MEMS Laser Scanning, the platform for next generation of 3D Depth Sensors

Don’t just think outside the box. See outside the box.

MEMS Laser Scanning, the platform for next generation of 3D Depth SensorsJari Honkanen

2 MICROVISION, INC. COPYRIGHT 2016. ALL RIGHTS RESERVED.10/14/2016

AbstractMicroVision's PicoP® scanning technology is a MEMS-based Laser Beam Scanning (LBS) solution for pico projection, heads-up-display, and augmented reality eyewear applications. The same flexible technology can also be applied to exciting new sensing applications, such as 3D depth sensing. Demand for small and low cost 3D depth sensing solutions is growing rapidly, driven by increasing demand for new Natural User Interface, Machine Vision, Robotic Navigation, Metrology, and Advanced Driver Assistance System (ADAS) solutions. This session will compare the existing 3D depth sensor solutions based on stereo cameras, structured light and 3D CMOS Cameras. It will then present a new MEMS LBS depth sensor platform solution that can enable a new generation of tiny 3D depth sensors with capabilities such as dynamic variable resolution and variable acquisition speed. These dynamic LBS depth sensors are an enabling technology for a completely new set of innovative products and applications.

3 MICROVISION, INC. PROPRIETARY AND CONFIDENTIALCOPYRIGHT 2016. ALL RIGHTS RESERVED.10/14/2016

Agenda What is a 3D Depth Sensor? 3D Depth Sensing Applications 3D Depth Sensing Market Opportunity 3D Depth Sensor Technologies 3D Depth Sensor Competitive Analysis Case Study:

MicroVision MEMS Technology and Applications MicroVision MEMS used for Depth Sensing Benefits of LBS for Depth Sensing

Conclusions & Call to Action


3D Depth Sensor – What Is It? 3D sensors allow devices to observe the

environment in 3 dimensions

3D imagers measure distance for every pixel within detection field.

3D imagers produce a 2D addressable array, a depth map, or further a 3-dimensional collection of points, a point cloud

Number of measurementswithin detectionfield of view

Depth Sensor/Imager

X

Y

Distance,Z

Depth Map Point Cloud


3D Depth Sensing Applications (just a small sample) Application Targets MarketsNatural User Interfaces / Gesture Recognition

Internet of ThingsGamingInteractive Displays

3D Scanning 3D ModelingGaming, Virtual Worlds3D Printing

Metrology, Location and Mapping

Indoor Measurements3D Room MappingRobot NavigationRange FindingAdvanced Driver Assistance Systems (ADAS)Drone Collision Avoidance

Machine Vision / Object Recognition

SecurityIndustrial Automation


3D Imaging & Sensor Market Opportunity The 3D imaging & sensor market is still at an early stage and growth is driven by new

application areas and cost reduction of sensor technologies.

Leading CE companies like Apple (PrimeSense acquisition), Microsoft (Canesta and 3DV Systems acquisitions), Sony (Softkinetic acquisition) and Google (Project Tango) have been investing heavily in the space.

Leading chip companies like Intel (RealSense) and Infineon (Real3) are offering silicon & systems.

The global 3D sensor market has been estimated to grow to > $3B in 2020 at an estimated CAGR of 23.4%. [Markets and Markets]


3D Depth Sensing TechnologiesTechnologyStereo Camera

PrincipleTwo cameras, displaced horizontally to obtain different views of the scene. Calculate depth from relative positions of objects in the two perspectives

TechnologyTriangulation

PrincipleProject laser dot or line to the scene from a laser source with known displacement to camera. Detect with camera and calculate depth based on the location in camera’s field of view


3D Depth Sensing TechnologiesTechnologyStructured Light (Fixed or Variable pattern)

PrincipleProject known pattern(s) of pixels on the scene. Captured with camera sensor. Based on deformation, calculate depth and surface information of objects in the scene

TechnologyTime of Flight (ToF) Imager

PrincipleMeasure time from light emittance to reflection delay, determine distance based on speed of light


3D Depth Sensing TechnologiesPrincipleEmit pulse of light, detect reflection, measure the delay between emitted and reflected light, determine distance based on speed of light

Target Scene

Detector

Emitter

Reference Signal

Emitted Light

Reflected Light

TechnologyTime of Flight (ToF) - LIDAR


3D Sensing Technology ComparisonTechnology Distance

RangeDepth Accuracy

Acquisition Speed

HardwareSize

Software Complexity

Low Light Performance

Outdoor Performance

Stereo Camera Mid range mm ~cm Medium Large High Weak Good

Structured Light(Fixed Pattern)

Short range (cm) to mid range (~5m)

mm ~ cm Fast Large Medium Good Weak

Structured Light(Variable Pattern)

Short range (cm) to mid range (~5m)

μm ~ cm Medium Large High Good Weak

Triangulation Short range (~1m) to long range (~40 m)

μm ~ cm Fast Large Low Good Good

Time of Flight Short range (~1m) to long range (~100 m)

mm ~ cm Fast Medium Low Good Good


Comparison of selected 3D Depth Sensing Solutions1 (Consumer Electronics & Near Field)

Advertised Specification

Microsoft Kinect V1

Microsoft Kinect V2

Intel RealSense F200 & SR300

Intel RealSense R200

Softkinetic PMD Tech

Technology Structured Light

ToF Camera Structured Light ToF Camera (x2)

ToF Camera ToF Camera

Sensor Manufacturer

PrimeSense Microsoft Intel Intel Texas Instruments

Infineon

Depth “Camera” Resolution (pixel x pixel)

