M2000 Hotplate

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Page 1

TABLE OF CONTENTS:

SECTION 0: SYSTEM DESCRIPTION PAGE 3SPECIFICATIONS PAGE 3

FEATURES PAGE 4

SECTION 1: UNPACKING INSTRUCTIONS PAGE 6TO UNPACK THE UNIT PAGE 6

SECTION 2: SYSTEM OPERATION PAGE 8KEYBOARD FUNCTIONS PAGE 8

TEMPERATURE CONTROLLER PAGE 11TEMPERATURE CONTROLLER KEYBOARD PAGE 11

SECTION 3: SYSTEM CONFIGURATION PAGE 13PROCEDURE PAGE 13

SECTION 4: COLD PLATE OPERATIONS PAGE 18TEMPERATURE CONTROLLER PAGE 18

SECTION 5: PROGRAMMING PAGE 20FLOW CHART SYSTEM PROGRAMMING PAGE 20

PROCEDURE PAGE 21

SECTION 6: RUNNING PROGRAMS PAGE 25PROCEDURE PAGE 25

SECTION 7: PROCESS DESCRIPTION PAGE 30CONVENTIONAL OVENS PAGE 30

HOTPLATE BAKING PAGE 31BAKING STYLES PAGE 32REFLOW SOLDERING PAGE 33SILICON WAFERS PAGE 33GALIUM ARSINIDE PAGE 33PHOTOMASKS AND DISPLAYS PAGE 34EXHAUST COVER PAGE 34BAKING PROCESS PAGE 35

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Page 2

TABLE OF CONTENTS:

SECTION 8: OPTIONS PAGE 38THE OPTion KEY PAGE 38

HARDWARE OPTIONS PAGE 40

SECTION 9: ERRORS AND THEIR RECOVERY PAGE 41

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Page 3

Section 0

DESCRIPTION:

MODEL: Cee (Cost Effective Equipment) Series 2000

Hotplate.

TEMPERATURE CONTROL: PID ( Proportional Integral Derivative) with plati-num RTD sensor. Microprocessor controlled to a

maximum temperature of 400 C with 0.1-C

resolution.

SUBSTRATE HANDLING: Substrates handled by a combination of Silicone

belts and gas pillow.

SUBSTRATE SIZE: Capacities are 3 to 6 inches depending on model

and or retrofit.

MAXIMUM THROUGHPUT: 18 substrates per minute with 0 bake time and 3-

inch substrates.

MAXIMUM BAKE TIME: 29 minutes 57 seconds (9 minutes 59 seconds per

step).

USER PROGRAM STORAGE: Lithium battery, life expectancy of approximately33 years.

EXHAUST COVER Cee open-faced single-lip exhaust cover supplied

as standard in all hotplates.

POWER SUPPLY: 120 Volts AC (240 Volts AC, optional), 700

Watts.

UTILITIES: Nitrogen: 1/4" NPT Female 70 psi minimum. Vac-

uum: 1/4" NPT Female 25" Hg

Exhaust: 2" O.D. 20-100 CFM

DIMENSIONS: 11" height x 24.1" length x 13.2" depth

WEIGHT: 85 lb / 32.3 kg

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Page 4

Section 0

DESCRIPTION:

FEATURES

The battery-backed memory stores up to ten user programs containing preset values for

bake temperature, bake time, and bake method. A program lockout key preventsunauthorized changes to user programs.

The Series 2000 Hotplate supports three bake methods: proximity, soft-contact, and

hard-contact (For more information, see bake methods in Section 6). These bake methods

provide maximum control of substrate warmup, solvent drying, and resin curing

characteristics.

A user program contains up to three consecutive bake methods.

With the automatic substrate handling, the operator need only load unbaked substrates onto

the entry track then remove baked substrates from the exit track. With the optional cassette

elevators installed, even this procedure is handled automatically.

A separate microprocessor allows greater control of temperature critical processes. The

Series 2000 Hotplate realizes bake temperatures to maximum of 400 C with resolution of

0.1 C.

Easily installed retrofits facilitate changing substrate size from large photomasks to Silicon

or GaAs wafers of less than 2 inches in diameter.

A benchtop unit, the Series 2000 Hotplate covers less than two-square feet and requires

only common utilities: 120 Volts AC; nitrogen gas; and vacuum.

Built-in, diagnostic software aids in system installation and testing.

Built-in communication facilitates interfacing with elevators.

Single-step, operating mode allows substrate baking without prior programming setup for

quick processing of one or two substrates.

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Section 0

DESCRIPTION:

FEATURES continued

The option key permits use of special or custom software to perform specific tasks not

available in the standard hotplate. For example, modifications can include special bakemethods, temperature ramp programs, or statistical data storage of substrate temperature

profiles during baking.

Information on various options will be distributed as they become available.

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Page 6

Section 1.

UNPACKING INSTRUCTIONS

The Series 2000 Hotplates are shipped in plyboard crates and packed with urethane foam during

shipment to reduce the possibility of damage to the unit.

TO UNPACK THE UNIT

1. Remove all loose packing material from the carton.

2. Remove the plastic bag containing the keys.

3. Lift the unit out of the carton by grasping the ends of the hotplate only . Do not lift the

unit by any of the top covers or protrusions. Do not flip the unit on its side or ends.

4. Remove the plastic wrap from the unit.

5. Open the bag containing the keys: insert one into the PROG/RUN switch on the front of

the unit, the other should be stored in a safe place.

