Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip

Andrew PieterickPaolo Ferrari

Fabrication

• Laser Induced Backside Wet Etching

• Components

• Materials

• Controls

Features

• Pros:– Varied aspect-ratios– Variable cross-section– Rapid prototyping– Crack/debris free

• Cons:– Roughness– CNC instability

Example Device

• Microreactor (A + B)

• Microconcentrator (A + B + C)

• Concentration mode (port E)

• Extraction mode (port D)