ProductsProducts

Mag LayersMag Layers

Product OverviewProduct Overview

Multilayer Products:

Wire-wound Products:

EMI & Signal Products Chip Bead, Common mode filter, Chip inductor

Bead Array

Telecom Products (on LTCC Tech.)

Antenna, Band pass filter, Low pass filter, BALUN,

Diplexer, Coupler, RF FEM modules

Power InductorsVDSL Filter Modules

A

B

R

W

P

L

M

Effective Range of Noise Suppression

1MHz 10 MHz 100 MHz 1GHz

Low Speed Signal Line, Ringing Prevention(AudioSignal, CMOS IC)

Medium Current Line (300mA to 1A)

High Speed Signal Line (LCD panel, Clock Signal,RAM Bus)

Large Current Line (3A to 6A)

Bead Array (High Density Circuit)

General Signal Line (I/O Port)

Applications

GHz-Band Noise Suppression

Mag. Layers Products (1) --- Ferrite Chip Beads

Mag. Layers Products (2) --- Wire-wound Type Inductors

AL

MCD

MRT

SMI/SMC

HFC

MSCH

MSCDB

MSCDRI

MSCD

10 100 1000 10000 100000

Rated Current (mA)

Pro

du

ct T

ype

Products Roadmap

200620032002 20052004

EMI &

Signal

Ferrite BeadFerrite inductor

Bead array

HF inductor

2012 1608 1005 size reduction

With Design & Simulation Capability

Common Mode Filters

LC Filters

Power & Signal

Dip typeSMD type without

& with shielding V core HCI

size reduction, power increase Super High Current

RF

Balun, Antenna, LP Filter, BPF & HPF

Balanced Filter

LTCC technology, Design, SimulationLibrary, High Integration Density

ModulesWLAN, BT ModulesGPRS FEM

Modulization

Year

Multilayer Common Mode FiltersMultilayer Common Mode Filters

CMF-3216 series (70, 120, 160)CMF-2012 series (90, 120, 160)

Co-fired CMF-2012Co-fired CMF Array 3216

USB 2.0 Application IEEE 1394 Application

Common Mode Fil terVcc

D+

D-

ESD Suppression- Chip Varistor

CablePair A

CablePair B

Con

nect

or

Common Mode Fil ter

Common Mode Fil ter

CMF Application: USB2.0/ IEEE 1394CMF Application: USB2.0/ IEEE 1394

Additional app.. : LVDS, DVI, HDMI… (VGA Cards, LCD TV & Monitors)Additional app.. : LVDS, DVI, HDMI… (VGA Cards, LCD TV & Monitors)

Global USB Enabled Device and PC MarketGlobal USB Enabled Device and PC Market

Unit Thousand Source: In-Stat/MDR 2003PC分類 2004 (E) 2005 (F)

PC Total (M) 172 188

NB (M) 46 53

DT 及其他(M)

126 135Source: IDC 2004

1PC uses 1 USB 及 1 IEEE 1394 Controller IC，

• Connects 4~8 USB Ports, requires 4~8 CMF.

• LAN Port uses one CMF• VGA Card uses 3~6

CMF• LCD Monitor: use more

than 3 CMF

DSC, DV, DVR, MP3, Game Players use CMF

Electrical Characteristics of Multi-layer Electrical Characteristics of Multi-layer CMF- 3216 seriesCMF- 3216 series

CMF-3216-0120I-S1

CMF-3216-0070I-S1

CMF-3216-0160I-S1

CMF-3216 -series

10

100

1000

10000

1 10 100 1000Frequency(MHz)

Impedance(Ohm)

70 Ohm 120 Ohm 160Ohm

CM Impedance (at 100MHz)

120 ohm

70 ohm

RDC Rated current

0.8 ohm

1.1 ohm

400 mA

350 mA

Part Number Rated Voltage

160 ohm 1.3 ohm 300 mA

50 V

50 V

50 V

Sizeminimization

Type

Wire-wound

Multi layerSingle Mat’ l

Multi layerCo-fired

Costdown

Solderingconvenience

DCresistance

*

**

**

*

**

***

* ***

*

**

***

***

Characteristics ComparisonCharacteristics Comparison

High Current Molded Power Inductor

1.DC current (A) that will cause an approximate △T of 40℃2.DC current (A) that will cause Lo to drop approximately 20%