6. On the back of the unit are two, 1/4" NPT pipe fittings: GAS and VAC. Connect these to

nitrogen gas at 60 psi or greater and vacuum at 25" Hg, respectively.

POWER OFFRUN PROG.

ON

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Page 7

Section 1.

UNPACKING INSTRUCTIONS

TO UNPACK THE UNIT continued

7. Plug in the unit; verify operation by turning on the power switch. The hotplate display

should read "CEE -----SERIES 2000."

8. Press the DIAG key to enter the diagnostic mode. Press the "3" key to turn on the gas

jets in the chuck; this allows precise leveling of the unit.

9. Place a wafer of correct size on the chuck. Adjust the leveling legs on the base of the

unit until the wafer does not tend appreciably toward the front or back of the chuck--but

does tend toward the right side of the chuck. Allow a 1/2" gap to the bench surface to

allow adequate ventilation.

10. Press the reset key to turn off the nitrogen flow.

* * * * *

This completes the setup procedure for the Series 2000 Hotplate.

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Page 8

Section 2.

SYSTEM OPERATION:

KEYBOARD FUNCTIONS

The Series 2000 Hotplate has two independent microprocessors: system and temperature

controllers.

The keyboard shown below guides the system controller. All programming and functioning of

the machine operate through here.

The second keyboard regulates the temperature-control microprocessor. However, the systemcontroller automatically and directly instructs the temperature controller which rarely

necessitates use of the temperature-control microprocessor.

KEYBOARD FUNCTIONS

0-9 number Selects a program to modify or run, as well as, encodes

numerical data.

PROGram Places the system in program mode. Using this key while in

run mode identifies the current bake program or most recent

bake program.

RUN Places the system in run mode. Allows selection of desired

program to execute.

1 2 3 4 5

6 7 8 9 0

OPT.

PROG RUN DIAG

START STOP RESET

ENTER CLEAR CONF

PROX

CONT

VAC

CEE ------ SERIES 2000

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Page 9

Section 2.

SYSTEM OPERATION:

KEYBOARD FUNCTIONS continued

DIAGnostics Starts diagnostic routines. Primarily used for system checkout,

DIAGnostics allows testing of all sensors in addition to the

manual operation of motors.

START Executes a user, bake program. In the event of an error,

START instructs the system to continue from the point at which

the error occurred.

STOP Stops a user program when the current cycle ends and immedi-

ately stops the bake cycle during single-step baking.

RESET Instructs the controller to perform a complete system reset. All

motors, solenoids, and elevators halt; the system returns to the

series number display. Note: after a reset, the controller will

not remember a substrate on the chuck--manually remove it.

ENTER Signifies acceptance of the currently displayed choice during

data entry and program selection. This key and the clear key

function similarily to a calculator keyboard.

1 2 3 4 5

6 7 8 9 0

OPT.

PROG RUN DIAG

START STOP RESET

ENTER CLEAR CONF

PROX

CONT

VAC


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Page 10

Section 2.

SYSTEM OPERATION:

KEYBOARD FUNCTIONS continued

CLEAR Removes unwanted or invalid information during data entry.

CLEAR also selects the nobake option when configuring a user

program.

CONFiguration Defines system. Allows selection of a usable, bake-temperature

range in percent.

OPTions Accesses optional software to perform specific or custom tasks.

PROXimity Selects proximity bake during system programming.

CONTact Selects soft-contact bake during system programming.

VACuum Selects hard-contact bake during system programming.

1 2 3 4 5

6 7 8 9 0

OPT.

PROG RUN DIAG

START STOP RESET

ENTER CLEAR CONF

PROX

CONT

VAC


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Page 11

Section 2.

SYSTEM OPERATION:

TEMPERATURE CONTROLLER

Except under specified circumstances, the user does not manipulate the temperature-control

keyboard located on the left-hand side of the Series 2000 Hotplate. The system controller

instructs the temperature controller during normal functions rendering operator intervention

unnecessary.

The display provides information about the current temperature setpoint, as well as, the current

chuck temperature. By manipulating the keyboard, the display provides informationrelating to output power and tuning.

TEMPERATURE CONTROLLER KEYBOARD

YES / NO Manually controls set point. Use these dual purpose keys with

the display shown above. The YES key increases the set point;

the NO key decreases the set point as indicated by an "up" ar-

row and a "down" arrow, respectively.

In addition, use these keys to answer questions about informa-

tion required by the temperature controller.

TUNE / RETURN Use during controller tuning and calibration. Unless a change

is dictated, the operator need not use this key.

Ye s No

TuneReturn

ParamDisplay

StartStop Last

110.3 COUT1 SP 110.5

REM

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Page 12

Section 2.

SYSTEM OPERATION:

TEMPERATURE CONTROLLER KEYBOARD continued

PARAMeters / DISPLAY Changes the type of information presented on the tem-

perature-controller display. The normal display shown

above reveals the current chuck temperature, 110.3 C;

and the current set point (SP), 110.5 C.

The left side of the readout displays "OUT 1" since atthis moment the chuck heating element is on. "REM" on

the right indicates active remote communications.

Pressing PARAM / DISPLAY once changes to a display

similar to the one depicted in Figure 1.

Figure 1 displays the current output power level of the

heater (OUT 1) as well as chuck temperature, 110.3 C.

110.3 COUT 1 70%

Ye s No

TuneReturn

Param

DisplayStartStop Last

110.3 COUT1 SP 110.5

REM

Figure 1.

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Page 13

Section 3.

SYSTEM CONFIGURATION:

This section presents the system configuration for the Series 2000 Hotplate.

