Values such as maximum speed and placement accuracy may vary depending on operating conditions. Please refer to the specification booklet for details.

*1: Compatible with 220/380/400/420/480 V*2: Only for main body*3: Dimension D including direct tray feeder: 2,565 mm*4: Excluding monitor and signal tower*5: Standard configuration: excluding batch exchange cart and tray feeders. This may differ depending on configuration.*6: The 0402 chip requires a specific nozzle/feederC

M602-L

Modular High-speed Multi-functional Placement Machine• One platform solution for any kind of production• APC-capable (Adaptive Process Control)—adapting placement of 01005s down to 1.6mil spacing• Linear motor drive increases reliability and reduces maintenance• Compatible with other CM-series equipment

Electronic Assembly Mounting System

High-speed head (12 nozzles)

CM602-L

MODEL NO. NM-EJM8A

PCBDIMENSIONS

Min L × W to 50 mm × 50 mm

Max L × W 510 mm × 460 mm

HEAD TYPE HIGH-SPEED (12 Nozzles) HIGH-FLEXIBILITY (8 Nozzles) MULTI-FUNCTION (3 Nozzles)

Maximum speed 0.036 s/chip (for Type A-2 head) 0.048 s/chip (for Type A-0 head) 0.18 s/QFP (for Type B-0 head)

Placement accuracy ±40 µm/chip (Cpk≥1)±40 µm/chip, ±35 µm/QFP 24 mm to 32 mm±50 µm/QFP <24 mm (Cpk≥1)

±35 µm/chip (Cpk≥1)

COMPONENT DIMENSIONS (mm) 0402 (01005") chip*6 to L 12 x W 12 0603 (0201") chip to L 32 x W 32 0603 (0201") chip to L 100 x W 90

PCB EXCHANGE TIME 0.9s (Board length up to 240 mm under optimum conditions)

ELECTRIC SOURCE*1 3-phase AC 200 V, 4.0 kVA

PNEUMATIC SOURCE*2 0.49 MPa, 170 L/min (A.N.R.)

DIMENSIONS*2 W 2,350 mm

D 2,290 mm*3

H 1,430 mm*4

MASS*5 3,400 kg

Head OptionsHigh-speed 12 nozzle head• Measures actual chip thickness• Maintains constant placement force,

preventing chip cracking

• Verifies chip placement

Compact Feeder Cart• 200 mm feeder cart

size decrease• Compact cart

compatible with existing feeder carts. Both cart types can be used at the same time.

*Installed high-speed software. NM-EJM8A is standard. NM-EJM4A is optional.

Maximum Speed (Type A-2)0.036 s/chip 100,000 cph*

• New high-speed head (12 nozzles) provides super high-speed placement of microchips

• Main body has space-saving small footprint• 166% higher productivity than previous

generations

High-flexibility 8 nozzle head• Measures actual chip thickness• Updates part

library with measured thickness

• Allows for multiple vendors of the same components

Area Productivity (Type A-2)• 15,800 to 18,500 cph/m2

Highly productive and compact

Compact feeder cart increases area productivity 17%

(optional)

Chip thickness measuring sensor

(optional)

one platform

solutionfor world-class

manufacturing

A wide range of options

400 mm

2,690 mm2,290 mm

CM602-L with CM602-L with existing feeder cart compact type

Placement Quality Enhancement

High-speed POP placement using transfer units (optional)

High-speed POP Placement• Placement speed 0.65 s/chip

Mid-sized Large Micro-chips Components Components

High-speed Head High-flexibility Head Multi-functional Head (12 nozzles) (8 nozzles) (3 nozzles)

Board Warp Sensing• The optimum placement height is controlled by

measuring board warp.

3D Sensor• Detects all leads of components; i.e., QFP,

SOP, SOJ• High-speed detection via batch scanning• Detects solder ball position and measures ball

height

Ball lacking CSP

BGA.CSPBatch transfer for 8 components by high-flexibility heads (8 nozzles)

Transfer unit

Easy Maintenance• Install and remove

squeegee and scraper without tools

Machine ConfigurationThe most suitable module can be selected to place components from microchips to odd-shaped components—depending on the products and production volume.

Board warp measuring sensor

(optional)

3D sensor for high-quality IC package placement

(optional)

CONFIGURATION TYPE 12 NOZZLES/12 NOZZLES 12 NOZZLES/8 NOZZLES 8 NOZZLES/8 NOZZLES 12 NOZZLES/3 NOZZLES 8 NOZZLES/3 NOZZLES 3 NOZZLES/3 NOZZLES

HEAD COMBINATION

A TYPE A-2 TYPE A-1 TYPE A-0 — — —

B — — — — — TYPE B-0

C — — — TYPE C-1 TYPE C-0 —

TRAY SUPPORT

ONE SIDE

D — TYPE D-3 TYPE D-2 TYPE D-1 TYPE D-0 —

E — — — — — TYPE E-0

BOTH SIDES

F — — TYPE F-2 — TYPE F-1 TYPE F-0

A wide range of options

Tray Support (optional)Direct Tray Feeder DT502-20

• JEDEC trays are supported.

• Up to 20 types of trays can be stocked.

• Components can be supplied from trays during operation.

Changeable Film Thickness• Squeegee gap is programmable for each

component

TRANSFER TYPE MAX. DIMENSION

8 NOZZLES 4 COMPONENTS x TWO-TIME BATCH TRANSFER 12 mm

3 NOZZLES 3 COMPONENTS BATCH TRANSFER 15 mm

Component Types: Up to 216 (8 mm double tape feeder)

© Copyright 2005, 2008 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement. EAG013.02

Panasonic Factory Solutions Company of America

1-847-495-6100PFSAmarketing@us.panasonic.companasonicfa.com

Safety Caution: To ensure safety when using this equipment, all work should be performed in accordance with the supplied operating instructions. Thoroughly read your operating instructions manual.

CM602-LGHG Factor 1.6Resource Factor 2.1(Ref. Product CM202-DH)

It may not conform to Machinery Directive and EMC Directive in case of optional configuration and custom-made specification.

Matsushita Group builds Environmental Management System in the factories of the world and acquires the International Environmental Standard ISO 14001:2004

Matsushita Group products are built with the environment in mind. http://panasonic.co.ip/eco/en/

platform solution

one

Quick changeoverModular and

highly compatible

Quick Changeover Capabilities Include:• Feeder carts• Intelligent tape feeders• Tape splicing (component

supplied during operation)• Optimized software

Common Nozzles

Tape Feeder Bulk Feeder Stick Feeder (8 mm to 104 mm)

Feeder Cart

Tape Splicing

• Our modular manufacturing concept ensures high compatibility with the CM series.

Feeder Cart

Feeder

Ceramic Nozzles

Placement Data

Touch Panel OperationShuttle Tray Feeder

All data as of February 1, 2008