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Macquarie Equipment Finance

This data sheet is provided to you on a strictly confidential basis and contains commercially sensitive and valuable information.No part of its content may be provided to any person without our prior written consent. This data sheet is not an offer capable of acceptance. The information contained in this data sheet is, to our knowledge and information, accurate, but it may contain typographical errors and we do not warrant the completeness or accuracy of the information contained herein. Any offer by you to purchase of the equipment described in this data sheet shall be subject to our standard terms and conditions of sale.

Interested parties may contact Ted Shafer at Macquarie Equipment Finance for additional information at (303) 653-7025 or [email protected]. Visit our web site at www.macquarie.com/electronics Important Information www.macquarie.com/uk/important_information.htm © 2013 Macquarie Group

ASML XT:1700i Immersion 193nm Scanner Serial Number 3797

Macquarie Equipment ID 9060 System has the following major specifications:

o Manufactured 2007 o 300 mm Wafers o 26 mm x 33 mm Exposure Field o 193nm immersion illumination o Variable NA 0.75 – 1.20 o 45 nm Resolution o Overlay 7nm single machine, 11nm matched o 122 12” wph thruput (125 shots, 30 mJ/cm2 dose) o New Welle installed May 2013 o Available with TEL Lithius Track




Configuration

1) PDO offset for EFL spots; 2) Alignment evaluation strategies; 3) Improved setpoint calculations for shifted images. Disabled

2 Sided IFM-beams for WS-X (expose) Not available 2 Sided IFM-beams for WS-X (measure) Not available 2D Barcode Reader Absent 2D grid correction Enabled 2D Manipulator None AA processing rack MPCR processing rack Activate Edge Speed Limiter. Protected Edge Speed Limiter Disabled

Activation of the airknife during hovering Airknife enabled during hovering in wet mode

Active Pupil Aberration Correction Element type APACE Absent Active Pupil Aberration Correction lens Element Metrology does not use any APACE Active wafer release for dry WS FALSE

Adjust LHV oscillation threshold of the green laser Disable decreased green laser oscillation threshold

Air Gauge Absent Air Gauge Improved Levelling Absent ALE 1 Use Calibration Alignment Camera Mirror Absent Alignment laser configuration 2 color laser Alignment Sensor Type Athena Narrow Marks OM Allow different Exp,TIS Align set Absent Allow even orders usage Absent Allow L1L7 Type 1 Optimization Absent Allow wafer plane deviation check with Focus

Monitoring Disabled AMCR configuration No configuration specified Angular sensitivity corrections of Spot Sensor on

Chuck 1 Disabled Angular sensitivity corrections of Spot Sensor on

Chuck 2 Disabled APACE used in production. APACE is disabled in production. Application Specific Lens Heating Calibration &

Verification Present Application Type Scanner Application Apply clamping grid correction during wafer align disabled; Assure System Snapshots Assure System Snapshot not allowed Ast offset correction in TIS LHFB/LOCO (Version

3) Disabled




Athena Focus Improvements 1 Present Athena Narrow Marks Twinscan Present Attenuator Mirror Type Quartz Attenuator Mirror Attenuator Type Variable Automated DOE Exchanger Present Automated DOE Exchanger Architecture 16 slots Automated Lens Heating Calibration Enabled Automated Reticle Transport System Absent Automatic CUA Absent Automatic CUA exchanger architecture Adjacent to the Rema objective Automatic PCE exchanger Present Availability of chucks in the waferstage

compartment. Both chucks are present. Avoid I1 or I2 mark on TIS plates Disabled; Avoid Track INPUT/OUTPUT conflicts, Raise AS

after APR Avoid Track INPUT/OUTPUT conflicts enabled

BALE Type WS15G Valves BaseLiner focus control. BaseLiner-Focus application is enabled.

BaseLiner focus high order intrafield BaseLiner-Focus high order intrafield is disabled.