The configuration procedure conditions the machine to accept substrates from or deliver sub-

strates to automatic cassette elevators or other Series 2000 Hotplates.

The configuration procedure instructs the system as to the maximum, acceptable, temperature

error (in percent) before initiating substrate baking.

NOTE--In order to insure proper functioning of the CONF key, set the keyswitch on the front

panel to PROG.

NOTE--The default values provided represent examples; values may be different in a given ma-

chine.

PROCEDURE

1. From the model number display (CEE-----SERIES 2000), press CONF to place the

system in configure mode.

DISPLAY

ACTION

CEE --- SERIES 2000

PRESS CONF KEY

(CONF)

POWER OFFRUN PROG.

ON

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Section 3.


PROCEDURE continued

The display reads "CONFIGURE ENTRY 0," where "0" indicates that the system is

currently configured for manual entry.

CONFIGURE ENTRY 0

PRESS ENTER

(ENTER)

At any time, a flashing number or cursor signals the system waits for input from the

operator. Pressing ENTER leaves the value unchanged.

Pressing CLEAR changes the value followed by "1 ENTER" for cassette elevator entryor "2 ENTER" for receiving substrates from another Series 2000 Hotplate.

CONFIGURE ENTRY 0

PRESS 1 FOR ELEVATOR

(CLEAR-1-ENTER)

CONFIGURE ENTRY 0

PRESS 2 FOR SUBSTRATES

(CLEAR-2-ENTER)

2. After configuring the entry type, next configure the exit type. The display reads

"CONFIGURE EXIT 0," where again, "0" indicates that the system is currently

configured for manual exit type.

CONFIGURE ENTRY 0

PRESS ENTER

(ENTER)

Retain or replace this value in the same manner as for the entry type.

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Page 15

Section 3.


PROCEDURE continued

If configuration of both the entry and exit is manual loading and unloading,

respectively, the system will skip the next two steps which pertain only to systemsusing cassette elevators.

3. If the operator selects cassette elevators for either the entry or exit, the system displays

"CASSETTE PITCH 3/16" indicating that the current configuration calls for cassettes

with 3/16" spacing between substrates.

CASSETTE PITCH 3/16"

PRESS ENTER

(ENTER)

Pressing ENTER retains this value.

Pressing CLEAR followed by the desired numeral and ENTER, changes this value.

Acceptable values range from one-sixteenths to eight-sixteenths of an inch spacing, i.e.

1/16" to 1/2."

CASSETTE PITCH 3/16"

PRESS # FOR SIZE

(CLEAR-1-1-6-ENTER)

4. The display reads "ENTER DIAM INCHES 3" where "3" represents the current,

configured, substrate size. Current values may be retained or changed as in the entry

type configuration. Acceptable values range from three to six inches.

ENTER DIAM INCHES 3

PRESS # FOR SIZE

(CLEAR-6-ENTER)

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Section 3.


PROCEDURE continued

3. At this point, the display reads "TEMP ERROR PRCNT 2.5," where "PRCNT 2.5"

equals 2.5%; a value previously configured to be the maximum error tolerated beforeactually baking wafers. Current values may be retained or changed as in the entry type

configuration.

TEMP ERROR PRCNT 2.5

PRESS ENTER

(ENTER)

With the value of 2.5% and a setpoint of 100.0 C, the system would not begin baking a

wafer unless the chuck temperature equalled at least 97.5 C--but not more than 102.5

C. Acceptable values range from 0.1% to 9.9%.

Note: setting the error range to 0.0% effectively shuts off the temperature-checking

function. Turn this function off in this manner only if unusually large temperature

variations can be tolerated without ill effects.

4. The display will now read "CHILL METHOD/ PROX.". The cool method can bechanged by pressing "CONT." or "PROX.".

CHILL METHOD/PROX PRESS "CONT" OR

"PROX"

5. The display will now read "CHILL TIME 0M 30S". Minutes are changed firstfollowed by seconds.

CHILL TIME 0M 30SENTER NEW MINUTES

(CLEAR-2-ENTER)

CHILL TIME 2M 30SENTER NEW SECONDS

(CLEAR-15-ENTER)

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Page 17

Section 3.


PROCEDURE continued

6. Now the display reads "STORE DATA 1/0." Up to this point, a temporary buffer stores

any changes; the system configuration remains unchanged. To make all changespermanent, press "1 ENTER."

STORE DATA 1/0

STORE CHANGES

(1-ENTER)

Before initiating permanent changes, if uncertainty about any changes exists, or the

operator desires to review the default settings, enter "0" to return to the first display

"CONFIGURE ENTRY 0."

7. After storing all changes, the system returns to the model number display.

8. To quit the configuration mode, press RESET at any time. The system returns to the

model number display without storing any changes to the system configuration.

* * * * *

This completes the system configuration procedure.

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Page 18

Section 4.

COLD PLATE OPERATIONS

This unit was purchased with a cold plate installed to speed the cooling after bake processing

photomask plates. This section outlines the operation of this portion of the system.

Programming of this operation is accomplished through the configuration routine. The last in-structions requested in the configuration routine are the style of cooling mode and the duration.

Cold plate programming is accomplished by using the up arrow, down arrow, and the enter

button.

TEMPERATURE CONTROLLER

Note: The display shown is for 0.1 (resolution) option installed. Machines with thestandard 1 resolution will not show the decimal.

The cold plate is designed to maintain itself at or near room temperature +/- 10C. The

temperature controller displays the cold chuck temperature at all times in degrees C. The error

indicators show at a glance if the temperature is correct, higher or lower than the setpoint of

the controller.

