M. Meyyappan Dit CtfNthlDirector, Center for Nanotechnology … · 2013-02-07 · M. Meyyappan Dit...
Transcript of M. Meyyappan Dit CtfNthlDirector, Center for Nanotechnology … · 2013-02-07 · M. Meyyappan Dit...
M. MeyyappanDi t C t f N t h lDirector, Center for Nanotechnology
NASA Ames Research CenterMoffett Field, CA 94035Moffett Field, CA [email protected]
web: http://www.ipt.arc.nasa.gov
N t h l i th ti f USEFUL/FUNCTIONALNanotechnology is the creation of USEFUL/FUNCTIONALmaterials, devices and systems through control of matter on the nanometer length scale and exploitation of novelon the nanometer length scale and exploitation of novel phenomena and properties (physical, chemical, biological) at that length scale
Source: K.J. Klabunde, 200
• Nanoelectronics (CNTs, molecular electronics)d h bl• Non-CMOS circuits and architectures, reconfigurable sy
• Spintronics, quantum computing, nanomagnetics• Nanophotonics nano-optics nanoscale lasers…• Nanophotonics, nano optics, nanoscale lasers….• Chemical and biological sensors• Novel materials for all applications (CNTs, quantum do
inorganic nanowires…• Integration of nano-micro-macro
Bi f i• Bio-nano fusion•••
CNT is a tubular form of carbon with diameter as small as 1 nm. Length: few nm to microns.
CNT is configurationally equivalent to a two dimensional graphene sheet rolled into a tube.
CNT exhibits extraordinary mechanical properties: Young’s modulus over 1 Tera Pascal, as stiff as diamond, and tensile strength ~ 200 GPa.
CNT b lli i d iCNT can be metallic or semiconducting, depending on chirality.
• The strongest and most flexible molecular material because of C-C covalent bonding and seamless hexagonal network architecture
• Strength to weight ratio 500 time > for Al, steel, titanium; one
d f it d i t hit /order of magnitude improvement over graphite/epoxy
• Maximum strain ~10% much higher than any material
• Thermal conductivity ~ 3000 W/mK in the axial direction with small values in the radial direction
• Very high current carrying capacity
• Excellent field emitter; high aspect ratio and• Excellent field emitter; high aspect ratio and small tip radius of curvature are ideal for field i i
• CNT quantum wire interconnectsq
• Diodes and transistors for computing
• Capacitors
• Data Storage
• Field emitters for instrumentation
• Flat panel displays
• THz oscillators
ChallengesChallenges
• Control of diameter, chirality• Doping contactsDoping, contacts• Novel architectures (not CMOS based!)• Development of inexpensive manufacturing processes
Ch ll• CNT based microscopy: AFM, STM…
• Nanotube sensors: force, pressure, chemical…
Challenges
• Controlled growth
• Biosensors
• Molecular gears, motors, actuators
g• Functionalization withprobe molecules, robustnes
• Integration, signal proces
• Batteries, Fuel Cells: H2, Li storage
• Nanoscale reactors ion channels
• Fabrication techniques
• Nanoscale reactors, ion channels
• Biomedical- in vivo real time crew health monitoring- Lab on a chip - Drug delivery- DNA sequencingA tifi i l l b l t- Artificial muscles, bone replacement,bionic eye, ear...
• CNT has been grown by laser ablation (pioneering at Rice) and carbon arc process (NEC, Japan) - early 90s.
SWNT hi h it ifi ti th d- SWNT, high purity, purification methods
• CVD is ideal for patterned growth (electronics, sensor applications)
- Well known technique from microelectronics
- Hydrocarbon feedstock- Growth needs catalyst
(transition metal)l ll b- Multiwall tubes at
500-800° deg. C.- Numerous parameters
i fl CNT thinfluence CNT growth
- Surface masked by a 400 mesh TEM grid
- Methane, 900° C, 10 nm Al/1.0 nm Fe
- Surface masked by a 400 mesh TEM grid; 20 nm Al/ 10 nm Fe; nanotubes grown for 10 minutes
Grown using ethylene at 750o C
• Inductively coupled plasma reactor, with an rf-d b ttpowered bottom
electrode, separate heating stage to heat the wafer (in addition
to plasma heating)to plasma heating)
• DC plasma reactor with similar capabilities, but generally lowergenerally lower
plasma efficiency and more power consumption
ICP O ti diti
Cassell et al., Nanotechnology, 15 (1), 200
• ICP Operating conditionsCH4/H2 : 5 - 20%Total flow : 100 sccmPressure : 1 20 Torr Ir_ FeCr Ni Si NiPressure : 1 - 20 TorrInductive power : 100-200 WBottom electrode power : 0 - 100 W
__ S _
Ta_Ni/Co Ti_ Ni W_ Ni
*First single nanotube logic device Inverter demonstration (Appl Phys Lett Nov 2001)*First single nanotube logic device – Inverter demonstration (Appl. Phys. Lett., Nov. 2001)by Chongwu Zhou (USC) and Jie Han (NASA Ames)
Vout
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A d i f i iAs device feature size continues to shrink (180 nm 130 nm 100 nm) and chip density continuesand chip density continuesto increase, heatdissipation from thedissipation from thechip is becoming a h h llhuge challenge.
