Message from the ChairYan Wang

Welcome to the 2019-2020 edition

of the Computers and Information

in Engineering (CIE) Division

newsletter. On behalf of the

division’s Executive Committee, I

would like to send our greetings

and best wishes to all members of

our community. For those have

experienced difficult time caused by the global

pandemics, our thoughts and wishes are with you.

Effective July 1st, 2019, the new Executive

Committee members include Chair: Yan Wang

(Georgia Tech), Vice Chair: Jitesh Panchal (Purdue

University), Technical Program Chair: Mahesh Mani

(Alleghany Science & Technology), Secretary: Paul

Witherell (National Institute of Standards &

Technology), and Member-at-large: Caterina Rizzi

(University of Bergamo). Marc Halpern (Gartner Inc.)

continues to be our Industry Executive. Our past chair,

Cameron Turner (Clemson University), now serves as

the chair of the Honors and Awards Committee.

We would also like to send our sincere appreciation to

the division’s volunteers, including members of the

four Technical Committees, symposium organizers,

and paper reviewers, for making the 2019 CIE

Conference a success. The conference was held in

Anaheim, California. We had 121 papers submitted,

and 99 papers were accepted and presented.

The 2019 CIE Conference featured two excellent

keynote addresses. Professor Karthik Ramani (Purdue

University) spoke about “Redesigning Manufacturing

Machines, Design Tools, and Robotics for Smart

Human Augmented Spatial Interfaces.” Dr. Scott

Perino (NASA Jet Propulsion Laboratory) presented

“On Bringing Mars to Earth: Mars Sample Return and

Earth Entry Vehicle Development.” In addition, at the

CIE Awards Luncheon, several division awards and

best paper awards were presented. Particularly,

Professor Imre Horváth (Delft University of

Technology) was honored with the Lifetime

Achievement Award, the most prestigious award that

CIE division upholds. Dr. Azad Madni (Intelligent

Systems Technology Inc.) received the CIE

Leadership Award for his leadership role in advancing

the discipline of computers and information in

engineering.

The organization of 2020 CIE Conference in St. Louis,

Missouri has started. This will be the 40th Computers

and Information in Engineering Conference, a major

milestone for our community. Some of us might have

this question in mind: what defines us in the CIE

community? I perused the list of over 2500 CIE

conference papers in the last two decades and created

a word cloud listing over 100 of the major keywords

we used. The breadth of CIE outreach is quite evident.

Inside This Issue

Message from the Chair 1

Honors and Awards 4

CIE 2019 Conference Report 5

Technical Committee Reports 7

CIE Panel: Industry Track 12

Poster Session and Awards 13

Photos from the 2019 Conference 14

CIE Hackathon Announcement 17

Updates from ASME JCISE 18

CIE 2020 Call for Papers 21

Relevant Journals, Conferences and Workshops 22

Editorial 23

C I E N E W S L E T T E R

Winter/Spring 2019-2020 Newsletter https://community.asme.org/computers_information_engineering/default.aspx

Page 2

CIE Newsletter

CIE Word Cloud

The scope of work in our CIE community is amazingly extensive and intertwined with all engineering disciplines.

As a very important branch of mechanical engineering, CIE has made profound impacts to engineers and our

society in general.

Looking forward, we would like to see the success of

CIE continue and be elevated to the next level as the

computing and information technologies evolve in the

next four decades. So we are calling for the

participation of you, with any capacities, to make our

achievements better known to others and other

engineering disciplines. We welcome members of all

experience levels as volunteers to continuously

strengthen our community. If you are a recent

graduate, early-career engineer, new faculty member,

or moving into a new career phase, volunteering is a

great way to get involved and to gain a sense of greater

achievement. Please contact any one of us in the CIE

leadership team, including the members of Executive

Committee and Technical Committees listed in the

later portion of this newsletter. Please also share our

welcoming message and assist us in recruiting new

members, and choosing CIE as the home division in

the ASME membership.

One example of volunteering is your help on the

organization of annual CIE Conference at IDETC/CIE

in August 2020 and the annual IMECE conference in

November 2020. We constantly seek symposium

organizers and paper reviewers.

As we approach our the 40th CIE conference, we look

forward to vast amount of new research that will be

shared across the technical sessions. In addition, on

August 15-16 and co-located with the 2020 CIE

Conference, will be the inaugural ASME Hackathon

organized by the CIE division. This year’s theme is

“Identifying, Extracting, Analyzing of Value from

CIE Newsletter

Page 3

Large Unstructured Data Sets in Mechanical

Engineering.” Please share this exciting news (flyer on

page 17) with your young colleagues, especially

undergraduate students, and encourage them to

participate in the competition. Travel awards are

available. The deadline for signup is May 21, 2020.

Please contact the organization committee members,

Zhenghui Sha (zsha@uark.edu), Yan Lu

(yan.lu@nist.gov), and Bryan O'Halloran

(bmohallo@nps.edu) for questions and volunteering

opportunities.

Our awards program has been very successful in

recognizing the achievements of our members, and we

need your help in identifying deserving colleagues and

nominating them. Nomination is the first and most

important step for us to give awards. Please contact

Cameron Turner (cturne9@clemson.edu), our Awards

Chair, with nominations and questions.

More information about the activities of our division

can be found at

https://community.asme.org/computers_information_

engineering/default.aspx/

Please mark your calendar for the 40th CIE conference

which will be held in St. Louis, Missouri, August 16-

19, 2020 (See ASME statement on conference below).

We look forward to seeing you at the Gateway to the

West.

Yan Wang

Associate Professor, Georgia Institute of Technology,

Atlanta, Georgia, USA

Chair, Computers and Information in Engineering

Division of ASME

OFFICIAL ASME STATEMENT ON CORONAVIRUS (COVID-19)

ASME is monitoring the Coronavirus (COVID-19) situation to ensure the health and safety of our meeting and

conference participants, as well as our staff. We will also be monitoring the recommendations from the Centers

for Disease Control and Prevention (CDC) and the World Health Organization (WHO) as the situation

progresses.

