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MSP430 Hardware Tools

User's Guide

Literature Number: SLAU278M

May 2009–Revised March 2013

Contents

Preface ....................................................................................................................................... 7

1 Get Started Now! ............................................................................................................... 121.1 Flash Emulation Tool (FET) Overview .................................................................................. 131.2 Kit Contents, MSP-FET430PIF .......................................................................................... 141.3 Kit Contents, eZ430-F2013 .............................................................................................. 141.4 Kit Contents, eZ430-T2012 .............................................................................................. 141.5 Kit Contents, eZ430-RF2500 ............................................................................................ 141.6 Kit Contents, eZ430-RF2500T ........................................................................................... 141.7 Kit Contents, eZ430-RF2500-SEH ...................................................................................... 141.8 Kit Contents, eZ430-Chronos-xxx ....................................................................................... 151.9 Kit Contents, MSP-FET430UIF .......................................................................................... 151.10 Kit Contents, MSP-FET430xx ............................................................................................ 151.11 Kit Contents, FET430F6137RF900 ..................................................................................... 161.12 Kit Contents, MSP-TS430xx ............................................................................................. 171.13 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 191.14 Hardware Installation, MSP-FET430PIF ............................................................................... 191.15 Hardware Installation, MSP-FET430UIF ............................................................................... 191.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 ......... 201.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900 ...... 201.18 Important MSP430 Documents on the Web ........................................................................... 20

2 Design Considerations for In-Circuit Programming ............................................................... 212.1 Signal Connections for In-System Programming and Debugging ................................................... 222.2 External Power ............................................................................................................. 262.3 Bootstrap Loader (BSL) .................................................................................................. 26

A Frequently Asked Questions and Known Issues ................................................................... 27A.1 Hardware FAQs ............................................................................................................ 28A.2 Known Issues .............................................................................................................. 30

B Hardware .......................................................................................................................... 31B.1 MSP-TS430D8 ............................................................................................................. 33B.2 MSP-TS430PW14 ......................................................................................................... 36B.3 MSP-TS430L092 .......................................................................................................... 39B.4 MSP-TS430L092 Active Cable .......................................................................................... 42B.5 MSP-TS430PW24 ......................................................................................................... 45B.6 MSP-TS430DW28 ......................................................................................................... 48B.7 MSP-TS430PW28 ......................................................................................................... 51B.8 MSP-TS430PW28A ....................................................................................................... 54B.9 MSP-TS430DA38 .......................................................................................................... 57B.10 MSP-TS430QFN23x0 ..................................................................................................... 60B.11 MSP-TS430RSB40 ........................................................................................................ 63B.12 MSP-TS430RHA40A ...................................................................................................... 66B.13 MSP-TS430DL48 .......................................................................................................... 69B.14 MSP-TS430RGZ48B ...................................................................................................... 72B.15 MSP-TS430RGZ48C ...................................................................................................... 75B.16 MSP-TS430PM64 ......................................................................................................... 78

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B.17 MSP-TS430PM64A ....................................................................................................... 81B.18 MSP-TS430RGC64B ..................................................................................................... 84B.19 MSP-TS430RGC64C ..................................................................................................... 87B.20 MSP-TS430RGC64USB .................................................................................................. 91B.21 MSP-TS430PN80 .......................................................................................................... 95B.22 MSP-TS430PN80A ........................................................................................................ 98B.23 MSP-TS430PN80USB .................................................................................................. 101B.24 MSP-TS430PZ100 ....................................................................................................... 105B.25 MSP-TS430PZ100A ..................................................................................................... 108B.26 MSP-TS430PZ100B ..................................................................................................... 111B.27 MSP-TS430PZ100C ..................................................................................................... 114B.28 MSP-TS430PZ5x100 .................................................................................................... 118B.29 MSP-TS430PZ100USB ................................................................................................. 121B.30 MSP-TS430PEU128 ..................................................................................................... 125B.31 EM430F5137RF900 ..................................................................................................... 128B.32 EM430F6137RF900 ..................................................................................................... 132B.33 EM430F6147RF900 ..................................................................................................... 136B.34 MSP-FET430PIF ......................................................................................................... 140B.35 MSP-FET430UIF ......................................................................................................... 142

B.35.1 MSP-FET430UIF Revision History .......................................................................... 147

C Hardware Installation Guide .............................................................................................. 148C.1 Hardware Installation .................................................................................................... 149

Document Revision History ........................................................................................................ 154

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List of Figures

2-1. Signal Connections for 4-Wire JTAG Communication................................................................ 23

2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx and MSP430F4xx Devices.............................................................................. 24

2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx andMSP430F6xx Devices .................................................................................................... 25

B-1. MSP-TS430D8 Target Socket Module, Schematic ................................................................... 33

B-2. MSP-TS430D8 Target Socket Module, PCB .......................................................................... 34

B-3. MSP-TS430PW14 Target Socket Module, Schematic ............................................................... 36

B-4. MSP-TS430PW14 Target Socket Module, PCB ...................................................................... 37

B-5. MSP-TS430L092 Target Socket Module, Schematic................................................................. 39

B-6. MSP-TS430L092 Target Socket Module, PCB ........................................................................ 40

B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic................................................. 42

B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB........................................................ 43



B-11. MSP-TS430DW28 Target Socket Module, Schematic ............................................................... 48

B-12. MSP-TS430DW28 Target Socket Module, PCB ...................................................................... 49



B-15. MSP-TS430PW28A Target Socket Module, Schematic.............................................................. 54

B-16. MSP-TS430PW28A Target Socket Module, PCB (Red) ............................................................. 55

B-17. MSP-TS430DA38 Target Socket Module, Schematic ................................................................ 57

B-18. MSP-TS430DA38 Target Socket Module, PCB ....................................................................... 58

B-19. MSP-TS430QFN23x0 Target Socket Module, Schematic ........................................................... 60

B-20. MSP-TS430QFN23x0 Target Socket Module, PCB .................................................................. 61

B-21. MSP-TS430RSB40 Target Socket Module, Schematic .............................................................. 63

B-22. MSP-TS430RSB40 Target Socket Module, PCB ..................................................................... 64

B-23. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................ 66

B-24. MSP-TS430RHA40A Target Socket Module, PCB ................................................................... 67

B-25. MSP-TS430DL48 Target Socket Module, Schematic ................................................................ 69

B-26. MSP-TS430DL48 Target Socket Module, PCB ....................................................................... 70

B-27. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................ 72

B-28. MSP-TS430RGZ48B Target Socket Module, PCB ................................................................... 73

B-29. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................ 75

B-30. MSP-TS430RGZ48C Target Socket Module, PCB ................................................................... 76

B-31. MSP-TS430PM64 Target Socket Module, Schematic................................................................ 78

B-32. MSP-TS430PM64 Target Socket Module, PCB....................................................................... 79

B-33. MSP-TS430PM64A Target Socket Module, Schematic .............................................................. 81

B-34. MSP-TS430PM64A Target Socket Module, PCB ..................................................................... 82

B-35. MSP-TS430RGC64B Target Socket Module, Schematic ............................................................ 84

B-36. MSP-TS430RGC64B Target Socket Module, PCB ................................................................... 85

B-37. MSP-TS430RGC64C Target Socket Module, Schematic ............................................................ 88

B-38. MSP-TS430RGC64C Target Socket Module, PCB ................................................................... 89

B-39. MSP-TS430RGC64USB Target Socket Module, Schematic ........................................................ 91

B-40. MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 92

B-41. MSP-TS430PN80 Target Socket Module, Schematic ................................................................ 95

B-42. MSP-TS430PN80 Target Socket Module, PCB ....................................................................... 96

B-43. MSP-TS430PN80A Target Socket Module, Schematic .............................................................. 98

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B-44. MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 99

B-45. MSP-TS430PN80USB Target Socket Module, Schematic ......................................................... 101

B-46. MSP-TS430PN80USB Target Socket Module, PCB ................................................................ 102

B-47. MSP-TS430PZ100 Target Socket Module, Schematic ............................................................. 105

B-48. MSP-TS430PZ100 Target Socket Module, PCB .................................................................... 106

B-49. MSP-TS430PZ100A Target Socket Module, Schematic............................................................ 108

B-50. MSP-TS430PZ100A Target Socket Module, PCB................................................................... 109

B-51. MSP-TS430PZ100B Target Socket Module, Schematic............................................................ 111

B-52. MSP-TS430PZ100B Target Socket Module, PCB................................................................... 112

B-53. MSP-TS430PZ100C Target Socket Module, Schematic ........................................................... 114

B-54. MSP-TS430PZ100C Target Socket Module, PCB .................................................................. 115

B-55. MSP-TS430PZ5x100 Target Socket Module, Schematic .......................................................... 118

B-56. MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. 119

B-57. MSP-TS430PZ100USB Target Socket Module, Schematic........................................................ 121

B-58. MSP-TS430PZ100USB Target Socket Module, PCB ............................................................... 122

B-59. MSP-TS430PEU128 Target Socket Module, Schematic ........................................................... 125

B-60. MSP-TS430PEU128 Target Socket Module, PCB .................................................................. 126

B-61. EM430F5137RF900 Target board, Schematic....................................................................... 128

B-62. EM430F5137RF900 Target board, PCB.............................................................................. 129

B-63. EM430F6137RF900 Target board, Schematic....................................................................... 132

B-64. EM430F6137RF900 Target board, PCB.............................................................................. 133

B-65. EM430F6147RF900 Target Board, Schematic ...................................................................... 136

B-66. EM430F6147RF900 Target Board, PCB ............................................................................. 137

B-67. MSP-FET430PIF FET Interface Module, Schematic ................................................................ 140

B-68. MSP-FET430PIF FET Interface Module, PCB ....................................................................... 141

B-69. MSP-FET430UIF USB Interface, Schematic (1 of 4) ............................................................... 142




B-73. MSP-FET430UIF USB Interface, PCB ................................................................................ 146

C-1. Windows XP Hardware Wizard ........................................................................................ 149

C-2. Windows XP Driver Location Selection Folder....................................................................... 150

C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010................................... 151

C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 .................................... 152

C-5. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432 .................................... 153

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List of Tables

1-1. Flash Emulation Tool (FET) Features and Device Compatibility.................................................... 13

1-2. Individual Kit Contents, MSP-TS430xx ................................................................................. 17

B-1. MSP-TS430D8 Bill of Materials.......................................................................................... 35

B-2. MSP-TS430PW14 Bill of Materials...................................................................................... 38

B-3. MSP-TS430L092 Bill of Materials ....................................................................................... 41

B-4. MSP-TS430L092 JP1 Settings .......................................................................................... 43

B-5. MSP-TS430L092 Active Cable Bill of Materials ....................................................................... 44

B-6. MSP-TS430PW24 Bill of Materials...................................................................................... 47

B-7. MSP-TS430DW28 Bill of Materials...................................................................................... 50

B-8. MSP-TS430PW28 Bill of Materials ..................................................................................... 53

B-9. MSP-TS430PW28A Bill of Materials .................................................................................... 56

B-10. MSP-TS430DA38 Bill of Materials ...................................................................................... 59

B-11. MSP-TS430QFN23x0 Bill of Materials.................................................................................. 62

B-12. MSP-TS430RSB40 Bill of Materials .................................................................................... 65

B-13. MSP-TS430RHA40A Bill of Materials................................................................................... 68

B-14. MSP-TS430DL48 Bill of Materials....................................................................................... 71

B-15. MSP-TS430RGZ48B Bill of Materials................................................................................... 74

B-16. MSP-TS430RGZ48C Revision History ................................................................................. 76

B-17. MSP-TS430RGZ48C Bill of Materials .................................................................................. 77

B-18. MSP-TS430PM64 Bill of Materials ...................................................................................... 80

B-19. MSP-TS430PM64A Bill of Materials .................................................................................... 83

B-20. MSP-TS430RGC64B Bill of Materials .................................................................................. 86

B-21. MSP-TS430RGC64C Bill of Materials .................................................................................. 90

B-22. MSP-TS430RGC64USB Bill of Materials............................................................................... 93

B-23. MSP-TS430PN80 Bill of Materials ...................................................................................... 97

B-24. MSP-TS430PN80A Bill of Materials ................................................................................... 100

B-25. MSP-TS430PN80USB Bill of Materials ............................................................................... 103

B-26. MSP-TS430PZ100 Bill of Materials.................................................................................... 107

B-27. MSP-TS430PZ100A Bill of Materials.................................................................................. 110

B-28. MSP-TS430PZ100B Bill of Materials.................................................................................. 113

B-29. MSP-TS430PZ100C Bill of Materials.................................................................................. 116

B-30. MSP-TS430PZ5x100 Bill of Materials................................................................................. 120

B-31. MSP-TS430PZ100USB Bill of Materials .............................................................................. 123

B-32. MSP-TS430PEU128 Bill of Materials ................................................................................. 127

B-33. EM430F5137RF900 Bill of Materials .................................................................................. 130



C-1. USB VIDs and PIDs Used in MSP430 Tools......................................................................... 149

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PrefaceSLAU278M–May 2009–Revised March 2013

Read This First

About This Manual

This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET).The FET is the program development tool for the MSP430 ultralow-power microcontroller. Both availableinterface types, the parallel port interface and the USB interface, are described.

How to Use This Manual

Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, providesinstructions on installing the hardware and according software drivers. After you see how quick and easy itis to use the development tools, TI recommends that you read all of this manual.

This manual describes the setup and operation of the FET but does not fully describe the MSP430™microcontrollers or the development software systems. For details of these items, see the appropriate TIdocuments listed in Section 1.18.

This manual applies to the following tools (and devices):

• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)

• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)

• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for allMSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)

• eZ430-T2012 (three MSP430F2012 based target boards)

• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, forall MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,and MSP430G2x31 devices)

• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)

• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 targetand solar energy harvesting module)

• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development systemcontained in a watch. Includes <1 GHz RF USB access point)

The following tools contain the USB debug interface (MSP-FET430UIF) and the respective target socketmodule:

• MSP-FET430U8 (for MSP430G2210 and MSP430G2230 devices in 8-pin D packages) (green PCB)

• MSP-FET430U14 (for MSP430F20xx, MSP430F20xx, MSP430G2x01, MSP430G2x11,MSP430G2x21, and MSP430G2x31 devices in 14-pin PW packages) (green PCB)

• MSP-FET430U092 (for MSP430FL092 devices in 14-pin PW packages) (green PCB)

• MSP-FET430U24 (for MSP430AFE2xx devices in 24-pin PW packages) (green PCB)

• MSP-FET430U28 (for MSP430F11xx(A) devices in 20- and 28-pin DW or PW packages)

• MSP-FET430U28A (for MSP430F20xx and MSP430G2xxx devices in 14-, 20-, and 28-pin PW)

• MSP-FET430U38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages)

• MSP-FET430U23x0 (for MSP430F23x0 devices in 40-pin RHA packages)

• MSP-FET430U40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages)

• MSP-FET430U40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages)

• MSP-FET430U48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages)

• MSP-FET430U48B (for MSP430F534x devices in 48-pin RGZ packages)

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• MSP-FET430U48C (for MSP430FR58xx and MSP430FR59xx devices in 48-pin RGZ packages)

• MSP-FET430U64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1),MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A),MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages)

• MSP-FET430U64A (for MSP430F41x2 devices in 64-pin PM packages) (red PCB)

• MSP-FET430U64B (for MSP430F530x devices in 64-pin RGC packages) (blue PCB)

• MSP-FET430U64C (for MSP430F522x and MSP430F521x devices in 64-pin RGC packages) (blackPCB)

• MSP-FET430U64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGCpackages)

• MSP-FET430U80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x,MSP430F47x, and MSP430FG47x devices in 80-pin PN packages)

• MSP-FET430U80A (for MSP430F532x devices in 80-pin PN packages)

• MSP-FET430U80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages)

• MSP-FET430U100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, andMSP430F47xx devices in 100-pin PZ packages)

• MSP-FET430U100A (for MSP430F471xx devices in 100-pin PZ packages) (red PCB)

• MSP-FET430U100B (for MSP430F67xx devices in 100-pin PZ packages) (blue PCB)

• MSP-FET430U100C (for MSP430F643x and MSP430F533x devices in 100-pin PZ packages) (blackPCB)

• MSP-FET430U5x100 (for MSP430F54xx(A) devices and MSP430BT5190 in 100-pin PZ packages)(green PCB)

• MSP-FET430U100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)(green PCB)

• MSP-FET430U128 (for MSP430F67xx and MSP430F67xx1 devices in 128-pin PEU packages) (greenPCB)

• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)

• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (greenPCB)

Stand-alone target-socket modules (without debug interface):

• MSP-TS430D8 (for MSP430G2210 and MSP430G2230 devices in 8-pin D packages) (green PCB)

• MSP-TS430PW14 (for MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 andMSP430G2x31 devices in 14-pin PW packages) (green PCB)

• MSP-TS430L092 (for MSP430FL092 devices in 14-pin PW packages) (green PCB)

• MSP-TS430PW24 (for MSP430AFE2xx devices in 24-pin PW packages) (green PCB)

• MSP-TS430DW28 (for MSP430F11xx(A) devices in 28-pin DW packages) (green PCB)

• MSP-TS430PW28 (for MSP430F11xx(A) devices in 28-pin PW packages) (green PCB)

• MSP-TS430PW28A (for MSP430F20xx and MSP430G2xxx devices in 14, 20, and 28-pin PW) (redPCB)

• MSP-TS430DA38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages) (green PCB)

• MSP-TS430QFN23x0 / MSP-TS430QFN40 (for MSP430F23x0 devices in 40-pin RHA packages)(green PCB)

• MSP-TS430RSB40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages) (green PCB)

• MSP-TS430RHA40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages) (redPCB)

• MSP-TS430DL48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages) (green PCB)

• MSP-TS430RGZ48B (for MSP430F534x devices in 48-pin RGZ packages) (blue PCB)

• MSP-TS430RGZ48C (for MSP430FR58xx and MSP430FR59xx devices in 48-pin RGZ packages)(black PCB)

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• MSP-TS430PM64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1),MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A),MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages) (greenPCB)

• MSP-TS430PM64A (for MSP430F41x2 devices in 64-pin PM packages) (red PCB)

• MSP-TS430RGC64B (for MSP430F530x devices in 64-pin RGC packages) (blue PCB)

• MSP-TS430RGC64C (for MSP430F522x and MSP430F521x devices in 64-pin RGC packages) (blackPCB)

• MSP-TS430RGC64USB (for MSP430F550x, MSP430F551x, MSP430F552x, devices in 64-pin RGCpackages) (green PCB)

• MSP-TS430PN80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x,MSP430F47x, and MSP430FG47x devices in 80-pin PN packages) (green PCB)

• MSP-TS430PN80A (for MSP430F532x devices in 80-pin PN packages) (red PCB)

• MSP-TS430PN80USB (for MSP430F551x and MSP430F552x devices with USB peripheral in 80-pinPN packages) (green PCB)

• MSP-TS430PZ100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, andMSP430F47xx devices in 100-pin PZ packages) (green PCB)

• MSP-TS430PZ100A (for MSP430F471xx devices in 100-pin PZ packages) (red PCB)

• MSP-FET430PZ100B (for MSP430F67xx devices in 100-pin PZ packages) (blue PCB)

• MSP-TS430PZ100C (for MSP430F643x and MSP430F533x devices in 100-pin PZ packages) (blackPCB)

• MSP-TS430PZ5x100 (for MSP430F54xx(A) and the MSP430BT5190 devices in 100-pin PZ packages)(green PCB)

• MSP-TS430PZ100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)(green PCB)

• MSP-TS430PEU128 (for MSP430F67xx and MSP430F67xx1 devices in 128-pin PEU packages)(green PCB)

• EM430F5137RF900 (with integrated CC430F5137 IC in a 48-pin RGZ package) (green PCB)

• EM430F6137RF900 (with integrated CC430F6137 IC in a 64-pin RGC package) (green PCB)

• EM430F6147RF900 (with integrated CC430F6147 IC in a 64-pin RGC package) (red PCB)

These tools contain the most up-to-date materials available at the time of packaging. For the latestmaterials (data sheets, user's guides, software, application information, etc.), visit the TI MSP430 web siteat www.ti.com/msp430 or contact your local TI sales office.



