MACDERMID ENTHONE ELECTRONICS SOLUTIONSfiles.interconti.cz/200000654-d9927da8e3/Mechanism...

BLACKHOLE/ECLIPSE

MACDERMID ENTHONE

ELECTRONICS SOLUTIONS

DEC, 2016

A Platform Specialty Products Company.

OUTLINE

2

• Mechanism of Blackhole / Eclipse

• Blackhole / Eclipse process

- Sequence

- Process

• Equipment enhancement

• Performance test method

• Process Capability

- General

- Laminate types

• Latest Development - Eclipse LE

• Reliability data


MECHANISM OF BLACKHOLE / ECLIPSEPRE ETCH - OPTIONAL

3

•“Nailhead” : The most common

type seen on small holes and flex

material

•“Nailhead” should be removed

after before Carbon process

• Etch rate needed is around 0,35μ

* Thickness of adsorption exaggerated for illustration

Nailheading


MECHANISM OF BLACKHOLE / ECLIPSECONDITIONER

4

• Conditioner wets the holes

• Changes the surface charge

of the substrate

•Electrostatic adsorption onto

all surfaces of the panel


NN

NN

N

+


MECHANISM OF BLACKHOLE / ECLIPSECARBON TREATMENT

5


• Dispersant makes carbon

particle miscible in

aqueous solution and

imparts a negative charge.

• Negatively charged

particles are

electrostatically adsorbed

onto conditioned surfaces.

HO

HO


MECHANISM OF BLACKHOLE / ECLIPSEMICROCLEAN

6


Carbon particles removed

from all copper surfaces

only

Etch


BLACKHOLE / ECLIPSE PROCESS SEQUENCE

7

Antitarnish

Cleaner / Conditioner

Rinse

Carbon treatment

Blow Off / Dry

Rinse

Rinse

Dry

Microclean

Pre- Etch

Repeat for

double pass

Video clip : Blackhole double pass running


BLACKHOLE / ECLIPSE PROCESSPRE-ETCH

8

• H2SO4, H2O2 with G-5S or SPS

• Control : Etch rate, concentrations

• Dump : Every week

• Dwell time : 30~40 sec

• Temp varied to etch rate

• Immersion

• Etch rate : 0,35 μ

• 3X rinse rinses

• Auto dosing : optional


BLACKHOLE / ECLIPSE PROCESSCLEANER

9

• For standard process : – Blackhole Cleaner, Eclipse Cleaner,

Blackhole Cleaner-ESP

• For low etch process : – Eclipse Cleaner LE, Eclipse LE-ESP


• Temp : 50~57℃

• Immersion (via flood recommended)

• Ultra sonic

• Control : pH, Normality

• Dump : 250SSF/gallon or pH below 9.6


BLACKHOLE / ECLIPSE PROCESSCONDITIONER

10

• For double pass : – Blackhole AF Conditioner

• For single pass : – Blackhole Coditioner SP


• Temp : 21~57℃


• Control : pH, Normality

• Dump : 250SSF/gallon or 3PSM


BLACKHOLE / ECLIPSE PROCESSCARBON TREATMENT

11

• For double pass : – Blackhole AF Starter,

– Blackhole AF Replenisher

• For single pass : – Blackhole SP Starter,

– Blackhole SP Replenisher


• Temp : 32~35℃


• Control : pH, Normality, solid %

• Dump : 1 year recommended

• Sponge roller recommended

Sponge rollers

Inlet Outlet


BLACKHOLE / ECLIPSE PROCESSBLOW OFF AND DRYER

12

• Contact time : 30 sec

• Temp : 75 +/- 5C

• Maintenance / Cleaning : Every month


BLACKHOLE / ECLIPSE PROCESSMICROCLEAN

13

• H2SO4, H2O2 with G-5S

• SPS


• Temp varied to etch rate

• Etch rate for standard process : 0,8~1,3μ

• Etch rate for LE process : 0,2~0,65μ

• Via flood and spray nozzles recommended

• Control : E/R, concentrations

• Auto dosing : recommended

• Dump : copper < 20g/L


EQUIPMENT ENHANCEMENTIMMERSION FLOOD BAR TYPE COMPARISON

14

Fan Spray

Nozzle

Drilled Hole

pipe Slit type bar Slash type bar Via Fluid Head

Surface

treatmentGood Weak Best Uniformity Good Weak

Hole treatment Bad Reasonable Worst Good best

Pressure Highest High Lowest Low High

Flowrate Lowest Low Highest High High

Recommended

for micro vias

and small holes.


EQUIPMENT ENHANCEMENTEFFECTIVE CARBON REMOVING IN MICROCLEAN

15

• High performance spray nozzle

• Spray (surface) +Immersion (Hole) +spray (uniform)

configuration (Recommended)

• Via head flood bar

% good microvia circuits (continuity)

75

80

85

90

95

100

105

6 mil 4 mil 3 mil 6 mil 4 mil 3 mil

Top Bottom

Flood pipe

Viaflood


PERFORMANCE TEST METHODPROPAGATION RATE

16

• Hull cell sized test panels are processed through the Blackhole line

• These panels are electroplated in a Hull cell at 1 Amp for 10 minutes

• After each panel is processed the number of holes that have propagated is recorded