The display provides information about the current temperature set point, as well as, the cur-

rent chuck temperature. By manipulating the keyboard, the display reveals information related

to output power and tuning.

The temperature controller incorporates a red and green LED display. Display of the current

chuck temperature and set point occurs at all times. The red LED display shows the current

temperature. The green LED display shows the set point.

SP1

AL

SP2

F

C

INDEX ENTER

PV

SV

MADE IN USA

AL

20.0

20.0

AL

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Page 19

Section 4.

COLD PLATE OPERATIONS

KEYBOARD FUNCTIONS

INDEX/AL Pressing INDEX once allows the user to adjust the setpoint

with the up and down arrows. ENTER must be pressed to make

set point changes.

UP ARROW Used in conjunction with the INDEX/AL key to alter the set

point (desired temperature setting) of the controller.

DOWN ARROW Used in conjunction with the INDEX/AL key to alter the set

point of the controller. This key functions inversely to the UP

ARROW key.

ENTER ENTER stores the value or the item changed.

In order to minimize set-up times when adjusting the system temperature, the UP ARROW and

the DOWN ARROW keys change to a high-speed mode after depressing for a few seconds.

SP1

AL

SP2

F

C

INDEX ENTER

PV

SV

MADE IN USA

AL

20.0

20.0

AL

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Page 20

Section 5.

PROGRAMMING:

The Series 2000 Hotplates stores ten user programs in battery-backed memory. Programs

contain information such as bake temperature, up to three bake methods, and bake times.

The operator individually modifies or reviews programs, numbered zero to nine.

NOTE--In order to insure proper functioning of the PROG key, set the switch on the front pan-

el to PROG.

NOTE--The default values provided represent examples; values may be different in a given

machine.

FLOW CHART SYSTEM PROGRAMMING

PRESS PROGRAM

KEY

CEE --- SERIES 2000

PROG MODE/PROG #? 2

ENTER PROGRAM #

(CLEAR-0-ENTER)

PGM 0/ TEMP 115.0

ENTER NEW TEMP

(CLEAR-1000-ENTER)

PGM 0/ METHOD 1 CONT

ENTER NEW METHOD

(CLEAR-PROX-ENTER)

PGM 0/ TIME 1 0M 10S

ENTER NEW MINUTES

(CLEAR-1-ENTER)

PGM 0/ TIME 1 0M 10SENTER NEW SECONDS

(CLEAR-45-ENTER)

PGM 0/ METHOD 2 VAC

ENTER NEW METHOD

(CLEAR-CONT-ENTER)


ACCEPT MINUTES

(ENTER)

PGM 0/ TIME 2 0M 15SENTER NEW SECONDS

(CLEAR-20-ENTER)

PGM 0/ METHOD 3 PROX

ENTER NEW METHOD

(CLEAR-VAC-ENTER)


ACCEPT MINUTES

(ENTER)

PGM 0/ TIME 3 0M 10SACCEPT SECONDS

(ENTER)

IFNOBKE

(CLEAR)SELECTED

IFNOBKE

(CLEAR)SELECTED

CEE ---- SERIES 2000 PROGRAMMING

END OF

DISPLAYACTION

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Section 5.

PROGRAMMING:

PROCEDURE

1. The preceding page details the Flow Chart System Programming.

DISPLAY

ACTION

From the series number display (CEE -----SERIES 2000), press the PROG key to install

program mode.

CEE --- SERIES 2000

PRESS PROGRAM

KEY

The display reads "PROG MODE/PROG #? 2," where "2" represents the most recently

used program (default value). To work with program number 0 instead of number 2,

press CLEAR, followed by "0," then ENTER.

PROG MODE/PROG #? 2

ENTER PROGRAM #

(CLEAR-0-ENTER)

2. At this point, the display reads "PGM 0/ TEMP 115.0," where "115.0" indicates the

current temperature setting (TEMP) for program number 0 (PGM 0). To alter this val-

ue press CLEAR, followed by "1," " 4," " 5," " 5," then ENTER. This sets the tempera-

ture of program 0 to 145.5 C.

PGM 0/ TEMP 115.0

ENTER NEW TEMP

(CLEAR-1-4-5-5-ENTER)

3. Next, the display indicates "PGM 0/ METHOD 1 CONT" to program the first of three

possible bake methods as indicated by "1."


ENTER NEW METHOD

(CLEAR-PROX-ENTER)

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Section 5.

PROGRAMMING:

PROCEDURE continued

In this example, the contact ("CONT") bake method is currently selected. To change to

the proximity bake method, press CLEAR, followed by PROX, then ENTER.


ENTER NEW METHOD

(CLEAR-PROX-ENTER)

4. As currently revealed by the display, "PGM 0/ TIME 1 0M 10S," the bake time

("TIME") for method 1 ("1") is 0 minutes ("0M") and 10 seconds ("10S").


ENTER NEW METHOD

(CLEAR-1-ENTER)

First, accept or change the bake time minutes value. To program minutes in the bake

time to 1, press CLEAR, followed by "1," then ENTER.


ENTER NEW MINUTES

(CLEAR-1-ENTER)

Next, accept or change the bake time seconds value. To program seconds in the bake

time to 45, press CLEAR, followed by "45," then ENTER.


ENTER NEW SECONDS

(CLEAR-45-ENTER)

As a result, total bake time for the first bake, method 1, equals 1 minute and 45 sec-

onds.

Acceptable values for bake times range from 0 to 9 minutes and 0 to 59 seconds.

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Section 5.