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Information About Cautions and Warnings www.ti.com

Information About Cautions and Warnings

This document may contain cautions and warnings.

CAUTION

This is an example of a caution statement.

A caution statement describes a situation that could potentially damage yoursoftware or equipment.

WARNINGThis is an example of a warning statement.

A warning statement describes a situation that could potentiallycause harm to you.

The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.

Related Documentation From Texas Instruments

MSP430 development tools documentation:

CCS for MSP430 User's Guide (literature number SLAU157)

Code Composer Studio v5.x Core Edition (CCS Mediawiki)

IAR for MSP430 User's Guide (literature number SLAU138)

IAR Embedded Workbench KickStart (literature number SLAC050)

eZ430-F2013 Development Tool User's Guide (literature number SLAU176)

eZ430-RF2480 User's Guide (literature number SWRA176)

eZ430-RF2500 Development Tool User's Guide (literature number SLAU227)

eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273)

eZ430-Chronos Development Tool User's Guide (literature number SLAU292)

MSP-SA430SUB1GHZ, Sub-1 GHz RF Spectrum Analyzer Tool (literature number SLAU371)

MSP430F5529 USB Experimenter’s Board, MSP-EXP430F5529 (literature number SLAU330)

MSP430F5438 Experimenter Board, MSP-EXP430F5438 (literature number SLAU263)

MSP430 LaunchPad Value Line Development kit, MSP-EXP430G2 (literature number SLAU318)

MSP430 device user's guides:

MSP430x1xx Family User's Guide (literature number SLAU049)




MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208)

CC430 Family User's Guide (literature number SLAU259)

MSP430FR57xx Family User's Guide (literature number SLAU272)

MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367)

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http://www.ti.com/lit/pdf/SLAU157

http://processors.wiki.ti.com/index.php/Category:Code_Composer_Studio_v5


http://www.ti.com/lit/zip/slac050


http://www.ti.com/lit/pdf/SWRA176

















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If You Need Assistance

Support for the MSP430 devices and the FET development tools is provided by the Texas InstrumentsProduct Information Center (PIC). Contact information for the PIC can be found on the TI web site atwww.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provideopen interaction with peer engineers, TI engineers, and other experts. Additional device-specificinformation can be found on the MSP430 web site.



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Chapter 1SLAU278M–May 2009–Revised March 2013

Get Started Now!

This chapter lists the contents of the FET and provides instruction on installing the hardware.

Topic ........................................................................................................................... Page

1.1 Flash Emulation Tool (FET) Overview .................................................................. 131.2 Kit Contents, MSP-FET430PIF ............................................................................. 141.3 Kit Contents, eZ430-F2013 .................................................................................. 141.4 Kit Contents, eZ430-T2012 .................................................................................. 141.5 Kit Contents, eZ430-RF2500 ................................................................................ 141.6 Kit Contents, eZ430-RF2500T .............................................................................. 141.7 Kit Contents, eZ430-RF2500-SEH ........................................................................ 141.8 Kit Contents, eZ430-Chronos-xxx ........................................................................ 151.9 Kit Contents, MSP-FET430UIF ............................................................................. 151.10 Kit Contents, MSP-FET430xx .............................................................................. 151.11 Kit Contents, FET430F6137RF900 ........................................................................ 161.12 Kit Contents, MSP-TS430xx ................................................................................ 171.13 Kit Contents, EM430Fx1x7RF900 ......................................................................... 191.14 Hardware Installation, MSP-FET430PIF ................................................................ 191.15 Hardware Installation, MSP-FET430UIF ................................................................ 191.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-

EXP430F5529 .................................................................................................... 201.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,

EM430Fx137RF900 ............................................................................................ 201.18 Important MSP430 Documents on the Web ........................................................... 20

12 Get Started Now! SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback



www.ti.com Flash Emulation Tool (FET) Overview

1.1 Flash Emulation Tool (FET) Overview

TI offers several flash emulation tools according to different requirements.

Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility (1)

eZ43

0-F

2013

eZ43

0-R

F25

00

eZ43

0-R

F24

80

eZ43

0-R

F25

60

MS

P-W

DS

xxM

etaw

atch

eZ43

0-C

hro

no

s

MS

P-F

ET

430P

IF

MS

P-F

ET

430U

IF

Lau

nch

Pad

(MS

P-E

XP

430G

2)

MS

P-E

XP

430F

R57

39

MS

P-E

XP

430F

5529

Supports all MSP430 and CC430 flash-based devices (F1xx, F2xx, F4xx, F5xx, x xF6xx, G2xx, L092, FR57xx)

Supports only F20xx, G2x01, G2x11, xG2x21, G2x31

Supports MSP430F20xx, F21x2, F22xx, xG2x01, G2x11, G2x21, G2x31, G2x53

Supports MSP430F20xx, F21x2, F22xx, x xG2x01, G2x11, G2x21, G2x31

Supports F5438, F5438A x

Supports BT5190, F5438A x

Supports only F552x x

Supports FR57xx, F5638, F6638 x

Supports only CC430F613x x

Allows fuse blow x

Adjustable target supply voltage x

Fixed 2.8-V target supply voltage x

Fixed 3.6-V target supply voltage x x x x x x x x x

4-wire JTAG x x

2-wire JTAG (2) x x x x x x x x x x

Application UART x x x x x x x x

Supported by CCS for Windows x x x x x x x x x x x

Supported by CCS for Linux x

Supported by IAR x x x x x x x x x x x(1) The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011.(2) The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface.

13SLAU278M–May 2009–Revised March 2013 Get Started Now!Submit Documentation Feedback


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Kit Contents, MSP-FET430PIF www.ti.com

1.2 Kit Contents, MSP-FET430PIF• One READ ME FIRST document

• One MSP-FET430PIF interface module

• One 25-conductor cable


NOTE: This part is obsolete and is not recommended to use in new design.

1.3 Kit Contents, eZ430-F2013• One QUICK START GUIDE document

• One eZ430-F2013 development tool including one MSP430F2013 target board

1.4 Kit Contents, eZ430-T2012• Three MSP430F2012-based target boards

1.5 Kit Contents, eZ430-RF2500• One QUICK START GUIDE document

• One eZ430-RF2500 CD-ROM

• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board

• One eZ430-RF2500T target board

• One AAA battery pack with expansion board (batteries included)

1.6 Kit Contents, eZ430-RF2500T• One eZ430-RF2500T target board


1.7 Kit Contents, eZ430-RF2500-SEH• One MSP430 development tool CD containing documentation and development software

• One eZ430-RF USB debugging interface

• Two eZ430-RF2500T wireless target boards

• One SEH-01 solar energy harvester board




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www.ti.com Kit Contents, eZ430-Chronos-xxx

1.8 Kit Contents, eZ430-Chronos-xxx

'433, '868, '915• One QUICK START GUIDE document

• One ez430-Chronos emulator

• One screwdriver

• Two spare screws

eZ430-Chronos-433:– One 433-MHz eZ430-Chronos watch (battery included)

– One 433-MHz eZ430-Chronos access point





1.9 Kit Contents, MSP-FET430UIF• One READ ME FIRST document

• One MSP-FET430UIF interface module

• One USB cable


1.10 Kit Contents, MSP-FET430xx

'U8, 'U14, 'U092, 'U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64B,'U64C, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U100C, 'U5x100, 'U100USB, 'U128• One READ ME FIRST document

• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one endof the case, and a 2×7-pin male connector on the other end of the case.

• One USB cable

• One 32.768-kHz crystal from Micro Crystal (except MSP-FET430U24)

• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)

• One 14-Pin JTAG conductor cable

• One small box containing two MSP430 device samples (See table for Sample Type)

• One target socket module. To check the devices used for each board and a summary of the board,see Table 1-2. MSP-TS430xx below is the target socket module for each MSP-FET430Uxx kit.

MSP-FET430U8: One MSP-TS430D8 target socket module.

MSP-FET430U14: One MSP-TS430PW14 target socket module.

MSP-FET430U092: One MSP-TS430L092 target socket module with Active Cable.



MSP-FET430U28A: One MSP-TS430PW28A target socket module.

MSP-FET430U38: One MSP-TS430DA38 target socket module..

MSP-FET430U23x0: One MSP-TS430QFN23x0 (former name MSP-TS430QFN40) target socketmodule.

MSP-FET430U40: One MSP-TS430RSB40 target socket module.

MSP-FET430U48: One MSP-TS430DL48 target socket module.



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Kit Contents, FET430F6137RF900 www.ti.com

MSP-FET430U48B: One MSP-TS430RGZ48B target socket module.

MSP-FET430U48C: One MSP-TS430RGZ48C target socket module.

MSP-FET430U64: One MSP-TS430PM64 target socket module.

MSP-FET430U64A: One MSP-TS430PM64A target socket module.

MSP-FET430U64B: One MSP-TS430RGC64B target socket module.

MSP-FET430U64C: One MSP-TS430RGC64C target socket module.

MSP-FET430U64USB: One MSP-TS430RGC64USB target socket module.

MSP-FET430U80: One MSP-TS430PN80 target socket module.

MSP-FET430U80A: One MSP-TS430PN80A target socket module.

MSP-FET430U80USB: One MSP-TS430PN80USB target socket module.

MSP-FET430U100: One MSP-TS430PZ100 target socket module.

MSP-FET430U100A: One MSP-TS430PZ100A target socket module.

MSP-FET430U100B: One MSP-TS430PZ100B target socket module.

MSP-FET430U100C: One MSP-TS430PZ100C target socket module.

MSP-FET430U5x100: One MSP-TS430PZ5x100 target socket module.

MSP-FET430U100USB: One MSP-TS430PZ100USB target socket module.

MSP-FET430U128: One MSP-TS430PEU128 target socket module.

Consult the device data sheets for device specifications. Device errata can be found in the respectivedevice product folder on the web provided as a PDF document. Depending on the device, errata may alsobe found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.

1.11 Kit Contents, FET430F6137RF900• One READ ME FIRST document

• One legal notice

• One MSP-FET430UIF interface module

• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB

• Two CC430EM battery packs

• Four AAA batteries

• Two 868-MHz or 915-MHz antennas

• Two 32.768-kHz crystals

• 18 PCB 2x4-pin headers

• One USB cable

• One 14-pin JTAG conductor cable



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www.ti.com Kit Contents, MSP-TS430xx

1.12 Kit Contents, MSP-TS430xx• One READ ME FIRST document

• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)

• One target socket module

• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)

• One small box containing two MSP430 device samples (see Table 1-2 for sample type)

Table 1-2. Individual Kit Contents, MSP-TS430xx

Part Number Socket Type Supported Devices Included Devices Headers and Comment

8-pin D MSP430G2210, 1 x MSP430G2210 and Two PCB 1×4-pin headers (two male andMSP-TS430D8 (TSSOP ZIF) MSP430G2230 1 x MSP430G2230 two female)

MSP430F20xx,MSP430G2x01,14-pin PW Four PCB 1×7-pin headers (two male andMSP-TS430PW14 MSP430G2x11, 2 x MSP430F2013IPW(TSSOP ZIF) two female)MSP430G2x21,MSP430G2x31

Four PCB 1×7-pin headers (two male andtwo female). A "Micro-MaTch" 10-pinfemale connector is also present on the14-pin PWMSP-TS430L092 MSP-TS430L092 2 x MSP430L092IPW PCB which connects the kit with an(TSSOP ZIF) 'Active Cable' PCB; this 'Active Cable'PCB is connected by 14-pin JTAG cablewith the FET430UIF

24-pin PW Four PCB 1×12-pin headers (two maleMSP-TS430PW24 MSP430AFE2xx 2 x MSP430AFE253IPW(TSSOP ZIF) and two female)

MSP430F11x1,MSP430F11x2,MSP430F12x,28-pin DW Four PCB 1×12-pin headers (two maleMSP-TS430DW28 MSP430F12x2, 2 x MSP430F123IDW(SSOP ZIF) and two female)MSP430F21xx

Supports devices in 20- and28-pin DA packages

MSP430F11x1,MSP430F11x2,28-pin PW Four PCB 1×12-pin headers (two maleMSP-TS430PW28 MSP430F12x, 2 x MSP430F2132IPW(TSSOP ZIF) and two female)MSP430F12x2,MSP430F21xx

MSP430F20xx,28-pin PW Four PCB 1×12-pin headers (two maleMSP-TS430PW28A MSP430G2xxx in 14-, 20-, 2 x MSP430G2452IPW20(TSSOP ZIF) and two female)and 28-pin PW packages

MSP430F22xx, 2 x MSP430F2274IDA38-pin DA Four PCB 1×19-pin headers (two maleMSP-TS430DA38 MSP430G2x44, 2 x MSP430G2744IDA(TSSOP ZIF) and two female)MSP430G2x55 2 x MSP430G2955IDA

40-pin RHA Eight PCB 1×10-pin headers (four maleMSP-TS430QFN23x0 MSP430F23x0 2 x MSP430F2370IRHA(QFN ZIF) and four female)

40-pin RSB MSP430F51x1, Eight PCB 1×10-pin headers (four maleMSP-TS430RSB40 2 x MSP430F5172IRSB(QFN ZIF) MSP430F51x2 and four female)

40-pin RHA MSP430FR572x, Eight PCB 1×10-pin headers (four maleMSP-TS430RHA40A 2 x MSP430FR5739IRHA(QFN ZIF) MSP430FR573x and four female)

48-pin DL Four PCB 2×12-pin headers (two maleMSP-TS430DL48 MSP430F42x0 2 x MSP430F4270IDL(TSSOP ZIF) and two female)

48-pin RGZ Eight PCB 1×12-pin headers (four maleMSP-TS430RGZ48B MSP430F534x 2 x MSP430F5342IRGZ(QFN ZIF) and four female)

48-pin RGZ MSP430FR58xx and Eight PCB 1×12-pin headers (four maleMSP-TS430RGZ48C 2 x MSP430FR5969IRGZ(QFN ZIF) MSP430FR59xx and four female)



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Kit Contents, MSP-TS430xx www.ti.com

Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)

Part Number Socket Type Supported Devices Included Devices Headers and Comment

MSP430F13x,MSP430F14x,

MSP430F14x1,MSP430F15x,

MSP430F16x(1), TS Kit:MSP430F23x, 2 x MSP430F2618IPM;64-pin PM MSP430F24x, Eight PCB 1×16-pin headers (four maleMSP-TS430PM64 FET Kit:(QFP ZIF) MSP430F24xx, and four female)2 x MSP430F417IPM andMSP430F261x, 2 x MSP430F169IPMMSP430F41x,MSP430F42x(A),

MSP430FE42x(A),MSP430FE42x2,MSP430FW42x

64-pin PM Eight PCB 1×16-pin headers (four maleMSP-TS430PM64A MSP430F41x2 2 x MSP430F4152IPM(QFP ZIF) and four female)

64-pin RGC Eight PCB 1×16-pin headers (four maleMSP-TS430RGC64B MSP430F530x 2 x MSP430F5310IRGC(QFN ZIF) and four female)

64-pin RGC MSP430F522x, Eight PCB 1×16-pin headers (four maleMSP-TS430RGC64C 2 x MSP430F5229IRGC(QFN ZIF) MSP430F521x and four female)

MSP430F550x,64-pin RGC 2 x MSP430F5510IRGC or Eight PCB 1×16-pin headers (four maleMSP-TS430RGC64USB MSP430F551x,(QFN ZIF) 2 x MSP430F5528IRGC and four female)MSP430F552x

MSP430F241x,MSP430F261x,MSP430F43x,80-pin PN Eight PCB 1×20-pin headers (four maleMSP-TS430PN80 MSP430F43x1, 2 x MSP430FG439IPN(QFP ZIF) and four female)MSP430FG43x,MSP430F47x,MSP430FG47x

80-pin PN Eight PCB 1×20-pin headers (four maleMSP-TS430PN80A MSP430F532x 2 x MSP430F5329IPN(QFP ZIF) and four female)

80-pin PN MSP430F552x, Eight PCB 1×20-pin headers (four maleMSP-TS430PN80USB 2 x MSP430F5529IPN(QFP ZIF) MSP430F551x and four female)

MSP430F43x,MSP430F43x1,100-pin PZ Eight PCB 1×25-pin headers (four maleMSP-TS430PZ100 MSP430F44x, MSP430 2 x MSP430FG4619IPZ(QFP ZIF) and four female)MSP430FG461x,MSP430

F47xx

100-pin PZ Eight PCB 1×25-pin headers (four maleMSP-TS430PZ100A MSP430F471xx 2 x MSP430F47197IPZ(QFP ZIF) and four female)

100-pin PZ Eight PCB 1×25-pin headers (four maleMSP-TS430PZ100B MSP430F67xx 2 x MSP430F6733IPZ(QFP ZIF) and four female)

MSP430F645x,100-pin PZ MSP430F643x, Eight PCB 1×25-pin headers (four maleMSP-TS430PZ100C 2 x MSP430F6438IPZ(QFP ZIF) MSP430F535x, and four female)

MSP430F533x

MSP430F543x,100-pin PZ Eight PCB 1×25-pin headers (four maleMSP-TS430PZ5x100 MSP430BT5190, 2 x MSP430F5438IPZ(QFP ZIF) and four female)MSP430SL5438A

MSP430F665x,100-pin PZ Eight PCB 1×25-pin headers (four maleMSP-TS430PZ100USB MSP430F663x, 2 x MSP430F6638IPZ(QFP ZIF) and four female)MSP430F563x

MSP430F677x,MSP430F676x, Four PCB 1x26-pin headers (two male128-pin PEU MSP430F674x,MSP-TS430PEU128 2 x MSP430F67791IPEU and two female) and four PCB 1x38-pin(QFP ZIF) MSP430F677x1, headers (two male and two female)MSP430F676x1,MSP430F674x1

See the device data sheets for device specifications. Device errata can be found in the respective deviceproduct folder on the web provided as a PDF document. Depending on the device, errata may also befound in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.