BaseLiner overlay control. BaseLiner-Overlay application is enabled. Beam Control Closed loop board configuration OADB Bubble Extraction Seal Setting Bes boost 2 Cache ImageTuner wafer calculations Disabled Capacitive z-height sensor type. Extended Z sensor board Carrier Handler Type Mark II 300 Foup CDC Enabled Center pole location in the machine Center pole is located in the center Changed Short Stroke diff XY controller Disabled Choice of avoidance routing. Phase 2 Chuck 1 wafer size 300mm Chuck 2 wafer size 300mm Chuck Dedication Enhanced Circuit Dependent FEC Present Clean Air Configuration Air Shower Type 7A low pressure Clean Air Temperature Control Driver and ACC Clean Air Temperature Performance level Level 2 Closing disk type SiC closing present Combined stage alignment Disabled Communication with Air Control Cabinet RS232 communication Computational ASCAL Disabled




Constrained fit Disabled Continuous clampable wafer table for dry WS Absent CT Miscellaneous Rack Present Data collection not covered by FOCUS and

OVERLAY Disabled Depolarizer type no retarder but pce-depolarizer Depth of Focus enhancement with adjustable laser

bandwidth Laser bandwidth is not adjustable Describes at what plane the BMU measures Correct for BMU below DOE1 level Determination of NA ellipticity Disabled Diaphragm Limiter Absent Diff pressure correction for IFM beams Absent Docking wheels at WH unload Absent Dose Intensity Optimization Disable Dose Intensity Optimization; Dose System Performance Test for Lithoguide Present Dosecontrol Hardware DCB DOSEMAPPER Present DoseSystemPerformanceTest sequence Test sequence 1 DOSE_MAPPER_1 Present Double TIS scan Disabled Dual Speed Data Delay Absent DUV Lightsource Power Level 60.00 Watt Dynamic Performance Calculation Mark 2 E-chuck Flatness Qualification Test Disabled EDA Interface Disabled Editable M-action queues Editable M-action queues disabled EDO Disabled EFESE Absent "Enable redirection of I6 to I1/I2 on TIS plates

v5.5" disabled; Enable the Maintenance Assistant Disable Maintenance Assistant Enable to support SMASH XY mark types. SMASH XY marks are not supported. Enable to upgrade LH defaults Disabled Enable/disable mid-frequency model for 2DE

calibration Enabled Energy Sensor Star TechC Energy sensor calibration type Normal Enhanced Exposure Overlay Full Enhanced exposures 1 Present Enhanced Throughput Reticle Alignment Extended Enhancements in Reticle Monitor no enhancements Equipment Constants via SECS interface Disabled




ESO Manual Override ESO Manual Override Disabled Exchangeable Last Lens Element Present Exchangeable Pupil Lens Element EPLE Type INACTIVE Exchangeable Pupil Lens Element Present Extend IRIS maximum particles scanned to 50000. Present extended docking interface at Prealigner ECC_0MM Extended Lens Heating History (ELHH) Enabled Extended LS areas Disabled Extended maximum for FILS Timeout. Standard Extended measurements after expose Disabled Extended minimum for FILS Timeout. Standard Extended Spot Sensor Matching Present Extreme Clean Humiditied Air Present Field width optimised leveling Disabled FlexRay Control Rack Configuration Absent Flexray illuminator Flexray Absent FOCAL Measurement for Lithoguide Present Focus Data Collection Absent Focus Monitoring Present Fresnel corrections for WSSS Disabled FSM Flexibility package Disabled Functional use of Active Elements BALE function as BALE Gas Control Unit Type Ultra High Flow (UHF) Gridmapper Enabled Ifm config at measure side. 8 axes IFM Laser Configuration AOM Recombo Laser ILIAS Functionality For Lithoguide Present ILIAS lens setup Absent ILIAS Sensor Location Both ILIAS sensor type chuck 1 Hyper NA MK3 ILIAS sensor type chuck 2 Hyper NA MK3

