_UCA1TXD/PM_UCA1SIMO19

P2.4/PM_TA0.120

P2.5/PM_TA0.221

P2.6/PM_TA0.322

P2.7/PM_TA0.423

P3.0/PM_UCA2STE32

P3.1/PM_UCA2CLK33

P3.2/PM_UCA2RXD/PM_UCA2SOMI34

P3.3/PM_UCA2TXD/PM_UCA2SIMO35

P3.4/PM_UCB2STE36

P3.5/PM_UCB2CLK37

P3.6/PM_UCB2SIMO/PM_UCB2SDA38

P3.7/PM_UCB2SOMI/PM_UCB2SCL39

P4.0/A1356

P4.1/A1257

P4.2/ACLK/TA2CLK/A1158

P4.3/MCLK/RTCCLK/A1059

P4.4/HSMCLK/SVMHOUT/A960

P4.5/A861

P4.6/A762

P4.7/A663

P5.0/A564

P5.1/A465

P5.2/A366

P5.3/A267

P5.4/A168

P5.5/A069

P5.6/TA2.1/VREF+/VEREF+/C1.770

P5.7/TA2.2/VREF-/VEREF-/C1.671

P6.0/A1554

P6.1/A1455

P6.2/UCB1STE/C1.576

P6.3/UCB1CLK/C1.477

P6.4/UCB1SIMO/UCB1SDA/C1.378

P6.5/UCB1SOMI/UCB1SCL/C1.279

P6.6/TA2.3/UCB3SIMO/UCB3SDA/C1.180

P6.7/TA2.4/UCB3SOMI/UCB3SCL/C1.081

P10.3UCB3SOMI/UCB3SCL3

P9.7/UCA3TXD/UCA3SIMO99

P9.6/UCA3RXD/UCA3SOMI98

P9.5/UCA3CLK97

P9.4/UCA3STE96

P9.3/TA3.475

P9.2/TA3.374

P9.1/A1653

P9.0/A1752

P8.7/A1851

P8.6/A1950

P8.5/A2049

P8.4/A2148

P8.3/TA3CLK/A2247

P8.2/TA3.2/A2346

P8.1/UCB3CLK/TA2.0/C0.031

P8.0/UCB3STE/TA1.0/C0.130

P7.0/PM_SMCLK/PM_DMAE088

P7.1/PM_C0OUT/PM_TA0CLK89

P7.2/PM_C1OUT/PM_TA1CLK90

P7.3/PM_TA0.091

P7.4/PM_TA1.4/C0.526

P7.5/PM_TA1.3/C0.427

P7.6/PM_TA1.2/C0.328

P7.7/PM_TA1.1/C0.229

DVSS382

SWDIOTMS94

PJ.5/TDO/SWO93

PJ.4/TDI/ADC14CLK92

PJ.3/HFXIN86

PJ.2/HFXOUT85

PJ.1/LFXOUT42

PJ.0/LFXIN41

SWCLKTCK95

AVSS340

RSTN/NMI83

DCOR44

DVSS272

DVSS115

AVSS284

AVSS143

AVCC287

AVCC145

DVCC273

DVCC113

VCORE12

VSW14

P10.5/TA3.1/C0.625

P10.4/TA3.0/C0.724

P10.0/UCB3STE100

MSP1

C4C7 C3

R1

R5

C8

C11

C12

12

Q1

13

Q2

+3V3

VCORE

VSW

DCOR

TMS_SWDIOTCK_SWDCLK

TDITDO_SWO

P1.0_LED1P1.1_BUTTON1

P6.0_A15_J1.2

P1.4_BUTTON2P1.5_SPICLK_J1.7P1.6_SPIMOSI_J2.15P1.7_SPIMISO_J2.14

RST

P2.0_RGBLED_REDP2.1_RGBLED_GREENP2.2_RGBLED_BLUE

P2.4_PWM_J4.38P2.5_PWM_J2.19P2.6_PWM_J4.39P2.7_PWM_J4.40

