Mikron - Leading Semiconductor IDM Company in Russia

Leading Semiconductor IDM Company in Russia

Corporate Presentation

www.mikron-semi.com | [email protected]

Mikron in brief

Founded in 1964, as “Research Institute for Molecular Electronics” and manufacturing facility “Mikron”

Mikron plant under construction , circa 1964

Mikron today

Today Mikron group of companies consolidates experience and know-how of 7 business units: leading scientific research institutions and high-tech enterprises

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Research and development 1) Research Institute for Molecular Electronics 2) Research Institute for Precise

Mechanical Engineering 3) Sitronics Microdesign

Mikron Group of companies: structure

JSFC SISTEMA, listed on:

RTI JSC

Mikron Group of companies

Semiconductor manufacturing 1) Mikron PJSC 2) Voronezh Manufacturing Facility

Assembly services 1) Sitronics Smart Technologies 2) Assembly Fab (Shenzhen)

Sales and distribution: regional representations 1) Foster City & Highlands Ranch, USA 2) Hong Kong 3) Shanghai 4) Taipei

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Industry leader

• The only Russian semiconductor manufacturer supporting 90-65 nm topology

• Russia’s principal SIM-card supplier for all leading cellular carriers

Largest semiconductor vendor in Russia and in the CIS by revenue and production volume

• 500+ IC items and discrete semiconductor devices in the product portfolio

• 30+ new products added annually

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Technology partners

Market leader in payment, secure communication and identity management products and solutions

Collaboration for RFID-tags and inlays manufacturing, as well as for smart-cards (bank and identity)

Technology transfer and joint venture in creating the manufacturing facility for smart-cards (bank and identity) and SIM-cards in Zelenograd (now Sitronics Smart Technologies)

One of the global top 10 semiconductor vendors by sales volume

Technology transfer for the launch of the 180 and 90 nm production lines at Mikron manufacturing facilities

World leader in protecting, verifying and managing digital identities and interactions

Collaboration in SIM-cards manufacturing

Semiconductors vendor for automotive and industrial electronics and chip card and security applications

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Certificates & associations

• International certifications: – Quality Management System – Environmental Management System – Energy Management System

• Member of: – Global Semiconductor Association – Silicon Trust Alliance – Semi – OSPT Alliance

GS1 Russia – Stanford Center for Integrated Systems

• Product certification by EMVCo (with Visa and MasterCard as members), and by Russian, as well as internationally authorized government agencies and industry organizations

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http://www.google.ru/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=-IngPZSCeQ_0OM&tbnid=OyieO-7sFfxfAM:&ved=0CAUQjRw&url=http://blog.discovernetwork.com/stories/news/discover-joins-emvco-to-help-advance-global-emv-standards/&ei=9r5fUqWbOsLp4gTVnoHgCg&bvm=bv.54176721,d.bGE&psig=AFQjCNHu_Rc3ywqr_YIuf9t3EI4bpaBxLA&ust=1382092904153691

http://www.google.ru/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&docid=wxi_u1qrwzTkPM&tbnid=Sng0JFzKeItbHM:&ved=0CAUQjRw&url=http://eepos-project.eu/eepos/project-partners/&ei=zb5fUqTOIKT04QSw64D4Cw&bvm=bv.54176721,d.bGE&psig=AFQjCNE6juDI6948OBvpEyMTXYqg2Dod1A&ust=1382092869367293

http://www.arsenal-testhouse.com/


Customers

All Russia’s top cellular carriers

Leading banks, including:

Transport companies, including:

Governmental bodies and agencies:

Main export directions: Southeast Asia (China, Taiwan, Hong Kong), Europe, USA

Main export products: AC-DC & DC-DC converters, LED drivers, analog ICs, DA/AD converters, voltage regulators, interface ICs, operational amplifiers, ASICs, RFID inlays.