ILIAS Zernike measurement performance node ILIAS Zernike measurement performance node 17

Illumination modes All illumination modes Illuminator Machine Safety Hardware PTI board Illuminator platform Aerial XP Illuminator Type 170 Image quality data path arch Data path architecture A Imaging Control Rack Configuration IMCR Imaging control support for rotated features. Rotated features support disabled. Imaging Electronics Architecture B Architecture Imaging Fading Control Lens set-up only




Imaging Generic Power Amplifier Ten Axis Power Amplifier

Imaging performance package Standard imaging performance settings for non-8xy

Immersion Present Immersion hood heater configuration Internal single segmented heater Immersion Hood Sub version Sub-Version 1 Immersion Hood version Version 4 Improve the mean stability performance of AGILE Disabled Improved Contrast Control Absent Improved Edge Field Leveling Enabled Improved Maintenance action scheduling. Disabled Improved wafer reject mode Disabled Improvements for reticle handling Disabled In situ Wafer Table Stone Cleaning Indication what kind of AM controller hardware is

present SUCR Inlet restriction for clean air Inlet restriction at right side Insert a delay time before starting a Lot (lens

heating). Disabled Integrated Reticle Inspection System PPD2 with IRIS5um functionality. Integrated Reticle Inspection System

Configuration. Enable creation of OSIRIS viewable files for PPD2 systems.

Integrated Reticle Library IRL with original functionality Intensity Calibration Per DOE Disabled Interferometer axis version at exposure 3 plus 1 axis Interferometer Electronics Ifsr Interfield Scan Up Scan Down focus correction SUSD enabled model type 1 Intrafield Higher Order Process Corrections Enabled Intrafield Wafer Alignment Disabled IPEP package enabled or not. Protected. IPEP package is not enabled Iris feature Scan Present Is NA accuracy measurement allowed? Disabled ISIS Functionality For Lithoguide Absent Laminar Bottom Hood Absent LAR event log pollution reduction Disable LAR event log pollution reduction Laser Gas Life eXtension Enable Laser Gas Life eXtension; Layout Version Number TIS Plate 1 on Chuck 1 TIS Plate 1 Layout Version 5 Layout Version Number TIS Plate 1 on Chuck 2 TIS Plate 1 Layout Version 5 Layout Version Number TIS Plate 2 on Chuck 1 TIS Plate 2 Layout Version 5 Layout Version Number TIS Plate 2 on Chuck 2 TIS Plate 2 Layout Version 5 LCI WaitWatcher plug-in Absent LCW Circuit set-up Pressure Version 1




LEC Rack in Electronic Architecture Absent Lens Circuit Water Flow High Immersion Lens Heating Feedback Absent Lens OverPressure Compensation OverPressure Compensation Disabled

Lens Top Tool Connection Lens Top Tool can not be mounted on top of the Lens

Lens Type 7 Level Sensor Processing Rack MPCR Leveling Verification Test for Lithoguide Present Levelling throughput improvement on measure

side No levelling throughput package Light-source Architecture Laser Light-source Type Cymer Laser: XLA 360 60W, 10 mJ, 6.0kHz Light-source Wave-length 193nm Liquid Particle Counter Unit No Liquid Particle Counter Unit installed Lithoguide Imaging Recipes Absent Load Robot Internal Docking WH LR Without Damping Load Robot Wrist Assy Type WH LR Wrist Long Tension Rod Log missed translations Disabled Lot Alignment Report Encryption Unencrypted Lot Correction Sequence Type D Lot Overhead Reduction LOR2 Lot Report Data Category Enhanced Diagnostics LS focus node LS focus node 5 LS spot coverage Absent LS_CPU_CONFIG 2 CPU's available LS_PEMM_CONFIG Present Machine Architecture XT Machine Architecture Machine Location Customer Site Machine Specification F Specification Machine Type 1700 MALE used in production. MALE is disabled in production. Max alignment speed Setting 2 Max. NA that can be used in Lot Production level 0 Maximum Reticle ID Length 12 Characters mbds control Present MDL Viewer Site View Measure and model strategy for vertical stage

align VSA and advanced XVSA

Method for alignment of the laser beam Align beam by optimizing pupil telecentricity params: LUBB

