MC2716&MC2718 Technical Specifications and Hardware Design basit kan

22
MC2716/MC2718 Technical Spec and Hardware Design MC2716 MC2718 Technical Specifications and Hardware Design ZTE Corporation

Transcript of MC2716&MC2718 Technical Specifications and Hardware Design basit kan

Page 1: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

MC2716 MC2718

Technical Specifications

and

Hardware Design

ZTE Corporation

Page 2: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

II

Update History:

Version Status Date Written by Reason for revision Remarks

Trial version 2010-03-05 Initial version

Copyright Notice: Copyright©2006 ZTE Corporation Shenzhen P. R. China All rights reserved. No part of this documentation may be excerpted, reproduced, translated, annotated or duplicated, in any form or by any means without the prior written permission of ZTE Corporation.

Page 3: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

II

Contents 1 Product description.................................................................................................................................. 1

1.1 Applications ................................................................................................................................ 1 1.2 MC2716/MC2718 System Block Diagram ................................................................................. 2

2 Abbreviations .......................................................................................................................................... 5 3 Appearance and Mechanical Design ....................................................................................................... 6

3.1 Appearance.................................................................................................................................. 6 3.2 Mechanical Explosion Diagram .................................................................................................. 7

4 Pin descriptions ....................................................................................................................................... 8 5 Electrical Characteristics ......................................................................................................................... 9

5.1 Limit Work Conditions................................................................................................................ 9 5.2 Recommended Work Conditions................................................................................................. 9

6 Functions and properties........................................................................................................................ 11 6.1 Data Function ............................................................................................................................ 11 6.2 Other Function........................................................................................................................... 11

7 Technical Specification ......................................................................................................................... 12 7.1 RF Communication Protocol and Data Rate ............................................................................. 12 7.2 RF Specification........................................................................................................................ 12 7.3 Antenna Performance Requirements......................................................................................... 16

7.3.1 Electrical Specification .................................................................................... 16 8 References ............................................................................................................................................. 18 9 Clarifications ......................................................................................................................................... 19

Page 4: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 1

1 PRODUCT DESCRIPTION

1.1 Applications Developed by ZTE Corporation, MC2716 built-in card could be built in the laptops through PCI

Express Mini Card interface, which enables the users to get access to Internet in wireless way, and allows

the users to send/receive E-mail, browse the web pages, download at high speed and play online movies,

etc.

MC2716 supports CDMA2000 1X/EV-DO Rev. A and CDMA2000 1X network at the same time. The

software supports data, voice call and SMS function, and it supports 800M and 1900MHz. Based on

MC2716, MC2718 adds GPS function. Where there is the mobile network CDMA2000 1x EV-DO Rev. A

or CDMA2000 1X, the card allows the users to get access to Internet any time anywhere, and also it

provides SMS, voice call, etc. In mobile data telecom field, it provides users with highly free, convenient

solutions and helps to realize the dream of mobile office.

A) Mobile Technical System

Technical system Technical standard Whether or not support

CDMA IS-95 √

CDMA cdma2000 1X √

cdma2000 1x EV-DO REV.A √

RDAS

WCDMA 3GPP-R99

TD-SCDMA

GSM

GPRS

PHS STD-28

B) Work Frequency Band

Work Frequency(MHZ) Remarks Whether or not support

UL453.00~457.475,DL463.00~467.475 CDMA 450MHz Band A

UL452.00~456.475,DL462.00~466.475 CDMA 450MHz Band B

UL450.00~454.800,DL460.00~464.800 CDMA 450MHz Band C

UL451.310~455.730,DL461.310~465.730 CDMA 450MHz Band H

UL1850~1910,DL1930~1990 CDMA √

UL824~849,DL869~894 CDMA √

UL1926~1980,DL2110~2170 WCDMA

UL880~890,DL925~935 EGSM

UL890~915,DL935~960 GSM/GPRS

Page 5: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 2

UL1710~1785,DL1805~1880 GSM/GPRS

UL&DL1900~1915 PHS

C) List of Functions

Classification Functions Description Version

Voice call

SMS

Data Access to Internet √

UIM Built-in UIM/ R-UIM √

GPS GPS √ (only MC2718)

Other

1.2 MC2716/MC2718 System Block Diagram Figure 1-1 shows MC2716 system block diagram. The main function components are marked in the

diagram.