As well as OEMs, electronic components distributors, system integrators and design houses

400+ customers in Russian and 100+ abroad

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Research & development

• 15% of revenues are invested in R&D

• 40 R&D projects in progress for 91 new products

• Designing and testing ICs and discrete semiconductor devices

• Process development: CMOS, HV CMOS, Bipolar, Planar, HV Planar, BCD, trench MOS, EEPROM, Flash memory

• Development of semiconductor structures

• CAD tools mastering and development

• Processing and extraction of data for photo-masking

• IP and libraries development, SPICE extraction, layout optimization

• RFID test lab

• Development of specialized product software:

– Embedded software for smart-card microcontrollers

– Operation system of ICs for ID documents / SIM-cards

– Universal OS

Research areas

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• Tag specification development for specific tasks and materials (glass, plastic, wood, etc.); choice of technology, material, shape, dimensions, etc.

• Tag and antenna development for HF and UHF tags in various applications

• Certified development software (CST Studio Suite, Ansoft HFSS, AWR Design Environment) and best of class measuring and testing equipment (Agilent, Micropross, Voyantic, R&S)

• Testing via usage environment simulation

• Broad experience in product design using a wide range of crystals: • HF: Mikron – MIK; NXP – Mifare Ultralight, ICode, Mifare 1K, NTag

(NFC); Infineon – Mydmove;

• UHF: Impinj – Monza 3/4/5/6, NXP – UCODE 7, G2iL, G2iM; QuanRay – QStar 53; EM Microelectronics – EM4423

• Full RFID production cycle for additional security and fast time-to-market

Mikron RFID lab

Design cycle , including antenna delivery, within 1.5 month

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Full cycle manufacturer

Mikron’s expertise

and top of the line manufacturing

facilities allow the company

to be in control

of the entire IC

and smart-card production cycle

Front end production (wafers)

Back end production (ICs, smart-cards)

Supply IC design

System design, applications

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Manufacturing facilities

IC manufacturing • 8” line in Zelenograd (Moscow, Russia)

CMOS with embedded NVM 180 and 90nm for smart-card ICs, RFID and logic

• 6” line in Zelenograd Bipolar for power management ICs

• 6” line in Voronezh (Russia) Planar for Schottky diodes and power management ICs

• 4” line in Voronezh Planar for TVS diodes and fast recovery diodes

IC and smart-card assembly • Shenzhen (China)

Assembling facilities for power management ICs and discrete semiconductor devices

• Zelenograd (Russia) RFID assembly & personalization for plastic and paper chip cards and tags

Voronezh

Zelenograd

30 000 16 000 3 000

4” 6” 8”

Supported nodes: 3-0,25 µm 180 nm 90 nm 65 nm

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RFID chips, tags, inlays and cards

Discrete semiconductor

devices

Microprocessors for smart-cards

Power management &

power electronics ICs

Main product groups

• HF inlays

• UHF inlays

• NFC inlays

• Fast Recovery diodes

• Schottky diodes

• LC-EMI / RS-EMI filters

• TVS diodes & arrays

• Microprocessors for bank cards

• Microprocessors for SIM cards

• Microprocessors for ID-cards

• DC-DC / AC-DC converters

• Voltage regulators (LDO, standard)

• Pulse-width-modulation controllers

• Comparators and operational amplifiers

• LED drivers

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Technologies & Products. 8” Fab

Technology Base technology

Voltage, V (core / I/O)

#Me Options Design rules and libraries IP Products

HCMOS8D CMOS 0.18 µm

HCMOS8D_6M_3.3V

1,8 / 3,3 6 HIPO, MIM

Cadence Design Framework II 5.10.41_USR5.90.69, Cadence Spectre MMSIM 6.2.0.445, Mentor Graphics Calibre DRC\LVS\xRC V2007.3_36.25, Mentor Graphics Eldo V6.8_3.1

Yes • High performance universal microcontrollers and microprocessors

• Memory VLSIs, GLONASS navigation and digital TV VLSIs

• High performance DA/AD converters, etc.