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www.ti.com Kit Contents, EM430Fx1x7RF900

1.13 Kit Contents, EM430Fx1x7RF900• One READ ME FIRST document

• One legal notice

• Two target socket module

MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on whichis soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also presenton the PCB

MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on whichis soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCB

MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on whichis soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also presenton the PCB

• Two CC430EM battery packs

• Four AAA batteries

• Two 868- or 915-MHz antennas

• Two 32.768-kHz crystals

• 18 PCB 2×4-pin headers

1.14 Hardware Installation, MSP-FET430PIF

Follow these steps to install the hardware for the MSP-FET430PIF tools:

1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. Thenecessary driver for accessing the PC parallel port is installed automatically during CCS or IAREmbedded Workbench installation. Note that a restart is required after the CCS or IAR EmbeddedWorkbench installation for the driver to become active.

2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, suchas an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.

1.15 Hardware Installation, MSP-FET430UIF

Follow these steps to install the hardware for the MSP-FET430UIF tool:

1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDEinstallation installs drivers automatically.

2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FETshould be recognized, as the USB device driver is installed automatically. If the driver has not beeninstalled yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.

The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC orc:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version ofthe tool.

The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.

The USB driver is installed automatically. Detailed driver installation instructions can be found inAppendix C.

3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash forapproximately two seconds. If the self-test passes successfully, the green LED stays on.

4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as anMSP-TS430xxx target socket module.

5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.

6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAGsecurity fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.



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Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 www.ti.com

1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529

To install eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools followinstructions 1 and 2 of Section 1.15

1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,EM430Fx137RF900

Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:

1. Follow instructions 1 and 2 of Section 1.15

2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.

3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with acircular indentation on the top surface) aligns with the "1" mark on the PCB.

4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrationsof the target socket modules and their parts are found in Appendix B.

1.18 Important MSP430 Documents on the Web

The primary sources of MSP430 information are the device-specific data sheet and user's guide. TheMSP430 web site (www.ti.com/msp430) contains the most recent version of these documents.

PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and thelibrarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) isavailable, and the Texas Instruments E2E Community support forums for the MSP430 and CodeComposer Studio v5 provide additional help besides the product help and Welcome page.

PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, thelatest information) are available in HTML format in the same directories. A IAR specific Wiki Page is alsoavailable.



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Chapter 2SLAU278M–May 2009–Revised March 2013

Design Considerations for In-Circuit Programming

This chapter presents signal requirements for in-circuit programming of the MSP430.

Topic ........................................................................................................................... Page

2.1 Signal Connections for In-System Programming and Debugging ............................ 222.2 External Power .................................................................................................. 262.3 Bootstrap Loader (BSL) ..................................................................................... 26

21SLAU278M–May 2009–Revised March 2013 Design Considerations for In-Circuit ProgrammingSubmit Documentation Feedback



Signal Connections for In-System Programming and Debugging www.ti.com

2.1 Signal Connections for In-System Programming and Debugging

MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430

With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. Inaddition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,thus providing an easy way to program prototype boards, if desired.

Figure 2-1 shows the connections between the 14-pin FET interface module connector and the targetdevice required to support in-system programming and debugging for 4-wire JTAG communication.Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode issupported on most MSP430 devices except of small pin count devices e.g. MSP430G2230. The 2-wireJTAG mode is available on selected devices only. See the CCS User's Guide for MSP430 (SLAU157) orIAR for MSP430 User's Guide (SLAU138) for information on which interface method can be used on whichdevice.

The connections for the FET interface module and the MSP-GANG, MSP-GANG430 or MSP-PRGS430are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board (viapin 2). In addition, the FET interface module, MSP-GANG and MSP-GANG430 have a VCC-sense featurethat, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses thelocal VCC present on the target board (that is, a battery or other local power supply) and adjusts the outputsignals accordingly. If the target board is to be powered by a local VCC, then the connection to pin 4 on theJTAG should be made, and not the connection to pin 2. This utilizes the VCC-sense feature and preventsany contention that might occur if the local on-board VCC were connected to the VCC supplied from the FETinterface module, MSP-GANG or the MSP-GANG430. If the VCC-sense feature is not necessary (that is, ifthe target board is to be powered from the FET interface module, MSP-GANG or MSP-GANG430), theVCC connection is made to pin 2 on the JTAG header and no connection is made to pin 4. Figure 2-1 andFigure 2-2 show a jumper block that supports both scenarios of supplying VCC to the target board. If thisflexibility is not required, the desired VCC connections may be hard-wired eliminating the jumper block. Pins2 and 4 must not be connected simultaneously.

Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signalto the JTAG connector is optional when using devices that support only 4-wire JTAG communicationmode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAGmode, the RST connection must be made. The MSP430 development tools and device programmersperform a target reset by issuing a JTAG command to gain control over the device. However, if this isunsuccessful, the RST signal of the JTAG connector may be used by the development tool or deviceprogrammer as an additional way to assert a device reset.

22 Design Considerations for In-Circuit Programming SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback


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1

3

5

7

9

11

13

2

4

6

8

10

12

14

TDO/TDI

TDI/VPP

TMS

TCK

GND

TEST/VPP

JTAG

VCC TOOL

VCC TARGET

J1 (see Note A)

J2 (see Note A)

VCC

R1

47 k

(see Note B)

W

C2

10 µF

C3

0.1 µF

V /AV /DVCCCC CC

RST/NMI

TDO/TDI

TDI/VPP

TMS

TCK

TEST/VPP (see Note C)

V /AV /DVSS SS SS

MSP430Fxxx

C1

10 nF/2.2 nF

(see Notes B and E)

RST (see Note D)

www.ti.com Signal Connections for In-System Programming and Debugging

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 familyuser's guide for the recommended configuration.

C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific datasheet to determine if this pin is available.

D The connection to the JTAG connector RST pin is optional when using 4-wire JTAG communication mode capable-only devices and not required for device programming or debugging. However, this connection is required when using2-wire JTAG communication mode capable devices in 4-wire JTAG mode.

E When using 2-wire JTAG communication capable devices in 4-wire JTAG mode, the upper limit for C1 should notexceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).

Figure 2-1. Signal Connections for 4-Wire JTAG Communication



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1

3

5

7

9

11

13

2

4

6

8

10

12

14

VCC / AV CC / DVCC

VSS / AV SS / DVSS

TEST/SBWTCK

MSP430Fxxx

RST/NMI/SBWTDIO

10μF 0.1μF47kΩ

TDO/TDI

TCK

GND

TEST/VPP

VCC

JTAG

R1

VCC TOOL

VCC TARGET

2.2 nF

See Note B

C1

C2 C3

330Ω

R2

J1 (see Note A)

J2 (see Note A)

See Note B

Signal Connections for In-System Programming and Debugging www.ti.com

A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,make connection J2.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.

C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by theTEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)and do not connect TEST/VPP to TEST/SBWTCK.

Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,MSP430G2xx and MSP430F4xx Devices



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1

3

5

7

9

11

13

2

4

6

8

10

12

14

VCC / AV CC / DVCC

VSS / AV SS / DVSS

TEST/SBWTCK

MSP430Fxxx

RST/NMI/SBWTDIO

10µF 0.1μF47kΩ

TDO/TDI

TCK

GND

VCC

JTAG

R1

VCC TOOL

VCC TARGET

C1

C2 C3

J1 (see Note A)

J2 (see Note A)

2.2 nF

See Note B

See Note B

www.ti.com Signal Connections for In-System Programming and Debugging

A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from thedebug or programming adapter.

B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device duringJTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection withthe device. The upper limit for C1 is 2.2 nF when using current TI tools.

Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx andMSP430F6xx Devices



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External Power www.ti.com

2.2 External Power

The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Pleasenote that the target should not consume more than 60 mA, even as a peak current, as it may violate theUSB specification. E.g., if the target board has a capacitor on VCC more than 10 µF, it may cause inrushcurrent during capacitor charging that may exceed 60 mA. In this case the current should be limited by thedesign of the target board, or an external power supply should be used.

The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the targetcan be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pinconnector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;not both at the same time.

When a target socket module is powered from an external supply, the external supply powers the deviceon the target socket module and any user circuitry connected to the target socket module, and the FETinterface module continues to be powered from the PC via the parallel port. If the externally suppliedvoltage differs from that of the FET interface module, the target socket module must be modified so thatthe externally supplied voltage is routed to the FET interface module (so that it may adjust its outputvoltage levels accordingly). See the target socket module schematics in Appendix B.

The PC parallel port can source a limited amount of current. Because of the ultralow-power requirement ofthe MSP430, a standalone FET does not exceed the available current. However, if additional circuitry isadded to the tool, this current limit could be exceeded. In this case, external power can be supplied to thetool via connections provided on the target socket modules. See the schematics and pictorials of thetarget socket modules in Appendix B to locate the external power connectors. Note that the MSP-FET430PIF is not recommended for new design.

2.3 Bootstrap Loader (BSL)

The JTAG pins provide access to the flash memory of the MSP430Fxxx devices. On some devices, thesepins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing maynot be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program(a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set ofsignals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes thisinterface. See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers.

TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggestsproviding access to these signals by, for example, a header).

See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.



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Appendix ASLAU278M–May 2009–Revised March 2013

Frequently Asked Questions and Known Issues

This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.

Topic ........................................................................................................................... Page

A.1 Hardware FAQs ................................................................................................. 28A.2 Known Issues ................................................................................................... 30

27SLAU278M–May 2009–Revised March 2013 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback



Hardware FAQs www.ti.com

A.1 Hardware FAQs1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information

Due to the large capacitive coupling introduced by the device socket between the adjacent signalsXIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb theLFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire(2-wire) JTAG configuration and only to the period while a debug session is active.Workarounds:

• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAGconfiguration. This can be achieved by placing jumpers JP4 through JP9 accordingly.

• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-downmenu (at top of Debug View). This prevents the debugger from accessing the MSP430 while theapplication is running. Note that, in this mode, a manual halt is required to see if a breakpoint washit. See the IDE documentation for more information on this feature.

• Use an external clock source to drive XIN directly.

2. With current interface hardware and software, there is a weakness when adapting target boardsthat are powered externally. This leads to an accidental fuse check in the MSP430. This is valid forPIF and UIF but is mainly seen on UIF. A solution is being developed.Workarounds:

• Connect RST/NMI pin to JTAG header (pin 11), LPT and USB tools are able to pull the RST line,which also resets the device internal fuse logic.

• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-downmenu. This prevents the debugger from accessing the MSP430 while the application is running.Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDEdocumentation for more information on this feature.

• Use an external clock source to drive XIN directly.

3. The 14-conductor cable connecting the FET interface module and the target socket module must notexceed 8 inches (20 centimeters) in length.

4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and theUSB FET.

5. To utilize the on-chip ADC voltage references, the capacitor must be installed on the targetsocket module. See schematic of the target socket module to populate the capacitor according to thedata sheet of the device.

6. To utilize the charge pump on the devices with LCD+ Module, the capacitor must be installed onthe target socket module. See schematic of the target socket module to populate the capacitoraccording to the data sheet of the device.

7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.For MSP430 devices that contain user-selectable loading capacitors, see device and crystal datasheets for the value of capacitance.

8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger orC-SPY (as any required clocking and timing is derived from the internal DCO and FLL).

9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.For C-SPY: "Release JTAG On Go" must be selected.

10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider usingan MSP430 device that is a "superset" of the smaller device. A very powerful feature of theMSP430 is that the family members are code and architecturally compatible, so code developed onone device (for example, one without shared JTAG and port pins) ports effortlessly to another(assuming an equivalent set of peripherals).

28 Frequently Asked Questions and Known Issues SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback


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www.ti.com Hardware FAQs

11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.Customers should erase the information memory before its first use. Main memory of packageddevices is blank when the device is delivered from TI.

12. The device current is higher then expected. The device current measurement may not be accuratewith the debugger connected to the device. For accurate measurement, disconnect the debugger.

13. The following ZIF sockets are used in the FET tools and target socket modules:

• 8-pin device (D package): Yamaichi IC369-0082

• 14-pin device (PW package): Enplas OTS-14-065-01

• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146

• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02

• 28-pin device (DW package): Wells-CTI 652 D028

• 28-pin device (PW package): Enplas OTS-28-0.65-01

• 38-pin device (DA package): Yamaichi IC189-0382-037

• 40-pin device (RHA package): Enplas QFN-40B-0.5-01

• 40-pin device (RSB package): Enplas QFN-40B-0.4

• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001

• 48-pin device (DL package): Yamaichi IC51-0482-1163

• 64-pin device (PM package): Yamaichi IC51-0644-807

• 64-pin device (RGC package): Yamaichi QFN11T064-006

• 80-pin device (PN package): Yamaichi IC201-0804-014

• 100-pin device (PZ package): Yamaichi IC201-1004-008

• 128-pin device (PEU package): Yamaichi IC500-1284-009P

Enplas: www.enplas.com

Wells-CTI: www.wellscti.com

Yamaichi: www.yamaichi.us

29SLAU278M–May 2009–Revised March 2013 Frequently Asked Questions and Known IssuesSubmit Documentation Feedback


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http://www.enplas.com

http://www.wellscti.com/

http://www.yamaichi.us/


Known Issues www.ti.com

A.2 Known Issues

MSP-FET430UIF Current detection algorithm of the UIF firmware

Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequentlyswitching on and off the target power supply. This power switching puts some MSP430devices such as the MSP430F5438 in a state that requires a power cycle to return thedevice to JTAG control.

A side issue is that if the UIF firmware has entered this switch on and switch off loop, itis not possible to turn off the power supply to the target by calling MSP430_VCC(0). Apower cycle is required to remove the device from this state.

Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version2.04.00.003 and higher do not show this problem. Update the software development toolto this version or higher to update the MSP-FET430UIF firmware.

MSP-FET430PIF Some PCs do not supply 5 V through the parallel port

Problem Description Device identification problems with modern PCs, because the parallel port often does notdeliver 5 V as was common with earlier hardware.

1. When connected to a laptop, the test signal is clamped to 2.5 V.

2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adaptervia pin 4 (sense).

Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to theVCC pads of the interface. The jumper on a the target socket must be switched toexternal power.

30 Frequently Asked Questions and Known Issues SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback


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Appendix BSLAU278M–May 2009–Revised March 2013

Hardware

This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,and bills of materials. All other tools, such as the eZ430 series, are described in separate product-specificuser's guides.

31SLAU278M–May 2009–Revised March 2013 HardwareSubmit Documentation Feedback



Appendix B www.ti.com

Topic ........................................................................................................................... Page

B.1 MSP-TS430D8 ................................................................................................... 33B.2 MSP-TS430PW14 ............................................................................................... 36B.3 MSP-TS430L092 ................................................................................................ 39B.4 MSP-TS430L092 Active Cable ............................................................................. 42B.5 MSP-TS430PW24 ............................................................................................... 45B.6 MSP-TS430DW28 ............................................................................................... 48B.7 MSP-TS430PW28 ............................................................................................... 51B.8 MSP-TS430PW28A ............................................................................................. 54B.9 MSP-TS430DA38 ............................................................................................... 57B.10 MSP-TS430QFN23x0 .......................................................................................... 60B.11 MSP-TS430RSB40 ............................................................................................. 63B.12 MSP-TS430RHA40A ........................................................................................... 66B.13 MSP-TS430DL48 ................................................................................................ 69B.14 MSP-TS430RGZ48B ........................................................................................... 72B.15 MSP-TS430RGZ48C ........................................................................................... 75B.16 MSP-TS430PM64 ............................................................................................... 78B.17 MSP-TS430PM64A ............................................................................................. 81B.18 MSP-TS430RGC64B ........................................................................................... 84B.19 MSP-TS430RGC64C ........................................................................................... 87B.20 MSP-TS430RGC64USB ....................................................................................... 91B.21 MSP-TS430PN80 ............................................................................................... 95B.22 MSP-TS430PN80A ............................................................................................. 98B.23 MSP-TS430PN80USB ....................................................................................... 101B.24 MSP-TS430PZ100 ............................................................................................ 105B.25 MSP-TS430PZ100A .......................................................................................... 108B.26 MSP-TS430PZ100B .......................................................................................... 111B.27 MSP-TS430PZ100C .......................................................................................... 114B.28 MSP-TS430PZ5x100 ......................................................................................... 118B.29 MSP-TS430PZ100USB ...................................................................................... 121B.30 MSP-TS430PEU128 .......................................................................................... 125B.31 EM430F5137RF900 ........................................................................................... 128B.32 EM430F6137RF900 ........................................................................................... 132B.33 EM430F6147RF900 ........................................................................................... 136B.34 MSP-FET430PIF ............................................................................................... 140B.35 MSP-FET430UIF ............................................................................................... 142

32 Hardware SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback


http://www.ti.com


GN

D

10

0n

F

330R

10

uF

/10

V

47K

2.2

nF

GN

D

330R

GN

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T/S

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K7

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www.ti.com MSP-TS430D8

B.1 MSP-TS430D8

Figure B-1. MSP-TS430D8 Target Socket Module, Schematic



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Connector J5

External power connector

Jumper JP3 to "ext"Jumper JP2

Open to disconnect LED

D1 LED connected to P1.2

Orient Pin 1 of MSP430 device

14 pin connector for debugging only

in Spy-Bi-Wire mode (4 Wire JTAG

not available)

MSP-TS430D8 www.ti.com

Figure B-2. MSP-TS430D8 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430D8

Table B-1. MSP-TS430D8 Bill of Materials

No. perPosition Ref Des Description DigiKey Part No. CommentBoard

1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header

2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2

3 SBW 1 10-pin connector, male, TH HRP10H-ND

4 J3 1 3-pin header, male, TH SAM1035-03-ND

5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292

6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND

7 R5 1 47K, 0805 541-47000ATR-ND

8 C5 1 100nF, CSMD0805 311-1245-2-ND

9 R2, R3 2 330R, 0805 541-330ATR-ND

DNP: headers enclosed with kit.10 J1, J2 2 4-pin header, TH SAM1029-04-ND Keep vias free of solder.