INDUCTANCE Rdc HEAT RATING SATURATION

Lo(? H) (mΩ ) CURRENT CURRENT@0A Max DC AMPS 1 DC AMPS2

MMD-1205-R36 0.36 1.1 41 75MMD-1205-R47 0.47 1.3 38 65MMD-1205-R50 0.5 1.5 36 55

MMD-1205-R56 0.56 1.5 36 55MMD-1205-R68 0.68 1.7 34 54MMD-1204-R47 0.47 2 32 55

MMD-1204-R56 0.56 2.2 29 51

MMD-1204-R68 0.68 2.5 28 49

MMD-1004-R15 0.15 0.8 25 75MMD-1004-R36 0.36 1.3 20 60

MMD-1004-R56 0.56 1.8 15 25

MMD-0603-R90 0.9 10 11 22

MMD-0603-1R0 1 10 11 22

PART NUMBER

High Current Power InductorIdc and Isat

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

0 10 20 30 40 50 60 70 80

DC BIAS(A)

INDUCTANCE(uH)

0

10

20

30

4050

60

70

80

90

100

TEMP.RISE(C)

R50(INDUCTANCE)R68(INDUCTANCE)R50(TEMP.RISE)R68(TEMP.RISE)

High Current Molded Power Inductor

Reliability TestReliability Test1. Magnetic leakage test2. High temperature resistance test for wires 3. Short circuit test for insulating-layer of

wires4. High humidity test for molded coils 5. High temperature resistance test for

molded coils 6. Rust resistance test of molded coils7. Vibration test8. Current resistance test9. Soldering test10. Electrical resistance measurement11. Efficiency test of molded coils (on-board

measurement)

0.5 1 1.5 2 2.5Frequency (GHz)

Graph 1

-60

-50

-40

-30

-20

-10

0

DB(|S[1,1]|)zzz

DB(|S[2,1]|)zzz

CIRCUIT

3D Layout

Simulation Result

Low Pass Filter

RF product lineup – Atheros a/b/gRF product lineup – Atheros a/b/g

S.W

BPF

BPF

BLN

2.4 & 5 GHz

2.4 & 5 GHz

On PCB

Tx:2.4 GHz

Tx:5 GHz

A5006

Diplexer

Diplexer

On PCB

On PCB

Rx:2.4 GHz

Rx:5 GHz

BPF

PA

MDR880J (Soshin) HHM1562B (TDK)LFB215G (muRata)

LPFOn PCB

DBA-7040-25GH3-A1DBA-7040-25GH3-A1

LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1 LTB-2012-5G5H3-A1LTB-2012-5G5H3-A1 LTU-1608-5G5H3-A1

S.W

BLN

BLN

BLN

BLN

2.4 & 5 GHz

2.4 & 5 GHzTx:2.4 GHz

Tx:5 GHz

4330

Diplexer

Rx:2.4 GHz

Rx:5 GHz

LPF

On PCB

RF product lineup – Broadcom a/b/gRF product lineup – Broadcom a/b/g

HHM1732B1(TDK)

HHM1732B1(TDK)HHM1711D1(TDK)

HHM1711D1(TDK)

LFD212G45DP4A189(Murata)

LFD212G45DP4A189(Murata)

Diplexer

LTD-2012-2G4H3-A2 LTU-1608-2G4H3-A1LTU-1608-2G4H3-A1 LTU-1608-5G5H3-A1

LTD-2012-2G4H3-A2LTU-1608-2G4H3-A1LTU-1608-2G4H3-A1 LTU-1608-5G5H3-A1

DBA-7040-25GH3-A1DBA-7040-25GH3-A1

RF product lineup – Conexant a/b/gRF product lineup – Conexant a/b/g

S.W

BBF

LPF

ISL36921

BLN

2.4 & 5 GHz

2.4 & 5 GHz

Tx:2.4 GHz

Tx:5 GHz

Diplexer

Diplexer

Rx:2.4 GHz

Rx:5 GHz

PA

MDR888J (Soshin)