P2.3_IO_J4.34

P3.0_IO_J2.18P3.1

P3.4P3.5_IO_J4.32P3.6_IO_J2.11P3.7_IO_J4.31

P4.0_A13_J3.24P4.1_IO_J1.5P4.2_A11_J3.25P4.3_A10_J1.6P4.4_A9_J3.26P4.5_A8_J3.27P4.6_IO_J1.8P4.7_A6_J3.28

P5.0_IO_J2.13P5.1_IO_J4.33P5.2_IO_J2.12P5.3P5.4_IO_J3.29P5.5_IO_J3.30P5.6_PWM_J4.37P5.7_IO_J2.17

P7.0P7.1P7.2P7.3P7.4P7.5P7.6P7.7

P9.0P9.1P9.2P9.3P9.4P9.5P9.6P9.7

P10.0P10.1P10.2P10.3P10.4P10.5

P6.6_CAPTURE_J4.36P6.7_CAPTURE_J4.35

P6.4_I2CSDA_J1.10P6.5_I2CSCL_J1.9

P6.2P6.3

P8.0P8.1P8.2P8.3P8.4P8.5P8.6P8.7

P6.1_A14_J3.23

P3.2_URXD_J1.3

P1.2_BCLUART_RXD

P3.3_UTXD_J1.4

P1.3_BCLUART_TXD

Texas Instruments

Mike Stein

2.1

A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

+

Schematics www.ti.com




6 Schematics

Figure 28. Schematics (1 of 6)

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Buttons and LEDs

GND

GND

470

GND

GND

+5V

+3V3

GND

110R

16R

24R

1n

GND

+3V3

47k

LED1

LED2_RED

LED2_GREEN

LED2_BLUE

MOUNTHOLE_125MIL MOUNTHOLE_125MIL

MOUNTHOLE_125MIL MOUNTHOLE_125MIL

EVERLIGHT_19-337

GND

GND

User LEDs User Buttons

RESET

5V Header

3V3 Header

Mounting Holes: 125 mil for 4-40/M2.5/M3 screws

Silkscreen

LED1

R7

R2

R3

R4

C13

R6

1 2

JP8

1 2

JP9

1 2

JP10

1 2

JP11

U$1 U$2

U$3 U$5

LED2

123

J6

123

J7S1 S2

S2

G2G1

S1 S2

S1

G2G1

S1 S2

S3

G2G1

P1.0_LED1

P1.1_BUTTON1

P1.4_BUTTON2

P2.2_RGBLED_BLUE

P2.1_RGBLED_GREEN

P2.0_RGBLED_RED

RST

Texas Instruments

Mike Stein

2.1

A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

Red

Green

Blue

+3V3GNDGND

+5VGNDGND

www.ti.com Schematics





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BoosterPack Headers

MSP432P401R Debugger Connectorfor use with external debug probeBypass XDS110-ETRemove J101 jumpers to disconnect XDS110

XDS110 Debug Probe ConnectorDebug external targetsBypass MSP432P401RRemove J101 jumpers to disconnect MSP432