PROGRAMMING:

PROCEDURE continued

5. At this point, the operator may continue programming for multiple bakes. The same

procedure applies to the second and third methods and bake times.

PGM 0/METHOD 2 VAC PGM 0/METHOD 3 PROX

ENTER NEW METHOD ENTER NEW METHOD

(CLEAR-CONT-ENTER) (CLEAR-VAC-ENTER)

PGM 0/TIME 2 0M 10S PGM 0/TIME 3 0M 10S

ACCEPT MINUTES ACCEPT MINUTES

(ENTER) (ENTER)

PGM O TIME 2 0M 10S PGM O TIME 3 0M 10S

ENTER NEW SECONDS ACCEPT SECONDS

(CLEAR-20-ENTER) (ENTER)

END OF

PROGRAMMING

CEE --- SERIES 2000

If a multistage bake is unnecessary, press CLEAR for the second bake method. Thedisplay will read "NOBKE" indicating no additional bake methods.

PGM 0/METHOD 2 VAC PGM 0/METHOD 3 PROX

ENTER NEW METHOD ENTER NEW METHOD

(CLEAR-CONT-ENTER) (CLEAR-VAC-ENTER)

IF NOBKE (CLEAR) SELECTED

IF NOBKE (CLEAR) SELECTED

END OF

PROGRAMMING

CEE --- SERIES 2000

To end the program at this point, press the ENTER key. To program dual method

bakes, enter CLEAR, "NOBKE," for the third method.

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Section 5.

PROGRAMMING:

PROCEDURE continued

6. After programming the third bake method and time or selecting a NOBKE, the system

stores all program data in memory.

NOTE: The current program in memory is not replaced until completing the program.

If at any time during programming the operator is unsure of the values selected or

would prefer to use the default values, press RESET, and no changes occur to the origi-

nal program. Press PROG again to start over from the beginning.

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Section 6.

RUNNING PROGRAMS:

Running user programs on the Series 2000 Hotplates is not difficult. The hotplate system itself

handles most of the work; the user need only supply substrates and instruct the system as to

which program to run.

Units equipped with cassette elevators accept many substrates at once. Except to replace a

cassette for a completed batch, the Series 2000 Hotplate requires no operator intervention.

Except when noted, the following procedures apply to both manual and cassette elevator

systems.

Warning: The surface of the chuck is hot; never touch the chuck surface. Never touch

substrates after baking until sufficient time for cooling elapses.

PROCEDURE

1. From the model number display (CEE -----SERIES 2000), press the RUN key. This

initiates the run mode. The display will read "RUN PROG#? _," where the flashing

cursor indicates that the system

waits for input from the operator.

CEE --- SERIES 2000

PRESS RUN KEY

RUN PROG #?_

ENTER PROGRAM #

No default value exists in this display; however, it is possible to find out the last pro-

gram entered or run.

RUN PROG #?_

PRESS PROGRAM KEY

(PROG)

PROGRAM NUMBER 4

RELEASE PROGRAM KEY

Pressing the PROG key anytime during run mode displays "PROGRAM NUMBER 4"

where, "4" indicates the most recently used program.

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Section 6.

RUNNING PROGRAMS:



PROCEDURE continued

To enter a user program, press the appropriate numerical key "2," then ENTER.

RUN PROG #?_

ENTER PROGRAM #

(2-ENTER)

2. The system controller instructs the temperature controller as to the temperature setpoint

of the current program. If disabled on the temperature controller keyboard, the system

controller enables the heat element.

In addition, the system controller compares the chuck temperature to the error bounds

established in the configuration procedure (see section 3 for more information).

3. If the chuck temperature falls under the acceptable temperature range, specified in the

system configuration, the display reads "UNDER TEMP / OVERRIDE _." This indi-

cates that the chuck temperature is currently below the normal operating range; at thispoint, the system allows the operator to override the error.

UNDER TEMP/OVERRIDE_

ENTER START TO OVERRIDE

(START)

Pressing START at this point overrides the system and begins baking wafers.

Similarly, if the current chuck temperature is too high, the display reads "OVER TEMP

/ OVERRIDE_" indicating that the current chuck temperature falls out of range. At this

point, the system allows the operator to override the error.

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Section 6.

RUNNING PROGRAMS:



PROCEDURE continued

Pressing START at this point overrides the system and begins baking wafers.

OVER TEMP/OVERRIDE_

ENTER START TO OVERRIDE

(START)

Before baking each wafer, the system checks the chuck surface temperature. To insti-

tute a global override, during the configuration procedure set the allowed percent error

to 0% (see Section 3 for more information). When the temperature has fallen within

specifications or has been overridden, the system will begin the program.

4. For systems configured for manual substrate loading, the display reads "READY

PRESS START." Press START to initiate the program.

READY PRESS START

PRESS START TO BEGIN

(START)

Systems configured for auto cassette loading skip this step.

5. First, the system checks verifies that no substrates remain on the exit track (right-hand

belts). If present, the display reads "PLEASE CLEAR EXIT." Remove any substrates

from the exit track.

PLEASE CLEAR EXIT

REMOVE SUBSTRATE

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Section 6.

RUNNING PROGRAMS:



PROCEDURE continued

6a. Manual systems:

At this point, the display reads "PLEASE LOAD ENTRY."

PLEASE LOAD ENTRY

PLACE SUBSTRATE

ON BELT

The entry track runs for approximately twenty seconds; after which if no substrate is de-

tected, the track turns off, and the system reverts to step 4. Place a substrate on the en-

try track if empty. The track carries the substrate past the entry track detector and onto

the chuck.