320x240 512x424 640x480 640x480 320x240 352x288

Depth “Camera” frame rate (fps)

30 30 30 30 12 - 60 5 – 45

FOV [H x V] (degrees)

57 x 43 70 x 60 72 x 60 70 x 59 74 x 59 62 x 45

Depth Range (m) 0.4-4.0 0.5 - 4.5 0.2 - 1.2 Up to 4 Up to 4 0.1 - 4

1Based on published advertised specifications

Case Study


MicroVision’s Laser Beam Scanning Technology is a platform approach, applying one solution across multiple markets – at the heart of which is our proprietary MEMS scanner

Mobile Projection

Application Industry Drivers

Anytime, Anywhere Content Sharing

Industry Growth

32.4%

AR / VR Display

194%Personal Mobility

Heads-Up Display 27%Driver Safety & Infotainment

Personal Projection: CAGR 2014 – 2019, Source: TechNavio; AR / VR Display: CAGR 2014 – 2019, Source: TechNavio; Heads-Up Display: CAGR 2014 – 2024, ABI Research

One Solution, Multiple Markets

Platform Technology


How PicoP® Scanning Technology Works

Red laser

Green laserBlue laser2D MEMSMicro mirror

PicoP® scanning technology produces a large screen

viewing experience that is always in focus

A single MEMS scanning mirror

in an extremely tiny, low power package


MicroVision MEMS Evolution MicroVision MEMS development started in 1997 to enable the long term cost and size goals

Gen-1 Vacuum Scanner (~4 cc)

Gen-2 Vacuum Scanner (~2 cc)

Early Gen-3 Atmospheric Scanner (~2 cc)

Gen-3 Atmospheric Scanner (< 1 cc) Gen-3 G3T-P5 0.65

cc

Gen 3 MEMS Scanner: Simplified Magnetic Drive for Atmospheric Operation

Early Generation MEMS Scanners: Magnetic plus Capacitive drive


The same MicroVision technology can also be applied for 3D Imaging & Sensing Applications.

Mobile Projection

Application Industry Drivers

Anytime, Anywhere Content Sharing

Industry Growth

32.4%

AR / VR Display

194%Personal Mobility

Heads-Up Display 27%Driver Safety & Infotainment

Personal Projection: CAGR 2014 – 2019, Source: TechNavio; AR / VR Display: CAGR 2014 – 2019, Source: TechNavio; Heads-Up Display: CAGR 2014 – 2024, ABI Research; 3D Imaging & Sensing: CAGR 2014 – 2020, Source: Markets&Markets;

One solution, multiple markets

Platform Technology

3D Imaging & Sensing 23.4%Information Capture & Interaction


Red laser

Green laser

Blue laser

2D MEMSMicro mirror

IR laser

IR Photodiode

Measure time of flight from IR laser light emittance to photodiode reception. Calculate distance based on speed of light.

Combined RGB Projection Display & Depth Sensing

👈

👈

Applications:• Natural User Interfaces• 3D Scanning• Industrial & Medical• Metrology

MEMS Technology for Depth Sensing


2D MEMSMicro mirror

IR laser

IR Photodiode

👈

👈

IR laser

IR laser

Depth Sensing only

Applications:• Robotics• Navigation• Mapping

MEMS Technology for Depth Sensing


Unique capabilities of MicroVision MEMS Laser Scanning for Depth Sensing

FeaturePicoP® Scanning Technology Targets Benefit

Size Smallest size, thinnest (6mm) Enables new class of devicesPlatform Technology

Same platform for both Projection Display and Depth Sensing

Enables interactive displays from single integrated platform

Flexibility Programmable:• Variable resolution• Variable frame rate• Supports both Time of Flight and

Structured Light

Wide variety of resolution and frame rate combinations.Enables both slower high resolution and faster lower resolution captures from the same platform.

Time of Flight Integrated IR laser(s) and Photo Detector

Compact size, integrated device. No camera sensor needed.

Structured Light

Integrated IR laser(s) and separate IR camera

Focus free structured light with Programmable & Dynamic Patterns

Depth map resolution

~128 – 2,304 x ~180 - 720 Variable resolution as needed by application

Frame rate 10 ~ 60Hz Variable frame rate and latency as needed by the application

Pixel Persistence

~ 15ns Blur-free capture of moving objects


Conclusion & Call to Action• 3D sensing is a new, fast growing application area for tomorrow’s Internet of Things - presenting

new opportunities for the sensor industry and supply chain.

• 3D depth sensors can be implemented with a variety of technologies, but MEMS based sensors can provide unique capabilities to enable new product innovation and consequently drive further MEMS and sensor industry growth.

• Designing platform solutions that can be applied to a variety of applications can reduce development costs and shorten time to market for new applications.

• In addition to producing great MEMS and Sensor hardware, collaboration with 3rd party software developers (middleware, algorithms, OS platforms) is needed to enable full stack MEMS based, off-the-shelf, advanced sensor solutions that reduce time from product idea to working prototype -- and ultimately reduce time to market for innovative new products.

DON’T JUST THINK OUTSIDE THE BOX.SEE OUTSIDE THE BOX.

© 2016 MICROVISION, INC. ALL RIGHTS RESERVED.

PICOP IS A REGISTERED TRADEMARK OF MICROVISION, INC. ALL OTHER TRADEMARKS ARE THE PROPERTY OF THEIR RESPECTIVE OWNERS.

Thank Youwww.microvision.com

MEMS Laser Scanning, the platform for next generation of 3D Depth Sensors

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