(Beyond the SIA Roadmap for Silicon)
• Must be easier and cheaper to manufacture than CMOS
• Need high current drive; should be able to drive capacitances ofNeed high current drive; should be able to drive capacitances of interconnects
of any length
• High level of integration (>1010 transistors/circuit)
• High reproducibility (better than ± 5%)
• Reliability (operating time > 10 years)
• Very low cost ( < 1 µcent/transistor)
• Better heat dissipation characteristics and amenable solutions
• Everything about the new technology must be compelling and• Everything about the new technology must be compelling and simultaneously
further CMOS scaling must become difficult and not cost-effective. Until these two happen together the enormous
• Neural tree with 14 symmetric Y-junctionsB hi d it hi f i l t h j ti i il t h t• Branching and switching of signals at each junction similar to what
happens in biological neural network• Neural tree can be trained to perform complex switching and computing functionsfunctions• Not restricted to only electronic signals; possible to use acoustic, chemical or thermal signals
Atomic Force Microscopy is a powerful technique for imagingAtomic Force Microscopy is a powerful technique for imaging, nanomanipulation, as platform for sensor work, nanolithography...
Conventional silicon or tungsten tips wear out quickly. CNT tip is robust, offers amazing resolution.
Simulated Mars dust 2 nm thick Au on Mica
193 nm IBM Version 2 Resist
Nguyen et al., App. Phys. Lett., 81 (5), 901
DUV Photoresist Patterns Generated byGenerated by Interferometric Lithography
DNA PROTEIN
CNT d tCNT advantages:(1) Small diameter(2) High aspect ratio(3) Highly conductive along the axis(4) High mechanical strength
Question: How to do this ?
M l
SiO2/Si
Metal DepositionTi, Mo, Cr, Pt
CatalystPatterning
Top Metal Layer DepositionNi
Plasma CVDAt ~ 400 to
TEOSCVD
CVD CMPAt 400 to 800° C
J. Li, Q. Ye, A. Cassell, H. T. Ng, R. Stevens, J. Han, M. M A l Ph L tt 82(15) 2491 (2003)Meyyappan, Appl. Phys. Lett., 82(15), 2491 (2003)
O i i d l f bi l d i i• Our interest is to develop sensors for astrobiology to study origins of life. CNT, though inert, can be functionalized at the tip with a probe molecule. • The technology is also being used to develop sensors for cancer• The technology is also being used to develop sensors for cancer diagnostics
- Identified probe molecule that will serve as signature of leukemia cells to be attached to CNTcells, to be attached to CNT
- Current flow due to hybridization will be through CNT electrode to an IC chip.
- Prototype biosensors catheter development
• High specificity• Direct fast response
Prototype biosensors catheter development
• The technology can be adapted for pathogen detection
• Direct, fast response• High sensitivity• Single molecule and
cell signal captureand detection
CNT DNA SensorUsing Electrochemical Detection
2+
3+
2+
3+
e
MWNT array electrode functionalized with DNA/PNA probe as an ultrasensitive
sensor for detecting the hybridization of target DNA/RNA from the sample.
• Signal from redox bases in the excess DNA single strands
The signal can be amplified with metal ion mediator oxidation Ru bPy( )2 +[ ]The signal can be amplified with metal ion mediator oxidation
catalyzed by Guanine.
