Mobile Products Group Update23.4.2004 Olaf Höhne.

Mobile Products GroupMobile Products Group

Update Update 23.4.200423.4.2004

Olaf HöhneOlaf Höhne

AgendaAgenda

-Mobile GrowthMobile Growth

-Roadmap updateRoadmap update

-Processor numberProcessor number

-DothanDothan

-Sonoma PlatformSonoma Platform

Intel® Confidential

For Customers Under NDA3Consumers Go MobileConsumers Go Mobile

Notebooks Outsell DesktopsNotebooks Outsell Desktops

“ “ Notebooks outsell desktops Notebooks outsell desktops for the first time in U.S”for the first time in U.S”

Computerworld, July 2003Computerworld, July 2003

“Move Over, Desktops. Make Way For Laptops . . Now even slim notebooks can do the work of a traditional PC. And buyers are snapping them up.” BusinessWeek, November 7, 2003

14%16%18%20%22%24%26%28%30%32%

2000 2001 2002 2003 2004

Worldwide Portables Ratio by SegmentWorldwide Portables Ratio by SegmentHomeCommercial

Source: IDC, September 2003


For Customers Under NDA4Platform Roadmap for Business Notebooks

Value

20052004Q1 Q2 Q3 Q4 Q1 Q2Form Factor

Thin & Lightand Full Size

Minis, Subs, Slates

Intel ® 915GM, 915PM, 910GML Chipsets

Dothan Processor

Intel ® 915GM, 915PM Chipsets

Intel ® 915GMS Chipset

Intel ® PRO/Wireless 2915ABG

Intel® Celeron® M Processor

Intel ® 855PM, 855GM, 855GME& 852GM Chipsets

Intel® Pentium® M Processor

Intel ® PRO/Wireless 2100, 2100AIntel ® PRO/Wireless 2200BG

Intel ® 855PM, 855GM &855GME Chipsets

Intel® Centrino™ Mobile Technology

Dothan Processor LV & ULV

Intel ® 915GM, 915PM Chipsets

Intel ® PRO/Wireless 2915ABG

Intel® Pentium® M Processor LV & ULV

Intel ® PRO/Wireless 2100, 2100AIntel ® PRO/Wireless 2200BG

Intel ® 855PM, 855GM &855GME Chipsets

Intel® Centrino™ Mobile Technology

Dothan Processor

Intel ® 915GMS Chipset


For Customers Under NDA5

Q2’04 Availability and Stability Guidance for IT ManagersQ2’04 Availability and Stability Guidance for IT Managers

Q1’04 Q2’04 Q3’04 Q4’04 2005

DeployDeploy

Intel® 915GM & 915PM Chipsets

Intel® 855 Chipset Family

Intel® PRO/Wireless 2100

Intel® PRO/Wireless 2200BG & Intel® PRO/Wireless 2915ABG

Intel® Pentium® M processor

Deploy

At least 12 months of Deployment for Image Compatible PlatformsAt least 12 months of Deployment for Image Compatible Platforms

Qualify & Launch

Qualify & Launch

Intel® Pentium® M processor

Intel® Stable Image Platform ProgramRoadmap and Transition Guidance



Mobility Processor Roadmap

Processor BrandProcessor BrandProcessorProcessorNumberNumber

Processor Processor Generation Generation (Architecture)(Architecture) Clock SpeedClock Speed Front Side BusFront Side Bus CacheCache

IntelIntelTechnologiesTechnologies

IntelIntel® ® PentiumPentium®® M Processor M Processor 770770 Dothan 90nmDothan 90nm 2.13 GHz2.13 GHz 533 MHz533 MHz 2MB L22MB L2 EISTEIST

760760 Dothan 90nmDothan 90nm 2 GHz2 GHz 533 MHz533 MHz 2MB L22MB L2 EISTEIST

755755 Dothan 90nmDothan 90nm 2 GHz2 GHz 400 MHz400 MHz 2MB L22MB L2 EISTEIST

750750 Dothan 90nmDothan 90nm 1.86 GHz1.86 GHz 533 MHz533 MHz 2MB L22MB L2 EISTEIST







System PriceSystem Price Q2’04Q2’04 Q3’04Q3’04 Q4’04Q4’04 Q1’05Q1’05

ProfessionalProfessional>$3.0K>$3.0K 755755 755755 770770 770770

MainstreamMainstreamPerformance 3Performance 3$2.5 to $3.0K$2.5 to $3.0K

745745 745745 755 / 760755 / 760 760760


735735 735735 745 / 750745 / 750 750750


725725715715

735 / 740735 / 740725 / 730725 / 730

740740730730

IntelIntel® ® PentiumPentium®® M Processor M Processor

Note: Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Over time processor numbers will increment based on changes in clock speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.



