Micronachining Intro Nits Final 060912

7/31/2019 Micronachining Intro Nits Final 060912

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Micro Machining: An Introduction

Dr.R.Edison Chandraseelan


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ContentsIntroductionMicro Machining(Advanced Micro Machining Processes,AMMPs)

Mechanical AMMPsThermal AMMPsElectro Chemical AMMPs

Advanced Nano Finishing Processes (ANFPs) ANFPs with no external control of forces(Abrasive Flow Finishing AFF, Chemo Mechanical Polishing CMP & ElasticEmission Machining EMM)

ANFPs with external control of forces(Magnetic Abrasive Finishing MAF ,Magneto Rheological Finishing MRF,Magneto Rheological Abrasive Flow Finishing MRAFF & Magnetic FloatPolishing MFP)

Selective Applications of Micro MachiningSummaryFuture Project Work


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1.Introduction-Why Micro Machining?

Present day High-tech Industries ,Design requirements are stringentExtraordinary Properties of Materials (High Strength, Highheat Resistant, High hardness, Corrosion resistant etc)Complex 3D Components (Turbine Blades)

Miniature Features (filters for food processing and textileindustries having few tens of microns as hole diameter andthousands in number)Nano level surface finish on Complex geometries (thousandsof turbulated cooling holes in a turbine blade )

Making and finishing of micro fluidic channels (in electricallyconducting & non conducting materials, say glass, quartz,&ceramics)


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1.Introduction-What is Micro Fabrication?

Fabrication of products deals with making of machines, structures or process equipment by casting,forming,welding,machining,&assemblingClassified into :Macro & micro

Macro: fabrication of structures /parts/products that are measurable/observable by naked eye( 1mm in size)Micro: fabrication of miniature structures /parts/products that are notvisible with naked eye(1 m dimension 1000 m in size)Methods of Micro Fabrication: Material deposition & Material

Removal


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1.Introduction-Classification of Micro fabrication

Figure 1.Classification of Micro Machining


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1.Introduction :MEMS

Microscopic mechanical structures and devices integrated in siliconor other substrates such as quartz, polymers and dielectrics toachieve certain engineering functions by electro mechanical or electro chemical meansVery small in size ,mass ,and volumeVery low power consumptionLow costEasy to integrate in systemHighly resistant to shock,vibration,and radiation

Batch fabrication in large arrays


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1.Introduction-Micro electronics Vs Micro systems

Micro Electronics Micro Systems

1.Uses single crystalline silicon die,silicon compounds and plastics Uses single crystalline silicon dieand few other materials such as Ga As ,Quartz, polymers and metals

2.Stationary structure May involve moving components

3.Primary 2D structure Complex 3D Structures

4.Fewer components in Assembly Many components to be assembled5.Mass Production Batch Production

6.Mature IC design methodology Lack of engineering methodology

7.Complex pattern over substrate Simple pattern over substrate

8.IC Die is completely protectedfrom contact media Sensor Die is integrated withcontacting media

9.Industrial standards available No industrial standard to follow

10.Packaging technology is wellestablished

Packaging technology is at infantstage


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1.Introduction: Micro Machining over Photofabrication

Photo fabrication achieve atomic level dimension and extremeprecision but most suitable for 2D processing of MEMS/NEMSNewly developed IBMM can remove material at the atomic level,more important is that it can fabricate 2.5 D and 3D nano/micro

components which are not feasible by LIGA


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2.Micro Machining

Machining of micro parts is not literally correctRemoval of material in the form of chips or debris having the size in the range of micronsCreating micro features or surface characteristics (especially surface finish) in themicro/nano levelDefinition: material removal at micro/nano level with no constraint on the size of thecomponent being machined

Figure 2.Micro Machining Definition


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2.Micro MachiningMain purposes:

Shaping and sizing a part (AMMPs)

Surface finishing a part (ANFPs)