Ru bPy( )3[ ]
Fabrication of Genechip
300 μm
30 dies on a 4” Si wafer200 μm
Simple Devices for Quick Molecular AnalysisAnalysis
HandheldHandheld Diagnostic Device Signal
Control
Potential applications:
Workstation
Potential applications:(1) Health monitoring and
astrobiology study in outer spaceWorkstation
DNA/RNA Sensor
p(2) Early cancer detection(3) Infectious disease detection(4) Environmental monitoring(5) Pathogen detection
Single Wall Carbon Nanotube
• Every atom in a single-walled nanotube (SWNT) is on the surface and exposed to environment Ch f ll h i h h• Charge transfer or small changes in the charge-environment of a nanotube can cause drastic changes to its electrical propertiesto its electrical properties
Sensor fabrication:1. SWCNT dispersions--Nice dispersion of CNT in DMF2. Device fabrication--(see the interdigitated electrodes below)3. SWCNT deposition—Casting, or in-situ growth
Jing Li et al., Nano Lett., 3, 929 (2003)
SWNT Sensor Response to NO2 with UV Light Aiding RecoveryAiding Recovery
Detection limit for NO2 is 44 ppb.
• When subjected to high E field, electrons near the Fermi level can overcome the energy barrier to escape to the vacuum level
• Common tips: Mo Si diamondCommon tips: Mo, Si, diamond
• Applications:- Cathode ray lighting elements- Flat panel displays- Gas discharge tubes in telecom networks- Electron guns in electron microscopyg py- Microwave amplifiers
• Fowler - Nordheim equation: φ is work function β is field enhancement factor
I = aV 2 exp(−bφ1.5 /βV )φ is work function, β is field enhancement factor
• Plot of ln (I/V2) vs. (1/V) should be linear• At low emission levels, linearity seen; in the high
i ld ifield region, current saturates• Critical: low threshold E field, high current density, high emission site density (for high resolution displays)
• N d• Needs- For displays, 1-10 mA/cm2
- For microwave amplifiers, > 500 mA/cm2For microwave amplifiers, > 500 mA/cm
• To obtain low threshold field- Low work function (φ)Low work function (φ)- Large field enhancement factor (β) ⇒ depends on geof the emitter; β ~ 1/5rβ
• Threshold field values (in V/µm) for 10 mA/cm2
- Mo - 50-100
_
Mo 50 100- Si - 50-100- P-type diamond - 130- Graphite Powder - 17- Carbon nanotubes - 1-3 (stable at 1 A/cm2)
• Working full color flat panel displays and CRT-lighting elements have been
demonstrated in Japan and KoreaJ p
• Display- Working anode, a glass substrate with phosphor coated ITOWorking anode, a glass substrate with phosphor coated ITO
stripes- Anode and cathode perpendicular to each other to form
pixels at thepixels at theintersection
- Phosphors such as Y2O2S: Eu (red), Zns: Cu, Al (green), Z S A Cl (bl )ZnS: Ag, Cl (blue)
- 38” prototype display showing a uniform and stable image
• Lighting Element- Phosphor screen printed on the inner surface of the glass
and backed by
CheMin XRD/XRF instrument, intended for quantitative mineralogy of Venus surface (1 liter 2Venus surface (1 liter, 2 kg, 5 watts).
• Surface analysis on planetary surfaces
Miniature carbon nanotube field emission X-ray tube
IMPACT: 10 X Reduction in Science Instrument Mass
• More & more components are packaged in smaller spaces whereMore & more components are packaged in smaller spaces where electromagnetic
interference can become a problemEx: Digital electronics coupled with high power- Ex: Digital electronics coupled with high power
transmitters as in manymicrowave systems or even cellular phone systems
• Growing need for thin coatings which can help isolate critical components from
other components of the system and external world
• Carbon nanofibers have been tested for EMI shielding; nanotubes have potential
as well- Act as absorber/scatterer of radar and microwaveAct as absorber/scatterer of radar and microwave
radiation- High aspect ratio is advantageous- Efficiency is boosted by small diameter Large d will
• Hi h p t r ti ll p r l ti n t l r mp iti n th n ph• High aspect ratio allows percolation at lower compositions than sph(less than 1% by weight)
l i h l i il d i l• Neat polymer properties such as elongation to failure and optical tare not decreased.