DNP: receptacles enclosed with10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND kit.

11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi

12 D1 1 red, LED 0603

"DNP: enclosed with kit. Is13 MSP430 2 MSP430x supplied by TI"

MSP-TS430D8 Rev.14 PCB 1 50,0mmx44,5mm 1.0



http://www.ti.com


12pF

12pF

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J8

1 2 3

J9

1 2 3

J10

1 2 3

J11

1 2 3

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P1.4

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P1.5

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MSP-TS430PW14 www.ti.com

B.2 MSP-TS430PW14

Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic



http://www.ti.com


Jumper J4Open to disconnect LED

Orient Pin 1 ofMSP430 device

Jumper J6Open to measure current

Connector J3External power connectorJumper J5 to 'ext'

LED connected to P1.0

Jumpers J7 to J12Close 1-2 to debug inSpy-Bi-Wire Mode.Close 2-3 to debug in4-wire JTAG mode.

www.ti.com MSP-TS430PW14

Figure B-4. MSP-TS430PW14 Target Socket Module, PCB



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Table B-2. MSP-TS430PW14 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

10uF, 10V, Tantal Size2 C7 1 511-1463-2-NDB

3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3

4 C8 0 2.2nF, SMD0805 DNP

5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder6 J1, J2 0 7-pin header, TH

SAM1029-07-ND : Header

SAM1213-07-ND : Receptacle

J3, J5, J7, Place jumpers on headers J5, J7, J8,7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2J11, J12

8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2

14-pin connector, male,10 JTAG 1 HRP14H-NDTH

Micro Crystal MS1V-T1K12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

12.5pF

13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas

17 PCB 1 56 x 53 mm 2 layers

For example, 3MAdhesive Approximately 6mm18 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 5302

19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI



http://www.ti.com


www.ti.com MSP-TS430L092

B.3 MSP-TS430L092

Figure B-5. MSP-TS430L092 Target Socket Module, Schematic



http://www.ti.com


MSP-TS430L092 www.ti.com

Settings of the MSP-TS430L092 Target Socket

Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning isrecommended:

• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.

• JP2 and JP3 connect device supply with boost converter. They can be opened to measure devicecurrent consumption. For default operation, they should be closed.

Figure B-6. MSP-TS430L092 Target Socket Module, PCB



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www.ti.com MSP-TS430L092

Table B-3. MSP-TS430L092 Bill of Materials

No. PerPos. Ref Des No. Description DigiKey Part No. CommentBoard

1 C1, C2 2 330nF, SMD0603

2 C5 1 100n, SMD0603

3 C6 1 10u, SMD0805

4 C10 1 100n, SMD0603

5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2 2 7-pin header, TH




DNP; Keep vias free of9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe solder.

Reichelt: MicroMaTch-11 J13 1 MICRO_STECKV_10 Connector: MM FL 10G

12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header

15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557

16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065

17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC

18 R0, R6, R7 3 2K7, SMD0603

19 R1 1 1k, SMD0603

20 R2 1 47k, SMD0603

R4,R5, R8,21 6 10k, SMD0603R10, RC, RD

22 RA 1 3.9k, SMD0603

23 RB 1 6.8k, SMD0603

14 Pin Socket - IC189-0142-24 U1 1 Manuf. Yamaichi146

DNP: Enclosed with kit. Is22 MSP430 2 MSP430L092PWR supplied by TI.



http://www.ti.com


MSP-TS430L092 Active Cable www.ti.com

B.4 MSP-TS430L092 Active Cable

Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic



http://www.ti.com


www.ti.com MSP-TS430L092 Active Cable

Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:

• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.

Table B-4. MSP-TS430L092 JP1 Settings

Jumper 1 Jumper 2 Description

Off Off The active cable has no power and does not function.

The active cable receives power from target socket. For this option, theOff On target socket must have its own power supply.

On Off The active cable receives power from the JTAG connector.

The JTAG connector powers the active cable and the target socket. ForOn On this option, the target socket must not have its own power source, as this

would cause a not defined state.

• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin tohigh and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.

Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB



http://www.ti.com


MSP-TS430L092 Active Cable www.ti.com

Table B-5. MSP-TS430L092 Active Cable Bill of Materials

No. PerPos. Ref Des Description DigiKey Part No. CommentBoard

C1, C3, C5,1 4 100nF, SMD0603C6

2 C2, C4 2 1uF, SMD0805

3 R1, R10 2 10K, SMD0603

4 R2 1 4K7, SMD0603

R5, R6, R7,5 4 100, SMD0603R9

6 R8 1 680k, SMD0603

7 R11, R15 2 1K, SMD0603

8 R12 0 SMD0603 DNP

9 R13 0 SMD0603 DNP

10 R14 1 0, SMD0603

11 IC1 1 SN74AUC1G04DBVR Manu: TI

12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI

Reichelt: MicroMaTch-13 J2 1 MICRO_STECKV_10 Connector: MM FL 10G

Put jumper on Position 1 and14 JP1 1 2x2 Header JP2Q 2. Do not mix direction.

15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header

16 JTAG 1 14-pin connector, male, TH HRP14H-ND

BC817-25LT1SMD, SOT23- Digi-Key: BC817-17 Q1 1 BEC 25LT1GOSCT-ND

18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI



http://www.ti.com



B.5 MSP-TS430PW24




http://www.ti.com


Jumper JP2Open to measure current



Jumper JP3Open to disconnect LED

Connector J5External power connectorJumper JP1 to "ext"

Jumpers JP4 to JP9Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode





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Table B-6. MSP-TS430PW24 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C5 1 2.2nF, SMD0805

3 C3, C7 2 10uF, 10V, SMD0805

4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND

5 D1 1 green LED, SMD0805 P516TR-ND

DNP: Headers and receptacles"SAM1029-07-6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free ofNDSAM1213-07-ND" solder. (Header & Receptacle)

J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9

8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

9 9 Jumper 15-38-1024-ND see Pos 7 an 8


11 Q1 0 Crystal DNP: keep vias free of solder

12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R5, R6,13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6R8, R9,

14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND

Socket: OTS 24(28)-15 U1 1 Manuf.: Enplas065-02-00

16 PCB 1 68.5 x 61 mm 2 layers

for example, 3MAdhesive Approximately 6mm17 4 Bumpons Part No. SJ- Apply to corners at bottom sideplastic feet width, 2mm height 5302

18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI



http://www.ti.com


ML

14

LE

D3

12

pF

12

pF

GN

D

GND

10

0n

F

56

0R

ML

10

JP

1Q

JP

1Q

10

uF

/10

V

50

K1

0n

F

0R

0R

0R

-

-0R

-

U1

SO

CK

28

DW

F1

23

FE

14

HF

E1

4L

0R

GN

D

rem

ove

R8

an

d a

dd

R9

(0 O

hm

)

If exte

rna

l su

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ly v

olta

ge

:re

mo

ve

R11

an

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dd

R1

0 (0

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m)

SM

D-F

oo

tprin

t

So

cke

t:Y

am

aic

hi

2.0

MS

P-T

S4

30

DW

28

Ta

rge

t So

cke

t DW

28

Typ

e: IC

18

9-0

28

2-0

42

If exte

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ly v

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ge

:

R1

, C1

, C2

no

t asse

mb

led

no

t asse

mb

led

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

D1

C2

C1

C5

R3

BO

OT

ST

12

34

56

78

91

0

1 2

J5

J4

12

C7

R5

C8

R6

R7

R8

R9

R1

0

R11

R1

12345678910

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

U2

15

16

17

18

19

20

21

22

23

24

25

26

27

28

J2

J1

12345678910

11

12

13

14

R2

123

J3

Q1

QUARZ3

P1

.0

P1

.0

P1

.3

P1

.3

P1

.2

P1

.2

P1

.1

P1

.1R

ST

/NM

I

RS

T/N

MI

RS

T/N

MIRS

T/N

MI

RS

T/N

MI

TC

K

TC

K

TC

K

TM

S

TM

S

TM

S

TD

I

TD

I

TD

I

TD

O

TD

O

TD

O

XO

UT

XO

UT

VC

C

GN

D

GN

D

GN

D

P2

.3

P2

.3

P2

.4

P2

.4

XIN

XIN

P2

.5

P2

.5

P2

.2

P2

.2P

2.1

P2

.1

P2

.0

P2

.0

TS

T/V

PP

TS

T/V

PP

TS

T/V

PP

P3

.0

P3

.0

P3

.1

P3

.1

P3

.2

P3

.2

P3

.3

P3

.3

P3

.7

P3

.7

P3

.6

P3

.6

P3

.5

P3

.5

P3

.4

P3

.4

VC

C4

30

Ext_

PW

R

Da

te:

11

/14

/20

06

1:2

6:0

4 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

DW

28

+

VC

C4

30

MSP-TS430DW28 www.ti.com

B.6 MSP-TS430DW28

Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic



http://www.ti.com


Jumper J4


Orient Pin 1 of

MSP430 device

Jumper J5

Open to measure current

Connector J3


Remove R8 and jumper R9


www.ti.com MSP-TS430DW28

Figure B-12. MSP-TS430DW28 Target Socket Module, PCB



http://www.ti.com


MSP-TS430DW28 www.ti.com

Table B-7. MSP-TS430DW28 Bill of Materials


DNP: C1, C2, Cover holes while1 C1, C2 0 12pF, SMD0805 soldering

2 C5 1 100nF, SMD0805

3 C7 1 10uF, 10V Tantal Elko B

4 C8 1 10nF SMD0805

5 D1 1 LED3 T1 3mm yellow RS: 228-4991

Micro Crystal MS1V-T1K6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering

12.5pF

DNP: Headers and receptaclesenclosed with kit. Keep vias free ofsolder.7 J1, J2 2 14-pin header, TH male: Header

: Receptacle

DNP: Headers and receptaclesenclosed with kit. Keep vias free of

14-pin header, TH solder.7.1 2 female : Header

: Receptacle

8 J3 1 3-Pin Connector, male

9 J4, J5 2 2-Pin Connector, male With jumper

10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering

11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121

R1, R2,R6, R7,12 4 0R, SMD0805 DNP: R1, R2, R9, R10R8,R9,

R10, R11

13 R3 1 560R, SMD0805

14 R5 1 47K, SMD0805

Yamaichi: IC189-0282-15 U1 1 SOP28DW socket 042

16 U2 0 TSSOP DNP



http://www.ti.com


12pF

12pF

GN

D

GN

D

100nF

33

0R

10uF

/10V

-

0R

GN

D

GN

D

gre

en

2.2

nF

47

kG

ND

0R

0R

33

0R

MS

P430F

12xx

If exte

rnal s

upply

volta

ge:

rem

ove R

11 a

nd a

dd R

10 (0

Ohm

)

3.1

MS

P-T

S4

30

PW

28

:

OT

S-2

8-0

.65-0

1S

ocket: E

npla

s

Vcc

int

ext

Targ

et S

ocket B

oard

for M

SP

430

's in

PW

28 p

ackage

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

JTA

G ->

SB

W ->

JTA

G-M

ode s

ele

ctio

n:

4-w

ire J

TA

G: S

et ju

mpers

JP

4 to

JP

9 to

positio

n 2

-32-w

ire "S

pyB

iWire

": Set ju

mpers

JP

4 to

JP

9 to

positio

n 1

-2

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C4

R1

12

34

56

78

91

0

BO

OT

ST

C3

R2

R3

123

J5

JP

1

1 2 3

JP

2

1 212J

P3

D1

C5

R4

JP

4

1 2 3

JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

JP

9

1 2 3

R5

R6

21

Q1

R7

J1

12345678910

11

12

13

14

J2

1 2 3 4 5 6 7 8 91

011

12

13

14

U1 TS

T1

VC

C2

P2

.53

VS

S4

XO

UT

5

XIN

6

RS

T7

P2

.08

P2

.19

P2

.21

0P

2.3

19

P2

.42

0P

1.0

21

P1

.12

2P

1.2

23

P1

.32

4P

1.4

25

P1

.52

6P

1.6

27

P1

.72

8

P3

.011

P3

.11

2

P3

.21

3

P3

.31

4P

3.4

15

P3

.51

6P

3.6

17

P3

.71

8

P1.0

P1.0

RS

T/N

MI

TM

ST

DI

VC

C

GN

D

GN

D

VC

C430

VC

C430

P2.0

P1.1

P1.1

P3.3

P3.2

P3.1

P3.0

P2.2

P2.2

XIN

/P2.6

XIN

/P2.6

XO

UT

/P2.7

XO

UT

/P2.7

P2.1

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

RS

T/S

BW

TD

IO

P3.4

P3.5

P3.6

P3.7

P2.3

P2.4

P1.2

P1.3

P1.4

/TC

K

P1.4

/TC

K

P1.5

/TM

S

P1.5

/TM

S

P1.6

/TD

I

P1.6

/TD

I

P1.7

/TD

O

P1.7

/TD

O

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

P2.5

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

XT

LG

ND

Ext_

PW

R

+


B.7 MSP-TS430PW28




http://www.ti.com




LED D1 connected to P5.1

Jumper JP11-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply

Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode

Orient Pin 1 of Device





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Table B-8. MSP-TS430PW28 Bill of Materials (1)

No. perPos. Ref Des Description DigiKey Part No. CommentBoard

DNP: C1, C2 , Cover holes1 C1, C2 0 12pF, SMD0805 while soldering

2 C3 1 10uF, 10V Tantal Elko B

3 C4 1 100nF, SMD0805

4 C5 0 2.2nF, SMD0805 DNP

5 D1 1 LED green SMD0603

Micro Crystal MS1V-T1K DNP: Cover holes and6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while

12.5pF soldering

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2 2 14-pin header, TH male: Header

: Receptacle

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.7.1 2 14-pin header, TH female: Header

: Receptacle

8 J5, IP1 1 3-Pin Connector , male

JP1, JP4,JP5, JP6,8a 7 3-Pin Connector , male Jumper on Pos 1-2JP7, JP8,

JP9

9 JP2, JP3 2 2-Pin Connector , male with Jumper

DNP: Cover holes while10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering

11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121

12 R1, R7 2 330R, SMD0805

R2, R3, R5,12 0 0R, SMD0805 DNPR6

14 R4 1 47K, SMD0805

15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces



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MSP-TS430PW28A www.ti.com

B.8 MSP-TS430PW28A

Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic



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www.ti.com MSP-TS430PW28A

Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red)



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MSP-TS430PW28A www.ti.com

Table B-9. MSP-TS430PW28A Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C5 1 2.2nF, SMD0805

3 C3 1 10uF, 10V, SMD0805

4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND


DNP: Headers and receptacles6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of

solder: (Header & Receptacle)

J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP97 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9




11 BOOTST 0 DNP Keep vias free of solder

Micro Crystal MS3V12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder

12.5pF

13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND

R2, R3,R5,14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6R6,

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas

17 PCB 1 63.5 x 64.8 mm 2 layers


19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI



http://www.ti.com


12

pF

12

pF

GN

D

GN

D

10

0n

F

560R

10

uF

/10

V

47k

10nF

-

0R

GN

D

MS

P4

30

F2

27

4ID

A

GN

D330R

GN

D

ye

llow

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R11

an

d a

dd

R1

0 (0

Oh

m)

IC1

89

-03

82

-03

7

So

cke

t:

4-w

ire J

TA

G:

2-w

ire "S

pyB

iWire

":

JTA

G-M

od

e s

ele

ctio

n:

Se

t jum

pe

rs J

P4

to J

P9

to p

ositio

n 2

-3

Se

t jum

pe

rs J

P4

to J

P9

to p

ositio

n 2

-1

JTA

G ->

SB

W ->

Ya

ma

ich

i

DN

P

DN

P

DN

PD

NP

DN

P

DN

P

DN

P

1 3 5 7 9 11

13

2 4 6

12

148

10

JTA

G

C2C1

C5

R3

12

34

56

78

910

BO

OT

ST

C7

R5

C8

R10

R11

123

J3

Q1

TE

ST

/SB

WT

CK

1

P3.5

26

P3.6

27

P1.4

/TC

K35

RS

T/S

BW

DA

T7

DV

CC

2

DV

SS

4

P4.7

24

P3.7

28

AV

SS

15

AV

CC

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23

24

25

26

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28

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30

31

32

33

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Date

:6/1

8/2

008 1

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heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430D

A38

+

1.3

MS

P-T

S430D

A38:

Vcc

int

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t So

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22

47

IDA

www.ti.com MSP-TS430DA38

B.9 MSP-TS430DA38

Figure B-17. MSP-TS430DA38 Target Socket Module, Schematic



http://www.ti.com


Orient pin 1 ofMSP430 device


Connector J3External power connectorJumper JP1 to 'ext'



Jumpers JP4 to JP9Close 1-2 to debug inSpy-Bi-Wire Mode,Close 2-3 to debug in4-wire JTAG Mode

MSP-TS430DA38 www.ti.com

Figure B-18. MSP-TS430DA38 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DA38

Table B-10. MSP-TS430DA38 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND

3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 0 2.2nF, SMD0805 DNP

5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 19-pin header, TH



"J3, JP1, Place jumpers on headersJP4, JP5,7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7,JP6, JP7, JP8, JP9; Pos 1-2JP8, JP9"


Place on: JP1 - JP9; Pos 1-9 9 Jumper 15-38-1024-ND 2


DNP: Keep vias free of11 BOOTST 0 10-pin connector, male, TH solder

Micro Crystal MS1V-T1K DNP: Keep vias free of12 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND

14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi


Adhesive for example, 3M Bumpons Apply to corners at bottom18 4 ~6mm width, 2mm heightPlastic feet Part No. SJ-5302 side

DNP: enclosed with kit19 MSP430 2 MSP430F2274IDA supplied by TI



http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

B.10 MSP-TS430QFN23x0

Figure B-19. MSP-TS430QFN23x0 Target Socket Module, Schematic



http://www.ti.com


LED connected

to P1.0

Connector J5


Jumper JP1 to 'ext'

Jumper JP3


Jumper JP2


www.ti.com MSP-TS430QFN23x0

Figure B-20. MSP-TS430QFN23x0 Target Socket Module, PCB



http://www.ti.com


MSP-TS430QFN23x0 www.ti.com

Table B-11. MSP-TS430QFN23x0 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND

3 C4 1 100nF, SMD0805 478-3351-2-ND

4 C5 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: headers andreceptacles enclosed with

J1, J2, J3, kit.Keep vias free of solder.6 0 10-pin header, THJ4 SAM1034-10-ND : Header


Place jumper on header7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND JP1; Pos 1-2.


