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Transcript of Microtek Laboratories
Global Headquarters:
Microtek Laboratories 1435 Allec Street
Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] (P) 714.999.1616 (F) 714.999.1636
Toll Free (USA only) 800.878.6601
“Global Leader in Test Technology and Expertise”
www.THETESTLAB.com
Summary of Services
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Microsec onal (Cross‐sec on) Analysis
PCB / PCBA Failure Analysis (F/A)
Advanced Analy cal Techniques:
Differen al Scanning Calorimetry (DSC)
Dynamic Mechanical Analysis (DMA)
Fourier Transform Interferometry (FTIR)
Scanning Acous c Microscopy (CSAM)
Scanning Electron Microscopy (SEM)
Thermal Gravinetric Analysis (TGA)
Themal Mechanical Analysis (TMA)
Environmental Simula on
Condu ve Anodic Filament (CAF)
Dielectric Withstanding Voltage (DWV)
ElectroChemical Migra on (ECM)
Moisture and Insula on Resistance (MIR)
Surface Insula on Resistance (SIR)
Humidity (Steady State & Cycling)
Temperature (Thermal Aging/Accelera on)
Electrical Tes ng
Visual and Dimen on Inspec on
Mechanical Proper es
Tensile Strength
Peel Strength
Bond Strength / Bond Pull
Microtek Laboratories has the capabilities to perform physical, mechanical, electrical, visual & dimensional testing and verification at the PCB bare board level, raw materials as well as the assembled PCBA’s. Microtek can evaluate to both military and commercial standards including IPC specification and test methods, MIL-PRF-55110; MIL-PRF-31032; MIL-P-50884, ASTM, IEC as well as customer procurement documents. Since 1986, our highly-qualified staff includes mechanical and chem-ical engineers, technicians and laboratory management in industry knowledge and experience.
PCB/PWB & PCBA TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
IPC-A-600 IPC-A-610 IPC-6012 IPC-6013 IPC-6016 IPC-6018 IPC-TM-650
MIL-PRF-55110 MIL-PRF-31032 MIL-P-50884 ASTM IEC Bellcore (Telcordia) UL
IPC‐4101 Specifica on for base Material for Rigid and Mul layer PCB
IPC‐4102 Flexible Base Dielectrics for use in Flexible Printed Circuitry
IPC‐4202 Flexible Base Dielectrics for use in Flexible Printed Circuitry
IPC‐4104 Flexible Metal‐Clad Dielectrics for use in Fabrica on of Flexible PCB
IPC‐6012 Qualifica on and Performance Specifica on for Rigid Printed Boards
IPC‐6013 Qualifica on and Performance Specifica on for Flexible PCB
IPC‐6018 Qualifica on and Performance Specifica on for High Frequency PCB
IPC‐9202 Material and Process Characteriza on/Qualifica on Test Protocol
for Assessing Electromechanical Performance
IPC‐A‐600 Acceptability of Printed Boards
IPC‐A‐610 Acceptability of Electronic Assemblies
IPC‐CC‐830 Qualifica on and Performance of Electrical Insula ng Compounds
J‐STD‐001 Requirements for Soldered Electrical and Electronic Assemblies
J‐STD‐002 Solderability Test for Component Leads, Termina ons, Lugs & Wires
J‐STD‐003 Solderability Test for Printed Boards (ANSI)
IPC‐TM‐650 Test Methods
Sec on 2.1 ‐ Visual Test Methods
Sec on 2.2 ‐ Dimensional Test Methods
Sec on 2.3 ‐ Chemical Test Methods
Sec on 2.4 ‐ Mechanical Test Methods
Sec on 2.5 ‐ Electrical Test Methods
Sec on 2.6 ‐ Environmental Test Methods
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Microtek Laboratories an A2LA ISO/IEC 17025 Accred-ited test lab with the capabilities to assess the physical and mechanical properties of both military and commer-cial applications that reference testing in accordance with IPC Standards and Test Methods. Our IPC testing exper-tise includes testing for printed circuit boards (PCB), Copper-Clad Laminates (CCL), solderability of materi-als, soldermasks and coatings. Our highly-qualified staff includes mechanical and chemical engineers, technicians and laboratory management with over 25-years in indus-try knowledge and experience. The full spectrum of IPC Standards and Test Methods and Training services are available from Microtek La-boratories. Working in close partnership with its custom-ers, Microtek may serve as an extension of its custom-er’s facilities, helping to sharpen the product manufactur-ing and development picture. In addition to providing test results and data interpretation, Microtek provides specialized client services such as failure analysis and test program development. Our technical staff will pro-duce customized test programs that aid in identifying the cause of manufacturing problems. If necessary, Microtek can also assist in mediating and resolving customer-
IPC TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