For additional information, please refer to the CDC and WHO websites. https://www.cdc.gov/coronavirus/2019-ncov/index.html https://www.who.int/emergencies/diseases/novel-coronavirus-2019

As of this date, the 2020 IDETC-CIE event is currently scheduled to take place. If there are any changes to

these plans, we will provide updates on this website. Please check back periodically.

Page 4

CIE Newsletter

Division Honors and Awards Our division’s honors and awards were awarded, as

always, during our annual conference, the 39th CIE

Conference that took place in Anaheim, California.

2019 CIE Lifetime Achievement Award

This year’s CIE Lifetime

Achievement Award was

presented to Professor Imre

Horváth of Delft University of

Technology in recognition of the

outstanding achievements during

his career in the discipline of

computers and information in

engineering

2019 CIE Leadership Award

The CIE Leadership Award was

awarded to Dr. Azad Madni,

Founder and CEO of Intelligent

Systems Technology Inc., in

recognition of his outstanding

leadership in advancing the

discipline of computers and

information in engineering.

.

2019 CIE Young Engineer Award

The 2019 ASME CIE Young

Engineer Award was awarded to

Dr. William Bernstein of the

National Institute of Standards and

Technology, in recognition of his

outstanding ability and potential

for making significant

contributions to the discipline of

computers and information in

engineering.

2019 CIE Distinguished Service Award

This year’s recipient of the

Distinguished Service

Award was Dr. Cameron

Turner from Clemson

University recognizing his

dedicated service in support

of the CIE Division’s

mission.

2019 CIE Best PhD Dissertation Award

The Best Dissertation of this

year was awarded to Dr. Morad

Behandish from the University

of Connecticut (now with Palo

Alto Research Center) for his

dissertation titled “Analytic

Methods for Geometric

Modeling.”

2019 CIE Best Paper Award

This year’s CIE Best Conference Paper Award was

presented to Ezra Ameperosa and Pranav A.

Bhounsule for their paper entitled, “Domain

Randomization for Detection and Position Estimation

of Multiples of a Single Object with Applications to

Localizing Bolts on Structures.”

Ezra Ameperosa Pranav A. Bhounsule

William

Bernstein

Cameron Turner

Morad Behandish

Azad Madni

Imre Horváth

CIE Newsletter

Page 5

CIE 2019 Conference Report

Jitesh Panchal

The 39th CIE conference was held

in Anaheim, California, on August

18-21, 2019. We received 121

papers for review, out of which 99

papers were accepted for 28

symposia and organized into 33

parallel sessions. In addition, there

were four panels of leading experts in their respective

fields to provide discussion opportunities, as well as

one special session for visualization and demonstration

where the latest development of computational design

tools was shown.

This year’s CIE keynote speakers were Professor

Karthik Ramani of the Purdue University and Dr. Scott

Perino of the NASA Jet Propulsion Laboratory.

Professor Ramani shared his insight with us in his talk

entitled “Redesigning Manufacturing Machines,

Design Tools, and Robotics for Smart Human

Augmented Spatial Interfaces.” This keynote

demonstrated the potential of redesigning our design

and manufacturing ecosystems to include humans,

with novel ideas and latest technologies such as mixed

dimensional suggestive modeling, collaborative

intelligence, mixed reality interactions, and artificial

intelligence-based human augmentation technologies.

Prof. Ramani also noted that

research directions in

artificial intelligence-based

human augmentation

technologies will have a

direct impact on workforce

re-skilling programs,

increasing human labor

capacity, factory

productivity, and agility.

Dr. Perino presented “On

Bringing Mars to Earth:

Mars Sample Return and

Earth Entry Vehicle

Development,” and

discussed his experiences

and perspectives on

preparations for missions to

Mars. His presentation

provided an introduction to

the joint Mars Sample

Return (MSR) architecture

(under construction) while focusing on the design

process, tools, and trades being explored for the Earth

Entry Vehicle (EEV) concept development.

Two CIE Technical Committee panel forums were

held during the conference. They were:

• “Structural Optimization, Multiscale Multiphysics

Simulation, and Democratization for Additive

Manufacturing,” hosted by CAPPD. This panel

discussed current and ongoing research and industrial

efforts on structural optimization, multiscale

Multiphysics simulation, and democratizing

manufacturing. Panelists included: Dr. Ming Zhou,

Conference at a Glance

121 papers submitted 99 accepted papers 2 Keynotes

4 Panels 28 Symposia

33 parallel Sessions

1 Visual demo Session

1 Industry Session

1 Graduate Student Poster Session

Scott Perino, Ph.D.

Karthik Ramani, Ph.D.

Page 6

CIE Newsletter

(Senior Vice President of Software Development -

Structural Analysis and Optimization, Altair, USA),

Dr. Fred van Keulen (Professor, Delft University of

Technology, Netherlands), Dr. Suraj Musuvathy,

(Senior Key Expert Scientist, Siemens Corporation,

Corporate Technology, USA), Dr. Yan Wang,

(Associate Professor, Georgia Institute of Technology,

USA), and Dr. Binil Starly (Professor, North Carolina

State University, USA), CAPPD Organizers: Dr.

Yayue Pan, University of Illinois at Chicago; Dr.

Chiradeep Sen, Florida Institute of Technology

• “The recent advances and future direction of model-

based systems engineering,” hosted by SEIKM. This

panel explored how to address the growing challenges

of designing engineered systems by using model-based

systems engineering (MBSE) as a design approach.

Panelists included: Dr. Arquimedes Martinez Canedo

(Principal Scientist, Siemens Corporate Technology),

Dr. Bryan M. O'Halloran (Assistant Professor, Naval

Postgraduate School, Systems Engineering dept.) and

Dr. Douglas L. Van Bossuyt, (Assistant Professor,

Naval Postgraduate School, Systems Engineering

dept.)

In addition, two panels were hosted under the Industry

Track. One panel focused on the “digital

transformation and infrastructure modernization for

engineering IT” while the second panel focused on

“Smart Manufacturing.” Details on the two panels can

be found in the Industry Track section.

