MECetchBOND CZ - Centurion Speciality … CZ-8100 ×5,000 Black Oxide ×10,000 H2SO4-H2O2 ×5,000...
Transcript of MECetchBOND CZ - Centurion Speciality … CZ-8100 ×5,000 Black Oxide ×10,000 H2SO4-H2O2 ×5,000...
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MECetchBOND 1
MEC COMPANY LTD.
MECetchBOND CZMECetchBOND CZ
Copper Surface Treatment System for Advanced PWBs
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MECetchBOND 2
MEC COMPANY LTD.
The Trends of Increased Functionality and Reduced Size of Portable Wireless Products and Routing Densities for PWB
Printed Wiring BoardPrinted Wiring Board
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MECetchBOND 3
MEC COMPANY LTD.
Customers Using MECetchBONDCustomers Using MECetchBOND
Japan
Asia
Europe
USA
95 Users (142 Lines)
45 Users(73 Lines)
41 Users(51 Lines)
8 Users(10 Lines)In 2004
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MECetchBOND 4
MEC COMPANY LTD.
Application of MECetchBONDApplication of MECetchBOND
BGADIE-PAD
SI
Cu/Via-fill Resin Cu/Prepreg or RCC
Cu/Build-up Resin
Cu/Solder Mask
BGA Solder Mask/Cu
Die-pad/Encapsulating Resin
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MECetchBOND 5
MEC COMPANY LTD.
• Excellent adhesion to resins• Fully conveyorized process• Easy to control• Proven process• Reasonable cost• Environmental friendly
Benefits of MECetchBONDBenefits of MECetchBOND
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MECetchBOND 6
MEC COMPANY LTD.
Copper Surface TopographyCopper Surface Topography
Buff Scrubbing ×5,000
Jet Scrubbing ×5,000
MECetchBOND CZ-8100 ×5,000
Black Oxide ×10,000
H2SO4-H2O2 ×5,000This chemistry is essentially a micro-etching process that roughens
the copper surface, resulting in a unique topography.
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MECetchBOND 7
MEC COMPANY LTD.
MECetchBOND Process FlowMECetchBOND Process Flow
Rinse
Rinse
Acid Rinse
Dry
Can create steeper peaks and valleys
Anchor Effect
MECetchBOND CZ-8100Standard 35℃(25~40℃)
Spray pressure 0.15~0.2MPa
Etching amount 0.5~3μm
20~30℃, 10sec Spray pressure 0.03~0.06MPa
Rinse
MAC-5330 / 3~5%HCl Pre-treatment for MECetchBOND
20~30℃, 10~30sec Spray pressure 0.1~0.2MPa
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MECetchBOND 8
MEC COMPANY LTD.
Advantages of MECetchBONDAdvantages of MECetchBOND
MECetchBOND CZ-8100
-Can Enhance Mechanical Bonding (Anchor Effect)
-Can Give Higher Adhesion
-Simple Control
-Fully conveyorized process
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MECetchBOND 9
MEC COMPANY LTD.
Physical Properties & ControlPhysical Properties & Control
【Usage】
Make-up: Use CZ-8100M as it is. Replenish: Use CZ-8100R as it is.
【Control】1. Replenish the dragged-out amount. 2. Cu Concentration (15-30 g/L) 3. Concentration/Dilution (-10- +10%)
Appearance
Specific Gravity (20℃)
pH
Blue transparent
1.13±0.011.11±0.01
3.4±0.53.1±0.5
Replenisher CZ-8100R
Colorless – Slight yellow transparent
Make-up Soln. CZ-8100M
MECetchBOND CZ-8100
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MECetchBOND 10
MEC COMPANY LTD.
CZCZ--8100 Treated Topography8100 Treated Topography
CCL
Plated Copper
0.5µm etching 1 µm etching 2 µm etchingSEM ×5,000
Can decide some roughening variation for some application
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MECetchBOND 11
MEC COMPANY LTD.
Operation Temp. vs. Etching RateOperation Temp. vs. Etching Rate
0
0 .5
1
1 .5
2
2 .5
3
3 .5
4
20 25 30 35 40 45
Operat ion Temp.(℃)
Etc
hin
g R
ate
(μ
m/
min
)
MEC Test Machine Data
Standard Operation Conditions at 35℃
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MECetchBOND 12
MEC COMPANY LTD.