www.IPCTesting.com
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PCB / PCBA Conformance and Failure Analysis
Advanced Analytical Techniques:
Differential Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Environmental Simulation and Electrical Properties
Conductive Anodic Filament (CAF)
Electrochemical Migration (ECM)
Moisture and Insulation Resistance (MIR)
Surface Insulation Resistance (SIR)
Humidity (Steady State & Cycling)
Temperature (Thermal Aging/Acceleration)
Thermal Shock
Dielectric Withstanding Voltage (DWV)
Continuity / Shorts
Volume and Surface Resistivity
Physical Properties
Bond Strength / Bond Pull
Folding Flexibility & Flexibility Endurance
Microsectional (Cross-Section) Analysis
Peel Strength
Thermal Stress
Solderability (Surface and Hole)
Rework Simulation
Tensile Strength and Elongation
Peel Strength
Visual and Dimensional Inspection / Verification
Microtek Laboratories has more than 25‐
years of Military Specifica on (MIL‐Spec) tes ng for the PCB industry. Microtek is an in‐terna onally accredited company to A2LA ISO/IEC 17025 and also has commercial Laboratory Suitability Status to the Department of De‐fense – DLA. Microtek can provide the full range of MIL‐Spec tes ng including; Qualifica‐
on, lot conformance and periodic conform‐ance tes ng for rigid, flex, rigid‐flex and high reliability printed circuits boards and electron‐ic components.
DEFENSE AND MILITARY TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
MIL‐PRF‐55110
Group A, Group B and Qualifica on
MIL‐PRF‐31032
Lot, & Periodic Conformance and Qualifica on
MIL‐P‐50884
Group A, Group B, Group C and Qualifica on
MIL‐STD‐202
Test Method Standard for Electronic Parts
MIL‐STD‐810
Environmental Engineering and Tests
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Failure Analysis (F/A)
Op cal Inspec on and external package analysis
Scanning Acous c Microscopy (CSAM)
Live‐Time X‐ray
Curve trace / Electrical characteriza on
Decapsula on: Jet‐etch and acid decapsula on
Wire bond pull tes ng
Ball shear tes ng
Die shear tes ng
Scanning Electron Microscopy (SEM)
Cross‐sec onal Analysis
Fourier Transform Interferometry (FTIR)
Materials Characteriza on:
Differen al Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Dynamic Mechanical Analysis (DMA)
Thermal Gravimetric Analysis (TGA)
Thermal Conduc vity
Microtek Laboratories’ Aerospace, Military and Defense
tes ng experience includes an extensive experience in
tes ng and cer fica on for a mul tude of commercial,
industrial and military applica ons. As a result, we un-
derstand the requirements involved when working in
the aerospace and defense industries.
Microtek’s staff and facility are equipped to work with
an array of metals, composites and cu ng edge materi-
als that are required for aerospace and defense applica-
ons. Microtek Lab’s mechanical tes ng qualifica ons
can provide the informa on necessary to improve the
mechanical performance of materials and components
for the Aerospace and Defense Industry. Microtek also
performs metallographic and failure evalua ons involv-
ing printed circuit boards and PC assemblies.
Our test programs may be customized to client product
protocols or to meet product performance goals. Our
full-service tes ng facility can also provide specialized
solu ons to meet your tes ng needs.
AEROSPACE TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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94HB - Horizontal Burning Test
94V-0 -Vertical Burning Testing
94VTM - Thin Material Vertical Burning Test
Ash Content
Bond Strength
Cold Bend
Comparative Tracking Index (CTI)
Deflection Temperature of Polymeric Materials Under Load
Delamination and Blistering
Dielectric Breakdown and Voltage Strength
Flexural Strength
Glow Wire Ignitability (GWI)
High Current Arc Ignition (HAI)
High Voltage Arc Resistance (HVAR)
High Voltage Arc Tracking Rate Resistance (HVTR)
High Voltage, Low Current Dry Arc Resistance (D495)
Hot Wire Ignition (HWI)
Long-Term Thermal Aging (LTTA)
Moisture Absorption
Repeated Flexing
Specific Gravity of Polymers
Stiffener Bond Strength
Tensile Impact
Tensile Strength of Thermoplastic Polymeric Materials
Tensile Strength of Thin Polymeric Sheeting
Thermal Cycling / Shock
Vicat Softening Point for Polymeric Materials Volume and Surface Resistivity
Microtek Laboratories has unparalleled experience providing UL Engineering and Administrative Client Agent Services and Testing to achieve your UL Recogni-tion for PCB and Laminate manufacturers for more than 25-years.