In this year’s conference, a special symposium of

“Video, Visualization and Virtual Demonstration of

Prototypes and Simulations” was organized. Videos

were submitted by researchers to demonstrate the

latest development and prototypes of design,

simulation, and visualization tools, such as a low-cost

virtual reality platform for automotive design and a

mixed reality environment for the virtual prototyping

of vacuum cleaners. More details are provided in the

Technical Report of Virtual Environments & Systems

later in this newsletter.

A CIE luncheon was organized on August 19th, 2019,

including the award ceremony. Our awards ceremony

recognized contributions to CIE in several categories:

Lifetime Achievement Award, Young Engineer

Award, Leadership award, Distinguished Service

Award, Best Paper awards, and Best Thesis

Dissertation awards. Student Poster awards were

given for each technical committee. This year the

award recipients consisted of 16 students from

different universities. The award winners and their

citations are also provided in this newsletter.

In addition to technical sessions, the four technical

committee meetings: Advanced Modeling and

Simulation (AMS), Computer-Aided Product and

Process Development (CAPPD), Systems

Engineering, Information and Knowledge

Management (SEIKM), and Virtual Environments and

Systems (VES) were held on August 20th, 2019, where

new committees for 2019-2020 were formed.

Finally, we would like to acknowledge the

organization efforts from our symposium organizers,

including Krishnanand Kaipa, Ravi Burla, Yayue Pan,

Chiradeep Sen, Andrea Vitali, Atif Mahboob,

Zhenghui Sha, Yan Lu, Bryan O'Halloran, John

Michopoulos, Brian Dennis, Yan Wang, Zhimin Xi,

Anh Tran, Chao Hu, Mahesh Mani, Bjorn Johansson,

Athanasios Iliopoulos, Alok Sutradhar, Rahul Panat,

Krishnan Suresh, Paul Witherell, Seung Ki Moon,

Namhun Kim, Tsz Ho Kwok, Shuichi Fukuda, Monica

Bordegoni, Keiichi Watanuki, James Yang, Giorgio

Colombo, Caterina Rizzi, Yujiang Xiang, Ying Liu,

Douglas Allaire, David C. Jensen, Ian Grosse, Ashis

G. Banerjee, Farhad Ameri, Christopher Hoyle,

Marina Carulli, Marc Halpern, Imre Horvath, Po Ting

Lin, Douglas L. Van Bossuyt, Pingfeng Wang, Nita

Yodo, Chao Hu, Zequn Wang, and Tsz Ho Kwok, for

their hard work in paper review coordination and

recommendation. We would also like to thank all

reviewers for their time to provide valuable feedback

and help maintain the high standard and improve the

quality of the conference.

The 40th CIE conference will be held in St. Louis,

Missouri, August 16-21, 2020. A list of planned

symposia is available in CIE 2020 Call for Paper

section of this Newsletter. We look forward to seeing

you in Missouri.

CIE Newsletter

Page 7

Technical Committee Reports

Advanced Modeling and Simulation (AMS)

The Advanced Modeling and

Simulation Symposium track

provides a venue for researchers to

present the original research topics of

modeling and simulation, including

theoretical advances in modeling and

simulation in engineering, advances

in finite element methodology, novel

numerical techniques, advances in discretization, and

industrial applications of modeling and simulation.

A total of 39 papers were accepted among the five

symposiums of AMS. Of these, 25 papers were among

the four symposiums organized directly by AMS and

14 papers were accepted under the symposium jointly

organized by AMS, SEIKM, and CAPPD. The

presented topics ranged from applications of advanced

simulations related to fluid structure interaction

analysis, energy harvesting and mechanical component

design to path planning of swarm robots and design for

additive manufacturing methods. This year, the topic

of Design, Simulation, and Optimization for Additive

Manufacturing was continued to be jointly organized

by AMS, SEIKM, and CAPPD.

The AMS symposium topics presented at Anaheim,

California include the following:

• AMS General (CIE-1) was conducted in two

sessions (CIE-1-1 and CIE-1-2) and covered a

wide range of topics on modeling and simulation

that were not included in the special sessions

below.

• Computational Multiphysics Applications

(CIE-7): Computational modeling and simulation

of multiphysics systems in engineering requires

development of sophisticated models, integration

methods, numerical algorithms, and

computational techniques. This symposium

featured presentations on applying these methods

to problems ranging from modeling of wind

turbine blade erosion to fluid structure interaction

on aircraft structures.

• Uncertainty Quantification in Simulation and

Model Verification & Validation (CIE-8)

Uncertainties are inherent in computational

models because of abstraction and numerical

treatments. This symposium featured more

presentations this year and was conducted in two

sessions (CIE-8-1 and CIE-8-2). Methods for

quantification of uncertainties in simulation and

their applications in energy generation,

manufacturing, and reliability validation were

presented.

• Simulation in Advanced Manufacturing (CIE-

9). In this symposium, modeling and simulation

methods related to job shop scheduling, path

reconfiguration, and path planning of swarm

robots for search applications were presented.

• Design, Simulation, and Optimization for

Additive Manufacturing (CIE-12): Simulation

plays an important role to understand the detailed

processes of additive manufacturing. This

symposium was jointly organized by AMS,

SEIKM, and CAPPD, and was conducted in

three sessions (CIE-12-1, CIE-12-2, and CIE-12-

3). Papers on various aspects of additive

manufacturing including multicomponent

topology optimization, surrogate models for

residual field estimation, 3D-printed electronics,

material characterization, metamodeling,

reconfiguration design, thermal analysis, and

machine learning methods for additive

manufacturing were presented.

There were a total of 18 graduate student posters that

were presented. The session was jointly organized and

closely coordinated by multiple CIE technical

committees.

AMS Technical Committee Best Paper Award

The 2019 AMS Best Paper was awarded to:

IDETC2019-97986, “sBF-BO-2CoGP: A Sequential

Bi-fidelity Constrained Bayesian Optimization for

Design Applications” by Anh Tran, Tim Wildey, and

Scott McCann on the topic: Uncertainty Quantification

in Simulation and Model Verification & Validation

(CIE-8).