☆ RF

● Duplexer

● SAW filter

● RF power amplifier

● Main/auxiliary antenna

Remarks: The RF socket duplexer is for MC2716 GPS Rx. antenna and CDMA2000 Rx. antenna

☆ Baseband

● High performance CDMA control chip(integrates baseband control, RF modulation/demodulation,

power management cell)

● Large MCP memory, including FLASH and DDR SDRAM

● Voltage control crystal oscillator

Page 6: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 3

Fig. 1-1 MC2716 System Block Diagram

FLASH+SDRAM

Power Management

SAW+LNA

SAW+PA

USB

3.3V

Status indication driver

Off-chipRF

Control Signal

UIM

Interface

(PC

I-EX

PR

ES

S-M

INI C

AR

D

Digital Baseband Control

RF RFT

RFR

Duplexer

VCTCXO

32.768K

Main Aux

Page 7: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 4

Fig. 1-2 MC2718 System Block Diagram

FLASH+SDRAM

Power Management

SAW+LNA

SAW+PA

USB

3.3V

Status indication driver

Off-chipRF

Control Signal

UIM

Interface

(PC

I-EX

PR

ES

S-M

INI C

AR

D

Digital Baseband Control

RF RFR

GPS

RFR

Duplexer

VCTCXO

32.768K

Main

Triplexer

ALM

Aux

Page 8: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 5

2 ABBREVIATIONS

Abbr. Full Name

ZTE ZTE Corporation

CDMA Code Division Multiple Access

UIM User Identity Module

MDDI Mobile display digital interface

SDRAM Synchronous dynamic random access memory

USB Universal Serial Bus

ESD Electronic Static Discharge

EMC Electro Magnetic Compatibility

EMI Electro Magnetic Interference

Page 9: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 6

3 APPEARANCE AND MECHANICAL DESIGN

3.1 Appearance

Items MC2716/MC2718 Remarks

Appearance

Dimensions 51mm×30mm×4.55mm

Weight About 11g

PID FFED MC2718 (TBD)

VID 19D2

Display 42pin provides the interface for LED display driver

Interface PCI Express Mini Card interface

52pin

Operating systems Windows XP/2000/2003, Windows Vista, Linux

Page 10: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 7

3.2 Mechanical Explosion Diagram

Note: MC2716’s mechanical design conforms to PCI Express Mini Card standard protocol. For details on parameters, please visit the website www.pcisig.com.

Page 11: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 8

4 PIN DESCRIPTIONS

PIN Name Signal direction Description 2, 24, 39, 41, 52 V_MAIN_3V3_IN MC2716 power(3.3V) MC2716 input power 4 9 15 18 21 26 27 29 34

35 37 40 43 50 GND Ground (GND) Ground

8 VREG-UIM UIM card power, output 10 UIM-DATA UIM card read/write data

cable 12 UIM-CLK U UIM card clock, output 14 UIM-RST UIM card reset, output

Card reader circuit is not designed inside the module. Please use built-in UIM or design card reader circuit outside the module.

20 W-DISABLE-N Input signal, switch-RF, low effective (OFF)

Active low input from the platform to the card to disable all the radios on the MPCI card from transmitting.

22 PON_RERET_N Input signal, low level effective

36 USB_D_M USB differential signal - 38 USB_D_P USB differential signal +

USB signal

42 LED_WWAN_N Low level effective 44 LED_WLAN_N Low level effective

(Reserved) 46 LED_WPAN_N Low level effective

(Reserved)

Work status display signal

1 3 5 6 7 11 13 16 17 19 23 25 28 30 31 32 33 44

45 46 47 48 49 51

N/C Reserved, not connected to signal

Remarks: 1. LED_WLAN_N and LED_WPAN_N are not used for MC2716. For details, please refer to section

5.2. 2. As per requirements of EVDO, MC2716 removes WAKE_N signal(reserve based on customer’s

requirements) 3. If PON_RESET_N signal is not used, users could hang up the PIN or set as POWER HIGH; 4. If W-DISABLE-N signal is not used, users could hang up the PIN or set as POWER HIGH;

Page 12: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 9

5 ELECTRICAL CHARACTERISTICS

5.1 Limit Work Conditions PIN Definition Range V_MAIN_3V3_IN(Vdd) Input power -0.5 TO 4.4V Imax Max. input current 2A(TBD) Vin Any input/output port -0.5 TO (Vdd+0.5)V Tw Work temperature -20℃~+65℃ Ts Storage temperature -40℃ ~+80℃ Humidity Humidity <95%