Result 2.5 ASD 1.0ASD

Excellent > 6 > 5

Good 5 to 5.5 4 to 4.5

Average 4 to 4.5 3 to 3.5

Below Average 3 to 3.5 2 to 2.5

Poor < 3 < 2

As Is After Blackhole After copper plating


CAPABILITYGENERAL

17

• 10:1 and higher PTH capability

• Interconnect reliability equal to or exceeding electroless copper

• 1:1 and higher microvia capability

• 2:1 and higher controlled depth drill capability

• Thin copper foil capable - nailheading issues

• Passes IPC class 3 and Military 55110G specifications


CAPABILITYLAMINATE TYPES

18

• BT

• Ceramic Filled

• Cyanate Ester

• Duroid

• FR-4

• FR-5

• Flex

– Acrylic Adhesive

– Epoxy Adhesive

– Adhesiveless

• Halogen free

– Hitachi MCL BE-67

• Pb Free

– Isola 410

– Polyclad 370 HR

• Polyimide

• PTFE

• Speed board

• Other exotic materials

6X SS BT

Duroid

Ceramic filled

Isola 406


ECLIPSE LEECLIPSE CLEANER LE / ECLIPSE CLEANER LE-ESP

19

IR spectra of copper after Eclipse Cleaner LE

• Eclipse LE Cleaner / Ecipse Cleaner LE-ESP performs 3 functions :

• Cleans mild oils/dirt from the substrate

• Wets the holes

• Selectively coats the copper with a sacrificial coating

IR copper baseline


ECLIPSE LEECLIPSE MICROCLEAN LE

20

• H2SO4, H2O2 based etch

− Control etch rate (0.2~0.6um)

• Effectively removes carbon from the surface and inner-layers

• No equipment changes required

− No pre-dip required prior to etch

− No special rollers required

− No changes to micro-clean module configuration


ECLIPSE LERELIABILITY

21

Standard process,

10μin (0.25um) etch

Eclipse LE,

10μin (0.25um) etch

Carbon Residues No carbon Residues

ICD (Carbon post) CD (Carbon on corners)

Defects % Defects %

16/308 5.2 4/28 14.3

ICD (Carbon post) CD (Carbon on corners)

Defects % Defects %

0/308 0 0/28 0


Clean Inner Layer

IST 22 Layer 0.093 8:1 aspect ratio

1 oz

1/2 oz

All interconnects clean


ECLIPSE LERELIABILITY

23

Eclipse LE process (10 μin, 0.25um) - 6 times solder shock @ 288°C

- 17 micron innerlayer foil – no negative etchback


CLEAN CAPTURE PAD OF MICRO-VIA

Etch rate 0.3micron

Whole image of via holeCarbon

on glass fiber

Via bottom

- clean etched copper

Top View

SEM


LOW ETCH ON MLFPC


THROUGH HOLE IST DATA

• Precondition 6x @230ºC

• Cycled from ambient to 150ºC

• No difference between electroless copper (M-85) and Eclipse LE.

Coupon Pre - condition P% S% Cycles Failuer Mode

1 6x @260 0.417 0.264 500 N/A

2 6x @260 0.517 0.345 500 N/A

3 6x @260 0.352 0.261 500 N/A

4 6x @260 0.161 0.269 500 N/A

5 6x @260 0.294 0.211 500 N/A

6 6x @260 0.302 0 500 N/A

1 and 4 M85 @ Calumet

2 and 5 Eclipse LE plated@ Calumet

3 and 6 Eclipse LE plated @ CT


• IST Coupon number : GP60001A

• Laminate type : Isola 370HR

• Coupon thickness : 0.125”

• Layer count : 12, 1-oz I/L in every hole

• Holes sizes : 15 mil & 10 mil

• All panels were drilled and De-smeared

at one account.

CARBON BASED TECHNOLOGIESIST RELIABILITY (THROUGH HOLES)

27

• All the IST coupons were pre-cycled at

240℃ three times to simulate the assembly

process.

• The IST equipment was set to cycle

between 25°C and 150°C (3 minutes

heating and 2 minutes cooling) and to run

to a 10% change in resistance or 1000

cycles whichever occurred first.


CARBON BASED TECHNOLOGIESIST RELIABILITY (THROUGH HOLES)

28

• Carbon based process performs

as well as, or better than, the

electroless copper processes.

• Review and comparison of

historical IST data (N>11,000)

provided by PWB Interconnect

corroborate these findings.

• MacDermid Enthone has

hundreds of accounts running

carbon based direct metallization


• Material: • 10 Layer Polyclad 370

• Blind Microvias: • 4x4, 5x4, 6x4

• Plating Baths:

• Via Plate, Via Fill, Pulse

• Test 1:

• Precondition 6X, 230C

• Cycle 1000X to 150C

• No failures

• Test 2:• No Precondition

• Cycle 500X to 210C

• Several barrel failures

No separation at target padDelamination of boardTest 2

CARBON BASED TECHNOLOGIESIST RELIABILITY (MICROVIAS)


CONCLUSION

• Production Proven: over 220 accounts

– Over 200.000 m² processed per day

– Over 60.000 m² processed per day for Automotive

• Reliability equal to or surpasses conventional electroless copper

• High technology capable

• Confirmed reliability from independent testing

MACDERMID ENTHONE ELECTRONICS SOLUTIONSfiles.interconti.cz/200000654-d9927da8e3/Mechanism...

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