Krishnanand

Kaipa

Page 8

CIE Newsletter

2020 AMS TC Leadership

Chair: Krishnanand N. Kaipa, Old Dominion

University, kkaipa@odu.edu

Vice-chair: Seung-Kum Choi, Georgia Institute of

Technology, schoi@me.gatech.edu

Secretary: Piyush Pandita, General Electric,

piyush.pandita@ge.com

Members-at-large:

Anh Tran, Sandia National Laboratories,

anhtran@sandia.gov

Ravi Burla, Auto Desk, Ravi.Burla@autodesk.com

Computer-Aided Product and Process Development (CAPPD)

As part of the 2019 CIE conference,

CAPPD sponsored five symposia:

1) the CAPPD general session, 2)

Motivation and Emotion, 3) Human

Modeling-Methods and

Applications in Engineering, 4)

Design, Simulation and

Optimization for Additive

Manufacturing, organized with AMS and SEIKM, and

5) an invitation-only panel session.

In total 39 draft papers were submitted, and 35 were

accepted, corresponding to an acceptance rate of 89%.

The CAPPD panel session hosted five speakers, who

discussed the role of structural optimization,

multiscale multiphysics simulation, and

democratization for additive manufacturing.

As in the past, the CAPPD technical committee

continued to organize the CIE Graduate Student Poster

Session. Thanks to the outstanding efforts of the

CAPPD secretary, Tsz Ho Kwok, this year’s poster

session drew great interest. 19 students submitted

poster abstracts, and the CIE division granted sixteen

of them $200-$750 travel awards based on the quality

of their submissions.

CAPPD Technical Committee Best Paper Award

The 2019 CAPPD Best Paper was awarded to:

IDETC2019-98466, “Using Automated Use Case

Generation for Early Design Stage Functional Failure

and Human Error Analysis” by Luckman Irshad, Onan

Demirel, and Irem Y. Tumer on the topic of Human

Modeling-Methods and Applications in Engineering.

2019-2020 CAPPD TC Leadership

Chair: Chiradeep Sen, Florida Institute of Technology

(csen@fit.edu)

Vice Chair: Tsz Ho Kwok (Tom), Concordia

University (tszho.kwok@concordia.ca)

Secretary: Ehsan T. Esfahani, University at Buffalo

(ehsanesf@buffalo.edu)

Past Chair: Yayue Pan, University of Illinois at

Chicago (yayuepan@uic.edu)

Yayue Pan

CIE Newsletter

Page 9

Virtual Environments & Systems (VES)

During the 2019 edition of IDETC

CIE Conference in Anaheim, the

Virtual Environment & Systems

(VES) technical session hosted 20

presentations organized in two (3)

sessions and one (1) special session

with video presentations. VES

sessions addressed a wide variety of topics, such as:

Design Tools and VR- Systems; Portable and

Wearable VR Systems for Simulation, Multi-Modality

and Scenario Design; Simulation and Interaction; UX

and Interfaces; Enhanced Visualization and Motion-

Based Design Systems; Multiple Realities (i.e. VR-

AR-MR-XR) and Blended Spaces; Vocational

Training, Immersive Learning and Education with

VR-based systems; Methods, Processes and Strategies

for Technology.

The VES community has expressions of interest and

focus towards the use of virtual reality technologies

applicable to a plethora of domains. The design and

operation of engineered and/or cyber-physical systems

present unique challenges and opportunities for

integrating human intelligence, cognition, multi-

sensorial aspects, and decision-making with computer

intelligence. Issues and aspects related to enabling

humans to visualize, simulate and make decision in the

context of large amounts of data, choice-architecture

on information and as one of many agents or

stakeholders in a D&E process.

The aim of the CIE-VES Video, Visualization and

Virtual Demonstration of Prototypes and Simulations

(VVVD) exhibit event was to digitally show & tell,

represent, and present ongoing research, progression

and development of VES prototypical and simulative

devices, be it low-cost or high-end customized,

dedicated or to specification of e.g.: tools,

environments, cyber-physical systems, user-

interfaces, multi-modalities, robust interaction

applications etc.

Over the years the VES Community reached and

demonstrated high scientific quality in their sessions,

contributions and outreach/crossover to other domains

and disciplines. The VES community is always

looking for researchers and domain-experts (including

cross-domains, multi-disciplinary) to expand and

strengthen their platform and research endeavors.

Please feel free to contact us (see below) if you are

interested to join, participate or get involved.

VES Technical Committee Best Paper Award

One paper was selected and awarded: IDETC2019-

97711, “Reinforcement Learning Content Generation

For Virtual Reality Applications” by Christian E.

Lopez, Omar Ashour, and Conrad S. Tucker on the

topic of Artificial Intelligence and Machine Learning

in Design and Manufacturing.

2019-2020 VES TC Leadership

Chair: Andrea Vitali, University of Bergamo,

andrea.vitali1@unibg.it

Co-Chair/Secretary: Atif Mahboob, Technical

University of Ilmenau, atif.mahboob@tu-ilmenau.de

Secretary: Marina Carulli, Politecnico di Milano,

marina.carulli@polimi.it

Past Chair: Robert E. Wendrich, University of

Twente,

info@rawshaping.com,r.e.wendrich@utwente.nl

Andrea Vitali

Page 10

CIE Newsletter

Systems Engineering, Information and Knowledge Management (SEIKM)

The goal of the Systems Engineering,

Information, and Knowledge

Management (SEIKM) Technical

Committee (TC) is two-fold; (i) to

serve the SEIKM community in the

broad computer and information

engineering field through activities

promoting the dissemination of new

knowledge and new technology, and (ii) to advance

research related to design, engineering, and operation

of systems where complexity, connectivity,

uncertainty, knowledge discovery, and management

present unique challenges. As the interest in IoT, big

data, machine learning and AI, cyber-physical

systems, and sociotechnical systems has grown, there

is room for significant collaborative research impact

from our community. To help both the research

community and industry, several efforts have been

made by the SEIKM TC in the last year.

Showcasing and highlighting the need for

collaborative research to address the challenges

associated with the systems engineering and design

(SE&D) research has been one of the main objectives

of the SEIKM TC at the 2019 ASME IDETC/CIE

conference in Anaheim, CA. This year we suggested to

organize a session on machine learning and AI. Due to

the topic’s popularity among CIE, the session was held

at the CIE level. The research focused on new

computational approaches and computational

reasoning to enable advances in systems engineering

design and operations. This research resulted in three

CIE sessions that accepted 10 research articles.