HCMOS8D CMOS 0.18 µm

HCMOS8D_6M_5V

1.8 / 5 / 3,3 6 HIPO, MIM, OTP

Cadence Design Framework II 5.10.41.500.6.147, Cadence Spectre version 11.1.0, Mentor Graphics Calibre DRC\LVS\xRC 2012.2_36.25, Mentor Graphics Eldo 2009.1



• High performance DA/AD converters, etc.

CMOSF8 CMOS + EEPROM 0.18 µm

CMOSF8_4M_5V

1,8 / 5 4 EEPROM Cadence Design Framework II 5.10.41.500.6.147, Cadence Spectre version 11.1.0, Mentor Graphics Calibre DRC\LVS\xRC v2010.2_38.23, Mentor Graphics Eldo 2009.1

Yes • RFID chips (transport tickets, etc.)

• ICs for smart-cards (ID documents)

• Microcontrollers and specialized VLSIs with low power consumption

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Technologies & Products. 8” Fab (cont.-ed)

Technology Base technology

Voltage, V (core / I/O)

#Me Options Design rules and libraries IP Suitable for:

HCMOS10_LP CMOS 90 nm

HCMOS10_LP_7M_2.5V

1.2 / 2.5 7 Cu + 1Al

Thick Me, MIM

Cadence Design Framework II 5.10.41.500.6.147, Cadence MMSIM 7.2.0.593.isr22, Cadence Extraction QRC 12.1.1-s782, Cadence Phisical Veryfication System 13.1.0-p286_1, Cadence EDI V12.00-p002, Mentor Graphics Calibre RC\LVS\xRC Ixl_cal_2010.2_38.23, Mentor Graphics Eldo 2009.1



• High performance FPGAs, etc.

HCMOS10_LP CMOS 90 nm

HCMOS10_LP_9M_2.5V

1.2 / 2.5 9 Cadence Design Framework II 5.1.41_USR3, Cadence Spectre MMSIM 7.1, Mentor Graphics Calibre DRC\LVS\xRC V2006.1_19.20, Mentor Graphics Eldo V6.7_1.2 (2006.1p084006)

• High performance universal microcontrollers and microprocessors


• High performance FPGAs, etc.

HCMOS065_LP 65 nm

HCMOS065_LP_8M_1.2V

1.2 / 2.5 8 Cu + 1Al

-- Cadence Design Framework II IC6.1.5.72, Cadence Spectre 7.2.0.373.isr13, Cadence PVS 13.1.0-s488, Mentor Graphics Calibre RC\LVS\xRC v2011.4_22.20

• Microprocessors and microcontrollers

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Technologies and products. 6” Fab

* under development

Technology Voltage, V #Me Products

Bipolar, 2 µm Trench - option

10V, 20V, 30V, 45V, 60V 1/2 DC-DC / AC-DC converters; voltage regulators; comparators and operational amplifiers; reference voltage sources; voltage and current control

CMOS, 1.6-2 µm 7V, 15V, 30V 1 Me, 1 polySi LDOs, AC-DC converters, mixed signal ICs

HV-CMOS (ВСD) 700V 1 Me, 1 polySi LED-drivers

Planar: Pt (IF: 1A - 100A) Mo (IF: 3A - 60A) Cr (IF: 0.5A - 30A); Ti (IF: 1A)

Pt (Vrrm: 45V - 250V) Mo Vrrm: 30V - 60V) Cr (Vrrm: 15V - 40V) Ti (Vrrm: 8V - 20V)

Schottky diodes, RC filters, TVS diodes and arrays, EMI filters, fast recovery diodes

Planar HV 400V - 1800V 2500V - 6500V*

Ultra fast recovery Schottky diodes, IGBTs

BCD 40V DC-DC converters

Thin film resistors RCDL arrays, resistors, reactors, inductance diodes

Trench MOS* Trench Schottky diodes, trench MOSFET, trench IGBTs

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Product Portfolio


Microprocessors for smart cards

Bank cards

MIK51SC72D: dual interface one-chip

microprocessor with cryptography support

• Dual interface: contact ISO 7816, contactless ISO 14443A/B

• ROM 384 Kbyte; RAM 8 Kbyte; EEPROM 72 Kbyte; Java Card 3.0.4 Classic Edition, M/Chip 4, MoC technology

