MCE 230_ F10_lec_4

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    MCE 230Materials Science

    Fall 2010

    Lecture - 4

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    Atomic Structure

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    Bonding Forces

    Two types of bonding forces:

    1. Attractive (FA ): particular type of bonding between twoatoms

    2. Repulsive (FR ): forces come from the interaction between

    electrons in the outer shells

    Both are function of the Interatomic distance (separation)

    The net for FN = FA + FR

    When FA = FR then FN = 0 (equilibrium state at r0

    (equilibrium spacing) )

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    Potential Energies

    One can use potential energies instead

    Bonding energy (E0 ) : the potential energy required to separatethe two atoms to an infinite separation ( potential energy at

    equilibrium (at r0)

    Many material properties depend on; the magnitude of (E0 ), the

    shape of energy shape and the type of bonding (melting point,

    modulus of elasticity, thermal expansion, etc..)

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    Types of Bonding

    Primary bonding: electrons are transferred or shared Secondary bonding: interaction of atomic dipoles ( no

    electrons are transferred or shared)

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    Primary Interatomic Bond

    Three different types of primary bond are found in solid:

    1. Ionic

    2. Covalent

    3. Metallic

    The nature of each bond depends on the electron

    structure of its atoms

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    Ionic Bond Between metallic and nonmetallic elements

    Electron transfer

    Between +ve andve ions

    Characteristics: hard, brittle, electrically and thermally

    insulative , and high melting point.

    Na (metal)

    unstable

    Cl (nonmetal)

    unstable

    electron

    + -Coulombic

    Attraction

    Na (cation)

    stable

    Cl (anion)

    stable

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    Covalent Bond Adjacent atoms share electrons ( to reach stable state) en

    Examples: H2, F2, CH4, H2O, diamond (carbon), silicon. Possible number of covalent bonds = Capacity of outer

    shellnumber of valence electrons

    Characteristics: may be very strong and has a highmelting temperature (diamond), and may be weak and

    has low melting temperature.

    It is possible to have Interatomic bonds that are partially

    ionic and partially covalent

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    CH4

    Carbon

    has 4 valence electrons

    and needs 4 more to be

    stable

    Hydrogen

    Has 1 valence electrons

    and needs 1 more to be

    stable

    Covalent Bond

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    Metallic Bond The valence electrons of

    each atoms form an electroncloud which is belonging to

    the entire metal (all atoms )

    (ve in charge)

    The remaining nonvalence

    electrons and nuclei are

    called ion cores ( +ve in

    charge )

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    It is the primary bond in metals and their alloys Characteristics: bonding may be weak or strong,

    good heat and electricity conductors

    Metallic Bond

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    Very weak compare to the primary bonds

    Usually they exists between all atoms, but when one

    of the primary bonding exists the effect of secondary

    bond is negligible.

    It is due to interactions between dipoles ( a dipole

    exists whenever there is some separation of positive

    and negative portions within an atom or a molecule)

    Secondary Bonds

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    1. Fluctuating induced dipole bonds

    Instantaneous and short-live distortions of the electrical

    symmetry of atoms or molecules due to vibrational motion

    So small dipoles are formed

    Secondary Bonds

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    2. Polar molecule induced dipole bonds

    Polar molecule has permanent dipole because of anasymmetrical arrangement of positive and negative regions

    within this molecule.

    Polar molecule may induce dipoles in an adjacent nonpolarmolecule to form a polar molecule induced dipole

    This bond is stronger than the fluctuating one

    Secondary Bonds

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    Bonding: Summary

    Ionic: bond energy is largeCovalent: bond energy varies

    Metallic: bond energy varies

    Secondary: bond energy is the smallest

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    Bonding: Summary

    Ceramics: Covalent & Ionic Bonding

    Examples: Silicon Carbide (SiC) Large melting temperature (> 3000 C)

    Large stiffness (E = 400 GPa)

    Small thermal expansion coefficient: 4.4x10-6 C-1

    Metal: Metallic Bonding Example: carbon steel

    Moderate melting temperature (1300 C)

    Moderate Stiffness (E = 207 GPa)

    Moderate Thermal expansion coefficient 11.5x10-6

    C-1

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    Bonding: Summary

    Polymers: Secondary Bonding Example: Polyethylene (HD)

    Low melting temperature (137 C)

    Low stiffness (E = 1.08 GPa)

    High thermal expansion coefficient (150x10-6 C-1)

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    Crystalline Structure

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    Structure of Solids

    The structure of the material is the way its atomsare arranged.

    Types of solid structure:Crystalline: where atoms are arranged in a repeated or

    periodic way ( metals, some polymer and manyceramics)

    Noncrystalline: (amorphous): ( some polymers and

    some ceramics)

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    Unit cell

    Unit Cell: the smallest arrangement of atoms thatis repeated (basic structural unit or buildingblock)

    The unit cell defines the structure through:

    GeometryAtoms positioning within the unit cell

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    Unit cell Atoms Positioning

    Number of whole atoms belonging to the unit cell

    Coordination number: number of touching neighboratoms

    Atomic Packing Factor (APF): how much the unit cellvolume is filled with atoms

    Relation between the atomic radius and the unit celldimension

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    Metallic Structures FCC: Face Centered Cubic

    Aluminum, Copper, Gold, Nickel

    BCC: Body Centered Cubic Iron, Chromium, Tungsten

    HCP: Hexagonal Closed Packed

    Titanium, Zinc, Cobalt