Another special session offered was the joint

AMS/SEIKM/CAPPD session titled Design,

Simulation and Optimization for Additive

Manufacturing. This session was offered after its

success at the 2018 conference. Due to the rapid

development and integration of artificial intelligence

(AI), smart sensors, and machine learning in modern

manufacturing systems, the session titled Smart

Manufacturing Informatics was also offered for the

second year. Both of these sessions continue to be

highly relevant to the SEIKM community and will be

continued at the 2020 conference.

As a response to the growing complexity in systems,

including factors such as increased cost, reduced

development schedules, increased connectivity within

the system, and the integration of new technology, a

new session was developed this year titled Complex

Systems Engineering and Design. This session covered

all stages of the design process and focused

contributions on the various challenges within

complex systems. The session resulted in four research

articles.

In addition to the special sessions, the established

SEIKM sessions were conducted, consisting of SEIKM

General, Design Informatics, Systems Engineering,

and Knowledge Capture, Reuse and Management. In

total, 13 research articles were presented in these

sessions. For all the sessions (excluding the joint

AMS/SEIKM/CAPPD session) organized by SEIKM

at 2019 ASME IDETC/CIE, the number of total

research article submissions was 38 and the number of

accepted was 26. The acceptance rate was 68%.

SEIKM contributors have hosted several workshops

over the past several years at the IDETC/CIE

conferences. In 2019 a panel session was organized to

offer expert knowledge and opinion on the topic of

Model-Based Systems Engineering (MBSE) with the

title The Recent Advances and Future Direction of

Model-Based Systems Engineering. The panel was

moderated by the Chair, Dr. Zhenghui Sha from the

University of Arkansas, and the Secretary, Dr. Yan Lu

from the National Institute of Standards and

Technology. The panel speakers included Dr.

Arquimedes Martinez Canedo (Siemens Corporate

Technology), Dr. Douglas Van Bossuyt (Naval

Postgraduate School), Dr. Bryan O’Halloran (Naval

Postgraduate School), and Dr. Rich Malak (Texas

A&M University). This panel provided a wonderful

opportunity for the SEIKM community to engage in a

lively discussion on the challenges and possibilities of

MBSE. We will expect another future-focused panel in

2020!

Looking forward to the 2020 conference in St. Louis

MO, the SEIKM leadership team plans to build on its

success by offering the new sessions on emerging

topics of AI and machine learning in SE&D research,

cyber-physical systems, sociotechnical systems, and

systems of system research. Furthermore, we will

continue the collaboration with ASME Journal of

Computing and Information Science in Engineering to

Bryan

O’Halloran

CIE Newsletter

Page 11

help transit the best SEIKM research articles into

journal publications.

SEIKM Technical Committee Best Paper Award

In 2019 there were several excellent paper submissions

to the SEIKM sessions. The SEIKM TC selected one

of these for the best paper award in recognition of the

paper’s communication quality and research impact.

The SEIKM Best Paper award for 2019 was awarded

to the paper titled A Deep Learning Based Approach to

Predicting Sequential Design Decisions by Molla

Hafizur Rahman, Charles Xie, and Zhenghui Sha from

the University of Arkansas. We appreciate their

contribution to SEIKM and look forward to more of

their work in the future.

2019-2020 SEIKM TC Leadership

Chair: Bryan O’Halloran, Naval Postgraduate School

(bmohallo@nps.edu)

Vice Chair: Yan Lu, National Institute of Standards

and Technology (yan.lu@nist.gov)

Secretary: Zhuo Yang, National Institute of Standards

and Technology (zhuo.yang@nist.gov)

Past Chair: Zhenghui Sha, University of Arkansas

(zsha@uark.edu)

Page 12

CIE Newsletter

CIE Industry Track

The 2019 Industry-Academic track at

IDETC was hosted by Dr. Marc

Halpern, a research Vice President at

Gartner, Inc. and Professor Korhan

Sevenler of Rochester Institute of

Technology. Two panels were

associated with the track. One panel

focused on digital transformation and

infrastructure modernization for

engineering IT and the second panel focused on Smart

Manufacturing.

During the first panel, Dr. Halpern’s presentation

discussed how today’s engineering infrastructure

evolved over decades in an adaptive emergent way.

This presentation shared a root-cause analysis of the

challenges of disruptive change and explored the

system-of-systems thinking needed to orchestrate

technology, people, and processes for continuous

improvement in the use of IT for engineering practice.

Dr. Peter Långsten, CEO of Predict Change, Inc.

discussed trends and lessons learned from helping

manufacturers investing in transforming the IT used

for engineering operations. Dr. Långsten described

how the last ten years have demonstrated previously

unseen interest for innovating the infrastructure and

way-of-working at large industrial corporations. He

explained how and why many of these programs

initially fell short of expectations and how he

supported leading international manufacturing to

succeed at innovating their product information

management infrastructure over his decades of

experience.

Michael Yost, Outreach Advisor at CESMII, The

Smart Manufacturing Institute, discussed how

digitization efforts are in full flight not only in

engineering but also in manufacturing operations. Mr.

Yost discussed how the Institute on Smart

Manufacturing is focusing to streamlining accessibility

of information between the plant and other business

functions such as engineering. Mike also addressed the

cultural and technological barriers CESMII is working

to remove from manufacturing businesses.

Dustin Mayfield, a Business and Engineering Systems

Operations Manager at Saratech, Inc. discussed how

the Internet-of-Things (IoT) and Augmented Reality

(AR) have generated great excitement across

engineering-intensive industries. In addition to

describing how companies have successfully

implemented IoT and AR, Mr. Mayfield also shared

what his experience has taught about best practices for

implementing them.

