MASK ALIGNER: INTRODUCTION - KTH
Transcript of MASK ALIGNER: INTRODUCTION - KTH
bullProvides a means to align a pattern on a chip to the pattern
on a mask and then to expose this pattern
UV-light
Mask quartz + Cr pattern
Photoresist
substrate
MASK ALIGNER INTRODUCTION
Pump service
corridor
Lamp power
supply
The aligner
Lamp house
microscope
Microscope Translation-control Mask holder
Alignment stage
Manometer box
Mirror house Sample
holder
Mercury lamp bull g - line 436 nm
bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 h
bullNitrogen cooling is very important
bullLamp must be cool before restarting hellip or you risk
damaging the lamp Therefore wait ~30 minutes after
previous use But it is better to leave the lamp on for several
hours than turn off and on and off and on hellip
bullThe first exposure after turning on the lamp should be done
with no wafer
1048766If the bulb explodes it will fill the lithography area with
toxic mercury vapor This can cause severe neurological
damage EVACUATE THE LAB FOR AT LEAST 30 MIN
The mask aligner will also be seriously damaged
1048766
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Pump service
corridor
Lamp power
supply
The aligner
Lamp house
microscope
Microscope Translation-control Mask holder
Alignment stage
Manometer box
Mirror house Sample
holder
Mercury lamp bull g - line 436 nm
bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 h
bullNitrogen cooling is very important
bullLamp must be cool before restarting hellip or you risk
damaging the lamp Therefore wait ~30 minutes after
previous use But it is better to leave the lamp on for several
hours than turn off and on and off and on hellip
bullThe first exposure after turning on the lamp should be done
with no wafer
1048766If the bulb explodes it will fill the lithography area with
toxic mercury vapor This can cause severe neurological
damage EVACUATE THE LAB FOR AT LEAST 30 MIN
The mask aligner will also be seriously damaged
1048766
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Lamp house
microscope
Microscope Translation-control Mask holder
Alignment stage
Manometer box
Mirror house Sample
holder
Mercury lamp bull g - line 436 nm
bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 h
bullNitrogen cooling is very important
bullLamp must be cool before restarting hellip or you risk
damaging the lamp Therefore wait ~30 minutes after
previous use But it is better to leave the lamp on for several
hours than turn off and on and off and on hellip
bullThe first exposure after turning on the lamp should be done
with no wafer
1048766If the bulb explodes it will fill the lithography area with
toxic mercury vapor This can cause severe neurological
damage EVACUATE THE LAB FOR AT LEAST 30 MIN
The mask aligner will also be seriously damaged
1048766
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Mercury lamp bull g - line 436 nm
bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 h
bullNitrogen cooling is very important
bullLamp must be cool before restarting hellip or you risk
damaging the lamp Therefore wait ~30 minutes after
previous use But it is better to leave the lamp on for several
hours than turn off and on and off and on hellip
bullThe first exposure after turning on the lamp should be done
with no wafer
1048766If the bulb explodes it will fill the lithography area with
toxic mercury vapor This can cause severe neurological
damage EVACUATE THE LAB FOR AT LEAST 30 MIN
The mask aligner will also be seriously damaged
1048766
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Mercury lamp
bull Life time 600 h
bullNitrogen cooling is very important
bullLamp must be cool before restarting hellip or you risk
damaging the lamp Therefore wait ~30 minutes after
previous use But it is better to leave the lamp on for several
hours than turn off and on and off and on hellip
bullThe first exposure after turning on the lamp should be done
with no wafer
1048766If the bulb explodes it will fill the lithography area with
toxic mercury vapor This can cause severe neurological
damage EVACUATE THE LAB FOR AT LEAST 30 MIN
The mask aligner will also be seriously damaged
1048766
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Mercury lamp power supply
bull It can be operated at constant power or
constant Intensity
bull Constant intensity better reproducibility bull CI1 refers to 365 nm
bull CI2 refers to 405 nm
In constant intensity mode the controller monitors the
lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the
intensity selected bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
WHATrsquoS NEW Before NOW
Turn onoff the whole
machine and Nitrogen in
service corridor
ONLY H2 and air switches
on the aligner controller unit
No vacuum no possibility
of different exposures modes
Vacuum is available
Possibility to choose
Height adjustment in contact NEVER height adjustment in
contact
The Lever separation was
not used
The lever separation must be
used
Exposures in constant power
mode
Exposures in constant
intensity mode
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Air pressure and
nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
ONLY MOVE THE THIN ENDS
Travel
limits
X 3mm
Y 3mm
3
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
CONTACT
ARM
CONTACT-
SEPARATION
LEVER
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
Exposure modes
Mode How does it work Resolution comments
Vacuum Contact
(HP)
vacuum is drawn between the mask and
the wafer prior exposure
~08 microm pitch
RISK OF BREAKING
THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding
the substrate to the chuck is switched off
and positive nitrogen pressure is used to
press the substrate against the mask
~15 microm pitch
RISK OF BREAKING
THE MASK
Soft Contact mode The substrate is held to the mask just by
mechanical pressure of chuck
throughout the exposure The vacuum
holding the substrate to the chuck
remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap
between the mask and substrate The
gap is determined by the height
adjustment
Depends
on separation SAFE It has to be
adjusted manually
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE
1 Fiber optic light pipe
2 Single field splitfield
shutter
3 Rotation for focus
4 Objective separation for
splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully
clockwise right shutter fully
anticlockwise
Left objective=left shutter half
way right shutter fully
anticlockwise
Right objective=left shutter fully
clockwise right shutter half way
MICROSCOPE