After detecting the substrate on the chuck, the Series 2000 Hotplate bakes the

substrate as programmed. The wafer unloads at the far end of the exit track.

Remove the finished substrate from the exit track: load a new substrate onto the entry

track. Continue this process until completion of all substrates. For more information

on baking styles, refer to Process Description, Section 6.

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Section 6.

RUNNING PROGRAMS:



PROCEDURE continued

6b. Cassette elevator systems:

A two-second delay occurs in unloading the substrate from the entry (left) elevator. The

entry track starts allowing a single "quickie" substrate to proceed through the automatic

system. This circumvents loading the substrate into a cassette or reconfiguring the sys-

tem for manual operation.

After the two-second delay, the system controller requests a substrate from the entry ele-

vator. The entry elevator unloads the substrate onto the chuck. After detecting the sub-

strate on the chuck, the Series 2000 Hotplate bakes the wafer as programmed. The sub-

strate unloads at the far end of the exit track.

Upon reaching the exit detector (located at the far end of the exit track), the exit eleva-

tor unloads the substrate from the exit track.

The process automatically continues until: 1) an empty entry cassette or 2) a full exit

cassette. For more information on baking styles, refer to process description, Section 6.

7. To abort processing in the middle of a batch, press the STOP key. The system halts af-

ter finishing the current substrate. Acknowledging this, the display reads "STOPPED -

PRESS START." Press START and the system continues as before.

STOPPED - PRESS START

PRESS START TO CONTINUE

(START)

To stop processing and exit the run mode, press RESET. If performing a reset anytime

other than during a stopped or idle system, clear any substrates from the chuck and exit

track. No memory of the substrates will exist; the substrates will not bake accurately.

8. For a complete description of possible errors, see Errors and Recovery, Section 8.

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Page 30

Section 7.

PROCESS DESCRIPTION:

Many advantages with hotplates exist compared to convection-type ovens: decreased baketime, increased reproducibility, and better film quality. This section describes some ofthese differences and sets a few guidelines for incorporating hotplates.

CONVENTIONAL OVENS

Stratification, the formation of different temperature zones within a unit, is a problemassociated with convection ovens. Stratification can severely affect film quality andreproducibility.

The heating rate of a substrate depends not onlyon the air flow past the substrate but on the

proximity to another cold substrate. Hence,the heating rate for a cassette of substratesplaced in an oven--for each substrate--willbe less than if each substrate baked alone inthe oven.

In addition, substrates near the ends of a cassette heatfaster than substrates in the middle producing non-uniformity of heating across substrates.

Particle generation occurs with standard ovens. In aforced-air, convection oven, substrates arecommonly exposed to a flow of unfiltered air forat least 30 minutes.

Considerable particulate contamination during resin film cures occurs in substrates. The sub-strates are vulnerable since the film may still contain solvent; flying particles will adhereto the surface during this "soft" state.

150

155154

153152

151150

148149

7/Min3/Min

7/Min

UNEVEN HEATING

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Section 7.


Another disadvantage in normal oven bakingresults from baking substrates from the"outside in." A skin forms on the surface ofthe film trapping solvents. Upon

vaporizing, these solvents form blisters orbubbles resulting in adhesion loss or evenbulk film failure. This problem prevails inprocesses involving thick film resins, e.g.polyimides.

HOTPLATE BAKING

A well designed hotplate

insures uniform bakingacross the substrate.Since the substrateintimately contacts asurface of known,constant temperature, itheats at a ratedependent only uponthe bake style selectedand the thermal

properties of the substrate.

Increased throughput results from a faster warmup of the substrate. Bake times measured inseconds result rather than minutes or hours as in conventional ovens.

Reduced vulnerability to particulate contamination is a major advantage to hotplate baking:only normal, clean room, ambient air passes over the substrate.

No skin effect occurs on a hotplate since hotplate

baking heats the substrate from the bottomup. This "inside out" approach offers advan-tages for thick films since solvents in thefilm nearest the substrate escape before thefilm surface seals over.

Surface

Temperature

C

140

150

160

Left edge Right edgeCenter

POSITION ON CHUCK SURFACE

SURFACE TEMPERATURE UNIFORMITY

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Section 7.


BAKING STYLES

Three baking styles exist on the Series 2000 Hotplates as well as combinations thereof. This

section details the methods and the advantages of each.

Proximity bake:

In this method, substrates

float on a pillow of nitro-

gen blown through orifices

in the chuck surface. A

combination of heated gas

and radiant heat from the

chuck heats the substrate.

This slower heating of the

substrate reduces blister-

ing and cracking of films

incorporating fast drying

solvents.

Commonly used as a prebake

stage and/or in combina-

tion with hard-contact

bake, the proximity bake

makes two temperature

bake schedules obsolete.

Soft-contact bake:

In this method, gravity alone

holds the substrate against

the chuck surface. Com-

pared to proximity and

hard-contact baking, more

heat transfers to the sub-

strate and slower warmup

times occur, respectively.

While this represents the least

accurate bake style, this

method finds some use as

an intermediate betweenhard-contact and proximi-

ty bakes.

Hard-contact bake:

Hard-contact bake represents

the most accurate baking

method for hotplates.

Vacuum ports in the chuck

intimately hold the sub-

strate in place. This meth-

od insures bake uniformity

and minimizes bowing and

warping of the substrate.

A quicker warmup and more

efficient heating produces

faster throughput in short-er bake times. Selecting

the VAC (vacuum) bake

method initiates the hard-

contact bake cycle--the

most preferred method.