Intel® Celeron® M Processor Roadmap


ValueValue<$1.5K<$1.5K 340340

320 / 330320 / 330360360

340 / 350340 / 350370370

350 / 360350 / 360

IntelIntel®® Celeron Celeron®® M Processor M Processor

ValueValueUltra Low VoltageUltra Low Voltage<$1.5K<$1.5K 338338 338338 358358

IntelIntel®® Celeron Celeron®® M Processor Ultra Low Voltage M Processor Ultra Low Voltage


Processor Processor Generation Generation (Architecture)(Architecture) Clock SpeedClock Speed Front Side BusFront Side Bus CacheCache


IntelIntel® ® CeleronCeleron®® M Processor M Processor 370370 Dothan 90nmDothan 90nm 1.50 GHz1.50 GHz 400 MHz400 MHz 1MB L21MB L2

360360 Dothan 90nmDothan 90nm 1.40 GHz1.40 GHz 400 MHz400 MHz 1MB L21MB L2

350350 Dothan 90nmDothan 90nm 1.30 GHz1.30 GHz 400 MHz400 MHz 1MB L21MB L2

340340 Banias 130nmBanias 130nm 1.50 GHz1.50 GHz 400 MHz400 MHz 512KB L2512KB L2

330*330* Banias 130nmBanias 130nm 1.40 GHz1.40 GHz 400 MHz400 MHz 512KB L2512KB L2

320*320* Banias 130nmBanias 130nm 1.30 GHz1.30 GHz 400 MHz400 MHz 512KB L2512KB L2

IntelIntel® ® CeleronCeleron®® M Processor M ProcessorUltra Low VoltageUltra Low Voltage

358358 Dothan 90nmDothan 90nm 1 GHz1 GHz 400 MHz400 MHz 512KB L2512KB L2

338338 Dothan 90nmDothan 90nm 900 MHz900 MHz 400 MHz400 MHz 512KB L2512KB L2

* Existing SKUs from Q2’04 renamed with processor number




Portability Processor Roadmap for Transportable Notebooks


MainstreamMainstreamPerformance 3Performance 3$2.5 to $2.5 to $3.0K$3.0K 538538 552552 558558 558558


538538532532

552552538538

552552538538

552552538538


518518 532532518518

532532518518

532532518518

Mobile IntelMobile Intel®® Pentium Pentium®® 4 Processor supporting Hyper-Threading Technology 4 Processor supporting Hyper-Threading Technology

Value 3Value 3$1.4 to $1.5K$1.4 to $1.5K 335335 340340 345345 350350

Value 2Value 2$1.2 to $1.4K$1.2 to $1.4K 330330 335335 340340

335335345345340340

Value 1 Value 1 <$1.0 to $1.2K<$1.0 to $1.2K 325325 330330

325325 330330 335335

IntelIntel® ® CeleronCeleron®® D Processor D Processor




Portability ProcessorFeature Set Reference Table


ProcessorProcessorGenerationGeneration(Architecture)(Architecture) Clock SpeedClock Speed Front Side BusFront Side Bus CacheCache


Mobile IntelMobile Intel® ® PentiumPentium®® 4 4 ProcessorProcessor

558558 Prescott 90nmPrescott 90nm 3.60 GHz3.60 GHz 533 MHz533 MHz 1MB L21MB L2 HT, EISTHT, EIST





IntelIntel® ® CeleronCeleron®® D Processor D Processor 350350 Prescott 90nmPrescott 90nm 3.20 GHz3.20 GHz 533 MHz533 MHz 256KB L2256KB L2