We can help you achieve your recognition and listings with UL in the shortest possible time. In addition prod-uct safety certifications, we can also help you optimize your test program for optimal ratings, from specially design test sample artwork to our experienced staff of engineers managing your test program throughout the process. Partner with Microtek Laboratories’ experi-enced team of Product Safety specialists operating on your behalf, coordinating with key UL personnel under the Client Agent Program (CAP), expediting the certifi-cation process and minimizing disruptions to your prod-uct release plans to apply the certification mark to your products.
SAFETY AND UL TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
“Global Leader in Test Technology and Expertise”
Copyright 2012 - Microtek Laboratories Scan to Learn More
UL 94
UL‐746A
UL‐746B
UL‐746E
UL‐746F
UL‐796
UL‐796F
Microtek Laboratories is an UL CAP Agent for the following categories:
ZPMV2, ZPXK2, QMTS2, QMJU2, QMFZ2 & OCDT2
www.ULTesting.com
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Op cal Inspec on and external package analysis
Scanning Acous c Microscopy (CSAM)
Live‐Time X‐ray
Curve trace / Electrical characteriza on
Decapsula on: Jet‐etch and acid decapsula on
Wire bond pull tes ng
Ball shear tes ng
Die shear tes ng
Scanning Electron Microscopy (SEM)
Cross‐sec onal Analysis
Fourier Transform Interferometry (FTIR)
Materials Characteriza on:
Differen al Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Dynamic Mechanical Analysis (DMA)
Thermal Gravimetric Analysis (TGA)
Thermal Conduc vity
Microtek Laboratories offers a wide range of Component Testing and inspection services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectan-cy and improve reliability, and increase perfor-mance on integrated circuits (ICs), printed cir-cuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.
Microtek Labs has an extensive array of equip-ment and technical experience to provide you with the tools and data necessary to overcome your shortfalls and failures.
COMPONENT TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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Op cal Inspec on and external package analysis
Imperfec ons in logo
Spelling and layout errors on labels
Examina on of the Indents
Incorrectly packaged devices
Label date codes labels not matching component
Date codes that are not possible
Date codes that are in the future
Checking country of origin against lot codes
Variance in texture
Scanning Acous c Microscopy (CSAM)
Live‐Time X‐ray
Curve trace / Electrical characteriza on
Decapsula on: Jet‐etch and acid decapsula on
Wire bond pull tes ng
Ball shear tes ng
Die shear tes ng
Scanning Electron Microscopy (SEM)
Cross‐sec onal Analysis
Fourier Transform Interferometry (FTIR)
Materials Characteriza on:
Differen al Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Dynamic Mechanical Analysis (DMA)
Counterfeit Component Inspec on and detec on
has become a widespread concern throughout the electronics manufacturing supply chain. Microtek Laboratories offers a wide range of component inspec on and verifica on services that can be u -lized to verify the accuracy of sourced components and materials. When it comes to guarding against counterfeit components, it's important to note that compo-nent counterfeiters are con nually evolving and improving their techniques con nuously. Accord-ingly, Microtek is inves ng in our people, systems and equipment to ensure we are ahead of the curve. Microtek Laboratories has the latest test equipment, detailed procedures, and highly-trained staff to properly inspect, detect, and iden -fy counterfeit components.
COUNTERFEIT COMPONENT INSPECTION
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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Op cal Inspec on and external package analysis
Scanning Acous c Microscopy (CSAM)
Live‐Time X‐ray
Curve trace / Electrical characteriza on / Leakage
Microprobing
Decapsula on: Jet‐etch and acid decapsula on
Wire bond pull tes ng
Ball shear tes ng
Die shear tes ng
Scanning Electron Microscopy (SEM)
Cross‐sec onal Analysis
Moisture sensi vity tes ng & qualifica on (MSL)
Dye and pry analysis
Fourier Transform Interferometry (FTIR)
Materials Characteriza on:
Differen al Scanning Calorimetric (DSC)
Thermal Mechanical Analysis (TMA)
Dynamic Mechanical Analysis (DMA)
Thermal Gravimetric Analysis (TGA)
Thermal Conduc vity
Microtek Laboratories offers a wide range of failure analysis and environmental services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies.
Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end-use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer, manager, test and process engineers, or end-user to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products and improved yield.
FAILURE ANALYSIS (F/A)
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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Curve Trace Automated Test Equipment (ATE) Arc Resistance Capacitance Testing Comparative Tracking Index (CTI)
Conductivity Contact Resistance
Continuity
Dielectric Breakdown
Dielectric Strength
Dielectric Withstanding Voltage (DWV)
Dissipation Factor DF (Loss)
Permittivity (Dielectric Constant)
High Current Arc Ignition (HAI)
Insulation Resistance (IR)
Interconnection Resistance
Surface Insulation Resistance (SIR)
Volume and Surface Resistivity
Wrapper Resistance (Wire Wrap)
Electrical and Electronics Testing characterizes the interaction between resistance, capacitance and inductance in electronics interconnection products. The electrical tests Microtek Laborato-ries performs help demonstrate attributes critical to the performance of the product. Electrical test and analysis are at the core capability of Microtek Laboratories, having over 25-years of experience servicing the electronics and printed circuit board (PCB) industries. Microtek Laboratories complies with the most demanding requirements of the Military, Aero-space, Automotive, Telecommunications and Med-ical industries, as well as those of Underwriters Laboratories (UL). In addition, our engineers routinely provide program insight, allowing our customers the flexibility to enhance and/or structure their testing accordingly. Improved product design, enhanced reliability, and better quality are just some of the valuable results you will realize by testing your products for compliance with their electrical operating parameters. Electrical testing may be performed as an independent analysis of the product’s electrical properties or it may be performed in conjunction with environmental simulation.
ELECTRICAL TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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CONDUCTIVE ANODIC FILAMENT (CAF) CORROSION DIFFERENTIAL SCANNING CALORITMETRY (DSC) ELECTROMIGRATION RESISTANCE (ECM) FLAMMABILITY GAS TIGHT HUMIDITY IMMERSION MOISTURE RESISTANCE STEAM AGING SURFACE INSULATION RESISTANCE (SIR) TEMPERATURE AGING TEMPERATURE CYCLING THERMAL SHOCK THERMAL STRESS UL LONG-TERM THERMAL AGING VICAT SOFTENING POINT
Environmental Simulation is a method of determining how a product will perform in a specific environment by accelerating the exposure to that environment. The accelerated test environment may contain elevated or reduced temperatures, in-creased relative humidity, pressure or other simulated condition. Electrical and mechanical attributes are often evaluated during or after accelerated environmental exposures to further ascertain the product’s performance under severe con-ditions. This accelerated aging allows the prediction of how a product will perform throughout its life cycle. Environmental simulation is at the core capability of Microtek Laboratories, hav-ing over 25-years of experience servicing the electronics Military, Aerospace, Auto-motive, Telecommunications and Medical industries, as well as those of Underwriters Laboratories (UL).
ENVIRONMENTAL SIMULATION
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan For More Info
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AdhesionAdhesionAdhesion
Bond StrengthBond StrengthBond Strength
Differen al Scanning Calorimetry (DSC)Differen al Scanning Calorimetry (DSC)Differen al Scanning Calorimetry (DSC)
Dynamic Mechanical Analysis (DMA)Dynamic Mechanical Analysis (DMA)Dynamic Mechanical Analysis (DMA)
Elonga onElonga onElonga on
Flexibility EnduranceFlexibility EnduranceFlexibility Endurance
Flexural Fa gueFlexural Fa gueFlexural Fa gue
Flexural StrengthFlexural StrengthFlexural Strength
Folding FlexibilityFolding FlexibilityFolding Flexibility
Fracture ToughnessFracture ToughnessFracture Toughness
Glass Transi on Temperature by TMAGlass Transi on Temperature by TMAGlass Transi on Temperature by TMA
Lap ShearLap ShearLap Shear
Peel StrengthPeel StrengthPeel Strength
Rework Simula onRework Simula onRework Simula on
Shear StrengthShear StrengthShear Strength
Tensile Strength )Tensile Strength )Tensile Strength )
Tension and CompressionTension and CompressionTension and Compression
Terminal StrengthTerminal StrengthTerminal Strength
Thermal Gravimetric Analysis (TGA)Thermal Gravimetric Analysis (TGA)Thermal Gravimetric Analysis (TGA)
Tensile ImpactTensile ImpactTensile Impact
Mechanical tes ng characterizes the mechanical prop-
er es of a product. Mechanical stresses are defined as those typically experienced by the product in both oper-a ng and non-opera ng environments. Opera onal mechanical stress relates to the breaking, bending, ex-panding, compressing, flexing, pulling and shaking the product during opera on. Non-opera onal mechanical stress experienced during delivery, setup and storage are typically the worst mechanical stresses the product will see and must also be considered.