Contact Discharge TBD ESD Immunity Air Discharge TBD

5.2 Recommended Work Conditions A) Work voltage, work temperature

PIN Definition Min. Typical Max. V_MAIN_3V3_IN Input power 3V 3.3 V

(recommended) 3.6V

Tw Work temperature -20ºC 65ºC

B) External input control signal(recommended)operation conditions

VL VH Signals

Min Max Min Max

Remarks

W_DISABLE_N -0.3V 0.9V 2.2V 3.3V Input signal

PON_RESET_N -0.3V 0.9V 2.2V 3.3V Input signal

Remarks: VL low-level logic VH high-level logic

C) Module’s Work Current

No. Work status

Ave. current (+3.3v) Remarks

1 Standby current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -55dBm)

About 49-52mA

If the laptop enters dormant status (the module enters suspend mode), the module’s standby current shall be about 7-9mA

2 Standby current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -104dBm)

About 49-52mA

If the laptop enters dormant status (the module enters suspend mode), the module’s standby current shall be about 7-9mA

3 Talk current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -55dBm) About 224 mA

4 Talk current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -75dBm) About 235 mA

Talk current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -85dBm) About 265 mA

5 Talk current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -95dBm) About 431 mA

6 Talk current(wireless configuration: F3R3; traffic signal channel: 384; Rx power: -104dBm) About 550 mA

7 Network Search current (none) About 57 mA

Page 13: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 10

D) Time Order for Module’s Power-on and Reset

MC2716 module adopts automatic power-on method (the module will be automatically powered on once the system provides power to V_MAIN_3V3_IN).

MC2716 module provides one RESET PIN PON_RESET_N and realizes the module’s hard reset through external reset circuit. Pull down Reset key (PON_RESET_N) 100ms to reset the module.

Remarks: 50ms<t<200ms. The wiring on the module’s interface board should not be too long (do not exceed 2-3CM, buried wires preferred) because the PIN is very sensitive to the interference. Otherwise, the module might be reset due to interference.

If PON_RESET_N signal is not used, users could hang up the PIN or set as POWER HIGH;

E) Module Status Display Signal

PIN Name Signal

Description

Effective level Max. drive current External power

VDD

46 LED_WPAN_N LED status driver Low level effective 150mA 3.3Vmax

44 LED_WLAN_N LED status driver Low level effective 150mA 3.3Vmax

42 LED_WWAN_N LED status drive Low level effective 40mA 3.3Vmax

Remarks: three status LED signals indicate three different networks status

LED_WLAN_N is defined as: 802.11b/g/a (2.4 GHz and 5.2 GHz bands) LED_WWAN_N is defined as: Cellular data (e.g., GSM/GPRS, UMTS, and CDMA-2000) LED_WPAN_N is defined as: Bluetooth

MC2716’s work status indication signal only uses MINI-PCI-E card’s 42PIN(LED_WWAN_N),which is used to indicate the card’s work status under CDMA2000; and it doesn’t use the other two signals. LED_WWAN_N (PIN42)status is indicated as below:

Work Status Doesn’t work Normally works Data service

LED_WWAN_N OFF ON Blink

MC2716 CDMA wireless module provides only one PIN LED_WWAN_N, which is used to indicate the module’s work status.

The PIN interface could be configured as programmable current source to drive the external LED indicator. The LED brightness could be adjusted through adjusting the value of resistance.

F) MC2718 GPS antenna socket

MC2718’s GPS antenna and the RF socket are duplexed, therefore it requires the users to consider

increasing the frequency band 1575.42MHz required by GPS when designing the sub antenna.

Page 14: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 11

6 FUNCTIONS AND PROPERTIES

6.1 Data Function

Items Descriptions Remarks

Data rate CDMA 1X EV-DO Rev.A: up to

3.1Mkbs

Network Records

Data rate display

Flow display

Flow statistic

6.2 Other Function

Items Descriptions Remarks

UIM card Built-in UIM or design card reader

circuit outside the module

AT commands Support AT commands

GPS GPS and RF Sub duplexer

Page 15: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 12

7 TECHNICAL SPECIFICATION

7.1 RF Communication Protocol and Data Rate

1) Communication Protocol and Technical Specification

Item MC2716

RF communication protocol CDMA20001X/EVDO

2) OAT Data Rate

Network format Reverse link data transmission rate

Forward link data transmission rate

CDMA2000 1xEV-DO Rev. A 1.8Mbps 3.1Mbps CDMA2000 1xEV-DO Rel.0 153.6Kbps 2.4Mbps CDMA2000 1X 153.6Kbps 153.6Kbps