345345 Prescott 90nmPrescott 90nm 3.06 GHz3.06 GHz 533 MHz533 MHz 256KB L2256KB L2








1H‘031H‘03 2H‘032H‘03 1H‘041H‘04 2H‘042H‘04

Intel® Pentium® M Intel® Pentium® M Processor Processor

1.70 GHz, LV 1.20GHz, 1.70 GHz, LV 1.20GHz, ULV 1 GHz ULV 1 GHz

Intel® 855PM Intel® 855PM Intel® 855GM Intel® 855GM

ChipsetsChipsets

Intel® 855PM Intel® 855PM Chipset Chipset (DDR333)(DDR333)

Intel® 855GME Intel® 855GME ChipsetChipset

Intel® Intel® PRO/Wireless PRO/Wireless 2100 Network 2100 Network Connection Connection

Intel® Intel® PRO/Wireless PRO/Wireless

2100A Network 2100A Network Connection Connection

Intel® Intel® PRO/Wireless PRO/Wireless

2200BG Network 2200BG Network Connection Connection

Intel® Pentium® M Intel® Pentium® M Processor (Dothan)Processor (Dothan)

Intel® Pentium® M Intel® Pentium® M Processor (Dothan Processor (Dothan w/ 533MHz FSB) w/ 533MHz FSB)

ChipsetsChipsets(Alviso)(Alviso)

802.11 a/b/g 802.11 a/b/g (Calexico 2)(Calexico 2)

Wir

eles

s C

hip

set

Pro

cess

or

SonomaSonoma

Taking Mobility to a New Level IntelIntel®® Centrino Centrino™™ Mobile Mobile

TechnologyTechnology



5555 Million Transistors Million Transistors

.13.13 Micron Micron

512K512K L2 Cache L2 Cache

20022002

Mobile Innovation Mobile Innovation Enhancements Relative to Die SizeEnhancements Relative to Die Size

X = 13mm y = 12mm

Mobile Intel® Pentium® 4 Mobile Intel® Pentium® 4 Processor – MProcessor – M

11.62mm x 11.34mm = 131.8mm11.62mm x 11.34mm = 131.8mm22







11.62mm x 11.34mm = 131.8mm11.62mm x 11.34mm = 131.8mm22

20032003

77 77 Million TransistorsMillion Transistors


1M1M L2 Cache L2 Cache


X = 13mm y = 12mm

Intel® Pentium® M Processor Intel® Pentium® M Processor (Banias) (Banias)

10.56mm x 7.84mm = 82.8mm10.56mm x 7.84mm = 82.8mm22







11.62mm x 11.34mm = 131.8mm11.62mm x 11.34mm = 131.8mm22

20032003





X = 13mm y = 12mm


10.56mm x 7.84mm = 82.8mm10.56mm x 7.84mm = 82.8mm22







10.56mm x 7.84mm = 82.8mm10.56mm x 7.84mm = 82.8mm22




20042004


X = 13mm y = 12mm

Intel® Pentium® M Processor Intel® Pentium® M Processor (Dothan)(Dothan)

12.3312.33mm Xmm X 6.78mm = 83.6mm 6.78mm = 83.6mm22


For Customers Under NDA15Sonoma: New Mobility Platform Q4’04

- Key Messages

Mobility driving growth & platform innovations spurring Mobility driving growth & platform innovations spurring exciting new usage modelsexciting new usage models

Sonoma: Next generation mobile platform targeted to launch Sonoma: Next generation mobile platform targeted to launch Q4’04 offers several new platform capabilities & initiativesQ4’04 offers several new platform capabilities & initiatives

– Extending mobility value propositionExtending mobility value proposition

Sonoma positioned forSonoma positioned for– Consumer: Mobile Entertainment Center Consumer: Mobile Entertainment Center – Business: High Productivity SolutionBusiness: High Productivity Solution

Momentum in press building on key features being offered on Momentum in press building on key features being offered on SonomaSonoma



Usage Models

•Other names and brands may be claimed as the property of others.Other names and brands may be claimed as the property of others.•Intel® Innovation PC Award WinnersIntel® Innovation PC Award Winners

Platform innovations spurring existing new usage Platform innovations spurring existing new usage modelsmodels



