Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

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description

Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 passes NASA low outgassing tests and develops a high bonding strength of 1,800 psi at ambient temperatures.

Transcript of Master Bond EP21TCHT-1 for High Performance Bonding and Sealing

Page 1: Master Bond EP21TCHT-1 for High Performance Bonding and Sealing
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