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Transcript of MEMS_2
ITRS MEMS
San Francisco, CAJuly 12, 2012
Presentation by Michael Gaitan, NIST
MEMS Technology Working Group
Akihiro KogaArthur Morris
Asif ChowdhuryBrian Jamieson
Buzz HardyChengkuo LeeChris Apanius
Chris van HoofChristian RembeChuck Richardson
Dave HowardDimitrios Peroulis
Dominique SchinabeckDon DeVoe
Edward ChiuFabio PasoliniFabrice Verjus
Fumihiko NakazawaGoro Nakatani
Hebert Bennett
ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroST MicroKFM TechnologyFujitsuRohmNIST
Henne
van
Heeren
Hiroshi
Yamada
Ingri
d
De
Wolf
Jae
Sung
Yoon
Ji
m
Spall
Ji
m
Mrvos
Ji
anm
in
M
iao
John
Rychci
kJ
osh
Mol
ho
Karen
Li
ght
man
Kevi
n
Chau
Koji
Fukumot
oM
arci
e
Wei
nst
ei
nM
ark
Crockett
Mary
Ann
Maher
Mi
chel
Brill
ouet
Moni
ca
Takacs
Patri
c
Sal
omon
Pete
Loeppert
Raj
Gupt
a
enablingMNTToshibaIMECKIMMDelphiLexmarkNTUSolidusCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMI, MEMSmartSoftMEMSLETIMEMS Industry Group4m2cKnowles AcousticsVolant Technologies
Chair: Mike Gaitan (NIST), ChairCo-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Raji BaskaranRakesh Kumar
Randy WagnerRobert De Nuccio
Ron LawesSacha RevelScott Bryant
Shawn BlantonStephane Donnay
Steve BreitSteve Greathouse
Steve WalshTakashi Mihara
Tetsu TanakaTony Stamper
Veljko MilanovicWei-Leun Fang
Wendy ChenXiaoming Wu
Yasutaka Nakashiba
IntelGlobal FoundriesNISTST MicroImperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECCoventorPlexusMANCEFMicromachine CenterTohoku Univ.IBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics
MEMS Technology Working Group
Akihiro KogaArthur Morris
Asif ChowdhuryBrian Jamieson
Buzz HardyChengkuo LeeChris Apanius
Chris van HoofChristian RembeChuck Richardson
Dave HowardDimitrios Peroulis
Dominique SchinabeckDon DeVoe
Edward ChiuFabio PasoliniFabrice Verjus
Fumihiko NakazawaGoro Nakatani
Hebert Bennett
ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroST MicroKFM TechnologyFujitsuRohmNIST
Henne
van
Heeren
Hiroshi
Yamada
Ingri
d
De
Wolf
Jae
Sung
Yoon
Ji
m
Spall
Ji
m
Mrvos
Ji
anm
in
M
iao
John
Rychci
kJ
osh
Mol
ho
Karen
Li
ght
man
Kevi
n
Chau
Koji
Fukumot
oM
arci
e
Wei
nst
ei
nM
ark
Crockett
Mary
Ann
Maher
Mi
chel
Brill
ouet
Moni
ca
Takacs
Patri
c
Sal
omon
Pete
Loeppert
Raj
Gupt
a
enablingMNTToshibaIMECKIMMDelphiLexmarkNTUSolidusCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMI, MEMSmartSoftMEMSLETIMEMS Industry Group4m2cKnowles AcousticsVolant Technologies
Chair: Mike Gaitan (NIST), ChairCo-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Raji BaskaranRakesh Kumar
Randy WagnerRobert De Nuccio
Ron LawesSacha RevelScott Bryant
Shawn BlantonStephane Donnay
Steve BreitSteve Greathouse
Steve WalshTakashi Mihara
Tetsu TanakaTony Stamper
Veljko MilanovicWei-Leun Fang
Wendy ChenXiaoming Wu
Yasutaka Nakashiba
IntelGlobal FoundriesNISTST MicroImperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECCoventorPlexusMANCEFMicromachine CenterTohoku Univ.IBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics
MEMS Industry Group
MEMS TWG
Subgroups: Devices,
Design and Simulation,
Packaging and Integration, and
Testing
Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012
Focus: MEMS in Mobile Devices
ITRS MEMS
• MEMS Device Technologies– Accelerometers – Gyroscopes– Microphones– RF MEMS– Emerging MEMS
• Technology Requirements– Device Performance– Design and Simulation– Packaging and Integration– Device Testing
MEMS Inertial Sensors
• MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.
• The integration of functionalities (tri axis accelerometer, gyroscope, magnetometer, and pressure sensor) towards the IMU has advanced to 9 DOF in the package.
• Driving down the cost of testing of the IMU continues to be a challenge.
Example - 9 DOF IMU Package Level
ST MicroelectronicsFeb 12, 2012
http://www.st.com/internet/com/press_release/p3273.jsp
MEMS Microphones• MEMS microphones are expected to
incrementally increase in performance and lower in cost.
• As the sensitivity of microphones advances to 68 db, testing in the factory environment is an issue.
• Advances in the ASIC include digital output and adaptive signal processing (such as noise cancellation).
• Testing of MEMS Microphones with adaptive signal processing is a challenge.
RF MEMS• RF MEMS are intended to lower the power
dissipation of the radio.• RF MEMS are sill in the process of increasing
their reliability and lowering cost before they can be adopted in mobile devices.
• RF MEMS are expected to increase in performance and reliability. – The biggest challenge in RF MEMS is enhancing
reliability and lifetime (# of operations)– Some of the future performance metrics have no
known solutions, (e.g., signal isolation requirements)
Grand ChallengesDifficult Challenges Potential Solutions
Integration of MEMS in the Package
Standardization for MEMS packaging to support integration.
Packages are needed that reduce or eliminate mechanical stress and enhancing hermeticity.
Package data that can be used to accurately predict the effect of the package on device performance.
Testing of MEMS More testing towards the wafer level.Validated tools to predict device device
performance from wafer tests.Methodologies for “Design for Test” or
“Design for NO Test.”
Validated accelerated life testing for MEMS
More knowledge of the physics of failure is required to develop accelerated life tests.
Need to share information. Individual solutions exist but are not being generalized across the industry.
MEMS Manufacturing
Packaging and
Testing
DeviceFabrication
MEMS Manufacturing Cost R&D Investment
Device andProcess
Development
Packaging and Testing
ITRS and iNEMI • The MEMS Technology Working Group is also
affiliated with iNEMI.
• The iNEMI MEMS will be expanded to include consumer health applications: the "Worried Well."
• TWG discussions include the concept of integration node.
• An iNEMI project on MEMS Testing Requirements is in discussion. The focus will likely be on defining performance metrics in data sheets.
MEDICAL MARKET- High Potential
Bubble Chart Ref: IBM Institute for Business Value,” The future of connected health devices”
3 BILLION POTENTIAL CUSTOMERS FOR
CONNECTED HEALTH DEVICES
Integration NodeAccelerometer
Tri-AxisAccelerometer
GyroscopeTri-Axis
Gyroscope
MagnetometerTri-Axis
Magnetometer
6 DOF Sensor
9 DOF Sensor
Pressure Sensor
10 DOF Sensor
Conclusions• Opportunities for industrial collaboration exist around issues at
the back end (packaging and test)
• MEMS Sensor Fusion creates challenges for testing in increasing complexity while still lowering cost.
• MEMS Testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).
• Our road mapping has so far been on near term (5 years). The concept of integration node might facilitate longer term road mapping of MEMS and other More than Moore Technologies.