0
0.5
1
1 .5
2
2 .5
3
3 .5
4
10 15 20 25 30 35
Copper Cocentrat ion(g/L)
Etc
hin
g R
ate
(μ
m/m
in)
MEC Test Machine Data
Control Range 15 – 30g/L
Copper Conc. vs. Etching RateCopper Conc. vs. Etching Rate
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MECetchBOND 13
MEC COMPANY LTD.
Etching MechanismEtching Mechanism
Cu + Cu(Ⅱ)An 2Cu(Ⅰ)An/2
2Cu(Ⅰ) An/2 + n/4O2 + nAH
2Cu(Ⅱ) An + n/2H2O
Air
A : Weak Complexer n : Coordination number
Copper reacts with a Cu(Ⅱ) complex in the solution to form a Cu(Ⅰ) complex. The formed Cu(Ⅰ) complex in the solution reacts with oxygen to generate a Cu(Ⅱ) complex. Such reactions accelerate dissolving of copper.
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MECetchBOND 14
MEC COMPANY LTD.
Topography Forming MechanismTopography Forming Mechanism
How can such a unique topography be obtained ?
Copper grains
MECetchBOND CZ attacks boundaries faster than crystals.
Well roughened topography is left.
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MECetchBOND 15
MEC COMPANY LTD.
Etching Amount for ApplicationsEtching Amount for Applications
For pretreatment of Solder Mask PrintingEtching amount:0.5~2.0μm
For pretreatment of Micro-via Formation
Etching amount:1.5~3.0μm
For pretreatment of Dry Film LaminationEtching amount:0.5~1.0μm
For pretreatment of Prepreg Lamination
Etching amount:1.5~3.0μm
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MECetchBOND 16
MEC COMPANY LTD.
Adhesion (Solder Mask)Adhesion (Solder Mask)
MECetchBOND CZ-8100 (1.5 μm)
Conventional Microetchant (2μm ) Buff Scrubbing
No Peel off of Solder Mask with MECetchBOND Process
Solder Mask Printing → Cross-cut → 3.5%HCl dipping(R.T., 10min) → Rinse&Dry → Tape on the cross-cuts → Peel
SEM×3,500
Tape Side
- Tape Peel Test-
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MECetchBOND 17
MEC COMPANY LTD.
Adhesion (Dry Film)Adhesion (Dry Film)
MECetchBOND CZ-8100 (1 μm)
Conventional Microetchant (2μm ) Buff Scrubbing
No Peel off of Dry Film with MECetchBOND Process
Dry Film Lamination → Cross-cut → 3.5%HCl dipping(R.T., 1min) → Rinse&Dry → Tape on the cross-cuts → Peel
SEM×3,500
Tape Side
- Tape Peel Test-
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MECetchBOND 18
MEC COMPANY LTD.
Adhesion (Dry Film)Adhesion (Dry Film)
Dense Patterns Column Pattern Diameter / Space=20μm/20μm
Sparse Patterns Column Pattern Diameter/ Space =20μm/60μm
0102030405060708090
100
200mj 140mj 80mj
Light Intensity
Perc
ent Colu
mn R
em
ainin
g
(%)
H2SO4-H2O2
Buffing CZ-8100
0102030405060708090
100
200mj 140mj 80mj
Light Intensity
Pe
rce
nt
Co
lum
n R
em
ain
in(
%)
H2SO4-H2O2BuffingCZ-8100
Column patterns with 10μm-30μm diameter are formed latticedly. Evaluation Conditions : sparse space / dense space
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MECetchBOND 19
MEC COMPANY LTD.
Resolution (Dry Film)Resolution (Dry Film)
Procedures- Measure the targeted width and the actual width.- A condition of light intensity is ;
80mj/cm2,140mj/cm2 and 200mj/cm2.
27
28
29
30
31
32
33
34
35
200mj 140mj 80mj
Light Intensity
Pat
tern
Wid
th (
Tar
get
30
μm
)
H2SO4 - H2O2
Buffing
CZ-8100
Line/Space=30/30μm
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MECetchBOND 20
MEC COMPANY LTD.
Summary of MECetchBONDSummary of MECetchBOND
• Adhesion between copper surface and resin has become more and more important.
• MECetchBOND CZ can enhance mechanical bonding.
• MECetchBOND system can give excellent adhesion and high reliability.
• MECetchBOND system is what you need for various applications!