7.2 RF Specification RF Rx Specification: 1. CDMA2000 1X EV-DO REV.A RF Rx Specification

Frequency range 869~894MHz/1930~1990MHz

Rx. Sensitivity -105.5 dBm(FER≤0.5%)

Rx. Signal Range -25 dBm~ -105.5dBm(FER≤0.5%)

Immunity FER≤1.0%(-102.4dBm/BW, -30dBm@±900KHz) (800 MHz) FER≤1.0%(-102.4dBm/BW, -30dBm@±1250KHz) (1900 MHz)

Inter-modulation spurious emissions

FER≤1.0%(Test1: -102.4dBm/BW ,+900/+1700KHz, -43dBm) FER≤1.0%(Test1: -102.4dBm/BW ,+1250/+2050KHz, -43dBm)

FER≤1.0%(Test 2: -102.4dBm/BW ,-900/-1700KHz, -43dBm) FER≤1.0%(Test 2: -102.4dBm/BW ,-1250/-2050KHz, -43dBm)

Conductive spurious emissions

<-76dBm/1MHz

<-61dBm/1MHz

<-47dBm/30KHz(other frequency)

2. CDMA2000 1X RF Rx Specification

Frequency range 869~894MHz/1930~1990MHZ

Rx. Sensitivity -104 dBm(FER≤0.5%)

Rx. Signal Range -25 dBm~ -104dBm(FER≤0.5%)

Page 16: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 13

Immunity FER≤1.0%(-101dBm/BW , 30dBm@±900KHz) (800MHz) FER≤1.0%(-101dBm/BW ,-40dBm@±1250KHz) (1900MHz)

FER≤1.0%(Test1: -101dBm/BW ,+900/+1700KHz, -43dBm) FER≤1.0%(Test1: -101dBm/BW ,+1250/+2050KHz, -43dBm)

Inter-modulation spurious emissions

FER≤1.0%(Test 2: -101dBm/BW ,-900/-1700KHz, -43dBm) FER≤1.0%(Test 2: -101dBm/BW,-1250/-2050KHz, -43dBm)

<-76dBm/1MHz(1930~1990MHz ; 869~894MHz)

< - 61dBm/1MHz(1850~1910MHz ; 824~849MHz)

Conductive spurious emissions

< - 47dBm/30KHz(other frequency)

FER≤3.0%(Test 1: Rate Group 1(9600bps)

FER≤1.0%(Test 2: Rate Group 1(9600bps)

FER≤0.5%(Test 3: Rate Group 1(9600bps)

FER≤1.0%(Test 4: Rate Group 1(4800bps)

FER≤1.0%(Test 5: Rate Group 1(2400bps)

FER≤1.0%(Test 6: Rate Group 1(1200bps)

FER≤3.0%(Test 7: Rate Group 2(14400bps)

FER≤1.0%(Test 8: Rate Group 2(14400bps)

FER≤0.5%(Test 9: Rate Group 2(14400bps)

FER≤1.0%(Test 10: Rate Group 2(7200bps)

FER≤1.0%(Test 11: Rate Group 2(3600bps)

Demodulation of forward traffic channel in AWGN

FER≤1.0%(Test 12: Rate Group 2(1800bps)

RF Tx Specification: 1. CDMA2000 1X EV-DO Rev. A RF Tx Specification:

Frequency range 824~849MHz/1850~1910MHz

Max. frequency tolerance

±300Hz/±150Hz

Max. Tx. Power 800MHz: 23dBm ~ [email protected] 1900MHz: 18dBm ~ [email protected] dBm

Min. output power < -50dBm@-25 dBm

Standby output power

<-61dBm

Code domain power

The code domain power for each deactivated code-division channel should be at least 23dB lower than the total output power for combined I and Q data channel.

Transmitter time error

±1.0μs

Waveform quality factor

>0.944

Open loop power control

(Test 1: -25dBm/1.23MHz)-48.3dBm/1.23MHz±9.5dB (800MHz) (Test 1: -25dBm/1.23MHz)-51.3dBm/1.23MHz±9.5dB (1900MHz)

Page 17: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 14

(Test 2: -65dBm/1.23MHz)-8.3dBm/1.23MHz±9.5dB (800MHz) (Test 2: -65dBm/1.23MHz)-11.3dBm/1.23MHz±9.5dB (1900MHz)

(Test 3: -93.5dBm/1.23MHz)20.3dBm /1.23MHz±9.5dB (800MHz) (Test 3: -91.3dBm/1.23MHz)15.3dBm /1.23MHz±9.5dB (1900MHz)