• Both international and Russian crypto standards supported (DES, 3DES, AES-128, AES-256, RSA up to 2048-bit, EC-DSA, GOST 28147; 34-11; Р34.10-2001)

• Electronic digital signature support

• EMVco & MasterCard certified

MIK51BC16D:* universal dual interface one-chip

microprocessor with cryptography support

• Enhanced data protection


• ROM 256 Kbyte; RAM 6 Kbyte; EEPROM 16 Kbyte

• Both international and Russian crypto standards supported (DES, 3DES, RSA up to 2048-bit, EC-DSA, GOST 28147-89; 34-11; Р34.10-2012)

• Electronic digital signature support (including new Р34.10-2012 standard)

• Original OS

• EMVCo certification Q42016

* Under development

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MIK51AB72D: one-chip contactless microprocessor with cryptography support

• Contactless interface (ISO 14443В)

• 160 Kbyte ROM, 6 Kbyte RAM, 72 Kbyte EEPROM

• Both international and Russian crypto standards can be supported (DES, 3DES, AES, RSA, EC-DSA, GOST 28147, GOST Р34.10-2001, GOST 34-11)

• Certified by authorized Russian agencies for data protection

ID documents

MIK51AB144D: one-chip dual interface microprocessor with cryptography support



• Both international and Russian crypto standards can be supported (DES, 3DES, AES-128, RSA up to 2048 bit, EC-DSA, GOST 28147, 34-11; Р34.10-2001)


• Original OS

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MIK51AD144D:* universal one-chip dual interface microprocessor with cryptography support

• Enhanced data protection



• Both international and Russian crypto standards can be supported (DES, 3DES, RSA up to 2048 bit, EC-DSA, GOST 28147-89, 34-11; Р34.10-2012)

• Cryptographic check sum support according to ISO/IEC13239 (ISO/IEC3309) and CRC-32 standards

• Electronic digital signature support (including new Р34.10-2012 standard)

• Original OS

ID documents

* Under development

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MIK32CA384: microprocessor for SIM-cards

• 32-bit RISC-based CPU (KM32) with hardware program memory protection and user-data protection against unauthorized access

• User memory: flash, 64 Kbyte with hardware data integrity support

• Program memory: flash, 32 Kbyte

• SRAM: 10 Kbyte (2560x32)

• Interface: ISO 7816 type T0 & T1

• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, GOST) according to customer requirements


• Original OS

SIM cards

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Case studies: ID documents

MIK51AB72D, single-chip microprocessor with cryptography support and contactless interface

Product

Application

Russian biometric foreign passport

End customer

General Administration for Migration Issues of the Interior Ministry of Russia

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Case studies: ID documents

Dual interface single-chip microprocessor with cryptography support

Product: MIK51SC72D

Application

End customer

JSC UEC

Russian Universal Electronic National Identity Card

• 2 logic areas: federal and regional

• 2 mandatory federal applications: for identification and banking – ID application: personal data area, data areas for federal governmental

agencies, crypto-protected e-signature and dedicated regional data area – Banking application: Russian PRO100 payment system

• Additional federal and regional applications can be added

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Case studies: bank cards

Universal dual interface one-chip microprocessor with cryptography support

Product: MIK51BC16D

Application

End customer

Microprocessor cards for multiple Russian banks supporting Russian national payment system “Mir”

• Mikron chip is authorized by the operator of the national payment system – Joint Stock Company National System of Payment Cards (NSPK)

• Pilot project for MTS-bank for co-badge Mir-Maestro cards started in February 2016

Russian banks to comply with the requirements of the National Payment Card System “Mir”

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Chips for HF RFID tags

MIK640M2D – the smallest passive NVM RFID chip on the market!