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Section 7.


REFLOW SOLDERING

Hotplate baking heats the substrateand the solder without applying

heat directly to the devices on

board. Using a combination of

proximity and hard-contact

bakes, the bake profile can be

adjusted to suit any process.

SILICON WAFERS Cee Hotplates virtually eliminate the skin effect with

thick films andsubstantially increase throughput. This chartpresents process examples for 2 commonly used res-ins: positive photoresist and polyimide. Do not useas a rigid guideline since the best method with a par-ticular application results through experimentation.

APPLICATION OVEN BAKE HOTPLATE BAKE

Positive photoresist 90 C/30 min 115 C/30 sec Hard contact

Polyimide alpha (solvent removal) 90 C/30 min 150 C/15 sec Prox bake

Polyimide beta (partial imidization) 135 C/30 min 150 C/90 sec Hard contact

GALIUM ARSINIDESegments and pieces of GaAs wafers are commonly used in

research and pilot lines for economic reasons. The Series

2000 Hotplates are ideally suited for these circumstances.

All Series 2000 Hotplates offer a proximity-bake mode.

This is most useful for prewarming GaAs wafers before go-

ing to a hard-contact bake and insures uniform heating with-

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Page 34

out thermal shock. Typical bake processes are identical to those provided above for Silicon.

Section 7.


PHOTOMASKS AND DISPLAYS

Reproducibility and throughput are key issues

both for photomask and for display

makers. Because of the large thermal

mass of these substrates, oven baking is

slow and nonuniform. A proximity bake

eliminates the back-side defects. The

Series 2000 Hotplate can typically reduce

bake times by 90%.

Reproducibility is greatly improved since heating rate is not dependent on batch size. All

substrates are baked individually.

Particle contamination is an important factor for photomask makers and display makers alike,

since both industries insist on zero or near zero defect yields. With the Series 2000 Hotplate,

these substrates bake in the clean room environment for a fraction of the time necessary in a

conventional oven.

EXHAUST COVER

The design of the exhaust cover promotes removal of vapors evolved from a substrate placed on

the chuck without actually drawing air across the chuck surface.

CHUCK SURFACE

TO

EXHAUST

BLOWER

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Section 7.

PROCESS DESCRIPTION:BAKING PROCESS

Loading, baking, and unloading on the Series 2000 Hotplates includes constant error checking

and precise timing to ensure efficient, reliable operation.

By placing the system in run mode and selecting a program, this informs the temperature

controller of the new temperature set point. The system controller begins polling the

temperature controller approximately every 1.5 seconds. If the current chuck temperature

falls outside the specified range, the system informs the operator by displaying "UNDER

TEMP / OVERRIDE_" or "OVER TEMP / OVERRIDE_."

UNDER TEMP / OVERRIDE_

PRESS START TO OVERRIDE

(START)

OVER TEMP / OVERRIDE_

PRESS START TO OVERRIDE

(START)

At this point, the system allows overriding of the error to continue processing. After reaching

the correct temperature or overriding the error, the system loads the first substrate.For a manually operated machine, the display reads "READY PRESS START" and waits for a

response from the operator.

READY PRESS START

PRESS START TO BEGIN

(START)

After the operator presses the START key, the exit track checks for substrates.

The Series 2000 Hotplates will not load the chuck with a substrate unless a clear exit pathway

exists. This prevents overbaking of a substrate while waiting for the exit to clear or for the

substrate on the exit to dump onto the floor.

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Section 7.

PROCESS DESCRIPTION:BAKING PROCESS continued

When the exit clears, the entry track begins to run. Autoloading systems run this track for

approximately 1.5 seconds before requesting a substrate from the entry elevator. This

permits the insertion of a substrate into the baking line without having to load it into acassette.

While the system controller waits for a substrate from the entry elevator, the display reads

"LOADING TRACK." A delivery error occurs if the substrate fails to show up within the

specified time; the entry track shuts down and sounds an alarm.

After an autoloaded or manually loaded substrate reaches the entry track sensor, the display

reads "LOADING CHUCK."

Next, the gas transfer and gas pillow jets turn on to carry the substrate to the stop pins and

chuck sensor. Again, an allotted time period exists for arrival of the substrate to the chuck

sensor before displaying a delivery error.

The substrate arrives at the chuck sensor and stop pins almost simultaneously. As soon as it is

detected the transfer and gas pillow jets turn off, the vacuum valve opens for 20

milliseconds, and the wafer halts.

Initiation of the programmed bake method starts by setting the necessary valves: gas jets,

proximity; vacuum, hard contact; or neither, soft contact. Multiple bake cycles consecutive-

ly run until program completion.

After completion of substrate baking, the stop pins lift out of the way; the transfer and gas

pillow jets turn on; the exit track starts.

Again a time-limit delay occurs to permit arrival of the substrate at the exit sensor before

issuing a delivery error. Upon arrival at the exit, the stop pins drop; gas jets turn off; and

the exit track stops.

At this point, manual systems request the operator to remove the finished substrate from the exit

track; autoloading systems order the exit elevator to unload a substrate. If the elevator

signals a ready condition, the exit track starts again, and the wafer unloads.

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Section 7.


BAKING PROCESS continued

Usually, no time lapses between the exit track stopping and starting up again. Display of a

delivery error proceeds if the exit elevator does not receive a substrate within the allottedtime.

After baking and unloading a substrate, the controller checks the chuck temperature. Unless

previously overridden, the next substrate loads and runs in a like manner. Continuation of

this process occurs until no substrates remain, or the operator halts the system.