The second panel was organized by Dr. Sudarsan

Rachuri and Dr. Mahesh Mani, and titled ‘Smart

Manufacturing.” This panel focused on the great

potential of smart manufacturing technologies to

improve quality, cost, productivity, and overall

efficiency for manufacturing industries. Panelists

addressed various research and technology challenges

as well as opportunities, for example: information

fusion; advanced sensing and instrumentation; process

monitoring, control and optimization; advanced

hardware and software platforms; real-time and

predictive modeling; and simulation technologies that

will have far-reaching impacts on smart

manufacturing.

Distinguished panelists included Dr. Said Jahanmir

Assistant Director Advanced Manufacturing National

Program Office (AMNPO); Phyllis Manchester,

Solution Architect IIoT/Industry 4.0 at Raytheon; Dr.

William Peter, Director Manufacturing Demonstration

Facility (MDF) at Oak Ridge National Lab (ORNL);

and Dr. Ram Sriram, Chief, Software and Systems

Division, Information Technology Laboratory at

NIST. The panel was facilitated by Dr. Haresh

Malkani, CTO, Clean Energy Smart Manufacturing

Innovation Institute (CESMII), the Smart

Manufacturing Institute.

The well-attended panel discussed several challenges

in pursuing smart manufacturing – including

infrastructure, standardization, scale-up, talent,

culture, ROI and cybersecurity. They touched up

specific opportunities and R&D challenges that

organizations are focusing on. The panel also served

the purpose of educating the ASME-CIE community

on the mission and vision of CESMII-the Smart

Manufacturing Institute.

Marc

Halpern

CIE Newsletter

Page 13

Poster Session and Awards The following are the poster session awardees:

1. Daniel Hulse “Object-Oriented Graph-Based

Modeling for Resilient Design”

2. Chih-Hsuan Hung “Design Synthesis and

Optimization for Next Generation High Power

and Energy Lithium-ion Batteries”

3. Ziyang Zhang “Modeling and Prediction of

the Flexural Behavior of Additively

Manufactured Continuous Carbon Fiber-

Reinforced Polymer Composites”

4. Laxmi Poudel “Design Of Multi-Robot

Systems With Evolving Constraints:

Cooperative 3D Printing System Design”

5. Amanda de Oliveira Barros “Kinematics and

Dynamics of Soft Magnetic Robot for

Minimally Invasive Procedures”

6. Felipe Meneguzzo Pasquali “Computational

Method for Design of Carbon Fiber

Reinforced Parts Fabricated by Fused

Filament Fabrication”

7. Mohammad Alsager Alzayed “Empathy in

Engineering Design”

8. Hailie Suk “Integrating Quality of Life in

Socio-Technical Design of Microgrid

Systems”

9. Ritwik Rakshit “A New Localized Muscular

Fatigue Model For Dynamic Target Loads”

10. Christopher T. Richard “Pattern and Mold

Design and Optimization for Rapid

Investment Casting to Reduce Mold Cracking

During Burnout”

11. Mahmuda Ishrat Malek “Nonlinear Dynamics

of Human Upright Postural Stability Based on

an Ankle-Knee-Hip Model on a Balance

Board”

12. Ankhy Sultana “Structural Design Of Shoe

Midsole For Directional Energy Transfer”

13. McKenzie Clark “Developing Interview

Protocol for Engineering Capstone Design

Course”

14. Lakshmi Narasimhon “A Feature-based

Approach to Function Modeling and

Reasoning for Thermal-Fluid Systems

Engineering”

15. Amaninder Singh Gill “An Evolutionary

Algorithm Approach to Function Model

Creation”

16. Devanshi Shah “Examining Factors

Influencing Student Motivation, Student

Identity and Performance in Engineering”

AWARD NOMINATIONS DUE SOON!! Nominate your colleagues for CIE Division Awards

Deadline May 24, 2024

• Best Paper Award

• Best Ph.D. Thesis/Dissertation Award

• Distinguished Service Award

• Excellence In Research Award

• Leadership Award

• Lifetime Achievement Award

• Young Engineer Award

For details visit: https://www.asme.org/about-asme/get-involved/honors-awards/unit-awards

Submit to Cameron Turner (cturne9@clemson.edu)

Deadline May 24, 2024

Page 14

CIE Newsletter

Photos from the 2019 CIE Conference

CIE Chair Yan Wang welcomes CIE members to the CIE Luncheon

CIE members gather for the CIE Luncheon and Keynote.

(a) (b) (c)

(a) Conference Chair Yan Wang recognizes CIE Lifetime Achievement award recipient Imre Horváth; (b) Conference Chair

Yan Wang recognizes CIE Young Engineer Award recipient William Bernstein; (c) Conference Chair Yan Wang and ASME

Fellow Ram Sriram recognize CIE Leadership Award recipient Dr. Azad Madni.

CIE Newsletter

Page 15

(a) (b) (c)

(a) Conference Chair Yan Wang recognizes CIE Best Dissertation award recipient Morad Behandish; (b) Conference Chair

Yan Wang and Program Chair Jitesh Panchal recognize CIE Best Conference Paper Award recipient Ezra Ameperosa; (c)

Conference Chair Yan Wang and Program Chair Jitesh Panchal recognize AMS Best Paper Award recipient Anh Tran.

(a) (b)

Conference Chair Yan Wang and Program Chair Jitesh Panchal recognize (a) VES Best Paper Award winners Conrad S.

Tucker and Christian E. Lopez; (b) SEIKM Best Paper Award winners Molla Hafizur Rahman, Charles Xie, and Zhenghui Sha.

(a) (b) (c)

(a) Conference Chair Yan Wang and Program Chair Jitesh Panchal recognize CAPPD Best Paper Award winners Onan

Demirel and Luckman Irshad; (b) ASME Fellow Ram Sriram recognizes newly elected ASME Fellow Marc Halpern. (c)

Conference Chair Yan Wang recognizes Past Chair Cameron Turner with the CIE Distinguished Service Award.

Page 16

CIE Newsletter

https://www.asme.org/professional-membership

CIE Newsletter

Page 17

Page 18

CIE Newsletter

Updates from ASME Journal of Computing and Information Science in Engineering (JCISE)

The field of computing and

information science is seeing

significant growth. New

developments in these areas

are expected to impact all

facets of engineering. ASME

Journal of Computing and

Information Science in

Engineering (JCISE) updated

its scope to cover recent

developments in the field.