-42dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.25MHz~1.98MHz)

-54dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.98MHz~4.00MHz)

< -13dBm/1KHz(|Δf| > 4MHz, 9KHz < f < 150KHz,)

< -13dBm/10KHz(|Δf| > 4MHz, 150KHz <f < 30MHz)

< -13dBm/100KHz(|Δf| > 4MHz, 30MHz < f < 1GHz)

Conductive spurious emissions

< -13dBm/1MHz(|Δf| > 4MHz, 1GHz < f < 10GHz)

2. CDMA2000 1X RF Tx Specification:

Max. frequency tolerance 824~849MHz/1850~1910MHz

Max. Tx. Power ±300Hz/±150Hz

Min. output power 800MHz: 23dBm ~ [email protected] dBm 1900MHz: 18dBm ~ [email protected] dBm

Standby output power < -50dBm@-25 dBm

Code domain power <-61dBm

Transmitter time error ±1.0μs

Waveform quality factor >0.944

(Test 1: -25dBm/1.23MHz)-48dBm/1.23MHz±9.5dBm (Test 1: -25dBm/1.23MHz)-51dBm/1.23MHz±9.5dBm

(Test 2: -65dBm/1.23MHz)-8dBm/1.23MHz±9.5dBm (Test 2: -65dBm/1.23MHz)-11dBm/1.23MHz±9.5dBm

Open loop power control

(Test 3: -93.5dBm/1.23MHz)+20dBm/1.23MHz±9.5dBm (Test 3: -91.3dBm/1.23MHz)+15dBm/1.23MHz±9.5dBm

±24dB(9600bps data rate)

±24dB(4800bps data rate)

±24dB(2400bps data rate)

Close loop power control

±24dB(1200bps data rate)

-42dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.25MHz~1.98MHz)

-54dBc/30KHz or -54dBm/1.23MHz(|Δf|: 1.98MHz~4.00MHz)

< -13dBm/1KHz(f> 4MHz, 9KHz < f < 150KHz,)

Conductive spurious emissions

< -13dBm/10KHz(f > 4MHz, 150KHz <f < 30MHz)

Page 18: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 15

< -13dBm/100KHz(f > 4MHz, 30MHz < f < 1GHz)

< -13dBm/1MHz(f> 4MHz, 1GHz < f < 10GHz)

Remarks: RF technical specification should conform to the following standards: 3GPP2 C.S0011-C V2.0 Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Mobile Stations 3GPP2 C.S0033-0 V2.0 Recommended Minimum Performance Standards for cmda2000 High Rate Packet Data Access Terminal 3GPP2 C.S0024-A v3.0

Page 19: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 16

7.3 Antenna Performance Requirements

7.3.1 Electrical Specification

MC2716’s antenna connector belongs to Murata SMD GSC type with the model number of

MM9329-2700B. For detailed parameters of the connector, please visit the website:

http://www.murata.com

Table 11 Antenna performance

Items MC2716

Frequency bandwidth DC-6GHz

VSWR 1.2max.(DC-3GHz) 1.3max.(3GHz-6GHz)

Gain >-3dBi

Input resistance 50ohm

Polarity method Vertical polarity

Temperature -40°C to +90°C

MM9329-2700B mechanical dimensions are shown as below:

Page 20: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 17

Note: Considering the low loss of antenna connector, the shielding cover could be added

between the external antenna and RF connector to make sure RF cables are far away from the

possible interference sources.

Page 21: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 18

8 REFERENCES

PCI Express Mini Card Specification Rev1.2

3GPP2 C.S0011-C V2.0 Recommended Minimum Performance Standards for cdma2000 Spread Spectrum

Mobile Stations

3GPP2 C.S0033-0 V2.0 Recommended Minimum Performance Standards for cmda2000 High Rate Packet

Data Access Terminal

3GPP2 C.S0024-A v3.0

3GPP2 C.S0056-0 Version 1.0 Electro-Acoustic Recommended Minimum Performance Specification

for cdma2000 Mobile Stations

China Telecom《EVDO Customization Specification-v0215》

Page 22: MC2716&MC2718 Technical Specifications and Hardware Design basit kan

MC2716/MC2718 Technical Spec and Hardware Design

www.zte.com.cn 19

9 CLARIFICATIONS

Some unclear contents in the documents are marked with “TBD” because constant improvement and

upgrade are required on the product. These contents will be described in details in the consequent versions.