Metroframe Circuit Water Cabinet Absent




Metroframe Temperature Performance level Level 1 Metroframe type TYPE_A Modelling for MAXYS Absent Motor Circuit Water Flow High Immersion Multi Functional Exchangeable Lens Element Projection lens has no MF-EPLE Multifunction Active Lens Element 0 Multifunctional Active Elements 0 Multilingual UI Absent MX Improved Scheduling Enabled NA Control Architecture NA3 Half Bridge NA Control Type 170 NA1 motor type None Nitrogen Purge Utility Control Absent Nitrogen purging of Reticle Stage RS is not purged Number of Active Elements 2 Number of Active Lens Elements 0 Number of Active Manipulator Elements 0 Number of Bi-directional Active Lens Elements 2 Number of EXLE elements 0 Number of Half Dome Mirrors 2 Number of Lens NEXZ Manipulators 6 Number of Lens Z Manipulators Using Camdisk 0 Number of manipulable ELLE axes 5 Number of Motion Controllers 5 Motion Controllers present Number of pre-amps available per Z-manipulator 0 Number of RMCS clients No clients Number of Rxm 6 Number of Rym 6 Number of Semi-Active X-Y Lens Manipulators 6 Number of Z Lens Manipulators 6 NXT Arch. revision no revision OADB Improved Dynamic Range Enabled Obsolete Disabled Off-axis slit Projection lens has an off-axis slit. Online Lamp Peak Disable Online Lamp Peak; Option to apply the usage of HO marks in

StageAlign Use XPA marks in StageAlign. Overlay Data Collection Overlay Data Collection disabled. Overlay Node Level 0 Parameter indicates how long overlay data will be

stored. Short retention period. Particle Extraction Mass Flow Meter Absent




Patch strategy Patchlevel Pattern Matcher Absent Pattern Matcher Full Chip Absent PCE Location pce in APEX PED control mode Absent PEP High SLIP PEP High SLIP is disabled PEP Image Streaming Present PEP-ADC Intensity Disable PEP-ADC Intensity; Performance Enhancement Package None Piezo Active Lens Mounts Analog Point-to-Point LS Machine Matching Disabled Polarization Present Polarization Shaping Element Retractor PSER hardware installed in the machine Polarized illumination amorph DOE. Only unpolarized illumination. Position Control Motion Control rack MPCR Position Control Power Rack Configuration TYPE_4: Stages Power Rack upto F-spec Position of Spot Sensor on Chuck 1 Spot Sensor Position on Chuck 1 layout 3 Position of Spot Sensor on Chuck 2 Spot Sensor Position on Chuck 2 layout 3

Power rack configuration Phase_1/XTIII electronics (reduced safety settings)

Power supply type used for the wafer table BES heater. Not applicable

Pressure update rate for fringelength correction Pressure update rate 40 Hz Process Dependent Gain Correction Absent Projection GPA Configuration Version Version 2 Proximity Matching Present PSE Location pse in PSER PSE type XY polarization PUPICOM Present PUPICOM Architecture Multi Spoke Pupil forming optics Zoom, axicon and DOE PUPIL Measurement For Lithoguide Present Pupil measurements with ILIAS Present Pupil qualification method Centre of gravity method Pupil TIS angular sensitivity calibration and

correction TIS Pupil Measurement will not be improved PUPILIAS matching in terms of sigma

measurement No matching Purge Hoods configuration Extremely Clean Dry Air only purging configuration purging CONFIG 3 Rapid prototyping using Python to control the

machine. Disable rapid prototyping.