Sonoma: Platform Capabilities / Initiatives

Next Generation Intel® Pentium® M Processor

Core Si ComponentsCore Si Components

Delivers Improvement on Vectors of Mobility

Mobile Intel® 915 Express Chipset Family

Next Generation Wireless – Intel® 2915 ABG PRO/Wireless Network Connection

Targeted Platform CapabilitiesTargeted Platform CapabilitiesFeatures to differentiate platformsDevices that enhance mobility benefits

DDR2 – Next Generation Memory Technology

Extended Battery Life ‘04

Intel® High Definition Audio

Technology InitiativesTechnology InitiativesFeatures to differentiate platformsExciting new usage models for early adopters

Extended Mobile Access (EMA)

Simplified Network Selection (SNS)

Multi Factor User Authentication (MF-UA)



Integrated Graphics with Intel® 855GM, Validated for Integrated Graphics with Intel® 855GM, Validated for High Performance with Space and Power SavingsHigh Performance with Space and Power Savings

VIDVID

PSIPSIIMVP IVIMVP IVIMVP IVIMVP IV

Hub Hub InterfaceInterface

ICH4-MICH4-MICH4-MICH4-M

DDR memoryDDR memory

AC’97 2.3AC’97 2.3ModemModemModemModem

Mobile Optimized ProcessorMobile Optimized ProcessorTarget Avg. Power < 1WTarget Avg. Power < 1W

Mobile Optimized ProcessorMobile Optimized ProcessorTarget Avg. Power < 1WTarget Avg. Power < 1W

USB 2.0USB 2.0USB 2.0USB 2.0APICAPIC

EnabledEnabledAPICAPIC

EnabledEnabled

IntegratedIntegratedGraphicsGraphics

IntegratedIntegratedGraphicsGraphics

DVO (2 ports)

LVDS

TPVDVO

OptimizedOptimizedPower SupplyPower Supply

OptimizedOptimizedPower SupplyPower Supply

2 ATA66/100 IDE Channels2 ATA66/100 IDE Channels

6 USB (1.1/2.0) Ports6 USB (1.1/2.0) Ports

Integrated Integrated LANLAN

PCI 33 MHzPCI 33 MHzCardbusCardbus

400MHz Low 400MHz Low Power Processor Power Processor

System BusSystem Bus

400MHz Low 400MHz Low Power Processor Power Processor

System BusSystem Bus

802.11a/b802.11a/b802.11a/b802.11a/b

Intel® Pentium® M Intel® Pentium® M ProcessorProcessor

Intel® 855GMIntel® 855GMIntel® 855GMIntel® 855GM

Intel® Centrino® Mobile Technology Intel® 855GM

Intel® Pro/Wireless Intel® Pro/Wireless Network ConnectionNetwork Connection



SATA

Codec

PCI Express X16

GMCHGMCH

DMI

533MHz FSB

DiscreteGraphics

ICH6-MICH6-M

Sonoma: New Mobile Platform Q4’04

TPVSDVO

Northway

ExpresscardSwitch

Calexico 2Calexico 2

DothanDothan

•802.11a/b/g 802.11a/b/g

AlvisoAlviso

ICH6-MICH6-M

* Other names and brands may be claimed as the property of others. * Other names and brands may be claimed as the property of others.

Expresscard

DDRII / DDR


Supporting Higher FSB 533MHz-Dothan

Supporting Higher FSB 533MHz-Dothan

Intel® Graphics Media Accelerator 900with PCI Express* discrete graphics support and display power savings technology

Intel® Graphics Media Accelerator 900with PCI Express* discrete graphics support and display power savings technology

Next Generation Wireless - With Tri-mode support a/b/g

Next Generation Wireless - With Tri-mode support a/b/g

Expresscard* Support – Next generation PC Card

Expresscard* Support – Next generation PC Card

DDR2 Support – Next generation Memory technology

DDR2 Support – Next generation Memory technology

Serial ATA – Next generation storage technology

Serial ATA – Next generation storage technology

Intel® High Definition Audio– New audio interface standard

Intel® High Definition Audio– New audio interface standard

Extending Mobility Value Proposition With Several New Extending Mobility Value Proposition With Several New FeaturesFeatures



Intel® Graphics Media Intel® Graphics Media Accelerator 900 Accelerator 900

Intel® High Definition AudioIntel® High Definition Audio Next generation I/O & Next generation I/O &

device supportdevice support Dothan 533 MHz FSBDothan 533 MHz FSB Direct Media InterfaceDirect Media Interface