Intellectual Property (IP) library allows to re-design the chip in 3-6 months (including pilot run)

Chip NVM (EEPROM),

bit

Cryptogra-phy

Input cap, pF

ISO certificate

Chip area, mm2

Chips per wafer

Status Applications

MIK640M2D 640 --- 16,9 + (2014) 0,19 105 000 Ready to order

Transport & access control systems

MIK64PTAS (MIK640D) 640 --- 16,9 + (2012) 0,32 69 900 Ready to order

MIK1KMCM 8192 Proprietary 16,9 + (2013) 0,35 60 600 Ready to order

MIK1K5PTAC 1536 3DES 16,9 + (2013) 0,38 56 000 Ready to order

MIK1312ED 1792 Password 16,9 + (2014) 0,23 88 300 Ready to order

MIK212ND NFC 1792 Password 16,9 In progress 0,23 88 000 Ready to order

RFID labelling, smart advertising

MIK213ND / MIK213ND NFC

1792 Password 50 In progress 0,27 78 000 Ready to order

MIK215ND NFC 4736 Password 50 In progress 0,30 up to 75 000 In development

MIK216ND (NFC) 8192 Password 50 In progress 0,35 60 000 Ready to order

MIK2048CD Cipurse L 16384 AES-128 16,8 In progress 0,95 up to 50 000 Ready to order Transport & access control systems

MIK301/MIK302 I2C 8192/ 16348

Password 50 In progress --- up to 50 000 Ready to order Home electronics & control systems

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CIPURSE support

• Application-rich smart-card based on partner-chip and/or own MIK32DA512 product

• Regular RFID card (single-trip tickets, event tickets)

CIPURSE is an open standard that provides an advanced foundation for developing highly secure, interoperable, and flexible transit fare collection solutions. It is built on proven standards, including ISO 7816, AES-128, ISO/IEC 14443-4 for securing multiple payment types.

Mikron also offers development of chip operation system according to specific customer requirements, embedding of Mikron-developed or any other OS at any production stage, as well as packaging services

CIPURSE-compliant products – test samples available

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RFID tags and inlays

• Supported standards: – HF RFID ISO 14443, 15693 – UHF RFID EPC Class1 Gen2 – NFC 14443A,B

• Frequencies: – HF RFID 13.56 MHz – UHF RFID 860-960 MHz – NFC 13.56 MHz

• Packaging: dry/wet inlays, PET and paper cards and tags, adhesive tags, tamper proof labels

• Delivered in rolls or cut

• Operating temperatures: inlays and cards: -25° …. +70°C; adhesive labels: -20° …. +80°C; tags: -40° …. +85°C

• Antenna material: aluminum

• Testing: 100% UID

• ESD: +/- 2KV

General specifications

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RFID tags portfolio

HF

• M-PASS

• M-BOOK

• MINI-ID

• M-LOAD

UHF

• M-3D

• M-FLAT

• M-BOX

• MINI-UHF

• NEAR-UHF

• FSTORE-ID

NFC

• M-BIBLIO

• M-LOOP

• MED-UHF

• M-CRUB

• M-FLY

• NFC-PASS

• NFC-MINI

• NFC-BOOK

• NFC-ROUND-D45

• NFC-ROUND-D17

• NFC-COPPER

150+ in-house developed tag types in the product portfolio

0

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Tamper proof UHF labels

М2040/151 Р

• Antenna technology: conducting ink printing

• Dimension: 34.0x14.0 mm

• Read range: 4 meters

• Frequency: 860-960 MHz

• EPC - 128 bit

• TID - 64 bit

• Access password – 32 bit

• Kill password - 32 bit

• Antenna technology: laser-beam cutting of the aluminum leaf

• Dimension: 19.0x94.0 mm

• Read range: 14 meters

• Frequency: 860-960 MHz

• EPC - 128 bit

• TID - 96 bit

• Access password – 32 bit

• Kill password - 32 bit

М2498/186 Р

Both labels have successfully passed verification testing at Mikron RFID-lab

Breakable labels on paper substrate for integrity control

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Case study

Moscow Metro is one of the largest underground systems in the world

• Began operations in 1935

• 12 lines, 190 stations, 317 km of rail network

• 2.4 billion passengers yearly

• Around 7 million passengers daily

• In 2008 all Moscow Metro tickets were replaced with RFID-based smart-cards

• Since that time Mikron has remained the official supplier of RFID tickets for the Moscow Metro