Main classification: Processes which useMechanical force (abrasion:abasive particles as tools, removing material in the form of micro / nano chips):Mechanical AMMPsDirect energy of beam or plasma (ablation: removal by melting /vaporization): Thermal AMMPsElectro Chemical or Chemical Reaction (removal by chemical reaction): Electro Chemical AMMPs

Hybrid / Nano MachiningTo take advantage of merits of two or more processes ,hybrid processes have been developed by combiningthem


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machining

Figure3.Classification of Micro Machining


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2. machining: Hybrid Technology

Figure4.Hybrid Technology


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2.Micro Machining: Mechanical AMMPs

Figure5.Working Principle of Mechanical USMM

a) Ductile Material b) Brittle Material


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2.Micro Machining: USMM

Figure6.Ultrosonic Micro Machining


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2.Micro Machining: Thermal AMMPs

Figure 7.Thermal Micro Machining Processes a) MEDM b) MEBM c) MLBM


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2.Micro Machining: Electro Chemical AMMPs

Figure 8 .Micro tools fabricated using Micro ECM a) straight sided tool 28 mtip radius b) tapered tool


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3.Advanced Nano Finishing Processes

Figure 9.Stages in material removal from the work surface (i),(ii),(iii) showslowly shearing off the irregularities (iv) critical surface finish achieved (v)cross section A-A


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3.Advanced Nano Finishing Processes: ANFPswith no external control of forces

Figure 10.AFF medium acts as a self deformable stone for finishing complexshaped components (i) internal octagonal cylinder (ii) internal concave shape (iii)external concave shape (iv) turbulated cooling holes


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3.Advanced Nano Finishing Processes: ANFPs with noexternal control of forces

Figure 11. Nano Finishing Processes a) Abrasive flow finishing b)Chemo Mechanical Polishing c) Elastic Emission Machining


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3.Advanced Nano Finishing Processes: ANFPswith external control of forces

Figure 11 Nanofinishing Processes d) Magnetic Abrasive Finishing e) Magneto Rheological Finishing f) Magneto

Rheological Abrasive Flow Finishing g) Magnetic Float Polishing


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4.Selective Applications of Micro Machining

Figure 12.Selective Applications of Micro Machining Processes


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5.Summary

AMMPs are developed to meet stringy designers requirements

Extraordinary Properties of MaterialsComplex 3D ComponentsMiniature FeaturesNano level surface finish on Complex geometriesMaking and finishing of micro fluidic channels

Fabrication of miniature structures /parts/products that are notvisible with naked eye(1 m dimension 1000 m in size)Main purposes:

Shaping and sizing a part (AMMPs)

Surface finishing a part (ANFPs)


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6.Future Work: Research Team Identified for funded projects

at DRDL,hydrabad,Ministry of Defence ,Government of India

Field :MEMS/Nano TechnologyResearchers Identified:Dr.Manickvasagam,Scientist G :Optimization techniques -optimalpath of missile trajectoryDr.Manoj Kumar, Scientist F :Hydraulics &Pneumatics

Dr.Rajasingh,Scientist F :Missile integration Anantha Narayanan,Scientist F :Computational Fluid Dynamics V.Shunmugam,Scientist F :Wind Tunnel Simulation Gobi.K,Scientist E :Sensors and its Applications -Performanceevaluation of rocket engines

S.Balaji,Scientist E :Application of Smart Structure in Aerospace Applications


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7.ReferencesJain.V.K(2002).,Advanced Machining Processes, Allied Publishers ,New Delhi.Kumar A, Dutta A. Electro photographic layered manufacturing. Journal of Manufacturing Science andEngineering 2004; 126: 571 576.Kunieda M, Kobayashi T. Clarifying Mechanism of Determining tool electrode wear ratio in EDM usingspectroscopic measurement of vapour density. Journal of Material Processing Technology 2004; 149: 248 288.Shankar P, Jain VK, Sundarajan T. Analysis of spark profiles during EDM process. Machining Science andTechnology 1997; 1-2: 195-217.

Micronachining Intro Nits Final 060912

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