DBF70A001(Soshin)

LTF1608L-F2R4H (Toko)

LDG0UQD3064 (NTK)

HHM1732B1(TDK)

LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1 BBF-2520-2G4H3-A2

LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1 LTL-1608-2G4H3-A1LTL-1608-2G4H3-A1 LTD-2012-5G5H3-A1

DBA-7040-25GH3-A1DBA-7040-25GH3-A1

RF product lineup – Marvell a/b/gRF product lineup – Marvell a/b/g

S.W

BPF

2.4 & 5 GHz

2.4 & 5 GHz

Rx:2.4 GHz

Rx:5 GHz

Diplexer

Diplexer

Tx:2.4 GHz

Tx:5 GHz

PA

MDR881J (Soshin)

MDR746 (Soshin)

HMD861H(Soshin)

MDR881J (Soshin)

WPSMLBLN001C(WTC)

LTD-2012-2G4H3-A3LTD-2012-2G4H3-A3 LTB-2520-2G4H3-A2

LTD-2012-2G4H3-A3LTD-2012-2G4H3-A3 LTB-2012-5G5H3-A2LTB-2012-5G5H3-A2 LTU-2012-2G4H3-A2LTU-2012-2G4H3-A2

BLN

BPF

IC

DBA-7040-25GH3-A1DBA-7040-25GH3-A1

I. Product Lineup for BT (CSR)I. Product Lineup for BT (CSR)

BLN

BLN

IC

2.4 GHz

Tx

Rx

S.W

LTA-XXXX-2G4H3-A1LTA-XXXX-2G4H3-A1

LTU-2012-2G4H3-A3

BPF

MDR746F (Soshin)MDR741F

LTB-2520-2G4H3-A4LTB-2520-2G4H3-A4

LTU-2012-2G4H2-A2LTU-2012-2G4H2-A2

HHM1517(TDK)

DEA252450BT (TDK)LFB212G45BA1(muRata)

BBF-2520-2G4H3-A1BBF-2520-2G4H3-A1BBF-2012-2G4H3-A1BBF-2012-2G4H3-A1

BasebandBasebandProcessorProcessor

LCD Module ApplicationLCD Module Application

Mobile Camera Mobile Camera CCD/CMOS CCD/CMOS SensorSensor

Mobile Handheld SystemMobile Handheld System Low Profile SMD Power Inductor LineLow Profile SMD Power Inductor Line

LED Backlight Circuit application

LDO Regulator Circuit application

P/N:MSCH3216C series LxWxH:3.2x1.6x1.8mm;Inductance:1uH~100uH

P/N:MSCH2015C seriesLxWxH:2x1.5x1.7mm;Inductance:1uH~22uH

P/N:MSD-0201 seriesLxWxH:2.8x2.6x1.0mm;Inductance:2.2uH~22uH

Charge ICCharge IC

Charge ICCharge IC

BTBT

BluetoothBluetooth

LCD ModuleLCD Module

Mobile Handheld SystemMobile Handheld System

GPSGPS

GPSGPS

LTCC Product LineLTCC Product Line

Audio JackAudio JackAudioAudio

LC Filter- LCF series

Linear Polarization GPS Antenna

CBA-1205-1G5S2-A1

Bluetooth chip antenna

Balance Filter for CSR Solution

BBF-2012-2G4H6-A1

BBF-2520-2G4H6-A1

RFRF

BTBTBluetoothBluetooth

USBUSB

RF ModuleRF Module

LCD ModulesLCD Modules

Mobile Camera Mobile Camera CCD/CMOS CCD/CMOS SensorSensor

Mobile Handheld SystemMobile Handheld System EMI Product LineEMI Product Line

Antenna Matching Circuit

HFI series

CMF series

MLI/MLB series

Matching Circuit-HFI seriesMLI/MLB series