Readout location of Pneumatic Facility Unit sensors CT sensor board (CTS)

Recipe Creator Absent Reduce wafer-load-offset tolerance of centring

unit to 25 um Standard Reduced capture range for TIS scans Disable reduced range TIS scan scenarios Relative direction of ws to rs on the X axis Same REMA architecture XTREMA ReMa mark Mark1 Reorder Lot Service Absent Reticle align capture Always capture the reticle Reticle Align High Precision Absent Reticle alignment scenarios XT reticle align scenarios Reticle Balance Mass 1 amp. 450V20A: PAAC AT-pepD Reticle Balance Mass 2 amp. 450V20A: PAAC AT-pepD Reticle Carrier Location Left Reticle Carrier Tag Reader Absent Reticle exchange type Retex option: E

Reticle Handler Machine Architecture Reticle Handler is designed to handle reticles in air.

Reticle Handler type RH Mark IV Reticle Heating Control Reticle Heating Control is disabled Reticle Level Polarization Sensor Present Reticle load protection for too wide/wrongly

placed pellicle Disabled Reticle shape correction Enabled Reticle Size 6 inch

Reticle Stage Chuck Type TYPE_4: MGC_CLT, Glued LS, Magn. GC, ENC

Reticle Stage Chuck Type Magn. Grav. Comp. Changed Lens Top Reticle Stage Lenscooler Box Lenscooler Box with anti-aliasing Filter

Reticle Stage Long Stroke Config TYPE_5:CoFe_18 motor,SIOB contr.,int. vacuum supply,magn. GC

Reticle Stage Long Stroke Motor Type Cobalt Ferro 18 teeth Reticle Stage Long Stroke Y11 amp. 450V20A: PAAC AT-pepD Reticle Stage Long Stroke Y12 amp. 450V20A: PAAC AT-pepD Reticle Stage Long Stroke Y13 amp. Don't care Reticle Stage Long Stroke Y21 amp. 450V20A: PAAC AT-pepD Reticle Stage Long Stroke Y22 amp. 450V20A: PAAC AT-pepD Reticle Stage Long Stroke Y23 amp. Don't care Reticle Stage Measurement System on Scan Heidenhain Encoders Reticle Stage purged mini environment Present




Reticle Stage Short Stroke X amp. PADC 100V/18A Reticle Stage Short Stroke Y11 amp. PADC 100V/18A Reticle Stage Short Stroke Y12 amp. PADC 100V/18A Reticle Stage Short Stroke Y21 amp. PADC 100V/18A Reticle Stage Short Stroke Y22 amp. PADC 100V/18A Reticle Stage Short Stroke Z1 amp. PADC 100V/18A Reticle Stage Short Stroke Z2 amp. PADC 100V/18A Reticle Stage Short Stroke Z3 amp. PADC 100V/18A Reticle Stage Short Stroke Z4 amp. Don't care Reticle streaming Disabled Reticle streaming II Disabled Reticle streaming lite Disabled Reticle Temperature Sensor RTS hardware is absent. routing for ASML test purposes Disabled RS Object Field Shifted 17x0 Ryz for x Abbe correction DISABLED SAMOS Stray Light Test For Lithoguide Present SASO robustness and fiber connectivity Disable SASO robustness Save throughput data to the disk Disabled ( Overrules Disabled ) Scanning Energy Sensor Calibration Scanning Energy Sensor Calibration SDM test on machines without SAXY elements Disabled Set PUPICOM use N_A Set UNICOM use N_A Settle time reduction to improve the throughput Default settle times Setup sensor board version Setup SSD version LSDB Shot Data Collection Absent Skip LS spots on TIS gratings for iVSA Disabled Smash capture in stage align Always capture in stage align SMASH Reuse Capture Information in Stage

Alignment Coarse capture scans are done on all stage alignment marks.