• ESD Materials: Surface resistivity should be 1012 - 105 Ω/sq- Carpeting, floor mats, wrist straps, electronics packaging
• EMI Applications: Resistivity should be < 105 Ω/sq- Cellular phone parts- Frequency shielding coatings for electronicsFrequency shielding coatings for electronics
• High Conducting Materials: Weight saving replacement for metalsAutomotive industry: body panels bumpers (ease of painting w- Automotive industry: body panels, bumpers (ease of painting wconducting primer)
- Interconnects in various systems where weight saving is crit
• Carbon nanotubes can be embedded in high performance composites as reinforcing agents and strain
ll i f d t ti it isensors allowing for nondestructive monitoring and distributed sensing of large structures
• SWNT/PVOH fibers with 60% wt SWNT ⇒ tensile strength similar to spider silk-These fibers can be woven into textiles to create
garments with sensing and EMI shielding capabilitiesshielding capabilities.
• Thermally conductive coatings (with nanotubesThermally conductive coatings (with nanotubes incorporated into polymers)
-Deicing aircrafts in cold weather by applying
V.S. Vavilov (1994)
• High single crystallinity ⇒ Low defect density grain boundary• High single crystallinity ⇒ Low defect density, grain boundary free
• Well-defined surface structuralWell defined surface structuralproperties ⇒ Enhanced interfacial engineering
• Predictable electron transportPredictable electron transportproperties ⇒ Predictable device performance
• Unique physical properties dueq p y p pto quantum confinement effects ⇒ Enhancement in device
characteristics
• Tunable electronic properties ⇒ Enhancement in device characteristics
by doping
• Truly bottom-up integration ⇒ Innovative fabrication schemesapproach
R d l li d
SiC
• Randomly aligned• Non-uniform length• Non-uniform diameter
Mostly on non conducting GaN
SiC • Mostly on non-conducting substrates
• Direct device integration almost impossible
Si
almost impossible
Si
• Planar configurationPlanar configuration• Lack of direct device integration• Lack of processing compatibility• Lack of high density alignment g y g• Poor reproducibility• Successful cases limited
(0001)
- Grown by Vapor-Liquid-Solid (VLS) Approach
C b th l d ti f i l hit- Carbothermal reduction of germanium plus graphite (1:1)
Nanowire-based Vertical Surround Gate FETNanowire based Vertical Surround Gate FET
Nanowire-based Vertical Surround Gate FET
n-NWVFET p-NWVFET
Nanowire based Vertical Surround Gate FET
The ConceptThe Concept
• Nanopore in membrane (~2nm diameter)opo e e e ( d a ete )
• DNA in buffer
• Voltage clampVoltage clamp
• Measure current
G. Church, D. Branton, J. Golovchenko, HarvardD. Deamer, UC Santa Cruz
GGA A A A
G
C CTT
GG G
Present Future
• Tree-like polymers, branching out from a central core and subdividing into hierarchical branching units
- Not more that 15 nm in size, Mol. Wt very high- Very dense surface surrounding a relatively
hollow core (vs. the linear structure in traditionalo ow co e (vs. t e ea st uctu e t ad t o a polymers)
• Dendrimers consist of series of chemical shells built on a
Courtesy of: http://www.uea.ac.uk/cap/wmcc/anc.htm
Dendrimers consist of series of chemical shells built on a small core molecule
- Surface may consist of acids or aminos ⇒ means to attach funct⇒ control/modify properties⇒ control/modify properties
- Each shell is called a generation (G0, G1, G2….)- Branch density increases with each generation
C i i i d h l b d l- Contains cavities and channels ⇒ can be used to trap guest molvarious applications.
1. Biomedical/Pharmaceutical• Drug delivery _ number of different drugs can be encapsulated in dendri
injected into the body for delivery- Incorporating sensors would allow release of drugs where needed
• Gene Therapy- Issue is getting enough genes into enough cells to make a differencIssue is getting enough genes into enough cells to make a differencviruses for this triggers immune reactions. Dendrimers provide an alternative without triggering immune response
C Th• Cancer Therapy
• Antimicrobial and Antiviral Agents
2 Ch mi l Indu tr2. Chemical Industry• Catalysis
- Encapsulating metal catalyst particles and preventing agglomorationsurface area highsurface area high
• Purification/chemical reaction scavenging
N t h l i bli t h l th t ill i t• Nanotechnology is an enabling technology that will impact electronics and computing, materials and manufacturing, energy, transportation….gy, p
• The field is interdisciplinary but everything starts with material science Challenges include:material science. Challenges include:
- Novel synthesis techniques- Characterization of nanoscale properties- Large scale production of materials- Application development
• Opportunities and rewards are great and hence, tremendous worldwide interest
• Integration of this emerging field into engineering and science curriculum is important to prepare the future