BREAKTHROUGH MOBILE PERFORMANCEBREAKTHROUGH MOBILE PERFORMANCE ENABLING EXTENDED BATTERY LIFEENABLING EXTENDED BATTERY LIFE

THINNER, LIGHTER DESIGNSTHINNER, LIGHTER DESIGNSINTEGRATED WIRELESS LAN CAPABILITYINTEGRATED WIRELESS LAN CAPABILITY

DothanDothanAlvisoAlviso

Calexico 2Calexico 2

Full rang of WLAN support: Full rang of WLAN support: 802.11 a/b/g with enhanced 802.11 a/b/g with enhanced securitysecurity

Muroc: New UI and Muroc: New UI and manageability featuresmanageability features

Bluetooth™ co-existence II Bluetooth™ co-existence II supportsupport

EBL ’04 techniquesEBL ’04 techniques DDR2 memory up to 2GBDDR2 memory up to 2GB Intel® Display Power Intel® Display Power

Saving Technology 2.0Saving Technology 2.0 Ambient Light SenseAmbient Light Sense

Integrated graphics chipset Integrated graphics chipset for board space savingsfor board space savings

PCIExpress* and PCIExpress* and ExpressCard* enable ExpressCard* enable smaller form factorssmaller form factors

TV-out integrationTV-out integration

Sonoma: Advancing the Four Vectors

All dates, plans, specifications, are subject to change without any noticeAll dates, plans, specifications, are subject to change without any notice

* Other names and brands may be claimed as the property of others. * Other names and brands may be claimed as the property of others.


For Customers Under NDA21Consumer Key Messages

Sonoma: Mobile Entertainment Center

Serial ATA physical storage technology

Intel® Graphics Media Accelerator 900

PCI Express* busArchitecture

Provides consumers incredible visual quality, smooth Provides consumers incredible visual quality, smooth video playback and support for key 3D features without video playback and support for key 3D features without the added COSTS or POWER of discrete graphicsthe added COSTS or POWER of discrete graphics

Architecture delivers up to a 4x increase in graphics and I/O bandwidth (Expresscard) for smooth multimedia performance

Dual Channel DDR 2 533 MHz Memory

New memory technology delivers increased bandwidth for improved system performance without compromising power

Better storage performance / power for your valuable digital memories

Premium sound for gaming, audio playback (DVD, MP3) including support for all major consumer electronic audio formats & stable audio solution

Wireless internet gaming over 802.11.g for intensive Wireless internet gaming over 802.11.g for intensive competition from any room in the house, ability to competition from any room in the house, ability to connect to public hotspots & ease of connectivity connect to public hotspots & ease of connectivity (Muroc)(Muroc)

Intel® PRO/Wireless Network Connection



For Customers Under NDA22Corporate: Key Messages

Sonoma: High Productivity SolutionHigh quality, stable and cost effective graphics solution designed for current and emerging business applications without the added POWER of discrete graphics

New memory technology delivers increased bandwidth for improved system performance without compromising power for demanding business applications and multitasking environments

Better application and data storage performance / power for valuable business data

New enhanced audio specification featuring multi-streaming capability for high quality speech recognition and voice over IP, while simplifying the configuration for lower cost, along with great system stability

Most significant PC bus architecture change in over a decade, delivering up to a 4x increase in graphics and I/O bandwidth for improved system and application performancePCI Express*

Dual Channel DDR 2 533 MHz Memory


Serial ATA physical storage technology

Intel® Graphics Media Accelerator 900

Sonoma – next stable image platform that provides standardized hardware configuration that IT departments can deploy into the enterprise for a set period of time

Intel® Stable Image Platform Program

Intel® 915GM & 915PM ChipsetsIntel® PRO/Wireless 2200BG & 2915ABGDeploy

Qualify & Launch

Qualify & Launch

Intel® Pentium®

M processor

Intel® PRO/Wireless Network Connection

Tri-mode wireless connectivity for flexible wireless solutions with enterprise class security support. Muroc provides flexibility, security & manageability support

Thank you!Thank you!

Mobile Products Group Update23.4.2004 Olaf Höhne.

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