9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3




13 R1 1 330 Ω, SMD0805 541-330ATR-ND

14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND

16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas



DNP: enclosed with kit19 MSP430 2 MSP430F2370IRHA supplied by TI



http://www.ti.com


www.ti.com MSP-TS430RSB40

B.11 MSP-TS430RSB40

Figure B-21. MSP-TS430RSB40 Target Socket Module, Schematic



http://www.ti.com








MSP-TS430RSB40 www.ti.com

Figure B-22. MSP-TS430RSB40 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430RSB40

Table B-12. MSP-TS430RSB40 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

C3, C7, C10,2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12C12

C4, C6, C8,3 3 100nF, SMD0805 311-1245-2-ND DNP C11C11

4 C5 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805


DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 4 10-pin header, TH: Header

: Receptacle

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7.1 4 10-pin header, TH: Header

: Receptacle

JP1,JP4,JP5, Jumper: 1-2 on JP1, JP10; 2-8 JP6, JP7, 9 3-pin header, male, TH SAM1035-03-ND 3 on JP4-JP9JP8, JP9, J5,

JP10

9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header


DNP. Keep vias free of11 BOOTST 0 10-pin connector, male, TH solder

QFN-40B-0.4_12 U1 1 EnplasENPLAS_SOCKET

Micro Crystal MS3V-T1R DNP: Q1. Keep vias free of13 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

Place on: JP1, JP2, JP3,15 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,

JP9, JP10

16 R1,R7 2 330R SMD0805

R2, R3, R5,17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6

R10

18 R4 1 47k SMD0805

DNP: enclosed with kit. Is19 MSP430 2 MSP430F5132 supplied by TI

Rubber stand select appropriate; for apply to corners at bottom20 4off example, Buerklin: 20H1724 side



http://www.ti.com


MSP-TS430RHA40A www.ti.com

B.12 MSP-TS430RHA40A

Figure B-23. MSP-TS430RHA40A Target Socket Module, Schematic



http://www.ti.com








www.ti.com MSP-TS430RHA40A

Figure B-24. MSP-TS430RHA40A Target Socket Module, PCB



http://www.ti.com


MSP-TS430RHA40A www.ti.com

Table B-13. MSP-TS430RHA40A Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

2 C5 0 2.2nF, SMD0805 DNP C12

3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11

4 C4, C6 2 100nF, SMD0805 478-3351-2-ND

5 C9 1 470nF, SMD0805


DNP: headers and receptaclesenclosed with kit. Keep vias free of

J1, J2, J3, solder.7 4 10-pin header, THJ4 : Header

: Receptacle

DNP: headers and receptaclesenclosed with kit. Keep vias free ofsolder.7.1 4 10-pin header, TH: Header

: Receptacle

J5, JP1,JP4, JP5, Place jumper on 1-2 of JP4-JP9;8 8 3-pin header, male, TH SAM1035-03-NDJP6, JP7, Place on 1-2 on JP1JP8, JP9




10-pin connector, male,12 BOOTST 0 DNP. Keep vias free of solderTH

13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas

Micro Crystal MS3V-T1R14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder

12.5pF

15 R1,R7 2 330R SMD0805 541-330ATR-ND

R2, R3,16 R5, R6, 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6

R8, R9,

17 R4 1 47k SMD0805


select appropriate; forRubber19 4 example, Buerklin: apply to corners at bottom sidestand off 20H1724

DNP: enclosed with kit. Is supplied by20 MSP430 2 MSP430N5736IRHA TI



http://www.ti.com


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18

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19

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20

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39

P2.4

40

P2.3

41

P2.2

42

P2.1

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P2.0

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P5.0

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P5.5

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P2.6

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P1.7

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P1.6

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23

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Date

:11/1

4/2

006 1

:24:4

4 P

MS

heet:

1/1 R

EV

:

TIT

LE

:

Docum

ent N

um

ber:

MS

P-T

S430D

L48

+

+

Vcc

ext

int

int

ext Vcc

www.ti.com MSP-TS430DL48

B.13 MSP-TS430DL48

Figure B-25. MSP-TS430DL48 Target Socket Module, Schematic



http://www.ti.com


Jumper J4

Open to

disconnect LED

LED connected

to P1.0

Orient pin 1 of

MSP430 device

Jumper J5


Connector J3


Jumper JP1 to ‘ext’

MSP-TS430DL48 www.ti.com

Figure B-26. MSP-TS430DL48 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430DL48

Table B-14. MSP-TS430DL48 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND

3 C3, C5 2 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2 0 24-pin header, TH



Place jumper on header7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND JP1; Pos 1-2. DNP: JP2


9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5




13 R3 1 560 Ω, SMD0805 541-560ATR-ND

R4, R6, R7,14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7R12

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: IC51-1387 KS-16 U1 1 Manuf.: Yamaichi15186



DNP: Enclosed with kit19 MSP430 2 MSP430F4270IDL supplied by TI



http://www.ti.com


MSP-TS430RGZ48B www.ti.com

B.14 MSP-TS430RGZ48B

Figure B-27. MSP-TS430RGZ48B Target Socket Module, Schematic



http://www.ti.com








www.ti.com MSP-TS430RGZ48B

Figure B-28. MSP-TS430RGZ48B Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGZ48B www.ti.com

Table B-15. MSP-TS430RGZ48B Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,3 3 10uF, 6.3V, SMD0805C12

C5, C11,4 4 100nF, SMD0805 311-1245-2-NDC13, C14

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND


SAM1029-12-ND DNP: Headers and receptaclesJ1, J2, J3,8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free ofJ4 ND (Receptacle) solder:

9 J5 1 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5,JP6, JP7,10 7 3-pin header, male, TH SAM1035-03-ND JP6, JP7, JP8, JP9, JP10 placeJP8, JP9, jumpers on pins 1-2 on JP3,JP10


12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11


10-pin connector, male,14 BOOTST 0 "DNP Keep vias free of solder"TH

Micro Crystal MS3V-T1R15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

12.5pF

Q2: 4MHz Buerklin:16 Q2 0 Crystal DNP: Q2 Keep vias free of solder78D134

http://www.ettinger.de/ArInsulating17 0 Insulating disk to Q2 t_Detail.cfm?ART_ARTdisk to Q2 NUM=70.08.121

18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,R4, R6,

19 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R12

20 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: QFN11T048-21 U1 1 Manuf.: Yamaichi008_A101121_RGZ48



24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI



http://www.ti.com


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19_P4.319

20_P2.520

21_P2.621

22_TEST/SBWTCK22

23_RST/SBWTDIO23

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41_AVSS 4142_HFXIN 42

43_HFXOUT 4344_AVSS 4445_LFXIN 45

46_LFXOUT 4647_AVSS 4748_AVCC 48

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ND

HF

XO

UT

HF

XIN

P2.4P2.3P2.7DVCC

DV

CC

DV

CC

DVCC

DV

SS

DV

SS

P4.6

P4.5

P4.4

P1.7

P1.6

P3.7

P3.6

P3.5

P3.4

P2.2

P2.6P2.5P4.3P4.2P4.1P4.0

P4.7

P3.3

P3.2

P3.1

P3.0

TE

ST

/SB

WT

CK

1

TEST/SBWTCK

TE

ST

/SB

WT

CK

TE

ST

/SB

WT

CK

www.ti.com MSP-TS430RGZ48C

B.15 MSP-TS430RGZ48C

Figure B-29. MSP-TS430RGZ48C Target Socket Module, Schematic



http://www.ti.com


MSP-TS430RGZ48C www.ti.com

Figure B-30. MSP-TS430RGZ48C Target Socket Module, PCB

Table B-16. MSP-TS430RGZ48C Revision History

Revision Comments

1.2 Initial release

LFOSC pins swapped at SV1 (9-10).1.3 HFOSC pins swapped at SV1 (6-7).

BOOTST pin 4 now directly connected to the device RST/SBWTDIO pin.



http://www.ti.com


www.ti.com MSP-TS430RGZ48C

Table B-17. MSP-TS430RGZ48C Bill of Materials

NumberPos Ref Des Per Description DigiKey Part Number Comment

Board

1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.


: Receptacle

1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.SV4 Keep vias free of solder.

: Header


2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP

4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP6, JP7, JP8


6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,JP3, JP4, JP5, JP7, JP8JP6, JP7, JP8

7 R2, R3, R5, R6, 9 DNP, 0805 DNPR8, R9, R10, R11,R14

8 R12, R13, R7 3 0R, 0805 541-000ATR-ND

9 C5 1 1.1nF, CSMD0805 490-1623-2-ND

10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND

11 R4 1 47k, 0805 541-47000ATR-ND

12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND

13 R1 1 330R, 0805 541-330ATR-ND

14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP

15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459

16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder


18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias20ppm, 12.5pF) free of solder

19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder

20 U1 1 Socket: QFN11T048-008 Manuf.: YamaichiA101121-001

20.1 U1 1 MSP430 DNP: enclosed with kit. Is supplied by TI.

21 D1 1 green LED, DIODE0805 P516TR-ND

22 D3 1 red (DNP), DIODE0805 DNP

23 D2 1 yellow (DNP), DIODE0805 DNP

24 TP1, TP2 2 Testpoint DNP, keep pads free of solder

25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side

26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder maskRev. 1.2



http://www.ti.com


ML

14

LED3

0R

12

pF

12

pF

12

pF

12

pF

GN

D

GND

0R

100nF

56

0R

ML

10

JP1Q

JP

1Q

10uF/6,3V

10uF/10V

47K10nF

0R

0R

0R

-

-

0R

-

0R

0R

FE

16

-1-1

FE16-1-2

FE

16

-1-3

FE16-1-4

PWR3

GN

DG

ND

-

MS

P6

4P

M

not assembled

not a

ssem

ble

d

not a

ssem

ble

d

not a

ssem

ble

d

enhancement

reserved forfuture

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

D1

R2

C2

C1

C3

C4

R1

C5

R3

BO

OT

ST

12

34

56

78

91

0

J71 2

J6

12

C6

C7

R5C8

R6

R7

R8

R9

R10

R11

R12

R13

R14

12345678910

11

12

13

14

15

16

J1

J2

17181920212223242526272829303132

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

R4

Q1

LFXTCLK

XTCLK

U2

DV

CC

234567XIN

XO

UT

10

11

12

13

14

15

16

17181920212223242526272829303132

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

4950515253

TDOTDI

TMSTCKRST

596061

AVSSDVSSAVCC

RS

T/N

MI

TC

KT

MS

TD

IT

DO

VC

C

Da

te:

3/1

4/2

00

6 1

0:4

6:3

0A

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

+

+

1

MS

P-T

S4

30

PM

64

Ta

rge

t So

cke

t PM

64

Ya

ma

ich

iIC

51

-06

44

-80

7

So

cke

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1.2

for F

14

x a

nd

F4

1x

Op

en

J6

if LC

D

is c

on

ne

cte

d

If exte

rna

l su

pp

ly v

olta

ge

:re

mo

ve

R8

an

d a

dd

R9

(0 O

hm

)

If exte

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l su

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ly v

olta

ge

:re

mo

ve

R11

an

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dd

R1

0 (0

Oh

m)

Fo

r BS

Lu

sa

ge

ad

d:

R6

R7

R1

3 R

14

MS

P4

30

F1

4x : 0

0 o

pe

n o

pe

nM

SP

43

0F

41

x : o

pe

n o

pe

n 0

0

MSP-TS430PM64 www.ti.com

B.16 MSP-TS430PM64

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-31. MSP-TS430PM64 Target Socket Module, Schematic



http://www.ti.com


Connector J5

External power connection


LED connected

to pin 12

Jumper J6


Jumper J7


Orient Pin 1 of

MSP430 device

www.ti.com MSP-TS430PM64

Figure B-32. MSP-TS430PM64 Target Socket Module, PCB



http://www.ti.com


MSP-TS430PM64 www.ti.com

Table B-18. MSP-TS430PM64 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6

3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 C9 1 470nF, SMD0805 478-1403-2-ND


DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.7 J1, J2, J3, J4 0 16-pin header, TH





11 2 Jumper 15-38-1024-ND Place on: J6, J7



Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of14 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder12.5pF

15 R3 1 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R9, R10,16 R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND R11, R12, R13, R14R11, R12,R13, R14

17 R5 1 47k Ω, SMD0805 541-47000ATR-ND

18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi


Rubber Apply to corners at bottom20 4 select appropriatestandoff side

MSP430F2619IPM DNP: Enclosed with kit21 MSP430 22 MSP430F417IPM supplied by TI



http://www.ti.com


0R

12

pF

12

pF

GN

D

GN

D

0R

10

0n

F

33

0R

10

uF

/6.3

V

0R

0R

0R

0R

PWR3

GN

D

47

k

2.2

nF

33

0R

GN

D

GN

D

10

0n

F

GN

D

0R

0R

MS

P-T

S4

30

PM

64

ATa

rge

t So

cke

t

DN

P

Yam

aic

hi

IC51-0

644-8

07

Socket:

DN

P

1.1

for F

41

52

Open J

P1 if L

CD

is c

onnecte

d

JTA

G ->

SB

W ->

DN

P

DN

P

DN

P

DN

PD

NP

DN

PD

NP

Vccext

int

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IOP

7.0

/TD

OP

7.1

/TD

IP

7.2

/TM

SP

7.3

/TC

K

AD

D L

CD

-CA

P!

DN

PDN

P

JTA

G

1 3 5 7 9 11

13

2 4 6

12

148

10

R2

C2

C1 R

1

C5

R3

BO

OT

ST

12

34

56

78

91

0

C6

R1

0R

11

R1

3R

14

12345678910

11

12

13

14

15

16

J1

17181920212223242526272829303132

J2

J3

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49505152535455565758596061626364

J4

J5123

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32313029282726252423222120191817

16 12345678911

12

13

14

15

10

64636261605958575655545352515049

21

Q1

R4

C3

1 2 3JP

4JP

5

1 2 3

JP

6

1 2 3

JP

7

1 2 3

JP

8

1 2 3

R6

JP

9

1 2 3

12

JP

1

JP

2

1 2

JP

3

1 2 3

D1

C4R

5

R7

RS

T/N

MI

TM

ST

DI

VC

C

GN

D XT

LG

ND

TC

K/S

BW

TC

K

TD

O/S

BW

TD

IO

VC

C430

VC

C430

VC

C430

P5.1

P5.1 A

VC

C

AV

CC

AV

SS

AV

SS

P1.0

P1.1

XIN

XO

UT

A

AA

B

BB

C

C

D

D

E

E

F

F

Da

te:

3/2

9/2

011

3:0

7:0

2 P

MS

he

et:

1/1 R

EV

:

TIT

LE

:

Do

cu

me

nt N

um

be

r:

MS

P-T

S4

30

PM

64

A

+

TE

ST

/SB

WT

CK

RS

T/S

BW

TD

IO

If supplie

d lo

cally

: popula

te R

10 (0

R), re

move R

11

If supplie

d b

y in

terfa

ce: p

opula

te R

11 (0

R), re

move R

10

www.ti.com MSP-TS430PM64A

B.17 MSP-TS430PM64A

Figure B-33. MSP-TS430PM64A Target Socket Module, Schematic



http://www.ti.com





Jumper JP31-2 (int): Power supply via JTAG interface2-3 (ext): External Power Supply

Jumper JP4 to JP9:Close 1-2 to debug in Spy-Bi-Wire modeClose 2-3 to debug in 4-wire JTAG mode


MSP-TS430PM64A www.ti.com

Figure B-34. MSP-TS430PM64A Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PM64A

Table B-19. MSP-TS430PM64A Bill of Materials


1 C1, C2, 0 12pF, SMD0805 DNP

2 C3 0 2.2nF, SMD0805 DNP

3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND

4 C4, C5 2 100nF, SMD0805 478-3351-2-ND


DNP: Headers andreceptacles enclosed with kit.Keep vias free of solder.6 J1, J2, J3, J4 0 16-pin header, TH



J5, JP3, JP4,JP5, JP6,7 8 3-pin header, male, TH SAM1035-03-NDJP7, JP8,

JP9






13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R5,R7, R9, R10, DNP: R5, R7, R9, R10, R11,14 2 0 Ω, SMD0805 541-000ATR-NDR11, R13, R13, R14

R14

15 R4 1 47k Ω, SMD0805 541-47000ATR-ND



Rubber stand Apply to corners at bottom18 4 select appropriateoff side

DNP: Enclosed with kit19 MSP430 2 MSP430F4152IPM supplied by TI



http://www.ti.com


MSP-TS430RGC64B www.ti.com

B.18 MSP-TS430RGC64B

Figure B-35. MSP-TS430RGC64B Target Socket Module, Schematic



http://www.ti.com






If the system shouldbe supplied via LDOI (J6),close JP4 andset JP3 to external


www.ti.com MSP-TS430RGC64B

Figure B-36. MSP-TS430RGC64B Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGC64B www.ti.com

Table B-20. MSP-TS430RGC64B Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

3 C6, C7, C10 3 10uF, 6.3V, SMD0805

C5, C11,4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C15

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805



11 J5 , J6 2 3-pin header, male, TH

JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,JP6, JP7,12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers onJP8, JP9, pins 1-2 on JP3,JP10

JP1, JP2,13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on headerJP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13




12.5pF


http://www.ettinger.de/ArtInsulating19 0 Insulating disk to Q2 _Detail.cfm?ART_ARTNUdisk to Q2 M=70.08.121

20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8,21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R12

22 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: QFN11T064-006-23 U1 1 Manuf.: YamaichiN-HSP



26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI



http://www.ti.com


www.ti.com MSP-TS430RGC64C

B.19 MSP-TS430RGC64C

The MSP-TS430RGC64C target board has been designed to operate with the target device DVIO inputvoltage supplied via header J6 (see Figure B-37). This development platform does not supply the 1.8-VDVIO rail on board and it MUST be provided by external power supply for proper device operation. Forcorrect JTAG connection, programming, and debug operation, it is important to follow this procedure:

1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fullydischarged to 0 V.

2. Enable the 1.8-V external DVIO power supply.

3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-FET430UIF JTAG debugger interface).