JCISE publishes articles related to Algorithms,

Computational Methods, Computing Infrastructure,

Computer-Interpretable Representations, Human-

Computer Interfaces, Information Science, and/or

System Architectures that aim to improve some

aspect of product and system lifecycle (e.g., design,

manufacturing, operation, maintenance, disposal,

recycling etc.). Applications considered in JCISE

manuscripts should be relevant to the mechanical

engineering discipline. Papers can be focused on

fundamental research leading to new methods, or

adaptation of existing methods for new applications.

Topic areas covered by JCISE include:

• Advanced Computing Infrastructure

• Artificial Intelligence

• Big Data and Analytics

• Collaborative Design

• Computer Aided Design

• Computer Aided Engineering

• Computer Aided Manufacturing

• Computational Foundations for Additive

Manufacturing

• Computational Foundations for Engineering

Optimization

• Computational Geometry

• Computational Metrology

• Computational Synthesis

• Conceptual Design

• Cybermanufacturing

• Cyber Physical Security for Factories

• Cyber Physical System Design and

Operation

• Data-Driven Engineering Applications

• Engineering Informatics

• Geometric Reasoning

• GPU Computing for Design and

Manufacturing

• Human Computer Interfaces/Interactions

• Industrial Internet of Things

• Knowledge Engineering

• Information Management

• Inverse Methods for Engineering

Applications

• Machine Learning for Engineering

Applications

• Manufacturing Planning

• Manufacturing Automation

• Model-based Systems Engineering

• Multiphysics Modeling and Simulation

• Multiscale Modeling and Simulation

• Multidisciplinary Optimization

• Physics-Based Simulations

• Process Modeling for Engineering

Applications

• Qualification, Verification and Validation of

Computational Models

• Symbolic Computing for Engineering

Applications

• Tolerance Modeling

• Topology and Shape Optimization

• Virtual and Augmented Reality

• Virtual Prototyping

2019-2020 Update Increase in AEs from 7 to 28

333 submissions (2018) 62 Accepted in 2016 (19%) ~ 2 in queue

Avg 5.68 months – submission to AE Approval 8% increase in Impact Factor 4% increase in Citations Special Issue of papers from IDETC 2018

published September 2019 (15 papers) Special Issue of papers from IDETC 2019 to be

published in 2020 (target is 15 papers) Currently 4/year – targeting 6, with special

issues

Satyandra Kumar

Gupta, Editor,

JCISE

CIE Newsletter

Page 19

Special Journal Issues Based on DETC/CIE Papers

We published a special issue called “Highlights from

2018 ASME Computers & Information in Engineering

Conference (CIE)” in September 2019. This issue

features 15 papers.

We are targeting publishing 15 papers from 2019

ASME CIE conference in a special JCISE issue in

2020.

Upcoming Special Journal Issue Machine Learning

Applications in Manufacturing

Machine Learning (ML) has recently become a power

engine transforming various manufacturing research

and applications. In the era of Smart Manufacturing

and I4.0, the abundance of smart sensors and industrial

internet of things, has made manufacturing systems a

data-rich environment. ML techniques play a

significant role in uncovering fine-grained complex

production patterns and offering timely decision

support in a wide range of applications, to name a few,

robotics and human-machine interaction, predictive

maintenance, process optimization, task scheduling,

quality improvement, and security. While different ML

techniques have been researched and deployed in

manufacturing, many open challenges and questions

still remain, from data understanding, data and

knowledge representation, and data reasoning in ML to

advanced topics such as predictive analytics, edge

computing and cybersecurity.

This Special Issue aims to harvest the latest efforts in

theoretical as well as experimental aspects of ML and

their applications in manufacturing.

Potential topics include, but are not limited to:

• ML-based theoretical approaches for

manufacturing

o ML for robotics and human-machine

interaction

o ML for predictive maintenance, quality

control, and process optimization

o ML for tasks scheduling and supply chain

management

o ML for sustainable manufacturing

o ML for manufacturing process monitoring

and control

o ML and data-driven design for

manufacturing to enable better and faster

fabrication of parts

o ML methods that provide insights for

manufacturing process improvement

o ML methods that leverage material

informatics for improved manufacturing

• ML-based experimental case studies for smart

manufacturing

o Advanced diagnostics, prognostics and

asset health management

o Energy consumption modelling and

optimization

o Advanced robotics (collaborative and

adaptive robots)

o Digital twin

o Leveraging ML for hybrid manufacturing

(additive and subtractive manufacturing)

o Data acquisition for novel manufacturing

processes

• Novel ML algorithm design for manufacturing

o Approaches to extract manufacturing

knowledge using ML techniques

o Algorithms and approaches handling big

data, data imbalance, uncertainty, data

fusion, etc.

o Calibration and validation of ML-based

patterns and models

o Addressing security, privacy, and cyber

resilience/reliability issues

o Novel deep learning architecture for

manufacturing domain problems

o Hybrid machine learning methods that

combine data-driven and equation-based

methods

• Creation and sharing of research data that

supports ML applications in manufacturing

We also encourage papers that leverage the specific

intersection between manufacturing tasks and ML

techniques, with contributions that generalize across

multiple manufacturing problems.

Page 20

CIE Newsletter

Publication Target Dates

Paper Submission Deadline: August 1, 2019

Initial Review Completed: October 30, 2019

Special Issue Publication Date: March 2020

Special Issue Guest Editors

• Ying Liu, Cardiff University, UK,

liuy81@cardiff.ac.uk

• Bin He, Shanghai University, China,

mehebin@shu.edu.cn

• Mahesh Mani, Allegheny Science & Technology,

US, mmani@alleghenyst.com

• Anurag Purwar, Stony Brook University, US,

anurag.purwar@stonybrook.edu

• Rahul Rai, University at Buffalo SUNY, US,

rahulrai@buffalo.edu

Plan for the Journal

Our plan for this year includes the following:

• Improve quality of submission by promoting the

journal

• Publish several review papers to increase the

visibility of the journal

• Publish invited guest editorials to increase the

visibility of the journal

• Develop special issues focused on emerging areas

• Recruit AEs from the industry to feature content

that is of interest to the industry

The current JCISE Associate Editors are:

• Anwer, Nabil, University Paris-Sud, France

• Balan, Gurumoorthy, Indian Institute of Sciences,

India

• Bordegoni,Monica, Politecnico di Milano, Italy

• Campbell, Matt, Oregon State University

• Chen, Yong, University Southern California

• Corney, Jonathan, Strathclyde University, UK

• Ferrise, Francesco, Politecnico di Milano, Italy

• He, Bin, Shanghai University, China

• Joneja, Ajay, HKUST, China

• Kumar, Ashok, University of Florida

• Liu, Ying, Cardiff University, UK

• Liu, Yusheng, Zhejiang University, China

• Mani, Mahesh, Allegheny Science & Technology

• Michopoulos, John, Naval Research Lab

• Panchal, Jitesh, Purdue University

• Paredis, Christiaan, Clemson University

• Purwar, Anurag, Stony Brook University

• Rai, Rahul, University of Buffalo

• Rao, P.V.M, Indian Institute of Technology,

Delhi, India

• Rizzi, Caterina, Università degli Studi di

Bergamo, Italy

• Saitou, Kazuhiro, University of Michigan

• Summers, Joshua, Clemson University

• Suresh, Krishnan, University of Wisconsin

• Song, Yu, Delft University of Technology,

Netherlands

• Tucker, Conrad, Penn State University

• Wang, Charlie, Delft University of Technology,

Netherlands

• Wang, Yan, Georgia Institute of Technology

• Wärmefjord, Kristina, Chalmers University of

Technology, Sweden.

CIE Newsletter

Page 21

40TH ASME Computers and Information Engineering Conference (CIE)

https://event.asme.org/IDETC-CIE/Program/Call-for-Papers

We are still accepting PRESENTATION ONLY submissions. Papers are solicited on all aspects of computer

applications on experimental, numerical, or analytical

studies with emphasis on the following core and special

topic areas.

Core areas:

• Advanced Modeling and Simulation (AMS)

• Computer-Aided Product and Process Development (CAPPD)

• Virtual Environments and Systems (VES)

• Systems Engineering Information Knowledge

Management (SEIKM)

Special topics:

• Artificial Intelligence and Machine Learning in

Design and Manufacturing

• AMS: Inverse Problems in Science and Engineering

• AMS: Computational Multiphysics Applications

• AMS: Uncertainty Quantification in Simulation and Model Verification & Validation

• AMS: Simulation in Advanced Manufacturing

• AMS: Material Characterization Methods and

Applications • AMS: Bio-inspired Design of Architected

Materials and Structures

• AMS/SEIKM/CAPPD: Design, Simulation and Optimization for Additive Manufacturing

• CAPPD: Motivation and Emotion

• CAPPD: Human Modeling-Methods and

Applications in Engineering • SEIKM: Design Informatics

• SEIKM: Systems Engineering

• SEIKM: Knowledge Capture, Reuse, and Management

• SEIKM: Smart Manufacturing Informatics • SEIKM: Complex Systems Engineering and

Design

• VES: Methods, Processes and Strategies for

Technology (MPS-T) • VES: Methods, Processes and Strategies for User

Interface (MPS-UI)

• VES: Video Presentation Exhibit: Visualization and Virtual Demonstration of Prototypes and

Simulations

• Industry Practice: Computer and Information

Technology Trends • CIE/MESA Joint Symposium: Cyber-Physical

Systems

• DAC/CIE Joint Symposium: Design for Resilience and Failure Recovery

• Graduate Student Poster Symposium (travel

support of $750 each is available)

Selected papers will be published in ASME Journal of

Computing and Information Science in Engineering

(JCISE). Five Best Papers will be awarded, including CIE

Conference Best Paper and AMS Best Paper, CAPPD Best Paper, SEIKM Best Paper, and VES Best Paper.

Conference Date:

August 16–19, 2020

Conference Organizers:

Conference Chair: Jitesh H. Panchal

Purdue University, West Lafayette, IN, USA

panchal@purdue.edu

Program Chair: Mahesh Mani

Allegheny Science & Technology, Bridgeport, WV, USA mahesh.mani@ee.doe.gov

Page 22

CIE Newsletter

Relevant Journals, Conferences & Workshops

The Journal of Computing and Information

Science in Engineering publishes archival

research results and advanced technical

applications. The scope includes: Solid and

Geometric Modeling; Computational geometry;

Reverse Engineering; Virtual Environments and

Haptics; Tolerance Modeling and Computational

Metrology; Rapid Prototyping; Internet-Aided

Design, Manufacturing and Commerce;

Information Models and Ontologies for

Engineering Applications; PDM/Enterprise

Information Management; AI/Knowledge

Intensive CAD/CAM; Engineering Simulation and

Visualization, including FEA and Meshing;

Creative IT; and Computational

Algorithms/Software Development for mechanical

product development.

http://computingengineering.asmedigitalcollectio

n.asme.org/journal.aspx

JOURNAL OF COMPUTING

AND INFORMATION

SCIENCE IN ENGINEERING

Founded in 1880 as the American Society of Mechanical

Engineers, ASME is the premier professional

membership organization for more than 127,000

mechanical engineers and associated members

worldwide. ASME also conducts one of the world's

largest technical publishing operations in the world,

offering thousands of titles including some of the

profession's most prestigious journals, conference

proceedings, and ASME Press books.

The ASME Digital Collection, previously known as The

ASME Digital Library, is ASME’s repository of current and

archival literature featuring:

ASME's Transaction Journals from 1960 to present.

ASME's Conference Proceedings from 2002 to present.

ASME Press eBooks selected from 1993 to present.

http://asmedigitalcollection.asme.org/index.aspx

CIE Newsletter

Page 23

https://community.asme.org/computers_information_engineering/default.aspx

CIE NEWSLETTER EDITORIAL

Issue Editor

Paul Witherell

Contributions Yan Wang, Jitesh Panchal, Marc Halpern, Krishnanand Kaipa, Yayue Pan, Andrea Vitali,

Bryan O’Halloran, S.K. Gupta