Debug Headers

1

10 11

2021

30

40

31

GND

GND+3V3

+5V

+3V3

+5V

EDGE_CON

GND

+3V3

+3V3 +3V3+5V +5V

J101_432

GNDGND

GND

GND

GND

XDS110-ET <<---->> LaunchPadEdge Connector for Unused Pin Access

11

33

55

77

99

1111

1313

1515

1717

1919

2121

2323

2525

2727

2929

3131

3333

3535

3737

3838

3636

3434

3232

3030

2828

2626

2424

2222

2020

1818

1616

1414

1212

1010

88

66

44

22

J5

J101

14 1312 1110 98 76 54 32 1

20 1918 1716 15

1 2

JP102

1 23 45 67 89 10

J81 23 45 67 89 10

J102

XDS-GNDXDS-GND

XDS-GND XDS-GND+3V3 +3V3+5V +5V

XDSET_RXDXDSET_TXDXDSET_VCCTARGET

XDSET_VCCTARGET

P6.0_A15_J1.2P2.4_PWM_J4.38P5.6_PWM_J4.37P6.6_CAPTURE_J4.36P6.7_CAPTURE_J4.35P2.3_IO_J4.34P5.1_IO_J4.33

P3.7_IO_J4.31

P3.2_URXD_J1.3P3.3_UTXD_J1.4

P4.3_A10_J1.6P1.5_SPICLK_J1.7P4.6_IO_J1.8P6.5_I2CSCL_J1.9P6.4_I2CSDA_J1.10

P6.1_A14_J3.23P4.0_A13_J3.24

P4.4_A9_J3.26P4.5_A8_J3.27P4.7_A6_J3.28P5.4_IO_J3.29P5.5_IO_J3.30

P3.0_IO_J2.18P5.7_IO_J2.17RST

RST

RST

P1.6_SPIMOSI_J2.15P1.7_SPIMISO_J2.14P5.0_IO_J2.13P5.2_IO_J2.12P3.6_IO_J2.11

P2.7_PWM_J4.40

P3.5_IO_J4.32

P8.0

P8.2P8.3P8.4

P8.5P8.6P8.7 P9.0P9.1

P9.2P9.3

P9.6P9.7

P10.1P10.2P10.3P10.4

P4.1_IO_J1.5 P4.2_A11_J3.25

P2.6_PWM_J4.39 P2.5_PWM_J2.19

P10.5

P5.3P6.2

P6.3 P7.3P7.2 P7.1P7.0 P9.4P9.5

P7.7 P7.6P7.5 P7.4

P10.0

XDSET_TMS_SWDIO

XDSET_TMS_SWDIO

XDSET_RESET_OUT

XDSET_RESET_OUT

P1.2_BCLUART_RXDP1.3_BCLUART_TXD

TMS_SWDIO

TMS_SWDIO

TDO_SWO

TDO_SWO

TDI

TDI

XDSET_VBUS

XDSET_TDO_SWO

XDSET_TDO_SWO

XDSET_TDI

XDSET_TDI

TCK_SWDCLK

TCK_SWDCLK

XDSET_TCK_SWDCLK

XDSET_TCK_SWDCLK

XDSET_GND

Texas Instruments

Mike Stein

2.1

A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

GND

RST

TMS/SWDIO

TXD

RXD

3V3

5V

XDS110 Target

TDO/SWO

TDI

TCK/SWDCLK






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XDS110 Debug Probe

0.1uF 2.2uF

10n 100n 10n

12pF

12pF

10k

DNP

51

0.1uF

2R

100

100n 10n

10n10n 100n

1k 1

%

1k1k

1k

470

470

NX3225G

A_O

SC

1u

1u

1u

LM

4040B25_D

CK_5

0

0

0

dnp

GND

GND

GND

GND

GND

GND

GND

GND

GND GND

GND

GND

51

0.1uF

GND

PA0P$33

PA1P$34

PA2P$35

PA3P$36

PA4P$37

PA5P$38

PA6P$40

PA7P$41

PB0P$95

PB1P$96

PB2P$91

PB3P$92

PB4P$121

PB5P$120

PC0P$100

PC1P$99

PC2P$98

PC3P$97

PC4P$25

PC5P$24

PC6P$23

PC7P$22

PD0P$1

PD1P$2

PD2P$3

PD3P$4

PD4P$125

PD5P$126

PD6P$127

PD7P$128

PE0P$15

PE1P$14

PE2P$13

PE3P$12

PE4P$123

PE5P$124

PF0P$42

PF1P$43

PF2P$44

PF3P$45

PF4P$46

PG0P$49

PG1P$50

PH0P$29

PH1P$30

PH2P$31

PH3P$32

PJ0P$116

PJ1P$117

PK0P$18

PK1P$19

PK2P$20

PK3P$21

PK4P$63

PK5P$62

PK6P$61

PK7P$60

PL0P$81

PL1P$82

PL2P$83

PL3P$84

PL4P$85

PL5P$86

PL6P$94

PL7P$93

PM0P$78

PM1P$77

PM2P$76

PM3P$75

PM4P$74

PM5P$73

PM6P$72

PM7P$71

PN0P$107

PN1P$108

PN2P$109

PN3P$110

PN4P$111

PN5P$112

PP0P$118

PP1P$119

PP2P$103

PP3P$104

PP4P$105

PP5P$106

PQ0P$5

PQ1P$6

PQ2P$11

PQ3P$27

PQ4P$102

HIBP$65

RESETP$70

WAKEP$64

EN0RXINP$53

EN0RXIPP$54

EN0TXONP$56

EN0TXOPP$57

GNDP$17

GNDP$48

GNDP$55

GNDP$58

GNDP$80

GNDP$114

GNDAP$10

OSC0P$88

OSC1P$89

RBIASP$59

VBATP$68

VDDP$7

VDDP$16

VDDP$26

VDDP$28

VDDP$39

VDDP$47

VDDP$51

VDDP$52

VDDP$69

VDDP$79

VDDP$90

VDDP$101

VDDP$113

VDDP$122

VDDAP$8

VDDCP$87

VDDCP$115

VREFA+P$9

XOSC0P$66

XOSC1P$67

C131 C133

C112 C113 C114

C102

C101

R103

C108

R104C103

R106

R102

C121 C123

C104C110 C111

R105

R108R109

R110

LED102

LED101

R111

R124

OSC0

1N

C2

OSC1

3N

C2

4Q

101

C107

C132

C130

1

TP110

A1

NC_2

2

C3

NC_3

4N

C5

IC107

R137

R138

R131

R139