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Section 8.

OPTIONS:

The Series 2000 Hotplates are designed to be quite flexible in operation as well as in modifica-

tion. This section describes both the OPT ("option") key which utilizes custom or special-

ized software and the hardware options currently available for the Series 2000 Hotplates.

THE OPTion KEY

Current Series 2000 Hotplates ship with one optional function installed: the single step function

Information on additional packages will be distributed as they become available.

The single step function allows the operator to bake wafers without prior system programming.

As a result, five or ten substrates may be baked with different methods and different bake

times without having to preset ten user programs.

All options are accessible from the model number display (CEE ----- SERIES 2000). Option 1

contains the single step function.

CEE --- SERIES 2000

PRESS OPT KEY

To enable this function, press the OPT key. The display reads "OPTION--." The system waits

for input from the user.

OPTION--

ENTER OPT #

Press "1," and the display reads "OPTION-- SSTEP."

OPTION--

ENTER OPT #

(1-ENTER)

Press ENTER; this engages the single step function which remains in effect until pressing the

RESET key.

OPTION-- SSTEP

(ENTER)

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Section 8.

OPTIONS:

THE OPTion KEY continued

Next, press the RUN key to enter run mode as in Section 5.

CEE --- SERIES 2000

PRESS RUN KEY

The display reads "RUN PROG# ? _ SSTEP" indicating that the selected program will be

run in single step mode.

RUN PROG# ? _ SSTEP

ENTER PROGRAM #

In actuality, the system only uses bake temperature from the preset program.

At which point the temperature falls within range or override occurs, the operator chooses the

system bake method. Choose a method "PROX," "CONT," or "VAC," and press ENTER.

PROG# SSTEP

ENTER NEW METHOD

(PROX, CONT, OR VAC-ENTER)

The substrate loads onto the chuck and bakes as usual; except, the display counts up from 0.

After reaching the desired bake time, press the STOP key: the substrate unloads from the

chuck.

Processing continues in this fashion until pressing the RESET key which restores the normal

operating mode.

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Section 8.

OPTIONS:

HARDWARE OPTIONS

1. CASSETTE ELEVATORS: A pair of our cassette elevators converts a manual Se-

ries 2000 Hotplate into a fully autoloading system. In-terfaces are already built into the machine.

2. FIELD INSTALLABLE Retrofits, which can be installed in the field, allow the

RETROFITS FOR baking of substrates other than those for which the

CHANGING SUBSTRATE system was originally designed. Preferred by research

SIZE: laboratories and pilot lines.

3. MULTI-SUBSTRATE This chuck adjusts to handle four different

CHUCK: substrate sizes. If installed, an appendix to this manu-

al details the operation of this option.

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Section 9.

ERRORS AND THEIR RECOVERY:

The Series 2000 Hotplates contain extensive error checking routines. These minimize problems

while in use, as well as, point out potential problems before they become serious.

The following lists the possible error messages ("display messages"), their cause, and the cor-

rective actions necessary.

ERROR: CAUSE: ACTION:

Delivery error entry Substrate did not leave the Reset substrate on entry track and

entry track as specified. press START.

Delivery error chuck Substrate did not arrive Reset substrate on entry track and

at chuck as specified. press START. May indicate

improper leveling of machine.

Delivery error exit Substrate did not arrive Reset substrate on exit track and

at the exit track as press START. May indicate

specified. chuck needs cleaning.

Wafer lost entry Substrate did not transfer Replace substrate into cassette.

from elevator to May indicate poor alignment

entry track. of elevator to unit.

Wafer lost exit Substrate did not transfer Replace substrate into cassette.

from exit track to elevator. May indicate poor alignment

of elevator to unit.

Temperature controller Electrical malfunction in Turn system off; Wait 5 seconds;

not responsive ("Temp temperature controller Turn back on; Check for loose

contr not resp") cables.

Temperature controller Error in communication to Press START to re-attempt.

communication error temperature controller

("Temp contr com error")

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Section 9.



Temperature controller Temperature controller not Enable remote communication,

disabled ("Temp contr able to comply with see Section 2, Temperaturedisabled") command. Controller.

Temperature controller Unforeseen error with Contact Cee Engineering Dept.

error ("Temp contr temperature controller.

error")

Cassette full exit Maximum capacity reached Replace full exit cassette with an

in the exit cassette. empty cassette.

Cassette empty entry No substrates in entry Replace empty cassette with a

full

cassette cassette.

Reset Cassette (entry/exit) Elevator does not recognize Lift cassette from platform and

cassette, or cassette is replace.

misaligned.

Need cassette (entry/exit) Cassette missing Place cassette on platform.

Elevator error (entry/exit) Unforeseen error with Contact Cee Engineering Dept.

elevator

System dead, no lights No power to outlet Check electrical outlet for

on temperature controller presence of 120 Volts, AC.

Blown fuse Replace fuse (located at the back

of unit).

Nitrogen and/or Blockage in tubing Check connections to the

vacuum not functional unit for possible kinks or

obstructions.

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Section 9.



Temperature controller Low voltage Check electrical outlet forreads "E1" presence of 120 Volts, AC.

Temperature controller Electrical problems Remove power for 5 seconds and

reads "E2," "E3," could be caused by restore, otherwise contact Cee

"E5," or "E6" noise on power line. Engineering Dept.

Temperature controller Calibration lost Contact Cee Engineering Dept.

reads "E4"

Cee A di i i f B S i I P O B GG R ll MO 65402

M2000 Hotplate

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