Microtek Laboratories is an A2LA ISO/IEC 17025 Accred-ited test lab with the capabili es to assess the physical and mechanical proper es of both military and com-mercial applica ons. Tes ng is performed in accord-ance with ASTM Test Methods and other industry recog-nized specifica ons. Depend on Microtek Laboratories for mely, reliable mechanical and physical test require-ments. For the highest degree of accuracy, we minimize factors that contribute to measurement uncertainty. At Microtek, all inspec ons are performed in an environ-mentally-controlled laboratory.
MECHANICAL TESTING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2013 - Microtek Laboratories Scan to Learn More
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Visual Inspec on:
IPC‐A‐600—Acceptability of Printed Boards
IPC‐A‐610—Acceptability of Electronic Assemblies
Microsec onal (cross‐sec on) Evalua on
PCB Plated‐through Hole Structural Integrity
Surface Examina on
Workmanship
Dimensional Verifica on:
Coordinate Measuring Machine (CMM)
Dimensional Stability
Part Feature Width & Spacing
Hole Size Verifica on & Pa ern Loca on
Material Thickness
Surface Pla ng/Coa ng Thickness
X‐Ray Fluorescence (XRF)
‐ Nickel/Gold Thickness
‐ Solder Thickness/Composi on
‐ Soldermask Thickness
All visual inspec on at Microtek Laboratories is per-formed by highly-trained personnel to interpret custom-er drawings. All inspectors are cer fied to IPC-A-600 and IPC-A-610 visual acceptability standards for elec-tronic parts and components. Microtek Laboratories performs dimensional verifica on on surface and specialty features of finished parts as well as raw materials and components. Our measure-ment capabili es range from basic plug/pin gauges for hole diameter verifica on to digital micrometers & cali-pers, to high-precision CMM and digital microscope technology to verify part compliance. First-ar cle and third-party dimensional inspec on can be performed according to both commercial and military require-ments. Our dimensional inspec on and measurement capabili es are accredited to A2LA ISO/IEC 17025. Depend on Microtek Laboratories for mely, reliable and repeatable visual and dimensional inspec on and verifica on. For the highest degree of accuracy, we min-imize factors that contribute to measurement uncer-tainty. At Microtek, all inspec ons are performed in an environmentally-controlled laboratory.
VISUAL AND DIMENSIONAL INSPECTION
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2012 - Microtek Laboratories Scan to Learn More
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Improve Microsec on Quality
Achieve the highest quality
Improve evalua on skills
Use of Proper Materials
Proper Measurement Techniques
Iden fica on of Poorly Prepared Sample
Hidden Defects
Accurate Features and Defects Analysis of:
Structural Integrity
Pla ng / Dielectric Thickness
Blind / Buried Vias
Pla ng Voids / Cracks
Laminate Voids / Cracks
Delamina on
Layer‐to‐Layer Registra on
Annular Ring (Internal & External)
Etchback / Smear Removal
Wicking
Li ed Lands
Wrap Copper
Cap Pla ng
Pla ng Separa on
The Microsectional (Cross-section) Preparation and Analysis training course will provide you with the skills and knowledge to improve your PCB Microsectional preparation techniques and develop the ability to accu-rately evaluate the prepared Microsection for common defects. Both technicians and inspectors will benefit from this dynamic combination of classroom presenta-tion with defect analysis images and hands-on laboratory training. This course is conducted at Microtek Laborato-ries, state-of-the-art Anaheim, California facility or can be customized and presented at your facility utilizing you own in-house equipment.
The 1-Day Course Description
The first half of this 1-day course covers both manual and semi-automatic Microsectional preparation tech-niques and will provide the technician with the base knowledge needed to prepare accurate, scratch-free Mi-crosectional mounts. The second half covers much of the evaluation criteria required by today’s demanding mili-tary and commercial standards.
MICROSECTIONAL PREPARATION & ANALYSIS TRAINING
Global Headquarters:
Microtek Laboratories 1435 Allec Street Anaheim, California 92805-6306 U.S.A.
eMail: [email protected] Phone: 714.999.1616 Fax: 714.999.1636 Toll Free: 800.878.6601 (in U.S.) www.THETESTLAB.com
Global Leader in Test Technology and Expertise
Copyright 2012 - Microtek Laboratories Scan to Learn More