R140C150

VDDC

OSC0

XDSET_VBATIRSTN XDSET_RST XDSET_VCC XDSET_VCC

XDSET_VCC

XDSET_VCC

XDSET_VCCVREFA+

VCCEN1VCCEN2

USBNXTUSBDIRUSB0D7USB0D6

DCDCIO0DCDCIO1DCDCRSTDCDCTEST

DCDCPULSE

USB0D0USB0D1USB0D2USB0D3USB0D4USB0D5

HOSTSCLHOSTSDA

XDSET_RTS

DEBUG_TRIGGER_0DEBUG_TRIGGER_1

VBUS_DETECT

LED0

LED0

LED1

LED1

ITCKITMSITDIITDO

XDSET_TMS_SWDIOXDSET_TDO_SWO

XDSET_CTS

XDSET_RXDXDSET_TXD

XDSET_TDIXDSET_RESET_OUTEXTERNAL_DEBUG

USBSTPUSB0CLK

REF_TARGET_VCC

REF_MAIN_LDO

XDSET_DPXDSET_DM

XDSET_ID

XDSET_TCK_SWDCLK

XDSET_VBUS

Texas Instruments

Mike Stein

2.1

A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

IC106G$1

TM4C129ENCPDT

IC106G$2

R104 and C103 used to meetVBAT rise time requirements






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EnergyTrace Software-controlled DCDC converter

Energy measurement method protected underU.S. Patent Application 13/329,073and subsequent patent applications

MSP430G2452IRSA16R

4k7 4k7

2k2

3k3

6k8

BAS40-05

BAS40-05

BC850CW-115

DMG1013UW

820

0

470

2u2

220k

220k 33p220k

220k33p

100n4.7u

4.7u 100n

47k

4.7u 100n

MSP430G2X[1/5]2

220n

TPS2102DBV

220n47u 100n

DN

P

DNP

220k

220k

GND GND

GNDGND

GNDGND

GND GND GND GND GND

GND

GND

GND

GND

GNDGND

GND

GND

R116 R117

R126

R127

R128

D101

D102

T102

T101R118

R119

R120

L101

R112

R113 C115 R114

R115C116

C118C117

C119 C120

R107

C106 C124

1234567 10

111213141516

8 9

TPMSP101

C126

EN1

GND2

IN23

OUT4

IN15

IC103

C127C128 C129

R134

R101

R135

R136

HOSTSDAHOSTSCL

DCDCIO0DCDCIO1 DCDCCAL0

DCDCCAL1

DCDCCAL2

DCDCPULSE

AVCC

AVCCOUT

XDSET_VCCTARGET

XDSET_VCCTARGET

VCCEN1

DCDCTESTDCDCRST

XDSET_VCC

XDSET_VCC

XDSET_VCC

XDSET_VCCOUT XDSET_VCCOUT

XDSET_VCCOUT

XDSET_VCCOUT

XDSET_VBUS

REF_TARGET_VCC

REF_MAIN_LDO

Texas Instruments

Mike Stein

2.1

+A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

+






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USB interface and power supply

DEBUG

1u

33

2u2

TPS73533DRB

330k

220k

10k 10k

4.7u

TPD4E004_DRY_6

GND

GNDGND

GND

GND

GND

GND

GND

GND

C141

R123

C105

1TP102

1TP103

1TP104

1TP105

1TP106

1TP109

1TP108

1TP101

OUT1

NC02

NR3 G

ND

4

EN5

NC16

NC27

IN8

PAD

9

IC101

R132

R133

R125 R129

C140

IO11

IO22

GND3

IO34

IO45

VCC6

IC102

1TP107

D+D-

GNDID

VBUS

XDSET_VBUS

XDSET_VBUS

XDSET_VBUS

XDSET_VBUSXDSET_DM

XDSET_DMXDSET_SHIELD

XDSET_VCC

XDSET_VCC

XDSET_VCC

IRSTN

ITDI

ITDO

ITCK

ITMS

DCDCTEST

DCDCRST

XDSET_ID

XDSET_ID

XDSET_DP

XDSET_DP

VBUS_DETECTXDSET_GND

Texas Instruments

Mike Stein

2.1

A

B

C

D

1 2 3 4 5 6

A

B

C

D

1 2 3 4 5 6

+

Voltage divider:VBUS_DETECT = 0.4 * XDSET_VBUS






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Revision History www.ti.com



Revision History

Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from January 9, 2018 to March 8, 2018 ............................................................................................................ Page

• Changed the link to the 10-pin Cortex-M JTAG cable in Section 2.3.4, Using the XDS110-ET Emulator With a DifferentTarget ..................................................................................................................................... 10

• Updated the answer to the question that begins "Q: How do I use the LaunchPad development kit and my Segger J-Link..." in Section 5, FAQ ............................................................................................................... 34

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