4. Connect the MSP-FET430UIF JTAG connector to the target board.

5. Start the debug session using IAR or CCS IDE.

For more information on debugging the MSP430F522x, see the device data sheet (SLAS718) andDesigning with MSP430F522x and MSP430F521x Devices (SLAA558).



http://www.ti.com

http://www.ti.com/lit/pdf/SLAS718

http://www.ti.com/lit/pdf/SLAA558


1.1

MS

P-T

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17 VCORE

18 P1.0/TA0CLK/ACLK

19 P1.1/TA0.0

20 P1.2/TA0.1

21 P1.3/TA0.2

22 P1.4/TA0.3

23 P1.5/TA0.4

24 P1.6/TA1CLK/CBOUT

25 P1.7/TA1.0

26 P2.0/TA1.1

27 P2.1/TA1.2

28 P2.2/TA2CLK/SMCLK

29 P2.3/TA2.0

30 P2.4/TA2.1

31 P2.5/TA2.2

32 P2.6/RTCCLK/DMAE0

33

P2

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CB

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50P7.1/TB0.1

51P7.2/TB0.2

52P7.3/TB0.3

53P7.4/TB0.4

54P7.5/TB0.5

55BSLEN

56RST/NMI

57P5.2/XT2IN

58P5.3/XT2OUT

59TEST/SBWTCK

60PJ.0/TDO

61PJ.1/TDI/TCLK

62PJ.2/TMS

63PJ.3/TCK

64RSTDVCC/SBWTDIO

65 THERMAL_1

66 THERMAL_2

67 THERMAL_3

68 THERMAL_4

69 THERMAL_5

70 THERMAL_6

71 THERMAL_7

72 THERMAL_8

U1

MS

P430F

5229

12

34

56

78

910

11

12

13

14

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G

12

34

56

78

91

0

BO

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ST

CN

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12345678910

11

12

13

14

15

16

J1

123

45

678

91011

1213

141516

J2

1 2 3 4 5 6 7 8 910

11

12

13

14

15

16

J3

123

45

678

91011

1213

141516

J4

123

JP

5

PIN

HE

AD

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3

123

JP

6

PIN

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AD

_1X

3

123

JP

7

PIN

HE

AD

_1X

3

123

JP

8

PIN

HE

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_1X

3

123

JP

9

PIN

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_1X

3

123 JP

10

PIN

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AD

_1X

3

123

J5

PIN

HE

AD

_1X

3

R7

330R

1 2 3

JP

3

C1

0

10uF

C1

4100nF

C5

10uF

C6

100nF

R10R R

20R

R60R

R80R

C1

12pF

C2

12pF

C7

10uF

C1

3

100nF

12

JP2

R3

330R

12

D1

??

?R

40R

C9

470nF

R5

47K

C82.2

nF

R110R

R12

0R

C1

6

4.7

uF

C3

tbd

C4

tbd

R90R

R1

00R

C1

5

100nF

1 2 3

J6

PIN

HE

AD

_1X

3

12

JP

4

PIN

HE

AD

_1X

2

D3

Q2

QUARZ_4PIN

26MHz/ASX53

Q1

12

JP

1

PIN

HE

AD

_1X

2

SH

C1

SH

OR

TC

UT

2

GN

D

GN

D

GN

D

GN

D

XT

LG

ND

VCORE

GN

D

GN

D

DV

CCD

VC

C

GN

D

XT

LG

ND

2

GN

D

GN

D

DV

CC

GN

D

RS

T/N

MI

TC

K

TM

ST

DI

TD

O

RS

TD

VC

C_

SB

WT

DIO

TD

O

RS

T/N

MI

TC

K

CT

CK

MT

MS

IT

DI

OT

DO

DV

CC

P1

.2/T

A0

.1P

1.1

/TA

0.0

TE

ST

/SB

WT

CK

CMIO

DVCC

P1.1/TA0.0P1.2/TA0.1

RS

TD

VC

C_

SB

WT

DIO

TE

ST

/SB

WT

CK

AV

SS

MSP-TS430RGC64C www.ti.com

Figure B-37. MSP-TS430RGC64C Target Socket Module, Schematic



http://www.ti.com


Connector J5

External power connector for DVCC.

Set jumper JP3 to "ext".

IMPORTANT NOTE:

Rev1.0 of the board does not have

connection from pin 4 of BOOTST to

pin 64 of MCU. To use BSL, these pins

should be connected by a wire.

Jumper JP2

Open to disconnect LED.

D1


Orient Pin 1 of

MSP430 device

Jumpers JP5 to JP10

-2 to debug in

Spy-Bi-Wire mode.

Close 2-3 to debug in

4-wire JTAG mode.

Close 1

Jumper JP4

Close if only one power supply is

used for VCC and DVIO, and if

VCC is not higher then 1.98 V.

Otherwise supply DVIO over J6.

Do not close if VCC > 1.98 V, as it

may damage the chip.

IMPORTANT NOTE:

Connector J6


to supply DVIO

www.ti.com MSP-TS430RGC64C

Figure B-38. MSP-TS430RGC64C Target Socket Module, PCB



http://www.ti.com


MSP-TS430RGC64C www.ti.com

Table B-21. MSP-TS430RGC64C Bill of Materials

Item Qty Reference Value Description Comment Supplier No.

1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2

2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4

4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805

5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 DigiKey: 311-1245-2-ND

5 5 C8 2.2nF CAP, SMD, Ceramic, 0805

6 1 C9 470nF CAP, SMD, Ceramic, 0805 DigiKey: 478-1403-2-ND

7 1 C16 4.7uF CAP, SMD, Ceramic, 0805

8 1 D1 Green LED LED, SMD, 0805

DNP: headers andreceptacles enclosed with

Pin header 1x16: Grid: 100mil kit. Keep vias free of9 4 J1-J4 16-pin header (2.54 mm) solder.: Header SAM1029-16-ND: Receptacle SAM1213-16-ND

Pin header 1x3: Grid: 100mil10 2 J5, J6 3-pin header, male, TH SAM1035-03-ND(2.54 mm)

JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil11 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-NDJP8, JP9, JP10 (2.54 mm)

Pin header 1x3: Grid: 100mil12 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-ND(2.54 mm)

Pin header 1x2; Grid: 100mil13 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-ND(2.54 mm)

Place on: JP1, JP2, JP3,14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND

JP9, JP10

Header, THD, Male 2x7 Pin,15 1 JTAG 2x7Pin,Wanne HRP14H-NDWanne, 100mil spacing

Header, THD, Male 2x5 Pin,16 0 BOOTST 2x5Pin,Wanne DNPWanne, 100mil spacing

CRYSTAL, SMD, 5x3MM,17 1 Q1 26MHz/ASX53 Only Kit.26MHz

CRYSTAL, SMD, 5x3MM,18 0 Q2 26MHz/ASX53 300-8219-1-ND26MHz

DIODE, SMD, SOD123,19 1 D3 LL103A Buerklin: 24S3406Schottky

20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND

21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND

R1, R2, R4, DNP: R6, R8, R9, R10,22 R6, R8, R9, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-NDR11,R12R10, R11, R12

Socket: QFN11T064-006-N-23 1 U1 Manuf.: YamaichiHSP

IC, MCU, SMD, 9.15x9.15mm24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket

Rubber stand apply to corners at bottom25 4 Rubber stand off Buerklin: 20H1724off side

26 1 PCB 84 x 76 mm 84 x 76 mm



http://www.ti.com


www.ti.com MSP-TS430RGC64USB

B.20 MSP-TS430RGC64USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; forexample, to run the MCU at 3.0 V, set it to 3.3 V.

Figure B-39. MSP-TS430RGC64USB Target Socket Module, Schematic



http://www.ti.com


MSP-TS430RGC64USB www.ti.com

Figure B-40. MSP-TS430RGC64USB Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430RGC64USB

Table B-22. MSP-TS430RGC64USB Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805

2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND

C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C14

3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND


DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 4 16-pin header, TH




JP5, JP6,9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP9, JP10

JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP4

11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2


JP9, JP10


Q1: Micro Crystal MS1V-T1K DNP: Q114 Q1 0 Crystal 32.768kHz, C(Load) = Keep vias free of solder"12.5pF

15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 1 1M Ω, SMD0805

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND

19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi


Rubber stand apply to corners at bottom21 4 Buerklin: 20H1724off side

DNP: enclosed with kit. Is22 MSP430 2 MSP430F5509 RGC supplied by TI

http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.121

27 C33 1 220n SMD0603 Buerklin: 53D2074

28 C35 1 10p SMD0603 Buerklin: 56D102

29 C36 1 10p SMD0603 Buerklin: 56D102

30 C38 1 220n SMD0603 Buerklin: 53D2074

31 C39 1 4u7 SMD0603 Buerklin: 53D2086

32 C40 1 0.1u SMD0603 Buerklin: 53D2068

33 D2, D3, D4 3 LL103A Buerklin: 24S3406



http://www.ti.com


MSP-TS430RGC64USB www.ti.com

Table B-22. MSP-TS430RGC64USB Bill of Materials (continued)


34 IC7 1 TPD4E004 Manu: TI

36 LED 0 JP3QE SAM1032-03-ND DNP

37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP



R13, R15,40 0 470R Buerklin: 07E564 DNPR16

41 R33 1 1k4 / 1k5 Buerklin: 07E612

42 R34 1 27R Buerklin: 07E444

43 R35 1 27R Buerklin: 07E444

44 R36 1 33k Buerklin: 07E740

45 S1 0 PB P12225STB-ND DNP


46 S3 1 PB P12225STB-ND

47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885



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www.ti.com MSP-TS430PN80

B.21 MSP-TS430PN80

NOTE: For MSP430F(G)47x devices:Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).

Figure B-41. MSP-TS430PN80 Target Socket Module, Schematic



http://www.ti.com


Connector J5



LED connected to pin 12

Jumper J6



MSP-TS430PN80 www.ti.com

Figure B-42. MSP-TS430PN80 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PN80

Table B-23. MSP-TS430PN80 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

DNP: Only recommendation.1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.


3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 D1 1 green LED, SMD0603 475-1056-2-ND

DNP: Headers andreceptacles enclosed withkit.Keep vias free of solder.6 J1, J2, J3, J4 0 25-pin header, TH



7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND

8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header

Place on: J6, JP2, JP1/Pos1-9 3 Jumper 15-38-1024-ND 2




13 R3 1 560 Ω, SMD0805 541-560ATR-ND

R1, R2, R4, DNP: R4, R6, R7, R10, R11,14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND R12R11, R12

15 R5 1 47k Ω, SMD0805 541-47000ATR-ND




DNP: Enclosed with kit19 MSP430 2 MSP430FG439IPN supplied by TI



http://www.ti.com


MSP-TS430PN80A www.ti.com

B.22 MSP-TS430PN80A

Figure B-43. MSP-TS430PN80A Target Socket Module, Schematic



http://www.ti.com







If the system shouldbe supplied via LDOI (J6),close JP4 andset JP3 to external

www.ti.com MSP-TS430PN80A

Figure B-44. MSP-TS430PN80A Target Socket Module, PCB



http://www.ti.com


MSP-TS430PN80A www.ti.com

Table B-24. MSP-TS430PN80A Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

C6, C7,3 3 10uF, 6.3V, SMD0805 DNP C10C10, C12

C5, C11,4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C15

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805



11 J5 , J6 2 3-pin header, male, TH



14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13




12.5pF


http://www.ettinger.de/ArInsulating19 0 Insulating disk to Q2 t_Detail.cfm?ART_ARTdisk to Q2 NUM=70.08.121

20 D3,D4 2 LL103A Buerklin: 24S3406

21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,R4, R6,

22 R8, 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12R9,R10,

R11, R12

23 R5 1 47k Ω, SMD0805 541-47000ATR-ND

24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi



27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI



http://www.ti.com


www.ti.com MSP-TS430PN80USB

B.23 MSP-TS430PN80USB


NOTE: R11 should be populated.

Figure B-45. MSP-TS430PN80USB Target Socket Module, Schematic



http://www.ti.com


Jumper JP31-2 (int): Power supply via JTAG debug interface2-3 (ext): External power supply

Connector J5External power connectorJumper JP3 to ‘ext’

USB Connector

BSL invoke button S3

Jumper JP4Close for USB bus powereddevice




Jumper JP5 to JP10

Close 1-2 to debug in Spy-Bi-Wire mode.

Close 2-3 to debug in 4-wireJTAG mode.

MSP-TS430PN80USB www.ti.com

Figure B-46. MSP-TS430PN80USB Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PN80USB

Table B-25. MSP-TS430PN80USB Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805


C5, C11,3 4 100nF, SMD0805 311-1245-2-NDC13, C14

3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND


DNP: headers andJ1, J2, J3, receptacles enclosed with7 4 20-pin header, TH SAM1029-20-NDJ4 kit. Keep vias free of

solder.

DNP: headers andreceptacles enclosed withkit. Keep vias free of

7.1 4 20-pin header, TH solder.


: Receptacle


JP5, JP6,JP7,9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3JP8,JP9,JP10


Place jumper only on oneJP4 1 SAM1035-02-ND pin

11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2


JP9, JP10


Micro Crystal MS1V-T1K DNP: Q1 Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

"Q2: 4MHzBuerklin:15 Q2 1 Crystal 78D134"

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12

R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 0 1M Ω, SMD0805 DNP

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND



Rubber Apply to corners at bottom21 4 Buerklin: 20H1724standoff side

DNP: Enclosed with kit22 MSP430 2 MSP430F5529 supplied by TI

http://www.ettinger.de/Art_Insulating23 1 Insulating disk to Q2 Detail.cfm?ART_ARTNUMdisk to Q2 =70.08.121

27 C33 1 220n Buerklin: 53D2074



http://www.ti.com


MSP-TS430PN80USB www.ti.com

Table B-25. MSP-TS430PN80USB Bill of Materials (continued)


28 C35 1 10p Buerklin: 56D102

29 C36 1 10p Buerklin: 56D102

30 C38 1 220n Buerklin: 53D2074

31 C39 1 4u7 Buerklin: 53D2086

32 C40 1 0.1u Buerklin: 53D2068







R13, R15,40 0 470R Buerklin: 07E564 DNPR16

41 R33 1 1k4 Buerklin: 07E612

42 R34 1 27R Buerklin: 07E444

43 R35 1 27R Buerklin: 07E444

44 R36 1 33k Buerklin: 07E740



46 S3 1 PB P12225STB-ND




http://www.ti.com


www.ti.com MSP-TS430PZ100

B.24 MSP-TS430PZ100

NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not bemade.

Figure B-47. MSP-TS430PZ100 Target Socket Module, Schematic



http://www.ti.com


Connector J5



LED connected to pin 12

Jumper J6



Jumper J7


MSP-TS430PZ100 www.ti.com

Figure B-48. MSP-TS430PZ100 Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100

Table B-26. MSP-TS430PZ100 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only1b C3, C4 0 47pF, SMD0805 recommendation. Check

your crystal spec.

2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6

3 C5 1 100nF, SMD0805 478-3351-2-ND

4 C8 1 10nF, SMD0805 478-1383-2-ND

5 C9 1 470nF, SMD0805 478-1403-2-ND

6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND

DNP: Headers andreceptacles enclosed with




9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header




Q1: Micro Crystal MS1V- DNP: Keep vias free of13 Q1, Q2 0 Crystal T1K 32.768kHz, C(Load) = solder12.5pF

14 R3 1 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12

R11, R12

16 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: IC201-1004-008 or17 U1 1 Manuf.: YamaichiIC357-1004-53N



DNP: enclosed with kit20 MSP430 2 MSP430FG4619IPZ supplied by TI



http://www.ti.com


MSP-TS430PZ100A www.ti.com

B.25 MSP-TS430PZ100A

Figure B-49. MSP-TS430PZ100A Target Socket Module, Schematic



http://www.ti.com


Jumper JP1


Jumper JP2



Jumper JP3

1-2 (int): Power supply via JTAG interface

2-3 (ext): External Power Supply


www.ti.com MSP-TS430PZ100A

Figure B-50. MSP-TS430PZ100A Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ100A www.ti.com

Table B-27. MSP-TS430PZ100A Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only1b C3, C4 0 47pF, SMD0805 recommendation. Check

your crystal spec.


C5, C11,3 3 100nF, SMD0805 311-1245-2-NDC14

4 C8 1 10nF, SMD0805 478-1358-1-ND

5 C6 0 470nF, SMD0805 478-1403-2-ND DNP

6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: Headers andreceptacles enclosed with




10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header


12 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3



Q1: Micro Crystal MS1V- DNP: Keep vias free of15 Q1, Q2 0 Crystal T1K 32.768kHz, C(Load) = solder12.5pF

16 R3 1 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R7, R8, DNP: R4, R6, R7, R8, R9,17 2 0 Ω, SMD0805 541-000ATR-NDR9, R10, R10, R11, R12R11, R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND

19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi


Rubber Apply to corners at bottom21 4 Select appropriatestandoff side

DNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI



http://www.ti.com


www.ti.com MSP-TS430PZ100B

B.26 MSP-TS430PZ100B

Figure B-51. MSP-TS430PZ100B Target Socket Module, Schematic



http://www.ti.com






JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCC ordrive AUXVCCx externally



MSP-TS430PZ100B www.ti.com

Figure B-52. MSP-TS430PZ100B Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100B

Table B-28. MSP-TS430PZ100B Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

C4, C5,2 C6 , C7, 6 100nF, SMD0805 311-1245-2-ND

C8, C9

3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND

4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP

C13, C14,5 C16, C18, 6 4.7 uF SMD0805

C19, C29



8 J5 1 3-pin header, male, TH



JP11,11 3 4-pin header, male, TH place jumper on header 1-2JP12, JP13

12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11



17 Q1 0 Crystal DNP: Q1 Keep vias free of solder

21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2,R4, R6,22 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11R8, R10,

R11

23 R5 1 47k Ω, SMD0805 541-47000ATR-ND




27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI



http://www.ti.com


DN

PD

NP

DN

P

DN

P

DN

P

DN

P

0R

12pF

12pF

47pF

47pF

GN

D

0R

100nF

330R

10 /6.3uF V

10 /6.3uF V

2.2

nF

PWR3

GN

D

GN

D

GN

D

GN

D0R

330R

47K

100nF

100nF

PT

RN

D516

-

470nF

100nF

100nF

0R

0R

0R

0R

GN

D

VCC

100nF

GN

D

100nF

100nF

GN

D

100nF

LL

A103

GN

D

4.7n

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

HCTC XTL_ _4

GN

D

0R

0R

GN

DG

ND

GN

D

4.7uF

GN

D

100nF

220nF

GN

D

VCC

LL A103

1.1

MS

PTa

rge

tS

ocke

tM

SP

TS

PZ

C430:

--

430

100

Socket:

Ya

maich

iIC

201-1

004-0

08

LFXTCLK

<-

SB

W

<-

JTA

G

Vccint

ext

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

BS

LR

x-

BS

LT

x-

DN

P

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3

C6

C7

C8

123

J5

8079787776

75

74

73

72

71

70

69

68

67

66

65

60

59

58

57

56

55

54

53

52

51

504948474645

3635343332313029282726

25

24

23

22

21

16

15

14

13

12

11 10

9 8 7 6 5 4 3 2 1

64

63

62

61

44434241

37383940

17

18

19

20

81828384858687888990919293949596979899

100

U1

QF

P1

00

PZ

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

J1

26272829303132333435363738394041424344454647484950

J2

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

J3

767778798081828384858687888990919293949596979899

100

J4

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1

2

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JP2

2

R4

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JP

6123

JP

7123

JP

8123

JP

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R7

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

1 2 3

JP

3

C17

C18

C19

C14

D3

C16

1 2 3

JP

11

4

21Q G1 $1

43Q G1 $2

2 1

Q G2 $1

4 3

Q G2 $2

12

34

56

78

910

BO

OT

ST

R10

R11

C15

C20

C21

1JP

4

2

D4

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J6

TM

S

TM

S

TD

I

TD

I

TD

O

TD

O

TD

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VC

C

GND

GND

GN

D

XIN

P1.0

DV

CC

1

DV

CC

1

DV

CC

1

DVCC1

DV

CC

1

DVCC1

AV

CC

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CK

/

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ST

SB

WT

CK

/

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CK

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RS

T

RS

T

RS

T

XTLGND2

XTLGND1

PU.0

PU.1

P1.6P1.7

P8.0

P8.1

P8.2

VBAKVBAT

VBAT

VB

AT

P1.1

P1.1

P1.2

P1.2

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3

MSP-TS430PZ100C www.ti.com

B.27 MSP-TS430PZ100C

Figure B-53. MSP-TS430PZ100C Target Socket Module, Schematic



http://www.ti.com


Connector J5


Jumper JP3 to "ext"

If the system should

be supplied via LDOI (J6),

close JP4 and

set JP3 to external

Jumper JP2




Jumpers JP5 to JP10

Close 1-2 to debug in Spy -Bi-Wire

mode

Close 2-3 to debug in 4-wire JTAG

modeLDOI LDOO/

14

1

2

GN

D

GN

D

VC

C

125

510

15

20

26 5030 3540 45 51

75

55

60

65

70

76100 80859095

12

3

123

123

123

123

123

1231 2 3 4

10

1

2

1 2 3

1

JTA

GS

BW

Vcc

int

ext

GN

D

VB

AT

DV

CC

JTA

G

R2

C2

C1

C3

C4

R1

C5

R3+C6

+

C7

C8

J5

U1

J1

J2

J3

J4

JP

1

JP2

R4

JP

5

JP

6

JP7

JP

8

JP

9

JP

10

R7

R5

C11

C12

D1

C9

C13

C10

R6

R8

R9

R12

JP3

C17

C18

C19

C14

D3

C16

JP11

Q1

Q2

BOOTSTR10

R11

C15

C20

C21

JP

4

D4

J6

www.ti.com MSP-TS430PZ100C

Figure B-54. MSP-TS430PZ100C Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ100C www.ti.com

Table B-29. MSP-TS430PZ100C Bill of Materials

NumberPos. Ref Des Per Description Digi-Key Part No. Comment

Board

1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4


C5, C11,3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND

C19, C20

C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18,17

4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292

5 C9 1 470nF, SMD0805 478-1403-2-ND


DNP: headers and receptacles enclosedJ1, J2, J3,7 4 25-pin header, TH SAM1029-25-ND with kit.J4 Keep vias free of solder.

DNP: headers and receptacles enclosed7.1 4 25-pin header, TH SAM1213-25-ND with kit.

Keep vias free of solder.

8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND

JP5, JP6,JP7,9 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3JP8,JP9,JP10


10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header


Place on: JP1, JP2, JP3, JP4, JP5, JP6,12 10 Jumper 15-38-1024-ND JP7, JP8, JP9, JP10



DNP: Q115 Q1 0 CrystalKeep vias free of solder

16 Q2 1 Crystal DNP: Q2 Keep vias free of solder

17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8, R9,18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12R10, R11,

R12

19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND


MSP-TS430PZ100C21 PCB 1 79.5 x 99.5 mm 2 layersRev 1.0

Rubber22 4 Buerklin: 20H1724 apply to corners at bottom sidestand off

DNP: enclosed with kit. Is supplied by23 MSP430 2 MSP430F643xTI.

24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042

26 D3, D4 2 LL103A Buerklin: 24S3406

27 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 2

28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430

29 C21 1 220nF, SMD0805 Buerklin 53 D 2381



http://www.ti.com


www.ti.com MSP-TS430PZ100C



http://www.ti.com


MSP-TS430PZ5x100 www.ti.com

B.28 MSP-TS430PZ5x100

Figure B-55. MSP-TS430PZ5x100 Target Socket Module, Schematic



http://www.ti.com


Connector J5External power connector

Jumper J3 to ‘ext’


Jumpers JP5 to JP10Close 1-2 to debug in

Spy-Bi-Wire mode.Close 2-3 to debug in

4-wire JTAG mode.



Jumper JP31-2 (int): Power supply via JTAG debug interface2-3 (ext): External power supply

www.ti.com MSP-TS430PZ5x100

Figure B-56. MSP-TS430PZ5x100 Target Socket Module, PCB



http://www.ti.com


MSP-TS430PZ5x100 www.ti.com

Table B-30. MSP-TS430PZ5x100 Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP

DNP: Only recommendation.1b C3, C4 47pF, SMD0805 Check your crystal spec.


C5, C10,3 C11, C12, 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14

C13, C14

4 C8 0 2.2nF, SMD0805 DNP

5 C9 1 470nF, SMD0805 478-1403-2-ND

6 D1 1 green LED, SMD0805 67-1553-1-ND

DNP: headers andreceptacles enclosed with kit.Keep vias free of solder.7 J1, J2, J3, J4 0 25-pin header, TH




JP5, JP6,9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3

JP9, JP10



Place on JP1, JP2, JP3, JP5,12 9 Jumper 15-38-1024-ND JP6, JP7, JP8, JP9, JP10




16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,R6, R8, R9, DNP: R6, R8, R9, R10, R11,17 3 0 Ω, SMD0805 541-000ATR-NDR10, R11, R12

R12

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND



Rubber Apply to corners at bottom21 4 Select appropriatestandoff side

DNP: Enclosed with kit22 MSP430 2 MSP430F5438IPZ supplied by TI



http://www.ti.com


www.ti.com MSP-TS430PZ100USB

B.29 MSP-TS430PZ100USB


Figure B-57. MSP-TS430PZ100USB Target Socket Module, Schematic



http://www.ti.com


MSP-TS430PZ100USB www.ti.com

Figure B-58. MSP-TS430PZ100USB Target Socket Module, PCB



http://www.ti.com


www.ti.com MSP-TS430PZ100USB

Table B-31. MSP-TS430PZ100USB Bill of Materials


1 C1, C2 0 12pF, SMD0805 DNP: C1, C2

1.1 C3, C4 2 47pF, SMD0805


C5, C11,3 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C19

C10, C12,3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17C18, C17

4 C8 1 2.2nF, SMD0805

5 C9 1 470nF, SMD0805 478-1403-2-ND


DNP: headers andreceptacles enclosed with kit.

7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND Keep vias free of solder.: Header: Receptacle

DNP: headers andreceptacles enclosed with kit.

7.1 4 25-pin header, TH SAM1213-25-ND Keep vias free of solder.: Header: Receptacle


JP5, JP6,9 JP7, JP8, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3

JP9, JP10

JP1, JP2,10 3 2-pin header, male, TH SAM1035-02-ND place jumper on headerJP4



JP9, JP10


Micro Crystal MS1V-T1K DNP: Q1. Keep vias free of14 Q1 0 Crystal 32.768kHz, C(Load) = solder12.5pF

15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134

16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12

R12

18 R10 1 100 Ω, SMD0805 Buerklin: 07E500

18 R11 1 1M Ω, SMD0603 not existing in Rev 1.0

18 R5 1 47k Ω, SMD0805 541-47000ATR-ND



Rubber stand apply to corners at bottom21 4 Buerklin: 20H1724off side

DNP: enclosed with kit. Is22 MSP430 2 MSP430F5529 supplied by TI

http://www.ettinger.de/Art_DeInsulating23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0disk to Q2 8.121

24 C16 1 4.7 nF SMD0603

27 C33 1 220n SMD0603 Buerklin: 53D2074

28 C35, C36 2 10p SMD0603 Buerklin: 56D102



http://www.ti.com


MSP-TS430PZ100USB www.ti.com

Table B-31. MSP-TS430PZ100USB Bill of Materials (continued)


30 C38 1 220n SMD0603 Buerklin: 53D2074

31 C39 1 4u7 SMD0603 Buerklin: 53D2086

32 C40 1 0.1u SMD0603 Buerklin: 53D2068




LED1, LED2,36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNPLED3

R13, R15,37 0 470R SMD0603 Buerklin: 07E564 DNPR16

38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612

39 R34 1 27R SMD0603 Buerklin: 07E444

40 R35 1 27R SMD0603 Buerklin: 07E444

41 R36 1 33k SMD0603 Buerklin: 07E740

42 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)


44 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1



http://www.ti.com


0R

12pF

12pF

GN

D

GN

D

0R

100nF

330R

2.2

nF

0R

0R

PWR3

GN

D

330R

47K

0R

0R

100nF

4.7

uF

GN

D

GN

D

100nF470nF

0R

QUARZ5

100nF

10uF

/6,3

V

10uF

/6,3

V

100nF

4.7

uF

4.7

uF

100nF

4.7uF

4.7

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4.7

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470nF

FE

04-1

VC

C

GN

D

GN

D

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4.7uF

GN

D

GN

D

GN

D

GN

D

GN

D

VCC1

VC

C1

VC

C1

VC

C1

VC

C1

GN

D

GN

D

GN

D

GN

D

GN

D

GN

D

AV

SS

AV

SS

AV

CC

DV

CC

GND

VC

C

VCC

GN

D

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1.1

12345678910

1112

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

J1

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

J2

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

J3

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126127

128

J4

1 3 5 7 9 11 13

2 4 6

12

148

10

JTA

G

R2

C2

C1

R1

C5

R3

12

34

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R10

R11

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12

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JP

6123

JP

7123

JP

8123

JP

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10

R7

R5

D1

R6

R8

C6

C29

C7

C10

R4

Q1

JP

12

1234

1234

JP

11

JP

13

1234

C4

C11

C12

C8

C13

C14

C9

C16

C19

C18

C26

1

2

JP

4

JP

3

1 2 3 4

C15

C17

TP1 TP2

IC1

MS

P430F

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IPE

U#

XIN

1

XO

UT

2

AU

XV

CC

33

RT

CC

AP

14

RT

CC

AP

05

P1.5

/SM

CLK

/CB

0/A

56

P1.4

/MC

LK

/SD

CLK

/CB

1/A

47

P1.3

/AD

C10C

LK

/TA

CLK

/RT

CC

LK

/A3

8

P1.2

/AC

LK

/TA

3.1

/A2

9

P1.1

/TA

2.1

/VE

RE

F+

/A1

10

P1.0

/TA

1.1

/TA

0.0

/VE

RE

F-/A

011

P2.4

/PM

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2.0

12

P2.5

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CL

13

P2.6

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0S

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0S

DA

14

P2.7

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0C

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P3.0

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M1

23

P1.6

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M2

24

P1.7

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M3

25

P5.0

/CO

M4

26

P5.1

/CO

M5

27

P5.2

/CO

M6

28

P5.3

/CO

M7

29

LC

DC

AP

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30

P5.4

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CLK

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32

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P4.2/PM_UCA3TXD/PM_UCA3SIMO40

P4.3/PM_UCA3CLK41

P4.4/PM_UCB1SOMI/PM_UCB1SCL42

P4.5/PM_UCB1SIMO/PM_UCB1SDA43

P4.6/PM_UCB1CLK44

P4.7/PM_TA3.045

P6.1/SD4DIO/S3946

P6.2/SD5DIO/S3847

P6.3/SD6DIO/S3748

P6.4/S3649

P6.5/S3550

P6.6/S3451

P6.7/S3352

P7.0/S3253

P7.1/S3154

P7.2/S3055

P7.3/S2956

P7.4/S2857

P7.5/S2758

P7.6/S2659

P7.7/S2560

P8.0/S2461

P8.1/S2362

P8.2/S2263

P8.3/S2164

P8.4

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65

P8.5

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66

P8.6

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P8.7

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270

P9.0

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71

P9.1

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72

P9.2

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73

P9.3

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74

P9.4

/S12

75

P9.5

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76

P9.6

/S10

77

P9.7

/S9

78

P10.0

/S8

79

P10.1

/S7

80

P10.2

/S6

81

P10.3

/S5

82

P10.4

/S4

83

P10.5

/S3

84

P10.6

/S2

85

P10.7

/S1

86

P11

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087

P11

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A3.1

/CB

388

P11

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A1.1

89

P11

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A2.1

90

P11

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92

P2.0

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93

P2.1

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94

P2.2

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0.2

95

P2.3

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1.0

96

TE

ST

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WT

CK

97

PJ.0

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PJ.1

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PJ.3

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ST

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102

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SD0N0104

SD1P0105

SD1N0106

SD2P0107

SD2N0108

SD3P0109

SD3N0110

VASYS2111

AVSS2112

VREF113

SD4P0114

SD4N0115

SD5P0116

SD5N0117

SD6P0118

SD6N0119

AVSS1120

AVCC121

VASYS1122

AUXVCC2123

AUXVCC1124

VDSYS125

DVCC126

DVSS1127

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P2.0

P2.0

P2.1

P2.1

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SD4P0SD4N0SD5P0SD5N0SD6P0SD6N0

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DS

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DS

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DV

DS

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DVDSYS

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AVSS

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PJ.2

PJ.1

PJ.1

PJ.0

PJ.0

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T/N

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T/N

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TC

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TC

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KP

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PJ.3

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CK

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CK

TE

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WT

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RS

T

RS

T

RS

T

RS

T

LC

DC

AP

LC

DC

AP

VR

EF

VREF

VE

RE

F+

VE

RE

F+

VCORE

AU

XV

CC

2

AUXVCC2

AU

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CC

1

AUXVCC1

AU

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3

AU

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3

1 2 3 4 5 6

1 2 3 4 5 6

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:

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CB

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www.ti.com MSP-TS430PEU128

B.30 MSP-TS430PEU128

Figure B-59. MSP-TS430PEU128 Target Socket Module, Schematic



http://www.ti.com


1

P1.0

SB

W

JTA

G

DVDSYS

ext

int

MSP-TS430PEU128

Rev. 1.1 RoHS

DVCC

AUXVCC

GND

AU

XV

CC

1

AU

XV

CC

2

AU

XV

CC

3

GND

GND

RST/NMI

TCK

TDI

TDO

TEST/SBWTCK

TMS

12

55

10

15

20

30

35

6040 45 50 55 64

65

90

70

75

80

85

95

10

0

125 105110115120128

14

12

10

12G

ND

GN

D

VC

C

123

123

123

123

123

123

12

34

12

34

12

34

1

J1

J2

J3

J4

JTA

G

R2

C2

C1

R1

C5R3

BOOTST

C3

R1

0R

11

J5

JP

1

JP

2

JP5

JP6

JP7

JP8

JP9

JP

10

R7

R5

D1

R6

R8

C6

C29

C7

C1

0

R4

JP

12

JP

11

JP

13

C4

C11

C1

2

C8

C1

3

C1

4

C9

C1

6

C1

9

C1

8

C2

6

JP

4

JP3

C1

5

C1

7

TP1

TP2

IC1



Orient Pin 1 ofMSP430 device


JP11, JP12, JP13Connect 1-2 to connectAUXVCCx with DVCC ordrive AUXVCCx externally



MSP-TS430PEU128 www.ti.com

Figure B-60. MSP-TS430PEU128 Target Socket Module, PCB

NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:• R7 value is changed to 0 Ω instead of 330 Ω.• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.• JP5 pin 2 is connected to IC1 pin 97.• BOOTST pin 7 is connected to IC1 pin 97.



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www.ti.com MSP-TS430PEU128

Table B-32. MSP-TS430PEU128 Bill of Materials


94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask1 PCB 1 Rev. 1.1

2 D1 1 green LED, DIODE0805 516-1434-1-ND

3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)4 6JP9, JP10

5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)

6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2

JP1, JP2, JP3, JP4, Jumper WM4592-NDJP5, JP6, JP7, JP8,7 13JP9, JP10, JP11,

JP12, JP13

8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND

9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP

10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP

C13, C14, C16, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND11 7C17, C18, C19, C29

12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND

13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP

14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP

15 R5 1 47K, 0805 311-47KARTR-ND

C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND16 6C15

17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP

18 R3, R7 2 330R, 0805 541-330ATR-ND

19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND



22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi

23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI


Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias25 Q1 1 12.5pF ±20ppm free of solder

26 TP1, TP2 2 Test point DNP, keep vias free of solder

26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias27 J2,J4 2 free of solder.

26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep28 J2,J4 2 vias free of solder.

38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias29 J1, J3 2 free of solder.

38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep30 J1, J3 2 vias free of solder.

31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners



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PowerManagement

VCC

exte

rnalVCC

01 =

Vdd

DVCC

=

Vdda

AVDD

RF

AVCC

RF

1 =

_/

_

Vdda

AVCC

2 =

Port

connecto

rs

CON1 ..

CON

Port

Port

ofcc

3 =

1 ..

