MCE 230_ F10_lec_4
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Transcript of MCE 230_ F10_lec_4
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MCE 230Materials Science
Fall 2010
Lecture - 4
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Atomic Structure
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Bonding Forces
Two types of bonding forces:
1. Attractive (FA ): particular type of bonding between twoatoms
2. Repulsive (FR ): forces come from the interaction between
electrons in the outer shells
Both are function of the Interatomic distance (separation)
The net for FN = FA + FR
When FA = FR then FN = 0 (equilibrium state at r0
(equilibrium spacing) )
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Potential Energies
One can use potential energies instead
Bonding energy (E0 ) : the potential energy required to separatethe two atoms to an infinite separation ( potential energy at
equilibrium (at r0)
Many material properties depend on; the magnitude of (E0 ), the
shape of energy shape and the type of bonding (melting point,
modulus of elasticity, thermal expansion, etc..)
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Types of Bonding
Primary bonding: electrons are transferred or shared Secondary bonding: interaction of atomic dipoles ( no
electrons are transferred or shared)
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Primary Interatomic Bond
Three different types of primary bond are found in solid:
1. Ionic
2. Covalent
3. Metallic
The nature of each bond depends on the electron
structure of its atoms
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Ionic Bond Between metallic and nonmetallic elements
Electron transfer
Between +ve andve ions
Characteristics: hard, brittle, electrically and thermally
insulative , and high melting point.
Na (metal)
unstable
Cl (nonmetal)
unstable
electron
+ -Coulombic
Attraction
Na (cation)
stable
Cl (anion)
stable
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Covalent Bond Adjacent atoms share electrons ( to reach stable state) en
Examples: H2, F2, CH4, H2O, diamond (carbon), silicon. Possible number of covalent bonds = Capacity of outer
shellnumber of valence electrons
Characteristics: may be very strong and has a highmelting temperature (diamond), and may be weak and
has low melting temperature.
It is possible to have Interatomic bonds that are partially
ionic and partially covalent
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CH4
Carbon
has 4 valence electrons
and needs 4 more to be
stable
Hydrogen
Has 1 valence electrons
and needs 1 more to be
stable
Covalent Bond
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Metallic Bond The valence electrons of
each atoms form an electroncloud which is belonging to
the entire metal (all atoms )
(ve in charge)
The remaining nonvalence
electrons and nuclei are
called ion cores ( +ve in
charge )
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It is the primary bond in metals and their alloys Characteristics: bonding may be weak or strong,
good heat and electricity conductors
Metallic Bond
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Very weak compare to the primary bonds
Usually they exists between all atoms, but when one
of the primary bonding exists the effect of secondary
bond is negligible.
It is due to interactions between dipoles ( a dipole
exists whenever there is some separation of positive
and negative portions within an atom or a molecule)
Secondary Bonds
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1. Fluctuating induced dipole bonds
Instantaneous and short-live distortions of the electrical
symmetry of atoms or molecules due to vibrational motion
So small dipoles are formed
Secondary Bonds
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2. Polar molecule induced dipole bonds
Polar molecule has permanent dipole because of anasymmetrical arrangement of positive and negative regions
within this molecule.
Polar molecule may induce dipoles in an adjacent nonpolarmolecule to form a polar molecule induced dipole
This bond is stronger than the fluctuating one
Secondary Bonds
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Bonding: Summary
Ionic: bond energy is largeCovalent: bond energy varies
Metallic: bond energy varies
Secondary: bond energy is the smallest
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Bonding: Summary
Ceramics: Covalent & Ionic Bonding
Examples: Silicon Carbide (SiC) Large melting temperature (> 3000 C)
Large stiffness (E = 400 GPa)
Small thermal expansion coefficient: 4.4x10-6 C-1
Metal: Metallic Bonding Example: carbon steel
Moderate melting temperature (1300 C)
Moderate Stiffness (E = 207 GPa)
Moderate Thermal expansion coefficient 11.5x10-6
C-1
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Bonding: Summary
Polymers: Secondary Bonding Example: Polyethylene (HD)
Low melting temperature (137 C)
Low stiffness (E = 1.08 GPa)
High thermal expansion coefficient (150x10-6 C-1)
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Crystalline Structure
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Structure of Solids
The structure of the material is the way its atomsare arranged.
Types of solid structure:Crystalline: where atoms are arranged in a repeated or
periodic way ( metals, some polymer and manyceramics)
Noncrystalline: (amorphous): ( some polymers and
some ceramics)
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Unit cell
Unit Cell: the smallest arrangement of atoms thatis repeated (basic structural unit or buildingblock)
The unit cell defines the structure through:
GeometryAtoms positioning within the unit cell
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Unit cell Atoms Positioning
Number of whole atoms belonging to the unit cell
Coordination number: number of touching neighboratoms
Atomic Packing Factor (APF): how much the unit cellvolume is filled with atoms
Relation between the atomic radius and the unit celldimension
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Metallic Structures FCC: Face Centered Cubic
Aluminum, Copper, Gold, Nickel
BCC: Body Centered Cubic Iron, Chromium, Tungsten
HCP: Hexagonal Closed Packed
Titanium, Zinc, Cobalt