• In 2013 a new generation of contactless tickets (Troyka card) was rolled out – one of the biggest transport card applications in Europe

• Mikron produces up to 32 mln. contactless tickets for Moscow Metro per month

Troyka tickets are plastic contactless smart-cards for fare payment

Mikron chip for transport cards; 180 nm, chip size 0,2 mm2

RFID tickets for Moscow underground

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Case study

Sochi 2014 winter Olympics

• 7-23rd February 2014

• 3,000 athletes and 3,000 other participants from 88 countries

• 1+ million visitors during the games in Sochi

• 363 buildings (re)constructed, 18 of them sporting facilities

• Mikron developed special RFID inlays for visitors’ and participants’ IDs to enable reliable mass reading in difficult conditions

• Mikron inlays were used within comprehensive access control system with RF-based unified identification module for area based access

• Mikron supplied plastic RFID smart-cards for high-speed regional train “Lastochka” (Swallow) that connect Sochi and other nearby cities with the Olympic park

Visitors’ IDs with Mikron RFID inlay Mikron RFID inlays

Participants’ and visitors’ IDs for Sochi Olympics

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Power management ICs

• DC-DC converters

• Voltage regulators

– Positive voltage regulators

– Adjustable positive voltage regulators

– Adjustable precise shunt regulators

– Negative voltage regulators

– LDOs

• Pulse-width modulation controllers

• LED drivers (AC-DC / DC-DC)

• Current and voltage controllers

• Comparators and operational amplifiers

• 100+ IC types

• Available both packaged* and as a wafer

* Minimal order for packaged devices starts from 100 000 pieces.

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Discrete semiconductor devices

• Manufactured at Voronezh manufacturing facility, part of the Mikron group of companies

• Discrete portfolio:

– Fast recovery diodes

– Schottky diodes (Pt Barrier, Mo Barrier, Cr Barrier, Ti Barrier)

– LS and RS EMI filters

– TVS diodes and arrays

• Large Schottky diodes portfolio with leading technical characteristics

• Available both packaged* and as a wafer

* Minimal order for packaged devices starts from 100 000 pieces.

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Mikron services

Development of new designs for ICs, application specific ICs and discrete semiconductor devices IC design

Probe testing equipment for wafers and reliability testing equipment for packaged devices Testing

Full cycle RFID tag and antenna development, from design to mass production. Prototypes developed within 6-8 weeks

RFID prototyping, antenna design

Mikron production lines can be used for mass manufacturing of IC designs developed by independent design houses. 8’, 6’ and 4’ wafer lines available.

Foundry services

Contract packaging services of ICs and discrete semiconductor devices Packaging

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Thank you!

Headquarters 12/1, 1-y Zapadny Proezd, Zelenograd, Moscow, 124460, Russia

+7 495 229 7286

[email protected]

www.mikron.ru | www.mikron-semi.com

Taiwan 5F-B., No.16, Lane 345, Yang-guang St., Taipei, 11491 +886 2 8752 6698

Shanghai 4F, Zi Jin Han Place Building 6, 1035, North Nan Quanroad Pudong, Shanghai +86 1522 130 2009

Hong Kong Room 1014, 10/F, Manhattan Centre, 8 Kwai Cheong Road, Kwai Chung, Hong Kong +86 1522 130 2009

USA Mikron America, Inc. 1745 Shea Center Drive Suite 400 Highlands Ranch CO 80129 USA +1 303 524 1199

Russia VSPP Mikron Leninsky prospekt 119а, 394033 Voronezh, Russia +7 473 223 1109

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USA Akatron Engineering 1111 Triton Drive Suite 100 Foster City, CA 94404 USA +1 3408 425 7337

Mikron - Leading Semiconductor IDM Company in Russia

Technology

Transcript of Mikron - Leading Semiconductor IDM Company in Russia