Smooth Field Uniformity Absent Specifies chuck1 config Immersion mark 3 Specifies chuck1 layout relev. for Immersion TYPE_2:t.b.d. Specifies chuck1 version Version 2 Specifies chuck2 config Immersion mark 3 Specifies chuck2 layout relev. for Immersion TYPE_2:t.b.d. Specifies chuck2 version Version 2 Specifies which mark types are supported ASML marks only SPM reference axis at measure side (XT ARA) No reference axis at measure side available SPM temp correction for lens axis Disabled Spot Sensor Chuck 1 VLOC Spot Sensor Chuck 2 VLOC




Spot Sensor Reticle Stage Present Spotsensor chuck 1 surface coating Bilatal Spotsensor chuck 2 surface coating Bilatal Spotsensor surface coating Bilatal Stage align just before FIWA Disabled Stage Alignment Filter Absent Stage Alignment Phases Fine stage alignment Stages Sample Rate 5.0 kHz Stand-alone Workstation FALSE Stressless wafer load for WS Version 0 Striping correction ILIAS sensor Disabled Support usage of 7xx-8xx DOE range FLEXRAY

pupils. Disable 7xx-8xx DOE range switch for 3DOF / 6DOF HDM HDM_TYPE_6DOF Symmetrical Reticle Alignment Enabled Test Table Absent Test table architecture Aerial XP Test Table Z Axis Worm Wheel The cpu for 2DM software. Absent The type of algorithm used for SFPM A simple tracking mechanism is used THFFC FDE model lens dependent Disabled Tighten wafer-load-offset tolerance of centring

unit Disabled TIS diffuser TIS diffuser absent

TIS overlay and TPT node TIS Overlay and Throughput Performance Node 17

TIS plate deformation correction Enabled TIS plate usage in reticle align RA always measures TIS1 and TIS2 TIS plate usage in stage align SA always measures TIS1 and TIS2 TIS Power switching Disabled TIS trigger mechanism Use internal trigger mechanism TIS_ITOP Disabled To enable the closing wafer refresh functionality Disabled TOP HD Present Track Pre-warning signal (APR) APR enabled Type of 1st general purpose amp TAPA Type of 5th general purpose amp TAPA Type of Air Gauge No Air Gauge device present Type of e-pins calibration for Wafer Stage 1DOF (z only) Type of immersion hood for immersion Actuator Fixed Height Type of inline cleaning cabinet ILCC absent Type of measurement carried out as SFPM The SFPM measurement is disabled




measurement Type of NEXZ actuator NEXZ with 885nm range (NO3) Type of projection multiplexer board MUX type LAMB Type of wafertable on chuck 1 for immersion

machine SiSiC version 4 Type of wafertable on chuck 2 for immersion

machine SiSiC version 4 Ultra Pure Water flow controller (WICC) Entegris NT Flow Controller UNICOM Present UNICOM Architecture 58 Motors Uniformity Improvement Package Present Universal Prealignment Disabled Unload Robot Wrist Assy Type WH UR Wrist Long Tension Rod UPW Unit Type A or type B UPW Unit installed Usage of Energy Sensor data by TIS Enabled Usage of wavelength data by TIS Enabled Use a servo setting set Defaultl servo setting

Use extended X modeling in Reticle Control Extended X modeling for Reticle Control is disabled.

Use inline Air Gauge Measurement Disabled Use new RA scenario XT4:1950 and

XT3:1900+ITOP Disabled Use Ryx or Ryz for the x Abbe correction Use Ryx for the x Abbe correction Use Sigma Calibration apply Sigma Calibration Use Sigma WIP Preserving Offsets no Sigma WIP Preserving Offsets Use the old at4.0.3 SPE sequence (ASF) Do not overrule the SPE sequence Use validity ranges around UIP data when

