Listing Number: 829. Automatic Optical Inspection Low cost, automated optical inspection system for...
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Transcript of Listing Number: 829. Automatic Optical Inspection Low cost, automated optical inspection system for...
Listing Number: 829
Automatic Optical Inspection
Low cost, automated optical inspection system for a fast, high resolution production line inspection.
Market
Markets Test & Measurement Industrial Processes Process control
Problem Solved by the Technology
The technology enables a high resolution, high throughput, automated optical inspection of products in production line at much lower cost than existing systems.
Typical inspection systems utilize collection of multiple images with different fields of view to detect defective products.
To gain the high resolution and throughput, multiple expensive high resolution cameras with high pixel rates are needed.
How the Technology Solves the Problem
High resolution camera and an image scanning module with multiple objectives arranged to each have a field of view covering a portion of the inspected article.
An image selection mirror sequentially transfers images from the multiple fields of views to the camera.
The images captured by the camera are processed to detect defects in the article.
Primary Application
Inspection of semiconductor wafers, electrical devices, solar panels, flat panel displays such as LCD, plasma, FET, and printed circuit boards.
Other Potential Applications
The technology can be used to examine both large and small area articles.
Inspection and control of any other production lines such as aerospace, cars, medical devices, printing and web substrates.
Competitive Advantage
High resolution High speed Low cost Modular Easily expanded for
wider substrates Bolts onto existing
equipment, or free standing
Low Cost Advantage
Multiple objectives shared by each camera
Camera is the more expensive component
High Precision
Defects as small as 1 micron can be detected.
Suitable for minimum features in the range of ~1 micron to 10’s of microns.
Well suited for wafers, flat panel displays, printed circuit boards.
Development Status
Prototype built and demonstrated
Intellectual Property Ownership
IP is owned by the seller. There are no known liens
or encumbrances.
Patent Status
U.S. patents are pending
Deal Structure Sought
The deal structure envisaged is the sale of this technology asset.
Acquisition in 3 parts: Initial acquisition. Payment triggered when
patents are issued. Royalties on product
sales3-5% Royalties
Follow Up
Please refer to Tynax listing number: 829 with regard to this opportunity.
Inquiries should be directed to: Moshe Sarfaty [email protected]
Thank You