Memory/SoC World ATE Markets - Computer Systems...
Transcript of Memory/SoC World ATE Markets - Computer Systems...
Memory/SoC World ATE Markets
- Products Trends and Test Solutions
J 29 2007June 29, 2007
Representati e Board Director President and CEORepresentative Board Director, President and CEO
Toshio Maruyama
All Rights Reserved - Advantest Corporation1 2007/6/29
Contents
1. ATE History & Future1. ATE History & Future
1. 3rd Generation ---- Test Cost
1. 4th Generation ---- Next Decade
hiOpen Architecture
Hi-speed serial
2007/6/29All Rights Reserved - Advantest Corporation2
History of ATE Architecture
1 x Rate Generator Multi RateGeneratorRate
Shared ResourceTiming Generator Formatter
Generator
ClockStrobe
Timing
Formatter per Pin
g Formatter and Timing Generator
per PinFormatterData
Format
3 bits 3 bits
Control Data
per System
Control Data
per Pin
ControlData
Test
Control Data
per Pin
1 bit per Pin
per Pin1 bit
per Pin
per PinTestData
Pattern
1971 1973 1982 1985 1991 1999 2000
T320/10 T320/20 T3340 Megaone J971 ITS9000 ???Tester model
2007/6/29All Rights Reserved - Advantest Corporation3
Number of Transistor 1(ref) 3 10 30 100 300 1000
ATE Player HistoryEntered into IC Tester
Advantest AdvantestTakeda Riken
Asia Electronicsmpa
nies
2000
All Tester TypesCurrent
FundedIn 1954
Changed company name in 1985Entered into IC TesterBusiness in 1968
Asia Electronicsrelated to Toshiba Yokogawa
Andorelated to NEC
Yokogawa
Shibasoku Shibasokunese
Com
Linear Testers
All Tester Types2004
1982
Shibasoku Shibasoku
Japa
n
Minato/Hitachi DecoMinatoclosedin 1997
Linear Testers
Kokuyo Closed
Long-established Tester Maker
VTTLow priceLogic Testers
Spin-offfrom Rohm
mpa
nies Fairchild Schlumberger NP Test
Credence Credence SoC TestersExpanded by M&A
GenRadSpin-off Linear Tester
Sold 2004
2003
Sold1990
1991
nese
Com SZ Testsysteme
Teradyne TeradyneTektronix
SoC TestersMegatest
1960 1995
2003TesterBusinessSold
STS1978
1975
on-J
apan
HP Agilent Verigy
LTX LTX Analog/Mixed Testers
SoC TestersFlash Memory
SoC Tester
Spin-off in 1976Megatest
Spin-offOct 2006
2007/6/29All Rights Reserved - Advantest Corporation4
No
Versatest TestersFlash MemoryTester
Spin-offfrom Intel Nextest Low price Flash
and SoC Testers1997
1970 1980 1990 2000 2010
ATE Business History1970 1980 1990 2000 2010
Main FrameWS PC
Hi speed ( 100MHz) i
1’st Generation 2’nd Generation
C
3’rd Generation
O A i
4’th Generation
Hi-speed (~100MHz)
OTA(Overall Timing Accuracy)
per Pin Test System
Flexible SoftwareT6691T3370/80
Test Cost Open Architecture
Hi-speed serial
T5588 T2000T6691 T5588 T2000
100MHz TESTER&
View Point 512 Parallel Test
6 5GH DM&OTA Paper
at ITC
in 1979
6.5GHz DM
2007/6/29All Rights Reserved - Advantest Corporation5
from Takeda Riken
Semiconductor/SPE/ATE MarketSemiconductor/SPE/ATE Market
140%
T. Semiconductor($B) Manufacturing Equipment GrowthT. Semi Growth ATE Growth (6MMA)
25
80%100%120%
th$B)
20
20%40%60%
Y/Y
Grow
t
Reve
nue
($ 15
10
-40%-20%0%
R 10
5
04 05 06-60%40%
Source: WSTS, SEMI, SEAJ
0
Key market driver for・・・
Front-End Equipment CAPEX activity of semiconductor manufacturing
2007/6/29All Rights Reserved - Advantest Corporation6
manufacturingEnd-user application (TV, PC, DVD, etc.)Test Equipment (ATE)
Contents
1. ATE History & Future1. ATE History & Future
1. 3rd Generation ---- Test Cost
1. 4th Generation ---- Next Decade
hiOpen Architecture
Hi-speed serial
2007/6/29All Rights Reserved - Advantest Corporation7
3rd Generation – Test Cost
• Growth-Driver : Consumer Electronics
2007/6/29All Rights Reserved - Advantest Corporation8
3rd Generation – Test Cost
Increasing chip complexity- Multicore architectureMulticore architecture- Convergence of CPU, GPU- Stacked die
Hi h- High power- High-speed digital- RF core proliferation Multicore Multicore
CPU/GPUConvergence
CPU/GPUConvergence
p- and more . . .
ChipChipC l itC l it
Multicore ArchitectureMulticore
Architecture StackedDie
StackedDie
ComplexityComplexity
High-speedDigital
High-speedDigital
What’sNext?What’sNext?