Enabled. Use exact matching for UIP data UV Shutter version UV Shutter version 1 Version of RS/WS IO library Version 1 Version of the Air Control Cabinet (ACC) ACC MK 1 to 4 Wafer Carrier Location Left Wafer Handler Productivity Wafer Handler Productivity Level 1 Wafer Handler wrt BF Shifted in Z Not Shifted Wafer Handling Docking Plate WH Docking Plate Extra Low Height Wafer Handling Drying Unit WH Drying Unit Absent Wafer Handling Load Robot Type Scara Arm, 40 mm Z stroke Wafer Handling Pneumatics Standard Wafer Handling Store Unit Type WH Store Unit 3 Slotted Wafer Handling Track Input WH Wafer Track Input Via PU Wafer Handling TSU WH TSU Heater Absent Wafer Handling Unload Robot Type Scara Arm, 40 mm Z stroke




Wafer Id Reader Absent Wafer Mark Sensor Absent Wafer Size 300mm Wafer Stage Balance Mass 11 amp. Don't care Wafer Stage Balance Mass 12 amp. Don't care Wafer Stage Balance Mass 21 amp. Don't care Wafer Stage Balance Mass 22 amp. Don't care Wafer Stage Configuration Wafer Stage type 3 configuration Wafer Stage Dedicated Hardware Configuration None Wafer Stage Fast Stiff X Move Electronics Present Wafer Stage Long Stroke E CS amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke E X amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke E Y1 amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke E Y2 amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke M CS amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke M X amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke M Y1 amp. 450V20A: PAAC AT-pepD Wafer Stage Long Stroke M Y2 amp. 450V20A: PAAC AT-pepD Wafer Stage Measurement System Agilent interferometers Wafer Stage Mirror Block Down Electronics Absent Wafer Stage Short Stroke 1 XY1 amp. PADC 100V/18A Wafer Stage Short Stroke 1 XY2 amp. PADC 100V/18A Wafer Stage Short Stroke 1 XY3 amp. PADC 100V/18A Wafer Stage Short Stroke 1 Z1 amp. PADC 100V/18A Wafer Stage Short Stroke 1 Z2 amp. PADC 100V/18A Wafer Stage Short Stroke 1 Z3 amp. PADC 100V/18A Wafer Stage Short Stroke 2 XY1 amp. PADC 100V/18A Wafer Stage Short Stroke 2 XY2 amp. PADC 100V/18A Wafer Stage Short Stroke 2 XY3 amp. PADC 100V/18A Wafer Stage Short Stroke 2 Z1 amp. PADC 100V/18A Wafer Stage Short Stroke 2 Z2 amp. PADC 100V/18A Wafer Stage Short Stroke 2 Z3 amp. PADC 100V/18A Wafer stage technology Wafer stage H-drive Wafer Stage Type Dual Chuck Wafer Switch Absent Wafer Track Present Wafer type used in the machine 300 mm - SEMI Notch Wafers per Carrier 25 Wavelength Adjustable Adjustable WES 2000M hardware presence Absent Wet Chuck Ex. while stay hovering

(Chuck1=Exp,Chuck2=Mea) Not Applicable




Wet Chuck Ex. while stay hovering (Chuck1=Mea,Chuck2=Exp) Not Applicable

Wet Imaging Control Cabinet Type B Wet Imaging Control Rack WICR-i4 or WICR-i5 WH Robot Power Amplifier CPM 20

WH temperature conditioning type Slow performance type used for XTIII and below.

Wide Pellicle Detection Absent WS Balance Mass Stainless Steel WS Immersion Hood Only Testrig Absent

WS Immersion throughput package Tiger mode chuck swap closing disc exchange

WS Immersion wafer table thermal control package

Single BES heater and cold-end wafer table heater

WVAC Unit Type A WVAC Unit installed XML Lot Report Content Level Basic XML output for LITHOGUIDE Disabled XT Architecture Revision Rev2 XT REMA MPAC board type MPAC type 1

Z-capture on low reflectivity wafers Z-capture on low reflectivity wafers is disabled.

ZERO Fiducial ILIAS MK3 Zeroing type for Encoders Measurement System Using reference marks on the encoder scales Zoom Axicon Architecture ZZA Zoom Axicon Type

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