3430

CON

spare

4 =

CON

XIN

XOUT

5 =

1:

2:

CON

Vdd

GND

Vco

re6 =

,,

,COM

LCDCAP

0,

CON

Vdda

Vdda

GND

7 =

1,

2,

,AGND

CON

JTAG

BASE

8 =

_(

)JTA

GPort

CON

Vdd

GND

AGND

9 =

,,

(Maybe

addedclose

totheres

pective

pins

toreduce

emissio

ns

at

GHztolevel

5require

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SI)

EM430F5137RF900 www.ti.com

B.31 EM430F5137RF900

Figure B-61. EM430F5137RF900 Target board, Schematic



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JTAG connector

External power connectorCON12

GNDGNDVCC

Open to disconnect LEDsjumper JP5/JP10

LED D2 (red) connected toP3.6 via JP10

LED D1 (green) connectedto P1.0 via JP5

RF - Crystal Q1 26 MHz

RF - Signal SMA

Reset button S1

Push-button S2connected to P1.7

Jumper JP1Close JTAGposition todebug inJTAG mode

Jumper JP2Close EXT for external supplyClose INT for JTAG supply

Close SBW positionto debug inSpy-Bi-Wire mode

Jumper JP1Spy-Bi-Wire mode

Footprint for 32kHz crystal

Use 0 resistor for R431/R441to make XIN/XOUT availableon connector port5

Ω

Open to measure currentjumper JP3

www.ti.com EM430F5137RF900

Figure B-62. EM430F5137RF900 Target board, PCB

The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Table B-33. EM430F5137RF900 Bill of Materials

No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number

( CUSTOMER SUPPLY ) CRYSTAL, AKER1 Q1 1 26M ASX-531(CS)SMT, 4P, 26MHz ELECTRONIC

C1-C5, C082,C222, C271, CAPACITOR, SMT, 0402, CER, 16V,2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX10%, 0.1uFC321, C341,C412, C452

CAPACITOR, SMT, 0603, CERAMIC,3 C071 1 0.47uF 0603YD474KAT2A AVX0.47uF, 16V, 10%, X5R

CRCW04024702F104 R401 1 RES0402, 47.0K 47kΩ DALE0

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm

HEADER, THU, MALE, 10P, 2X5,6 CON10 0 09 18 510 6323 HARTING DNP20.32x9.2x9.45mm

7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT

UNINSTALLED CRYSTAL, SMT, 3P, MICRO9 Q3 0 32.768k MS1V-T1K (UN) DNPMS1V (Customer Supply) CRYSTAL

HEADER, THU, MALE, 3P, 1x3,10 CON12 1 22-03-5035 MOLEX9.9x4.9x5.9mm

11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA

12 L341 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA 1kΩ BLM15HG102SN1D MURATA

CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H101JZ13 C293 1 100pF MURATA100pF, 50V, 0.25pF, C0G(NP0) 01

INDUCTOR, SMT, 0402, 2.2nH, 0.1nH,14 L304 1 0.0022uH LQP15MN2N2B02 MURATA220mA, 500MHz

INDUCTOR, SMT, 0402, 15nH, 2%,15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA450mA, 250MHz


CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H1R0W17 C291 1 1pF MURATA1pF, 50V, 0.05pF, C0G(NP0) Z01

CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H8R2W18 C303 1 8.2pF MURATA8.2pF, 50V, 0.05pF, C0G(NP0) Z01

C292, C301- CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H1R5W19 4 1.5pF MURATAC302, C304 1.5pF, 50V, 0.05pF, C0G(NP0) Z01


C282, C312, CAPACITOR, SMT, 0402, CERAMIC, GRM1555C1H2R0B21 C351, C361, 5 2.0pF Murata2pF, 50V, 0.1pF, C0G Z01C371

INDUCTOR, SMT, 0402, 6.2nH, 0.1nH,22 L1 1 6.2nH LQP15MN6N2B02 Murata130mA, 500MHz

ULTRA-SMALL TACTILE SWITCH, SMT,23 S1-S2 2 B3U-1000P OMRON2P, SPST-NO, 1.2x3x2.5mm, 0.05A, 12V

R4-R5, R051, UNINSTALLED RESISTOR/JUMPER,24 R061, R431, 0 0Ω ERJ-2GE0R00X PANASONIC DNPSMT, 0402, 0 Ω, 5%, 1/16WR441

RESISTOR/JUMPER, SMT, 0402, 0 Ω,24a R7 1 0Ω ERJ-2GE0R00X PANASONIC5%, 1/16W

RESISTOR, SMT, 0402, THICK FILM,25 R2-R3, R6 3 330Ω ERJ-2GEJ331 PANASONIC5%, 1/16W, 330

CAPACITOR, SMT, 0402, CER, 12pF,26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC50V, 5%, NPO

CAPACITOR, SMT, 0402, CER, 2200pF,27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC50V, 10%, X7R

RESISTOR, SMT, THICK FILM, 56K,28 R331 1 56kΩ ERJ-2GEJ563 PANASONIC1/16W, 5%

C081, C221, CAPACITOR, SMT, 0603, CERAMIC,29 4 10uF ECJ-1VB0J106M PANASONICC411, C451 10uF, 6.3V, 20%, X5R



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Table B-33. EM430F5137RF900 Bill of Materials (continued)

No. per Manufacturer's PartItem Reference Description Value Manufacturer CommentBoard Number

RESISTOR/JUMPER, SMT, 0402, 0 Ω,30 R1 1 0Ω ERJ-2GE0R00X PANASONIC5%, 1/16W

UNINSTALLED CAP CERAMIC 4.7UF31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP6.3V X5R 0603

32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER

33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP

DUT, SMT, PQFP, RGZ-48, 0.5mmLS,34 U1 1 CC430F52x1 TI7.15x7.15x1mm, THRM.PAD

35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH

36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP


JP3, JP5,38 3 Pin Connector 1x2pin 61300211121 WUERTHJP10

38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP

39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP

40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH



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PowerManagement

VCC

exte

rnalVCC

01 =

Vdd

DVCC

=

Vdda

AVDD

RF

AVCC

RF

1 =

_/

_

Vdda

AVCC

2 =

Port

connecto

rs

CON1 ..

CON

Port

Port

ofcc

5 =

1 ..

5430

CON

Vdd

GND

Vco

re6 =

,,

,COM

LCDCAP

0,

CON

Vdda

Vdda

GND

7 =

1,

2,

,AGND

CON

JTAG

BASE

8 =

_(

)JTA

GPort

CON

Vdd

GND

AGND

9 =

,,

(Maybeaddedclose

totherespectiv

epins

toreduceem

issio

ns

at

GHz

tolev

el5

require

dby

ETSI)


B.32 EM430F6137RF900

Figure B-63. EM430F6137RF900 Target board, Schematic



http://www.ti.com


JTAG connector

External power connectorCON12

GNDGNDVCC

Open to disconnect LEDsjumper JP5/JP10

LED D2 (red) connected toP3.6 via JP10

LED D1 (green) connectedto P1.0 via JP5

RF - Crystal Q1 26 MHz

RF - Signal SMA

Reset button S1

Push-button S2connected to P1.7

Jumper JP1Close JTAGposition todebug inJTAG mode

Jumper JP2Close EXT for external supplyClose INT for JTAG supply

Close SBW positionto debug inSpy-Bi-Wire mode

Jumper JP1Spy-Bi-Wire mode

Footprint for 32kHz crystal

Use 0 resistor for R541/R551to makeP5.0/P5.1 availableon connector port5

Ω

Open to measure currentjumper JP3

C392

C422

L451


Figure B-64. EM430F6137RF900 Target board, PCB

The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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No.Pos. Ref Des per Description Part No. Manufacturer

Board

( CUSTOMER SUPPLY ) CRYSTAL, SMT, AKER1 Q1 1 ASX-531(CS)4P, 26MHz ELECTRONIC

C1-C5, C112,C252, C381, CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391, C421, 14 0402YC104KAT2A AVX0.1uFC431, C451,C522, C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R

4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg

7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT


11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA

12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)

INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHz

INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,15 L413, L415 2 LQW15AN15NJ00 MURATA250MHz


CAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0

CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)


C46-C48, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 5 GRM1555C1H2R0CZ01 MurataC392, C422 50V, ±0.25pF, C0G(NP0)

INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH,22 L1 1 LQW15AN6N2D00 Murata700mA, 250MHz

ULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12V

RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 R7 1 ERJ-2GE0R00X (UN) PANASONIC1/16W

RESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330

CAPACITOR, SMT, 0402, CER, 2200pF,27 C511 1 ECJ-0EB1H222K PANASONIC50V, 10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,28 4 ECJ-1VB0J106M PANASONICC521, C561 6.3V, 20%, X5R

28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

RESISTOR, SMT, THICK FILM, 56K, 1/16W,29 R441 1 ERJ-2RKF5602 PANASONIC1%

RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,30 R1 1 ERJ-2GE0R00X PANASONIC1/16W




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Board

DUT, SMT, PQFP, RGC-64, 0.5mmLS,33 U1 1 CC430F6137 TI9.15x9.15x1mm, THRM.PAD



36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH




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B.33 EM430F6147RF900

Figure B-65. EM430F6147RF900 Target Board, Schematic



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Figure B-66. EM430F6147RF900 Target Board, PCB

The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensurecorrect battery insertion regarding the polarity as indicated in battery holder.



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Board

( CUSTOMER SUPPLY ) CRYSTAL, SMT, AKER1 Q1 1 ASX-531(CS)4P, 26MHz ELECTRONIC

C1-5 C112C252 C381 CAPACITOR, SMT, 0402, CER, 16V, 10%,2 C391 C421 14 0402YC104KAT2A AVX0.1uFC431 C451C522 C562

CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,3 C101 1 0603YD474KAT2A AVX16V, 10%, X5R

4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE

HEADER, THU, MALE, 14P, 2X7,5 CON11 1 09 18 514 6323 HARTING25.4x9.2x9.45mm, 90deg

7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT

8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT


11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA

12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA

CAPACITOR, SMT, 0402, CERAMIC, 100pF,13 C403 1 GRM1555C1H101JZ01 MURATA50V, ±0.25pF, C0G(NP0)

INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,14 L414 1 LQW15AN2N2C10 MURATA1000mA, 250MHz

Inductor, SMD, 0402, 15nH, 5%, 370mA,15 L413 1 LQW15AN15NJ00 MURATA250MHz

INDUCTOR,SMT,0402,15nH,±5%,460mA,25015 L415 1 LQW15AN15NJ00 MURATAMHz

Inductor, SMD, 0402, 18nH, 5%, 460mA,16 L402, L412 2 LQW15AN18NJ00 MURATA250MHz

CAPACITOR, SMT, 0402, CER, 1pF, 50V,17 C401 1 GJM1555C1H1R0CB01D MURATA±0.25pF, NP0

CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,18 C413 1 GRM1555C1H8R2CZ01 MURATA50V, ±0.25pF, C0G(NP0)

C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,19 4 GRM1555C1H1R5CZ01 MURATAC412, C414 50V, ±0.25pF, C0G(NP0)

INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,20 L1, L401, L411 3 LQW15AN12NJ00 MURATA250MHz

C46-C48, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,21 4 GRM1555C1H2R0CZ01 MURATAC392 50V, ±0.25pF, C0G(NP0)

Inductor, SMD, 0805, 2.2uH, 20%, 600mA,22 L2 1 LQM21PN2R2MC0 MURATA50MHz

ULTRA-SMALL TACTILE SWITCH, SMT, 2P,23 S1-S2 2 B3U-1000P OMRONSPST-NO, 1.2x3x2.5mm, 0.05A, 12V

R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,24 4 ERJ-2GE0R00X (UN) PANASONICR554 1/16W

RESISTOR, SMT, 0402, THICK FILM, 5%,25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC1/16W, 330

CAPACITOR, SMT, 0402, CER, 2200pF,27 C511 1 ECJ-0EB1H222K PANASONIC50V, 10%, X7R

C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF,28 4 ECJ-1VB0J105K PANASONICC521, C561 6.3V, 20%, X5R

28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC

RESISTOR, SMT, THICK FILM, 56K, 1/16W,29 R441 1 ERJ-2RKF5602 PANASONIC1%




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Board

DUT, SMT, PQFP, RGC-64, 0.5mmLS,31 U1 1 CC430F6147 TI9.15x9.15x1mm, THRM.PAD

IC, Step Down Converter with Bypass Mode33 U2 1 TPS62370 TIfor Low Power Wireless


35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH

JP3, JP5, JP9,36a 4 Pin Connector 1x2pin 61300211121 WUERTHJP10


38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA

38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA

CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,38 C041 1 MURATAX5R



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MSP-FET430PIF www.ti.com

B.34 MSP-FET430PIF

Figure B-67. MSP-FET430PIF FET Interface Module, Schematic



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www.ti.com MSP-FET430PIF

Figure B-68. MSP-FET430PIF FET Interface Module, PCB



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MSP-FET430UIF www.ti.com

B.35 MSP-FET430UIF

Figure B-69. MSP-FET430UIF USB Interface, Schematic (1 of 4)



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www.ti.com MSP-FET430UIF




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Figure B-73. MSP-FET430UIF USB Interface, PCB



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B.35.1 MSP-FET430UIF Revision History

Revision 1.3

• Initial released hardware version

Assembly change on 1.3 (May 2005)

• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R

Changes 1.3 to 1.4 (Aug 2005)

• J5: VBUS and RESET additionally connected

• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R

• U1, U7: F1612 can reset TUSB3410; R44 = 0R added

• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND

• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP

• Pullups on TCK and TMS: R78, R79 added

• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV

NOTE: Using a locally powered target board with hardware revision 1.4

Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunctionwith a locally powered target board is not possible. In this case, the target device RESETsignal is pulled down by the FET tool. It is recommended to remove R62 to eliminate thisrestriction. This component is located close to the 14-pin connector on the MSP-FET430UIFPCB. See the schematic and PCB drawings in this document for the exact location of thiscomponent.

Assembly change on 1.4 (January 2006)

• R62: not populated



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Appendix CSLAU278M–May 2009–Revised March 2013

Hardware Installation Guide

This section describes the hardware installation process of the following USB debug interfaces on a PCrunning Windows XP:

• MSP-FET430UIF

• eZ430-F2013

• eZ430-RF2500

• eZ430-Chronos

• eZ430-RF2780

• eZ430-RF2560

• MSP-WDSxx "Metawatch"

• LaunchPad (MSP-EXP430G2)

• MSP-EXP430FR5739

• MSP-EXP430F5529

The installation procedure for other supported versions of Windows is very similar and, therefore, notshown here.

Topic ........................................................................................................................... Page

C.1 Hardware Installation ....................................................................................... 149

148 Hardware Installation Guide SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback



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C.1 Hardware Installation

Table C-1 shows the USB VIDs and PIDs used in MSP430 tools.

Table C-1. USB VIDs and PIDs Used in MSP430 Tools

Tool USB VID USB PID INF File Name

eZ430-F2013 0x0451 0xF430 usbuart3410.inf

eZ430-RF2500 0x0451 0xF432 430CDC.inf

eZ430-RF2780 0x0451 0xF432 430CDC.inf

eZ430-RF2560 0x0451 0xF432 430CDC.inf

MSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.inf

eZ430-Chronos 0x0451 0xF432 430CDC.inf

MSP-FET430UIF (1) 0x2047 0x0010 msp430tools.inf

LaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.inf

MSP-EXP430FR5739 0x0451 0xF432 430CDC.inf

MSP-EXP430F5529 0x0451 0xF432 430CDC.inf(1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID

0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.

1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one ofIDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB DebugInterfaces without user interaction. After IDE installation the USB Debug Interface can be connectedand will be ready to work within few seconds.

2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PCthe Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.

3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).

Figure C-1. Windows XP Hardware Wizard

149SLAU278M–May 2009–Revised March 2013 Hardware Installation GuideSubmit Documentation Feedback


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Hardware Installation www.ti.com

4. Browse to the folder where the driver information files are located (see Figure C-2).

For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or

c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or

c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.

For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART, or

<Installation Root>\Embedded Workbench x.x\ 430\drivers\<Win_OS>.

Figure C-2. Windows XP Driver Location Selection Folder

5. The Wizard generates a message that an appropriate driver has been found.



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6. The wizard installs the driver files.

7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.

8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry asshown in Figure C-3, Figure C-4, or Figure C-5.

Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010



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Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430



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Figure C-5. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF432



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Document Revision History www.ti.com

Document Revision HistoryVersion Changes

SLAU278 Initial release

SLAU278A Updated USB driver installation according to CCE v3.1 SR1 and CCS v4.

SLAU278B Added information about MSP-FET430U80USB, MSP-TS430PN80USB, and eZ430-Chronos.

Added bills of materials and updated some PCBs in Appendix B.SLAU278CAdded information about MSP-TS430DA38, MSP-TS430DL48, MSP-TS430PW14, MSP-TS430PW28.

Added information about MSP-TS430L092, MSP-TS430RSB40, MSP-TS430RGC64USB, MSP-TS430PZ100USB, MSP-SLAU278DFET430F5137RF900

Added jumper information for MSP-TS430L092 PCBs to Appendix B.SLAU278EAdded new supported devices in Chapter 1.

Added information about MSP-TS430PW24, MSP-TS430PW28A, MSP-TS430RHA40A, MSP-TS430RGZ48B, MSP-SLAU278F TS430RGC64B, MSP-TS430PN80A, and MSP-TS430PZ100B.

Updated MSP-TS430RSB40 schematics

SLAU278G Added information for MSP-TS430PZ100C

SLAU278H Added information for MSP-TS430D8 and MSP-TS430RGC64C

Updated Table 1-1.Replaced Figure 2-2.Added Figure 2-3.SLAU278IReplaced Figure B-37 and Figure B-67.Added Table C-1.Editorial changes throughout.

SLAU278J Added EM430F6147RF900 Section B.33.

Added battery pack connection information to all EM430Fx1x7RF900 kits.SLAU278K Added information for MSP-TS430RGZ48C and MSP-TS430PEU128.

Updated Figure B-38.

Changed descriptions in Section B.19 and Section B.30.SLAU278LChanged Figure B-60.

SLAU278M Added information for MSP430G2x44 and MSP430G2x55 in Table 1-2.

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

154 Revision History SLAU278M–May 2009–Revised March 2013Submit Documentation Feedback


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RF EMISSION TESTING

All MSP-TS430xxx kits and kits listed below have been tested for compliance with Part 15 of the FCC and Canadian ICES-003 rules. SeeREGULATORY COMPLIANCE INFORMATION for details on compliance with these rules. All other kits described in this document eitherhave not been tested or have the statement in their documentation, which is listed in Related Documentation From Texas Instruments.

MSP-FET430UIF

EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TOBUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTHABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIALDAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safetyprograms, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, andtherefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the FederalCommunications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumeruse. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computingdevices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequencyinterference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense willbe required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency andpower limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with locallaws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate thisradio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited andunauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatoryauthorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not causeharmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate theequipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercialenvironment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with theinstruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely tocause harmful interference in which case the user will be required to correct the interference at his own expense.

http://www.ti.com/corp/docs/csr/environment/ESHPolicyandPrinciples.shtml

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipmentgenerates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may causeharmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. Ifthis equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate theequipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) thisdevice may not cause interference, and (2) this device must accept any interference, including interference that may cause undesiredoperation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gainapproved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain shouldbe so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximumpermissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gaingreater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité del'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation estautorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter toutbrouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gainmaximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique àl'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manueld’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus danscette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

SPACER

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【【Important Notice for Users of this Product in Japan】】This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs andCommunications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law ofJapan,

2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to thisproduct, or

3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan withrespect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please notethat if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

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【ご使用にあたっての注】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

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EVALUATION BOARD/KIT/MODULE (EVM)WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finishedelectrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation inlaboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risksassociated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished endproduct.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and DrugAdministration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicableregulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents tominimize the risk of electrical shock hazard.

3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, evenif the EVM should fail to perform as described or expected.

4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per theuser guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, andenvironmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contacta TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of thespecified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/orinterface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to theload specification, please contact a TI field representative. During normal operation, some circuit components may have case temperaturesgreater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components includebut are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using theEVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, pleasebe aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeablein electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representativesharmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or inconnection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claimsarise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (suchas life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as deviceswhich are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separateAssurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2013, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.

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