RF CoreProliferation
RF CoreProliferation
2007/6/29All Rights Reserved - Advantest Corporation9
3rd Generation – Test Cost
Test Cost ReductionTest Cost ReductionMemory Test System SoC Test System
1
T5501
2GHz/32
T5588
400MHz/512
Test Cost / DUT(Normalized Number)
1
Test Cost / DUT(Normalized Number)
T6683
0.8
T5591
1GHz/16 500MHz/128
T55852GHz/32
286MHz/384
T5383
0.8T6681
1GHz/1000pin
T6573
T2000SPT2000LS
0.6T5581
500MHz/128
286MHz/256
T5377 T5761
66MHz/5120.6
1GHz/1000pin
125MHz/512pin
T6573
250MHzDM/1000pin800MHzDM/1000pin
0 5
0.4T5335P
250MHz/64
0.4 T6671
0 3
0.4
0.5
60% Down 25% Down
0.230MHz/32
0.2200MHz/512pin
0.3
0.2
2007/6/29All Rights Reserved - Advantest Corporation10
2002 20071997 2002 20071997
Contents
1. ATE History & Future1. ATE History & Future
1. 3rd Generation ---- Test Cost
1. 4th Generation ---- Next Decade
hiOpen Architecture
Hi-speed serial
2007/6/29All Rights Reserved - Advantest Corporation11
Next DecadeOpen Architecture Test System
T2000T2000Full Module Base Test System T2000
TestModule
2007/6/29All Rights Reserved - Advantest Corporation12
Next Decade
The Semiconductor Test Consortium was founded in 2003 to develop a common test architecture that is2003 to develop a common test architecture that is completely open, documented and supported via solutions available from all ATE vendors.
Open to all companies throughout the semiconductor supply chain with a vested interest in the test sector thesupply chain with a vested interest in the test sector, the consortium is focused on providing value-added standards that deliver technical & economic benefits to th l b l i d t i d t
2007/6/29All Rights Reserved - Advantest Corporation13
the global semiconductor industry.
Next Decade
STC membersSTC members
2007/6/29All Rights Reserved - Advantest Corporation14
Next Decade
D ki &
Working Group Activities
EDAInterfaces
STIL Docking & Interfacing
Probecard
Test Program
Gen.
UserLevel
API
ToolingAbstraction
Data-logging Asynch.
Test
InstrumentAbstraction
Layer
Existing WG
AbstractionLayer
TestInterface
Existing WG
Forming Now
2007/6/29All Rights Reserved - Advantest Corporation15
Future Plans
Contents
1. ATE History & Future1. ATE History & Future
1. 3rd Generation ---- Test Cost
1. 4th Generation ---- Next Decade
hiOpen Architecture
Hi-speed serial
2007/6/29All Rights Reserved - Advantest Corporation16
Next Decade
High Speed Interface Market Trend
20GPCI E XDR
[bps]이미지를 표시할 수 없습니다 . 컴퓨터 메모리가 부족하여 이미지를 열 수없거나 이미지가 손상되었습니다 . 컴퓨터를 다시 시작한 후 파일을 다시 여십시오 . 여전히 빨간색 x가 나타나면 이미지를 삭제한 다음 다시 삽입해야 합니다 .
PCI Express
10G8G
PCI Express XDR
ed
PCI Express
8G
4G
6G FB-DIMM
BU
S Sp
ee
S i lATA
2G
3G4G
Hyper Transport
B SerialATA
Hyper Transport
2003 2004 2005 2006 2007 2008 2009 [year]
2007/6/29All Rights Reserved - Advantest Corporation17
Next Decade
HiHi--Speed serial solution Speed serial solution 6.5Gbps Test Module for T2000 Test Systemp y
Printed Circuit Board Technology
ATE Board Performance Board (PB)
Component
Number of Layer
Max Capability T2000 6.5Gbps T2000 Custom PBMax Capability
22 000
28
8 000
22
3 000
44
3 000
44
Hole Diameter (mm)
Size (mm)
Component
0.2
480 x 420
22,000
0.25
480 x 366
8,000
0.2
580 x 480
3,000
0.2
580 x 480
3,000
Line/Space (um)
Hole Count
70 / 70
68,000
100 / 154
47,200
70 / 70
30,000
70 / 70
30,000
Hi-Speed Device Technology
SiGe (BiCMOS) x 8 ft ~120GHzMCM x 8 4Million Gate CMOS[110nm] + DDR2 DRAM x 8
2007/6/29All Rights Reserved - Advantest Corporation18
MCM x 8 4Million Gate CMOS[110nm] + DDR2 DRAM x 816 Interleave
Next Decade
HiHi--Speed serial solution Speed serial solution 6.5Gbps Test Module for T2000 Test System
Optical Inter-connect Technology
1Gbps Optical Tester Bus
Cross Section of Cables Optical Cable Optical Module
p y
p p
MEMS (Micro Electoro-Mechanical System) Relay Technology
[mm]MEMS Relay
5mm x 4mm
Cooling Technology (Fluorinert)[×0.1in]
fmax =12.5GHz or over
650W/printed circuit board
Connection Technology 0.65mm pitch
2007/6/29All Rights Reserved - Advantest Corporation19
LIF (Low Insertion Force)
p144pin/connector
Next Decade
6 5Gbps Module for T2000 Test System
MEMS (Micro Electoro-Mechanical System) Relay Technology
6.5Gbps Module for T2000 Test System
160pS
6.5GHz
MEMS Technology
n Lo
ss [d
B] Isolation, R
e
[mm]5mm x 4mm
fmax =12.5GHz or over
Inse
rtion
eturn Loss [dB
2007/6/29All Rights Reserved - Advantest Corporation20
[×0.1in]
B]
Frequency [GHz]