Mag Layers Profile

7
Profile Profile Mag Layers Mag Layers

Transcript of Mag Layers Profile

Page 1: Mag Layers Profile

ProfileProfile

Mag LayersMag Layers

Page 2: Mag Layers Profile

Mag. LayersMag. LayersEstablished: April, 1990Capital:17 Million USD Plant locations: Hsin-chu & Chu-bei, Taiwan Kunshan, ChinaSales offices: Santa Ana CA, Tokyo Japan, Seoul KoreaEmployee Number: 280 (H), 400 (K) Sony SS-00259 Certified (green Parts)ISO 9001, QS 9000 & ISO14000 Certified, Emerging Stocks Market Taiwan (Dec. 2001)Mag Layers USA, established: September 1997

Page 3: Mag Layers Profile

MilestoneMilestone

1812/1206/0805/0603chip beads/ inductorsHigh impedance chip beads

Mag. LayersEstablished

1990

Awarded ISO 9002Awarded ISO 9001

B-type/P-type/R-type chip beadsHigh impedance P-type chip beadsChip bead arrayHigh Q inductorsHigh frequency chip inductors

1995

0402 chip beads/ chip inductorWide-band chip beads2010 bead arrayMultilayer common mode filtersHigh current chip inductor

Awarded QS9000

2000 2005

Band pass filterLow pass filterBalunDiplexerAntennaBalance BPFGPRS RF front-end module

Power Inductors

Low pass filterBalunDiplexerAntennaBalance BPFGPRS RF front-end module

ISO14000

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SmartPortables

Vision

IntelligentHouse System

Intelligent TransportationSystem

ElectronicProduct Code

Personal HealthAssistant

CommunicationApplications Information

SystemMag. Layers

C. M. SolutionProvider

ConsumerElectronics

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Main Customer ListMain Customer List

End User:

MOTOROLA, DELL, HP, IBM, APPLE,ACER, NEC, SONY, FUJITSU,

LG , etc.

Wireless Comm.:

Gemtek, ASUS, USI, Z-com, Cybertan,

D-Link, Askey,Gigabyte, Wistron, etc.

EMS:

Foxconn, Flextronics,Solectron, Jabil, Sanmina-SCI

STB/C. Modem:

Motorola, Quanta,Accton, etc.

NB/Peripherals:Kinpol, ASUS, Quanta,

Mitac, Inventec, etc.

MB/VGA:ASUS, ECS,

Gigabyte, FIC,MSI, Mitac, etc. Network:

D-Link, Alpha, AcctonAmbit, Aztech, C-Net,Advantech

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Products Roadmap

200620032002 20052004

EMI &

Signal

Ferrite BeadFerrite inductor

Bead array

HF inductor

2012 1608 1005 size reduction

With Design & Simulation Capability

Common Mode Filters

LC Filters

Power & Signal

Dip typeSMD type without

& with shielding V core HCI

size reduction, power increase Super High Current

RF

Balun, Antenna, LP Filter, BPF & HPF

Balanced Filter

LTCC technology, Design, SimulationLibrary, High Integration Density

ModulesWLAN, BT ModulesGPRS FEM

Modulization

Year

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Total Customer Satisfaction

Flexibility

Application SupportHigh Quality

Fast Delivery Strong R&D Capability

Competitive Price

Product CompetitivenessProduct Competitiveness